JP5871478B2 - Substrate holder and substrate processing apparatus - Google Patents

Substrate holder and substrate processing apparatus Download PDF

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JP5871478B2
JP5871478B2 JP2011069257A JP2011069257A JP5871478B2 JP 5871478 B2 JP5871478 B2 JP 5871478B2 JP 2011069257 A JP2011069257 A JP 2011069257A JP 2011069257 A JP2011069257 A JP 2011069257A JP 5871478 B2 JP5871478 B2 JP 5871478B2
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substrate
holding member
holding
hole
washer
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JP2012204713A (en
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本庄 一大
一大 本庄
秀彰 宮廻
秀彰 宮廻
友明 相原
友明 相原
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Screen Holdings Co Ltd
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本発明は、半導体ウエハ、液晶表示装置用基板、プラズマディスプレイ用ガラス基板、FED(Field Emission Display)用基板、光ディスク用基板、磁気ディスク用基板、光磁気ディスク用基板、フォトマスク用基板、太陽電池用ガラス基板等の複数枚の基板を起立姿勢で水平方向に配列させて保持しつつ、処理槽内に貯留された処理液中に浸漬させる基板保持具、および当該基板保持具を有し、複数枚の基板に対して、洗浄、エッチング、乾燥等の処理を行う基板処理装置に関する。   The present invention relates to a semiconductor wafer, a liquid crystal display substrate, a plasma display glass substrate, an FED (Field Emission Display) substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, and a solar cell. A plurality of substrates, such as glass substrates for use, which are arranged in a horizontal position in an upright position and held therein, and have a substrate holder that is immersed in the processing liquid stored in the processing tank, and the substrate holder. The present invention relates to a substrate processing apparatus that performs processing such as cleaning, etching, and drying on a single substrate.

処理槽内に貯留されたフッ酸(HF)、リン酸(HPO)あるいは硫酸(HSO)、アンモニア過酸化水素水(NH,H)等の薬液や純水といった処理液中に基板を浸漬させて、洗浄、エッチング等の処理を行う基板処理装置においては、基板保持具(リフタ)によって複数枚の基板を保持した状態で、その基板保持具を処理槽の内部と上方位置との間で移動可能となっている。まず、基板保持具を処理槽内へ配置させることにより、処理槽内の処理液中に基板を浸漬させて基板を処理し、処理液による基板への浸漬処理が終了すると、基板保持具を処理槽の内部から上方位置へ引き上げ、IPA(イソプロピルアルコール)、窒素(N)ガス等の乾燥ガスを基板に供給して、基板に対する乾燥を行う。この一連の処理で使用される基板保持具は、複数枚の基板(例えば、50枚)を互いに接触させることなく起立姿勢で水平方向に配列させて保持することができる構成を有している Chemical solution or pure water such as hydrofluoric acid (HF), phosphoric acid (H 3 PO 4 ) or sulfuric acid (H 2 SO 4 ), ammonia hydrogen peroxide (NH 3 , H 2 O 2 ), etc. stored in the treatment tank In a substrate processing apparatus that performs processing such as cleaning and etching by immersing a substrate in the processing solution, the substrate holder is held in a processing tank while a plurality of substrates are held by a substrate holder (lifter). It is movable between the inside and the upper position. First, by placing the substrate holder in the treatment tank, the substrate is treated by immersing the substrate in the treatment liquid in the treatment tank, and when the immersion treatment in the substrate with the treatment liquid is completed, the substrate holder is processed. The substrate is pulled upward from the inside of the tank, and a dry gas such as IPA (isopropyl alcohol) or nitrogen (N 2 ) gas is supplied to the substrate to dry the substrate. The substrate holder used in this series of processes has a configuration that can hold a plurality of substrates (for example, 50 substrates) arranged in a horizontal direction in a standing posture without contacting each other .

従来からの基板保持具は、鉛直方向に配設され処理槽の内部と外部との間で移動可能に支持された移動部材と、それぞれ一端部が移動部材の下端部分に固着され水平方向に配設された複数の基板保持枠(例えば、3本)と、これらの基板保持枠のそれぞれの他端部に固着され鉛直方向に配設された固定枠と、各基板保持枠にそれぞれ固設され基板の下端縁と係合する複数の基板保持溝を有し、複数枚の基板を相互に僅かな間隔をあけて、それぞれの基板を起立姿勢で水平方向に配列させて保持する保持部材とを備えている。そして、これらの複数の基板保持枠には、移動部材の下端部分の中央に固設された中央の基板保持枠、および、リフタ部材の下端部分の左・右にそれぞれ固設された左・右の基板保持枠の合計3本の基板保持枠がある。   A conventional substrate holder has a moving member that is vertically arranged and supported so as to be movable between the inside and the outside of a processing tank, and one end portion of which is fixed to the lower end portion of the moving member and is arranged in the horizontal direction. A plurality of substrate holding frames (for example, three) provided, a fixed frame fixed to the other end of each of these substrate holding frames and disposed in a vertical direction, and fixed to each substrate holding frame. A plurality of substrate holding grooves that engage with the lower edge of the substrate; and a holding member that holds the plurality of substrates arranged in a horizontal direction in a standing posture with a slight gap therebetween. I have. The plurality of substrate holding frames include a central substrate holding frame fixed to the center of the lower end portion of the moving member, and left and right fixed to the left and right of the lower end portion of the lifter member. There are a total of three substrate holding frames.

従来から、これら複数の基板支持枠のうち、各々の基板支持枠には左右2つの保持部材が固定具(ボルトおよびナット)によって固定されている。つまり、1つの基板保持具では6つの保持部材があり、これら保持部材が基板の下端部を6箇所で保持している。なお、基板保持枠及び保持部材には、固定具のボルトを挿通させるためのねじ孔が水平方向に形成されている(例えば、特許文献1参照)。   Conventionally, two left and right holding members are fixed to each substrate support frame by a fixture (bolts and nuts) among the plurality of substrate support frames. That is, there are six holding members in one substrate holder, and these holding members hold the lower end portion of the substrate at six places. In addition, the board | substrate holding frame and the holding member are formed with the screw hole for inserting the volt | bolt of a fixing tool in the horizontal direction (for example, refer patent document 1).

特開2007−36189号公報JP 2007-36189 A

しかしながら、従来の基板保持具では、複数枚の基板を保持した基板保持具を処理槽に貯留された処理液中に浸漬させた際に、基板支持枠に対して固定具により固定されている保持部材のねじ孔に処理液が入り込んでしまう。そして、基板保持具を処理槽の内部から上方位置へ引き上げ、乾燥ガスを基板に供給して基板を乾燥させると、保持部材のねじ孔に入り込んだ処理液の液滴が、例えば基板保持枠と保持部材との間等から出てきて、この処理液の液滴等が原因で、基板表面の保持部材近傍で、乾燥ムラが発生してしまうという問題がある。特に、基板の乾燥処理を減圧下で行った場合、ねじ孔と処理雰囲気との圧力差から処理液の液滴が基板表面に出てきやすくなる。   However, in the conventional substrate holder, when the substrate holder holding a plurality of substrates is immersed in the processing liquid stored in the processing tank, the holding is fixed to the substrate support frame by the fixing tool. The processing liquid enters the screw hole of the member. Then, when the substrate holder is lifted from the inside of the processing tank to the upper position and the drying gas is supplied to the substrate to dry the substrate, the droplets of the processing liquid that have entered the screw holes of the holding member are, for example, the substrate holding frame. There is a problem that unevenness of drying occurs in the vicinity of the holding member on the surface of the substrate due to the droplets of the processing liquid coming out between the holding member and the like. In particular, when the drying process of the substrate is performed under reduced pressure, the droplets of the processing liquid easily come out on the substrate surface due to the pressure difference between the screw hole and the processing atmosphere.

本発明は、以上のような事情に鑑みてなされたものであり、複数枚の基板を乾燥させる際に、基板表面における乾燥ムラの発生を防止できる基板保持具、および当該基板保持具を備える基板処理装置を提供することを目的とする。   The present invention has been made in view of the circumstances as described above, and when drying a plurality of substrates, a substrate holder capable of preventing the occurrence of uneven drying on the substrate surface, and a substrate provided with the substrate holder An object is to provide a processing apparatus.

上述した目的を達成するために、請求項1に記載の発明は、複数枚の基板を起立姿勢で配列させて保持する基板保持具において、処理液が貯留されている処理槽の内部と前記処理槽の上方位置との間で移動可能である移動部材と、前記移動部材に固着され、複数枚の基板の配列方向に沿って水平方向に配置された複数の基板保持枠と、基板の下端部に接触して基板を保持する保持部材と、前記基板保持枠に形成された第1の孔と前記保持部材に形成された第2の孔とを挿通させて、前記基板保持枠に前記保持部材を取り付ける固定具と、前記保持部材と前記固定具との間にワッシャーとを備え、前記保持部材には、処理液を前記第2の孔よりも下側に流すための直線の切欠部が前記第2の孔から連続形成され、前記ワッシャーの下部に処理液が流れる切欠部が形成されていることを特徴とするものである。 In order to achieve the above-described object, the invention described in claim 1 is a substrate holder that holds a plurality of substrates arranged in an upright posture, and the inside of the treatment tank in which a treatment liquid is stored and the treatment. A movable member movable between an upper position of the tank, a plurality of substrate holding frames fixed to the movable member and arranged in a horizontal direction along an arrangement direction of the plurality of substrates, and a lower end portion of the substrate A holding member that contacts the substrate and a first hole formed in the substrate holding frame and a second hole formed in the holding member are inserted, and the holding member is inserted into the substrate holding frame. And a washer between the holding member and the fixing member, and the holding member has a linear notch for flowing a processing liquid below the second hole. It formed continuously from the second hole, the treatment liquid at the bottom of the washer It is characterized in that the notch flows is formed.

また、請求項2に記載の発明は、複数枚の基板を起立姿勢で配列させて保持する基板保持具において、処理液が貯留されている処理槽の内部と前記処理槽の上方位置との間で移動可能である移動部材と、前記移動部材に固着され、複数枚の基板の配列方向に沿って水平方向に配置された複数の基板保持枠と、基板の下端部に接触して基板を保持する保持部材と、前記基板保持枠に形成された第1の孔と前記保持部材に形成された第2の孔とを挿通させて、前記基板保持枠に前記保持部材を取り付ける固定具と、前記保持部材と前記固定具との間にワッシャーと、を備え、前記保持部材には、処理液を前記第2の孔よりも下側に流すための直線の切欠部が前記第2の孔から連続形成され、前記ワッシャーの下部で、かつ前記保持部材側に処理液が流れる溝が形成されていることを特徴とするものである。 The invention according to claim 2 is a substrate holder for holding a plurality of substrates arranged in an upright posture, between the inside of the processing tank in which the processing liquid is stored and the upper position of the processing tank. A movable member that is movable at a position, a plurality of substrate holding frames that are fixed to the moving member and arranged in a horizontal direction along the arrangement direction of the plurality of substrates, and a substrate that is in contact with the lower end of the substrate to hold the substrate A fixing member for inserting the holding member into the substrate holding frame by inserting a holding member, a first hole formed in the substrate holding frame, and a second hole formed in the holding member; A washer is provided between the holding member and the fixture, and the holding member has a straight cutout portion for allowing the processing liquid to flow downward from the second hole. It is formed, at the bottom of the washer, and the treatment liquid to the holding member side A groove flow is formed, which is characterized in.

さらに、請求項4に記載の発明は、処理液に浸漬させて基板を処理する基板処理装置において、処理液を貯留する処理槽と、前記処理槽に処理液を供給する処理液供給手段と、請求項1または請求項のいずれかに記載の基板保持具とを備えることを特徴とするものである。 Furthermore, the invention according to claim 4 is a substrate processing apparatus for processing a substrate by immersing in a processing liquid, a processing tank for storing the processing liquid, a processing liquid supply means for supplying the processing liquid to the processing tank, The substrate holder according to claim 1 or 2 is provided.

本発明に係る基板保持具及び基板処理装置によれば、固定具により基板保持枠に取り付けられた保持部材の第2の孔よりも下側に処理液が流れる切欠部が形成されているので、第2の孔に処理液の液滴がたまることがなく、複数枚の基板を乾燥させる際に、処理液の液滴が原因で基板表面に発生する乾燥ムラを防止できるという顕著な効果がある。   According to the substrate holder and the substrate processing apparatus according to the present invention, since the cutout portion through which the processing liquid flows is formed below the second hole of the holding member attached to the substrate holding frame by the fixture, There is no accumulation of droplets of the treatment liquid in the second hole, and when drying a plurality of substrates, there is a remarkable effect that drying unevenness generated on the substrate surface due to the droplets of the treatment liquid can be prevented. .

本発明の実施形態に係る基板処理装置の概略構成の一例を示す模式的断面図である。It is typical sectional drawing which shows an example of schematic structure of the substrate processing apparatus which concerns on embodiment of this invention. 基板処理装置の構成要素である基板保持具の主要部を正面から見た拡大断面図である。It is the expanded sectional view which looked at the principal part of the substrate holder which is a component of a substrate processing apparatus from the front. 基板保持具の主要部を部分的に破断した状態で示す側面図である。It is a side view shown in the state where a principal part of a substrate holder was partially fractured. 第1の実施形態に係る基板保持具の右側基板保持枠の部分拡大図である。It is the elements on larger scale of the right side board | substrate holding frame of the board | substrate holder which concerns on 1st Embodiment. 第1の実施形態に係る基板保持具の保持部材及びワッシャーの図である。It is a figure of the holding member and washer of a substrate holder concerning a 1st embodiment. 第2の実施形態に係る基板保持具の右側基板保持枠の部分拡大図である。It is the elements on larger scale of the right side board | substrate holding frame of the board | substrate holder which concerns on 2nd Embodiment. 第2の実施形態に係る基板保持具の保持部材及びワッシャーの図である。It is a figure of the holding member and washer of a substrate holder concerning a 2nd embodiment.

以下、この発明に係る基板保持具及び基板処理装置の最良の実施形態について図面を参照しながら説明する。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of a substrate holder and a substrate processing apparatus according to the present invention will be described with reference to the drawings.

<基板処理装置の構成>
まず、本発明の実施形態に係る基板処理装置について説明する。図1は、本発明の実施形態に係る基板処理装置の概略構成の一例を示す模式的断面図であり、図2は、この基板処理装置の構成要素である基板保持具の主要部を正面から見た拡大断面図であり、図3は、基板保持具の主要部を部分的に破断した状態で示す側面図である。
<Configuration of substrate processing apparatus>
First, a substrate processing apparatus according to an embodiment of the present invention will be described. FIG. 1 is a schematic cross-sectional view showing an example of a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a front view of a main part of a substrate holder that is a component of the substrate processing apparatus. FIG. 3 is a side view showing the main part of the substrate holder partially broken.

この基板処理装置は、図1に示すように、ウエハ等の複数枚の基板を一括して処理するバッチ式の基板洗浄・乾燥装置である。この基板処理装置は、処理液を貯留する処理槽10、および、複数枚の基板W(例えば、50枚)を互いに接触させることなく、起立姿勢で水平方向に配列させて保持するリフタ12を備えている。リフタ12は、処理槽10の内部へ基板Wを搬入して処理槽10内の処理液中に基板Wを浸漬させるとともに、処理槽10内の処理液中から基板Wを引き上げて処理槽10の上方位置へ基板Wを搬出する。なお、このリフタ12は、本発明の基板保持具に相当する。   As shown in FIG. 1, this substrate processing apparatus is a batch type substrate cleaning / drying apparatus that collectively processes a plurality of substrates such as wafers. The substrate processing apparatus includes a processing tank 10 for storing a processing liquid, and a lifter 12 that holds and holds a plurality of substrates W (for example, 50 substrates) arranged in a horizontal direction in a standing posture without contacting each other. ing. The lifter 12 carries the substrate W into the processing tank 10 and immerses the substrate W in the processing liquid in the processing tank 10, and pulls up the substrate W from the processing liquid in the processing tank 10. The substrate W is unloaded to the upper position. The lifter 12 corresponds to the substrate holder of the present invention.

処理槽10の下部には、一対の吐出管14が設けられており、この吐出管14には、処理槽10内に処理液を噴出する複数の噴出孔(図示省略)が、長手方向に沿って水平方向に形成されている。この吐出管14には、フッ酸(HF)、リン酸(HPO)あるいは硫酸(HSO)等の薬液や純水といった処理液の供給源(図示省略)に、処理液供給管16を介して連通接続されている。なお、この一対の吐出管14及び処理液供給管16は、本発明の処理液供給手段に相当する。 A pair of discharge pipes 14 are provided in the lower part of the processing tank 10. A plurality of ejection holes (not shown) for jetting the processing liquid into the processing tank 10 are provided in the discharge pipe 14 along the longitudinal direction. Are formed horizontally. The discharge pipe 14 is supplied with a treatment liquid to a supply source (not shown) of a treatment liquid such as a chemical liquid such as hydrofluoric acid (HF), phosphoric acid (H 3 PO 4 ), sulfuric acid (H 2 SO 4 ), or pure water. The pipe 16 is connected in communication. The pair of discharge pipes 14 and the processing liquid supply pipe 16 correspond to the processing liquid supply means of the present invention.

処理槽10の底部には排液口18が設けられ、排液口18に排液管20が連通して接続されている。処理槽10の上部外周には、処理槽10の上部から溢れ出た処理液が流入する外槽22が設けられており、外槽22の底部に設けられた排液口に排液管24の上流側一端が連通して接続されている。   A drainage port 18 is provided at the bottom of the treatment tank 10, and a drainage pipe 20 is connected to the drainage port 18 in communication therewith. An outer tank 22 into which the processing liquid overflowing from the upper part of the processing tank 10 flows is provided on the outer periphery of the upper part of the processing tank 10, and a drain pipe 24 is connected to a drain port provided at the bottom of the outer tank 22. One end on the upstream side is connected in communication.

処理槽10の上方位置には、乾燥ガスを処理槽10の上方位置に供給する一対の供給ノズル23が設けられている。この一対の供給ノズル23には、IPA(イソプロピルアルコール)、窒素(N2)ガス等の供給源(図示省略)に、ガス供給管25を介して連通して接続されている。   A pair of supply nozzles 23 that supply dry gas to an upper position of the processing tank 10 are provided above the processing tank 10. The pair of supply nozzles 23 are connected to a supply source (not shown) such as IPA (isopropyl alcohol) and nitrogen (N 2) gas through a gas supply pipe 25.

リフタ12は、図2および図3に示すように、鉛直方向に配設された板状の移動部材26と、この移動部材26の下端部分にそれぞれ一端部が固着されて水平方向に配設された複数の基板保持枠28、30と、固定枠32を備える。図2の図示例では、基板保持枠28が移動部材26の下端部分の中央に固設されており、一対の基板保持枠30、30が、移動部材26の下端部分の紙面向かって左・右にそれぞれ固設されている。これらの基板保持枠28、30のそれぞれの他端部には、一体的に固着され鉛直方向に配設された固定枠32、ならびに、各基板保持枠28、30にそれぞれ固設され基板Wの下端部に接触して基板Wの下端を保持する第1の保持部材34a、36a及び第2保持部材34b、36bが備えられている。なお、リフタ12を構成する移動部材26、基板保持枠28、30および固定枠32は、それぞれSiCで形成されている。また、第1の保持部材34a、36a及び第2保持部材34b、36bおよび固定具38は、それぞれ例えば、処理液に対する耐薬品性に優れたPTFE、PFA、PVDF、PCTFE、PEEK等のフッ素樹脂で形成されている。   As shown in FIGS. 2 and 3, the lifter 12 has a plate-shaped moving member 26 arranged in the vertical direction, and one end is fixed to the lower end portion of the moving member 26 and arranged in the horizontal direction. A plurality of substrate holding frames 28 and 30 and a fixed frame 32 are provided. In the illustrated example of FIG. 2, the substrate holding frame 28 is fixed at the center of the lower end portion of the moving member 26, and the pair of substrate holding frames 30, 30 are left and right toward the paper surface of the lower end portion of the moving member 26. Respectively. The other end of each of the substrate holding frames 28 and 30 is fixed integrally with the fixed frame 32 arranged in the vertical direction, and the substrate holding frames 28 and 30 are fixed to the substrate W and 30. First holding members 34 a and 36 a and second holding members 34 b and 36 b that are in contact with the lower end portion and hold the lower end of the substrate W are provided. The moving member 26, the substrate holding frames 28 and 30 and the fixed frame 32 constituting the lifter 12 are each formed of SiC. The first holding members 34a, 36a, the second holding members 34b, 36b, and the fixture 38 are made of, for example, a fluororesin such as PTFE, PFA, PVDF, PCTFE, PEEK, etc., which has excellent chemical resistance to the processing liquid. Is formed.

移動部材26は、支持・移動機構(図示省略)により処理槽10の内部と処理槽10の上方位置との間で昇降可能である。処理槽10内で基板Wに対して処理液による洗浄・エ
ッチング等の処理を行うときは、支持・移動機構により、移動部材26は、処理槽10内に移動させられる。処理槽10の上方位置において、基板Wに対して乾燥を行うときは、支持・移動機構により、移動部材26は、処理槽10の上方位置に移動させられる。また、第1の保持部材34a、36a及び第2保持部材34b、36bは、図3に示すように、基板Wの下端縁と係合する複数の基板保持溝40a、40b、42a、42bをそれぞれ有しており、第1の保持部材34a、36a及び第2保持部材34b、36bにより、複数枚の基板Wを相互に僅かな間隔をあけて一定ピッチで水平方向に配列させて保持することができる。
The moving member 26 can be moved up and down between the inside of the processing tank 10 and the upper position of the processing tank 10 by a support / moving mechanism (not shown). When processing such as cleaning / etching with a processing solution is performed on the substrate W in the processing tank 10, the moving member 26 is moved into the processing tank 10 by the support / moving mechanism. When drying the substrate W at a position above the processing tank 10, the moving member 26 is moved to a position above the processing tank 10 by the support / movement mechanism. Further, as shown in FIG. 3, the first holding members 34a and 36a and the second holding members 34b and 36b respectively have a plurality of substrate holding grooves 40a, 40b, 42a, and 42b that engage with the lower edge of the substrate W. The first holding members 34a and 36a and the second holding members 34b and 36b can hold a plurality of substrates W arranged in a horizontal direction at a constant pitch with a slight gap therebetween. it can.

<第1の実施形態>
次に、第1の実施形態に係る基板保持具について説明する。なお、3つある基板保持枠28、30は略共通の形態をしているので、第1の実施形態においては、図2の図示方向からみて右側の基板保持枠30を一例に、以下説明する。図4は、第1の実施形態に係る基板保持具の図2の図示方向からみて右側の基板保持枠30の部分拡大図であり、図5(a)(b)は、第1の実施形態に係る基板保持具の保持部材36a、36b、図5(c)は、第1の実施形態に係る基板保持具のワッシャー37a(37b)の図である。
<First Embodiment>
Next, the substrate holder according to the first embodiment will be described. Since the three substrate holding frames 28 and 30 have a substantially common form, the first embodiment will be described below by taking the right substrate holding frame 30 as an example when viewed from the direction shown in FIG. . 4 is a partially enlarged view of the substrate holding frame 30 on the right side of the substrate holder according to the first embodiment when viewed from the direction shown in FIG. 2, and FIGS. 5A and 5B are views of the first embodiment. FIG. 5C is a view of the substrate holder washer 37a (37b) according to the first embodiment.

基板保持枠30に固設された第1の保持部材36aおよび第2の保持部材36bは、細長い薄板材からなり、図4に示すように基板保持枠30の左右両側面にそれぞれ固定具38のボルト38a及びナット38bによって固定されている。図4紙面向かって左側の第1の保持部材36aとナット38bとの間には、第1のワッシャー37aが挟みこまれている。また、図4紙面向かって右側の第2の保持部材36bとボルト38aとの間には、第2のワッシャー37bが挟みこまれている。つまり、一方向側(図4では左側)から、第1のワッシャー37a、第1の保持部材36a、基板保持枠30、第2の保持部材36b、及び第2のワッシャー37bの順番で、ボルト38a及びナット38bにより固定されている。   The first holding member 36a and the second holding member 36b fixed to the substrate holding frame 30 are made of an elongated thin plate material, and as shown in FIG. It is fixed by bolts 38a and nuts 38b. A first washer 37a is sandwiched between the first holding member 36a on the left side of FIG. 4 and the nut 38b. Further, a second washer 37b is sandwiched between the second holding member 36b on the right side of FIG. 4 and the bolt 38a. That is, from the one direction side (left side in FIG. 4), the bolts 38a in the order of the first washer 37a, the first holding member 36a, the substrate holding frame 30, the second holding member 36b, and the second washer 37b. And a nut 38b.

図4に示すように、基板保持枠30には、ボルト38a用の貫通孔30aが形成されている。この貫通孔30aは、基板保持枠30の長手方向に沿って、水平方向に4箇所形成されている(図示省略)。なお、この貫通孔30aは、本発明の第1の孔に相当する。   As shown in FIG. 4, the substrate holding frame 30 is formed with through holes 30a for bolts 38a. The through holes 30a are formed in four locations in the horizontal direction along the longitudinal direction of the substrate holding frame 30 (not shown). The through hole 30a corresponds to the first hole of the present invention.

図5(a)は、第1の実施形態に係る基板保持具の第1の保持部材36aの一部側面図を示している。この第1の保持部材36aの下部には、ボルト38a用の貫通孔36cが形成されている。この貫通孔36cは、第1の保持部材36aの長手方向に沿って、水平方向に4箇所形成されている(図示省略)。また、第1の保持部材36aにおける貫通孔36cよりも下側に直線の切欠部36eが形成されている。なお、この貫通孔36cは、本発明の第2の孔に相当する。   FIG. 5A shows a partial side view of the first holding member 36a of the substrate holder according to the first embodiment. A through hole 36c for the bolt 38a is formed in the lower portion of the first holding member 36a. The through holes 36c are formed in four locations in the horizontal direction along the longitudinal direction of the first holding member 36a (not shown). Further, a linear notch 36e is formed below the through hole 36c in the first holding member 36a. The through hole 36c corresponds to the second hole of the present invention.

図5(b)は、第1の実施形態に係る基板保持具の第2の保持部材36bの一部側面図を示している。第2の保持部材36bは、第1の保持部材36aより高さ方向にやや長い形状をしている。この第2の保持部材36bの下部には、ボルト38a用の貫通孔36dが形成されている。この貫通孔36dは、第2の保持部材36bの長手方向に沿って、水平方向に4箇所形成されている(図示省略)。また、第2の保持部材36bにおける貫通孔36dよりも下側に直線の切欠部36fが形成されている。なお、この貫通孔36dは、本発明の第2の孔に相当する。   FIG. 5B shows a partial side view of the second holding member 36b of the substrate holder according to the first embodiment. The second holding member 36b has a slightly longer shape in the height direction than the first holding member 36a. A through hole 36d for the bolt 38a is formed in the lower portion of the second holding member 36b. The through holes 36d are formed in four locations in the horizontal direction (not shown) along the longitudinal direction of the second holding member 36b. Further, a linear notch 36f is formed below the through hole 36d in the second holding member 36b. The through hole 36d corresponds to the second hole of the present invention.

図5(c)はワッシャーの側面図である。第1のワッシャー37a及び第2のワッシャー37bはともに、共通の形状をしている。この第1のワッシャー37a及び第2のワッシャー37bは、円形のリング状の形状をしている。第1のワッシャー37aの下部に直線の切欠部37cが形成され、第2のワッシャー37bの下部に直線の切欠部37dが形成されている。   FIG. 5C is a side view of the washer. Both the first washer 37a and the second washer 37b have a common shape. The first washer 37a and the second washer 37b have a circular ring shape. A straight notch 37c is formed in the lower part of the first washer 37a, and a straight notch 37d is formed in the lower part of the second washer 37b.

上述したように、第1の実施形態では、第1の保持部材36aおよび第2の保持部材36bの下部には、ボルト38a用の貫通孔36c、貫通孔36dが複数箇所形成されており、しかも第1の保持部材36aにおける貫通孔36cよりも下側に直線の切欠部36eが形成されているとともに、第2の保持部材36bにおける貫通孔36dよりも下側に直線の切欠部36fが形成されているので、貫通孔36c、貫通孔36dに処理液の液滴がたまることがない。したがって、複数枚の基板Wを乾燥させる際に、処理液の液滴が原因で発生する基板W表面における乾燥ムラを防止できる。   As described above, in the first embodiment, the lower portions of the first holding member 36a and the second holding member 36b are formed with a plurality of through holes 36c and 36d for the bolts 38a, and A straight cutout 36e is formed below the through hole 36c in the first holding member 36a, and a straight cutout 36f is formed below the through hole 36d in the second holding member 36b. Therefore, droplets of the processing liquid do not collect in the through hole 36c and the through hole 36d. Therefore, when drying the plurality of substrates W, drying unevenness on the surface of the substrate W caused by the droplets of the processing liquid can be prevented.

また、第1のワッシャー37aの下部に直線の切欠部37cが形成され、第2のワッシャー37bの下部に直線の切欠部37dが形成されているので、貫通孔36c及び貫通孔36dから切欠部37c及び切欠部37dを通って、スムーズに処理液の液滴を排出することができる。   In addition, since a straight notch 37c is formed in the lower part of the first washer 37a and a straight notch 37d is formed in the lower part of the second washer 37b, the notch 37c is formed from the through hole 36c and the through hole 36d. And the droplet of a process liquid can be discharged | emitted smoothly through the notch part 37d.

<第2の実施形態>
次に、第2の実施形態に係る基板保持具について説明する。なお、3つある基板保持枠28、30は略共通の形態をしているので、第2の実施形態においては、図2の図示方向から見て右側の基板保持枠30を一例に、以下説明する。図6は、第2の実施形態に係る基板保持具の図2の図示方向から見て右側の基板保持枠30の部分拡大図であり、図7(a)(b)は、第2の実施形態に係る基板保持具の保持部材36a、36b、図7(c)は、第2の実施形態に係る基板保持具のワッシャー37a(37b)の図である。
<Second Embodiment>
Next, a substrate holder according to the second embodiment will be described. Since the three substrate holding frames 28 and 30 have a substantially common form, in the second embodiment, the right substrate holding frame 30 as viewed from the direction shown in FIG. 2 will be described as an example. To do. 6 is a partially enlarged view of the substrate holding frame 30 on the right side when viewed from the direction shown in FIG. 2 of the substrate holder according to the second embodiment. FIGS. 7 (a) and 7 (b) are diagrams illustrating the second embodiment. The holding members 36a and 36b of the substrate holder according to the embodiment and FIG. 7C are views of the washer 37a (37b) of the substrate holder according to the second embodiment.

基板保持枠30に固設された第1の保持部材36aおよび第2の保持部材36bは、細長い薄板材からなり、図6に示すように基板保持枠30の左右両側面にそれぞれ固定具38のボルト38a及びナット38bによって固定されている。図6紙面向かって左側の第1の保持部材36aとナット38bとの間には、第1のワッシャー37aが挟みこまれている。また、図6紙面向かって右側の第2の保持部材36bとボルト38aとの間には、第2のワッシャー37bが挟みこまれている。つまり、一方向側(図6では左側)から、第1のワッシャー37a、第1の保持部材36a、基板保持枠30、第2の保持部材36b、及び第2のワッシャー37bの順番で、ボルト38a及びナット38bにより固定されている。   The first holding member 36a and the second holding member 36b fixed to the substrate holding frame 30 are made of an elongated thin plate material, and as shown in FIG. It is fixed by bolts 38a and nuts 38b. A first washer 37a is sandwiched between the first holding member 36a on the left side of FIG. 6 and the nut 38b. In addition, a second washer 37b is sandwiched between the second holding member 36b on the right side of FIG. 6 and the bolt 38a. That is, from the one direction side (left side in FIG. 6), the bolt 38a in the order of the first washer 37a, the first holding member 36a, the substrate holding frame 30, the second holding member 36b, and the second washer 37b. And a nut 38b.

図6に示すように、基板保持枠30には、ボルト38a用の貫通孔30aが形成されている。この貫通孔30aは、基板保持枠30の長手方向に沿って、水平方向に4箇所形成されている(図示省略)。なお、この貫通孔30aは、本発明の第1の孔に相当する。   As shown in FIG. 6, the substrate holding frame 30 is formed with through holes 30a for bolts 38a. The through holes 30a are formed in four locations in the horizontal direction along the longitudinal direction of the substrate holding frame 30 (not shown). The through hole 30a corresponds to the first hole of the present invention.

図7(a)は、第2の実施形態に係る基板保持具の第1の保持部材36aの一部側面図を示している。この第1の保持部材36aの下部には、ボルト38a用の貫通孔36cが形成されている。この貫通孔36cは、第1の保持部材36aの長手方向に沿って、水平方向に4箇所形成されている(図示省略)。また、第1の保持部材36aにおける貫通孔36cよりも下側に直線の切欠部36eが形成されている。なお、この貫通孔36cは、本発明の第2の孔に相当する。   FIG. 7A shows a partial side view of the first holding member 36a of the substrate holder according to the second embodiment. A through hole 36c for the bolt 38a is formed in the lower portion of the first holding member 36a. The through holes 36c are formed in four locations in the horizontal direction along the longitudinal direction of the first holding member 36a (not shown). Further, a linear notch 36e is formed below the through hole 36c in the first holding member 36a. The through hole 36c corresponds to the second hole of the present invention.

図7(b)は、第2の実施形態に係る基板保持具の第2の保持部材36bの一部側面図を示している。第2の保持部材36bは、第1の保持部材36aより高さ方向にやや長い形状をしている。この第2の保持部材36bの下部には、ボルト38a用の貫通孔36dが形成されている。この貫通孔36dは、第2の保持部材36bの長手方向に沿って、水平方向に4箇所形成されている(図示省略)。また、第2の保持部材36bにおける貫通孔36dよりも下側に直線の切欠部36fが形成されている。なお、この貫通孔36dは、本発明の第2の孔に相当する。   FIG. 7B is a partial side view of the second holding member 36b of the substrate holder according to the second embodiment. The second holding member 36b has a slightly longer shape in the height direction than the first holding member 36a. A through hole 36d for the bolt 38a is formed in the lower portion of the second holding member 36b. The through holes 36d are formed in four locations in the horizontal direction (not shown) along the longitudinal direction of the second holding member 36b. Further, a linear notch 36f is formed below the through hole 36d in the second holding member 36b. The through hole 36d corresponds to the second hole of the present invention.

図7(c)はワッシャーの側面図である。第1のワッシャー37a及び第2のワッシャー37bはともに、共通の形状をしている。この第1のワッシャー37a及び第2のワッシャー37bは、円形のリング状の形状をしている。第1のワッシャー37aの下部に直線の溝37eが形成され、第2のワッシャー37bの下部に直線の溝37fが形成されている。   FIG. 7C is a side view of the washer. Both the first washer 37a and the second washer 37b have a common shape. The first washer 37a and the second washer 37b have a circular ring shape. A straight groove 37e is formed below the first washer 37a, and a straight groove 37f is formed below the second washer 37b.

上述したように、第2の実施形態では、第1の保持部材36aおよび第2の保持部材36bの下部には、ボルト38a用の貫通孔36c、貫通孔36dが複数箇所形成されており、しかも第1の保持部材36aにおける貫通孔36cよりも下側に直線の切欠部36eが形成されているとともに、第2の保持部材36bにおける貫通孔36dよりも下側に直線の切欠部36fが形成されているので、貫通孔36c、貫通孔36dに処理液の液滴がたまることがない。したがって、複数枚の基板Wを乾燥させる際に、処理液の液滴が原因で発生する基板W表面における乾燥ムラを防止できる。   As described above, in the second embodiment, a plurality of through holes 36c and through holes 36d for the bolts 38a are formed in the lower portions of the first holding member 36a and the second holding member 36b. A straight cutout 36e is formed below the through hole 36c in the first holding member 36a, and a straight cutout 36f is formed below the through hole 36d in the second holding member 36b. Therefore, droplets of the processing liquid do not collect in the through hole 36c and the through hole 36d. Therefore, when drying the plurality of substrates W, drying unevenness on the surface of the substrate W caused by the droplets of the processing liquid can be prevented.

また、第1のワッシャー37aの下部に直線の溝37eが形成され、第2のワッシャー37bの下部に直線の溝37fが形成されているので、貫通孔36c及び貫通孔36dから溝37e及び溝37fを通って、スムーズに処理液の液滴を排出することができる。   Further, since the linear groove 37e is formed in the lower part of the first washer 37a and the linear groove 37f is formed in the lower part of the second washer 37b, the groove 37e and the groove 37f from the through hole 36c and the through hole 36d are formed. The liquid droplets of the processing liquid can be smoothly discharged through.

10 処理槽
12 リフタ(基板保持具)
14 吐出管(処理液供給手段)
16 処理液供給管(処理液供給手段)
18 排液口
20 排液管
23 供給ノズル
26 移動部材
28、30 基板保持枠
30a 貫通孔(第1の孔)
32 固定枠
34a、36a 第1の保持部材
34b,36b 第2の保持部材
36c、36d 貫通孔(第2の孔)
36e、36f 切欠部
37a 第1のワッシャー
37b 第2のワッシャー
37c、37d 切欠部
37e、37f 溝
38 固定具
38a ボルト
38b ナット
40a、40b、42a、42b 基板保持溝
W 基板
10 Treatment tank 12 Lifter (substrate holder)
14 Discharge pipe (treatment liquid supply means)
16 Treatment liquid supply pipe (treatment liquid supply means)
18 Drainage port 20 Drainage tube 23 Supply nozzle 26 Moving member 28, 30 Substrate holding frame 30a Through hole (first hole)
32 Fixed frame 34a, 36a First holding member 34b, 36b Second holding member 36c, 36d Through hole (second hole)
36e, 36f Notch 37a First washer 37b Second washer 37c, 37d Notch 37e, 37f Groove 38 Fixture 38a Bolt 38b Nut 40a, 40b, 42a, 42b Substrate holding groove W Substrate

Claims (3)

複数枚の基板を起立姿勢で配列させて保持する基板保持具において、
処理液が貯留されている処理槽の内部と前記処理槽の上方位置との間で移動可能である移動部材と、
前記移動部材に固着され、複数枚の基板の配列方向に沿って水平方向に配置された複数の基板保持枠と、
基板の下端部に接触して基板を保持する保持部材と、
前記基板保持枠に形成された第1の孔と前記保持部材に形成された第2の孔とを挿通させて、前記基板保持枠に前記保持部材を取り付ける固定具と
前記保持部材と前記固定具との間にワッシャーとを備え、
前記保持部材には、処理液を前記第2の孔よりも下側に流すための直線の切欠部が前記第2の孔から連続形成され
前記ワッシャーの下部に処理液が流れる切欠部が形成されていることを特徴とする基板保持具。
In a substrate holder that holds a plurality of substrates arranged in an upright position,
A movable member that is movable between the inside of the treatment tank in which the treatment liquid is stored and the upper position of the treatment tank;
A plurality of substrate holding frames fixed to the moving member and disposed in a horizontal direction along an arrangement direction of the plurality of substrates;
A holding member that holds the substrate in contact with the lower end of the substrate;
A fixture for attaching the holding member to the substrate holding frame by inserting the first hole formed in the substrate holding frame and the second hole formed in the holding member ;
A washer between the holding member and the fixture ;
The holding member is continuously formed with a straight cutout from the second hole for allowing the processing liquid to flow below the second hole .
A substrate holder, wherein a notch through which a processing liquid flows is formed in a lower part of the washer .
複数枚の基板を起立姿勢で配列させて保持する基板保持具において、
処理液が貯留されている処理槽の内部と前記処理槽の上方位置との間で移動可能である移動部材と、
前記移動部材に固着され、複数枚の基板の配列方向に沿って水平方向に配置された複数の基板保持枠と、
基板の下端部に接触して基板を保持する保持部材と、
前記基板保持枠に形成された第1の孔と前記保持部材に形成された第2の孔とを挿通させて、前記基板保持枠に前記保持部材を取り付ける固定具と、
前記保持部材と前記固定具との間にワッシャーと、を備え、
前記保持部材には、処理液を前記第2の孔よりも下側に流すための直線の切欠部が前記第2の孔から連続形成され、
前記ワッシャーの下部で、かつ前記保持部材側に処理液が流れる溝が形成されていることを特徴とする基板保持具。
In a substrate holder that holds a plurality of substrates arranged in an upright position,
A movable member that is movable between the inside of the treatment tank in which the treatment liquid is stored and the upper position of the treatment tank;
A plurality of substrate holding frames fixed to the moving member and disposed in a horizontal direction along an arrangement direction of the plurality of substrates;
A holding member that holds the substrate in contact with the lower end of the substrate;
A fixture for attaching the holding member to the substrate holding frame by inserting the first hole formed in the substrate holding frame and the second hole formed in the holding member;
A washer between the holding member and the fixture ,
The holding member is continuously formed with a straight cutout from the second hole for allowing the processing liquid to flow below the second hole.
A substrate holder, wherein a groove through which a processing solution flows is formed below the washer and on the holding member side.
処理液に浸漬させて基板を処理する基板処理装置において、
処理液を貯留する処理槽と、
前記処理槽に処理液を供給する処理液供給手段と、
請求項1または請求項に記載の基板保持具とを備えることを特徴とする基板処理装置。
In a substrate processing apparatus for processing a substrate by immersing it in a processing solution,
A treatment tank for storing the treatment liquid;
Treatment liquid supply means for supplying a treatment liquid to the treatment tank;
A substrate processing apparatus, characterized in that it comprises a substrate holder according to claim 1 or claim 2.
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