JP5863614B2 - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP5863614B2
JP5863614B2 JP2012215592A JP2012215592A JP5863614B2 JP 5863614 B2 JP5863614 B2 JP 5863614B2 JP 2012215592 A JP2012215592 A JP 2012215592A JP 2012215592 A JP2012215592 A JP 2012215592A JP 5863614 B2 JP5863614 B2 JP 5863614B2
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Japan
Prior art keywords
phase
current
electric motor
polishing
polishing apparatus
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JP2012215592A
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English (en)
Japanese (ja)
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JP2014069256A5 (enExample
JP2014069256A (ja
Inventor
篠崎　弘行
弘行 篠崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
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Priority to JP2012215592A priority Critical patent/JP5863614B2/ja
Priority to TW102134253A priority patent/TWI530360B/zh
Priority to KR1020130115603A priority patent/KR20140042748A/ko
Priority to US14/040,449 priority patent/US9132525B2/en
Priority to CN201310450332.5A priority patent/CN103707173B/zh
Publication of JP2014069256A publication Critical patent/JP2014069256A/ja
Publication of JP2014069256A5 publication Critical patent/JP2014069256A5/ja
Application granted granted Critical
Publication of JP5863614B2 publication Critical patent/JP5863614B2/ja
Priority to KR1020160023436A priority patent/KR101925675B1/ko
Priority to KR1020160096928A priority patent/KR101899210B1/ko
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012215592A 2012-09-28 2012-09-28 研磨装置 Active JP5863614B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012215592A JP5863614B2 (ja) 2012-09-28 2012-09-28 研磨装置
TW102134253A TWI530360B (zh) 2012-09-28 2013-09-24 研磨裝置
US14/040,449 US9132525B2 (en) 2012-09-28 2013-09-27 Polishing apparatus for flattening surface of workpiece
CN201310450332.5A CN103707173B (zh) 2012-09-28 2013-09-27 研磨装置
KR1020130115603A KR20140042748A (ko) 2012-09-28 2013-09-27 연마 장치
KR1020160023436A KR101925675B1 (ko) 2012-09-28 2016-02-26 연마 장치
KR1020160096928A KR101899210B1 (ko) 2012-09-28 2016-07-29 연마 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012215592A JP5863614B2 (ja) 2012-09-28 2012-09-28 研磨装置

Publications (3)

Publication Number Publication Date
JP2014069256A JP2014069256A (ja) 2014-04-21
JP2014069256A5 JP2014069256A5 (enExample) 2015-11-12
JP5863614B2 true JP5863614B2 (ja) 2016-02-16

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JP2012215592A Active JP5863614B2 (ja) 2012-09-28 2012-09-28 研磨装置

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JP (1) JP5863614B2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170282325A1 (en) * 2014-09-02 2017-10-05 Ebara Corporation End point detection method, polishing apparatus, and polishing method
US10744617B2 (en) 2015-10-16 2020-08-18 Ebara Corporation Polishing endpoint detection method
US11260499B2 (en) 2015-10-16 2022-03-01 Ebara Corporation Polishing apparatus and polishing method
US12131923B2 (en) 2017-10-31 2024-10-29 Ebara Corporation Polishing apparatus and polishing method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6377463B2 (ja) * 2014-09-02 2018-08-22 株式会社荏原製作所 終点検出方法、及び、研磨装置
JP6727761B2 (ja) * 2015-05-15 2020-07-22 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7403213B2 (ja) * 2017-10-31 2023-12-22 株式会社荏原製作所 研磨装置、及び研磨方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2607267B2 (ja) * 1988-05-11 1997-05-07 不二越機械工業株式会社 研磨量検出方法と自動定寸研磨機
JPH10180625A (ja) * 1996-12-26 1998-07-07 Toshiba Corp 研磨方法および研磨装置
JPH10202523A (ja) * 1997-01-22 1998-08-04 Ebara Corp ポリッシングの終点検知方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170282325A1 (en) * 2014-09-02 2017-10-05 Ebara Corporation End point detection method, polishing apparatus, and polishing method
US10759019B2 (en) * 2014-09-02 2020-09-01 Ebara Corporation End point detection method, polishing apparatus, and polishing method
US20200346318A1 (en) * 2014-09-02 2020-11-05 Ebara Corporation End point detection method, polishing apparatus, and polishing method
US12285836B2 (en) * 2014-09-02 2025-04-29 Ebara Corporation End point detection method, polishing apparatus, and polishing method
US10744617B2 (en) 2015-10-16 2020-08-18 Ebara Corporation Polishing endpoint detection method
US11260499B2 (en) 2015-10-16 2022-03-01 Ebara Corporation Polishing apparatus and polishing method
US12131923B2 (en) 2017-10-31 2024-10-29 Ebara Corporation Polishing apparatus and polishing method

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Publication number Publication date
JP2014069256A (ja) 2014-04-21

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