JP5847754B2 - 感光性樹脂構造体、ドライフィルム、及びフレキシブルプリント配線板 - Google Patents

感光性樹脂構造体、ドライフィルム、及びフレキシブルプリント配線板 Download PDF

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Publication number
JP5847754B2
JP5847754B2 JP2013087826A JP2013087826A JP5847754B2 JP 5847754 B2 JP5847754 B2 JP 5847754B2 JP 2013087826 A JP2013087826 A JP 2013087826A JP 2013087826 A JP2013087826 A JP 2013087826A JP 5847754 B2 JP5847754 B2 JP 5847754B2
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Japan
Prior art keywords
photosensitive resin
printed wiring
wiring board
flexible printed
developable
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JP2013087826A
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English (en)
Japanese (ja)
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JP2014211540A5 (enExample
JP2014211540A (ja
Inventor
宮部　英和
英和 宮部
亮 林
亮 林
直之 小池
直之 小池
横山　裕
裕 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
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Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Priority to JP2013087826A priority Critical patent/JP5847754B2/ja
Priority to KR1020157028866A priority patent/KR102229343B1/ko
Priority to PCT/JP2014/060986 priority patent/WO2014171525A1/ja
Priority to CN201480021937.5A priority patent/CN105164585B/zh
Priority to TW103114237A priority patent/TWI614571B/zh
Publication of JP2014211540A publication Critical patent/JP2014211540A/ja
Publication of JP2014211540A5 publication Critical patent/JP2014211540A5/ja
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Publication of JP5847754B2 publication Critical patent/JP5847754B2/ja
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  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
JP2013087826A 2013-04-18 2013-04-18 感光性樹脂構造体、ドライフィルム、及びフレキシブルプリント配線板 Active JP5847754B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013087826A JP5847754B2 (ja) 2013-04-18 2013-04-18 感光性樹脂構造体、ドライフィルム、及びフレキシブルプリント配線板
KR1020157028866A KR102229343B1 (ko) 2013-04-18 2014-04-17 적층 구조체, 플렉시블 프린트 배선판 및 그의 제조 방법
PCT/JP2014/060986 WO2014171525A1 (ja) 2013-04-18 2014-04-17 積層構造体、フレキシブルプリント配線板及びその製造方法
CN201480021937.5A CN105164585B (zh) 2013-04-18 2014-04-17 层叠结构体、柔性印刷电路板及其制造方法
TW103114237A TWI614571B (zh) 2013-04-18 2014-04-18 層合構造物、可撓性印刷配線板及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013087826A JP5847754B2 (ja) 2013-04-18 2013-04-18 感光性樹脂構造体、ドライフィルム、及びフレキシブルプリント配線板

Publications (3)

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JP2014211540A JP2014211540A (ja) 2014-11-13
JP2014211540A5 JP2014211540A5 (enExample) 2015-03-26
JP5847754B2 true JP5847754B2 (ja) 2016-01-27

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JP2013087826A Active JP5847754B2 (ja) 2013-04-18 2013-04-18 感光性樹脂構造体、ドライフィルム、及びフレキシブルプリント配線板

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102562958B1 (ko) * 2015-08-05 2023-08-04 다이요 홀딩스 가부시키가이샤 적층 구조체, 드라이 필름 및 플렉시블 프린트 배선판
CN105549160A (zh) * 2015-11-27 2016-05-04 青岛海信宽带多媒体技术有限公司 一种光模块
WO2023188296A1 (ja) * 2022-03-31 2023-10-05 株式会社レゾナック 感光性多層樹脂フィルム、プリント配線板、半導体パッケージ及びプリント配線板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3966743B2 (ja) * 2002-02-28 2007-08-29 三井化学株式会社 多層感光性樹脂フィルム及びそれからなる絶縁膜
JP2005300857A (ja) * 2004-04-09 2005-10-27 Fuji Photo Film Co Ltd 感光性転写シート、感光性積層体、画像パターン形成方法、及び配線パターン形成方法
JP2009025699A (ja) * 2007-07-23 2009-02-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、および、プリント配線板の製造方法
JP2009048170A (ja) * 2007-07-24 2009-03-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、及び、プリント配線板の製造方法
JP2010204174A (ja) * 2009-02-27 2010-09-16 Fujifilm Corp 感光性積層体及び感光性フィルム、並びに、プリント基板の製造方法

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JP2014211540A (ja) 2014-11-13

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