JP5843857B2 - 熱界面材料の性能を高めるための方法及びシステム - Google Patents
熱界面材料の性能を高めるための方法及びシステム Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 23
- 230000002708 enhancing effect Effects 0.000 title 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 134
- 239000010439 graphite Substances 0.000 claims description 132
- 229910002804 graphite Inorganic materials 0.000 claims description 132
- 239000002121 nanofiber Substances 0.000 claims description 102
- 229910052751 metal Inorganic materials 0.000 claims description 101
- 239000002184 metal Substances 0.000 claims description 101
- 230000003197 catalytic effect Effects 0.000 claims description 35
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- 238000005338 heat storage Methods 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
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- 230000007704 transition Effects 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000012188 paraffin wax Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
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- 239000000155 melt Substances 0.000 description 2
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 239000011232 storage material Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007036 catalytic synthesis reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
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- 238000001523 electrospinning Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
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- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
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- 238000003786 synthesis reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/20—Graphite
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/20—Graphite
- C01B32/21—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Carbon And Carbon Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
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Description
を参照して理解され、添付の特許請求の範囲で詳細に示される種々の要素及び組合せによって実現される。上記の全般的な説明、及び、以下の図面の簡単な説明及び発明の詳細な説明は、両方とも、本発明の好ましい実施形態の例示及び説明であり、特許請求される発明を限定するものではないことを理解されたい。
11:金属コア・グラファイト・ナノファイバ
12:触媒金属シード
13:グラファイト小板
21、23:物体
Claims (16)
- 熱界面材料中のグラファイト・ナノファイバを整列させて前記熱界面材料の性能を高めるための方法であって、
前記グラファイト・ナノファイバを、磁性触媒シードの周囲で所定配置を取るグラファイト粒子から作成することと、
前記グラファイト・ナノファイバを熱界面材料中に分散させることと、
前記熱界面材料中の前記グラファイト・ナノファイバを整列させるのに十分な強度の磁界を印加することと
前記グラファイト・ナノファイバを作成することが、
前記グラファイト粒子の堆積に先立って、磁性触媒金属シードを整列させるのに十分な強度の第1の磁界を印加することと、
前記磁性触媒金属シードの周囲に配置されたグラファイト粒子から前記グラファイト・ナノファイバを作成することと
を含む、方法。 - 前記磁性触媒シードは、金属である、請求項1に記載の方法。
- 前記熱界面材料をシート型にキャストすることと、
前記熱界面材料を所望のフットプリントに切断することと
を含む、請求項1または2に記載の方法。 - 前記グラファイト粒子は、前記グラファイト・ナノファイバ内で前記磁性触媒金属シードの周囲で矢筈状配置を取る、請求項1〜3のいずれか1項に記載の方法。
- 前記グラファイト・ナノファイバは、前記グラファイト・ナノファイバの伝導軸に沿って整列する、請求項1〜4のいずれか1項に記載の方法。
- 前記グラファイト・ナノファイバは、前記熱界面材料の嵌合面に対して垂直に整列する、請求項1〜4のいずれか1項に記載の方法。
- 前記熱界面材料中の前記グラファイト・ナノファイバは、相変化基材の量を基準として4乃至10重量パーセントの範囲内にある、請求項1〜6のいずれか1項に記載の方法。
- 前記熱界面材料中の前記グラファイト・ナノファイバは、5重量パーセントである、請求項1〜7のいずれか1項に記載の方法。
- 熱界面材料中のグラファイト・ナノファイバを整列させて前記熱界面材料の性能を高めるためのシステムであって、
前記グラファイト・ナノファイバを、磁性触媒シードの周囲で所定配置を取るグラファイト粒子から作成するための手段と、
前記グラファイト・ナノファイバを前記熱界面材料中に分散させるための手段と、
前記熱界面材料中の前記グラファイト・ナノファイバを整列するのに十分な強度の磁界を印加するための手段と
を備え、
前記グラファイト・ナノファイバを作成するための手段は、
前記グラファイト粒子の堆積に先立って、磁性触媒金属シードを整列させるのに十分な強度の第1の磁界を印加し、前記磁性触媒金属シードの周囲に配置されたグラファイト粒子から前記グラファイト・ナノファイバを作成することを特徴とする、システム。 - 前記磁性触媒シードは、金属である、請求項9に記載のシステム。
- 前記熱界面材料をシート型にキャストするための手段と、
前記熱界面材料を所望のフットプリントに切断するための手段と
を備える、請求項9または10に記載のシステム。 - 前記グラファイト粒子は、前記グラファイト・ナノファイバ内で前記磁性触媒金属シードの周囲で矢筈状配置を取る、請求項9〜11のいずれか1項に記載のシステム。
- 前記グラファイト・ナノファイバは、前記グラファイト・ナノファイバの伝導軸に沿って整列する、請求項9〜12のいずれか1項に記載のシステム。
- 前記グラファイト・ナノファイバは、前記熱界面材料の嵌合面に対して垂直に整列する、請求項9〜12のいずれか1項に記載のシステム。
- 前記熱界面材料中の前記グラファイト・ナノファイバは、相変化基材の量を基準として4乃至10重量パーセントの範囲内にある、請求項9〜14のいずれか1項に記載のシステム。
- 前記熱界面材料中の前記グラファイト・ナノファイバは、5重量パーセントである、請求項9〜15のいずれか1項に記載のシステム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US12/842,200 | 2010-07-23 | ||
US12/842,200 US8431048B2 (en) | 2010-07-23 | 2010-07-23 | Method and system for alignment of graphite nanofibers for enhanced thermal interface material performance |
PCT/EP2011/061063 WO2012010395A2 (en) | 2010-07-23 | 2011-06-30 | Alignment of graphite nanofibers in thermal interface material |
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JP2013534363A JP2013534363A (ja) | 2013-09-02 |
JP5843857B2 true JP5843857B2 (ja) | 2016-01-13 |
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Country Status (6)
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US (1) | US8431048B2 (ja) |
JP (1) | JP5843857B2 (ja) |
CN (1) | CN103025653B (ja) |
DE (1) | DE112011101746B4 (ja) |
GB (1) | GB2498464B (ja) |
WO (1) | WO2012010395A2 (ja) |
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US9111899B2 (en) * | 2012-09-13 | 2015-08-18 | Lenovo | Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks |
EP2917299A4 (en) | 2012-11-09 | 2016-06-29 | Bioastra Technologies Inc | NANOSTRUCTURED PHASE SWITCHING MATERIALS FOR SOLID WATER HEAT MANAGEMENT |
US9090004B2 (en) | 2013-02-06 | 2015-07-28 | International Business Machines Corporation | Composites comprised of aligned carbon fibers in chain-aligned polymer binder |
WO2014149189A1 (en) * | 2013-03-15 | 2014-09-25 | Graftech International Holdings Inc. | Thermal interfaces |
US10373891B2 (en) | 2013-06-14 | 2019-08-06 | Laird Technologies, Inc. | Methods for establishing thermal joints between heat spreaders or lids and heat sources |
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US20080291634A1 (en) * | 2007-05-22 | 2008-11-27 | Weiser Martin W | Thermal interconnect and interface materials, methods of production and uses thereof |
JP5361162B2 (ja) * | 2007-09-28 | 2013-12-04 | 株式会社東芝 | グラファイトナノチューブの製造方法 |
WO2009075320A1 (ja) * | 2007-12-11 | 2009-06-18 | Sumitomo Electric Industries, Ltd. | 冷却デバイスとその製造方法 |
JP2009246258A (ja) | 2008-03-31 | 2009-10-22 | Nikon Corp | 半導体装置および製造方法 |
US8075794B2 (en) * | 2008-07-01 | 2011-12-13 | Teledyne Scientific & Imaging, Llc | Magnetic graphite nanoplatelets |
JP2010034254A (ja) | 2008-07-29 | 2010-02-12 | Mitsubishi Chemicals Corp | 三次元lsi |
JP2010050259A (ja) | 2008-08-21 | 2010-03-04 | Zycube:Kk | 3次元積層半導体装置 |
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GB201302341D0 (en) | 2013-03-27 |
US8431048B2 (en) | 2013-04-30 |
CN103025653B (zh) | 2015-11-25 |
WO2012010395A3 (en) | 2012-04-26 |
DE112011101746B4 (de) | 2021-08-12 |
DE112011101746T8 (de) | 2013-06-06 |
GB2498464A (en) | 2013-07-17 |
GB2498464B (en) | 2017-10-25 |
JP2013534363A (ja) | 2013-09-02 |
DE112011101746T5 (de) | 2013-03-21 |
WO2012010395A2 (en) | 2012-01-26 |
CN103025653A (zh) | 2013-04-03 |
US20120018666A1 (en) | 2012-01-26 |
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