JP5832909B2 - WIRING DEFECT DETECTION DEVICE HAVING INFRARED CAMERA AND ABNORMALITY DETECTING METHOD FOR DETECTING ABNORMALITY OF THE IR - Google Patents

Description

  The present invention relates to a wiring defect detection device equipped with an infrared camera, suitable for detecting defects in wiring formed on panels such as liquid crystal panels and solar battery panels, and an abnormality detection method for detecting abnormality of the infrared camera. .

  For example, the liquid crystal panel manufacturing process includes, for example, an array (TFT) process, a cell (liquid crystal) process, and a module process. Among these, in the array process, after a gate electrode, a semiconductor film, a source / drain electrode, a protective film, and a transparent electrode are formed on a transparent substrate, an array defect inspection is performed, and a short circuit such as an electrode or a wiring The presence of defects such as disconnection is inspected.

  In general, for array defect inspection, a method is used in which a probe is brought into contact with an end portion of a wiring, and an electric resistance at both ends of the wiring and an electric resistance and / or capacitance between adjacent wirings are measured. However, even if the presence or absence of a defect in the wiring portion can be detected in the array defect inspection by this method, it is not easy to specify the position of the defect. As an example of an inspection method for identifying the position of a defect, there is a visual inspection in which an operator observes and identifies a substrate with a microscope, but this inspection method is burdensome to the operator, and it is difficult to determine the defect visually. Sometimes the position of the defect was wrong.

  For this reason, infrared inspection has been proposed in which a substrate is photographed with an infrared camera, image processing is performed, and a defect position is specified.

  Patent Document 1 relates to an infrared inspection. As shown in FIG. 13, in a thin film transistor liquid crystal substrate, a short circuit defect 803 is generated by applying a voltage V between scanning lines 811 to 815 and signal lines 821 to 825. Cause heat. On the other hand, the scanning lines 811 to 815 and the signal lines 821 to 825 are detected with an infrared microscope along the broken line 806 before and after voltage application, and the difference between the detected image signals is taken and projected in the X and Y directions. A technique for specifying the pixel address of the short-circuit defect 803 by calculating the above is disclosed.

  In recent years, many apparatuses equipped with relatively large panels (for example, 60-type liquid crystal panels) have been distributed, and the manufacture of large panels has become active. In the production line, as described above, there is a method of inspecting a defect of one large panel using a plurality of infrared cameras in order to inspect the defect of the wiring portion.

  As a method using a plurality of infrared cameras, Patent Document 2 discloses a method of monitoring an object surface temperature abnormality by photographing right and left sides of an object surface using two infrared cameras. ing.

  By the way, in the defect inspection apparatus using the infrared camera as described above, if the infrared camera itself, more specifically, the light receiving area of the infrared camera is contaminated, accurate defect detection cannot be performed, and the panel There is a risk of product failure. Therefore, as a maintenance of the defect inspection apparatus, there is one in which a mechanism for detecting the presence or absence of dirt on the infrared camera is mounted.

  Patent Document 3 discloses a technique in which a mechanism for detecting the presence or absence of dirt on an infrared camera is mounted, although it is not a panel wiring defect device. Patent Document 3 discloses an abnormality detection device for an imaging device that detects whether there is an abnormality in an imaging device that is mounted on a vehicle and images the periphery of the vehicle. The abnormality detection device of this imaging device calculates a luminance variance value for calculating a luminance dispersion value of an image for each of a plurality of imaging devices based on a luminance value of an image of each of the plurality of imaging devices obtained by imaging of the plurality of imaging devices. And an abnormality detecting means for detecting presence / absence of abnormality of the imaging device in accordance with the plurality of luminance dispersion values calculated by the luminance dispersion value calculating means.

Japanese Patent Laid-Open No. 6-51011 (published February 25, 1994) Japanese Patent Laid-Open No. 11-6769 (published on January 12, 1999) JP 2006-157740 A (released on June 15, 2006)

  However, in the configuration of Patent Document 3, the plurality of imaging devices are in a state in which the optical axes are parallel to each other and are fixed so as to have the same height from the ground surface, and thus different objects among the plurality of infrared sensors. May not be able to correctly determine the presence or absence of dirt.

  The present invention has been made in view of the above-described problems, and its purpose is to detect wiring defects and to appropriately detect abnormalities in the plurality of infrared cameras in wiring defect detection in which a plurality of infrared cameras are mounted. Provided are a wiring defect detection device capable of detecting a wiring defect with higher inspection reliability than the conventional configuration, and an abnormality detection method for detecting an abnormality of the infrared camera. There is.

  Therefore, the inventors of the present application have found that the above-mentioned object is realized by inspecting a plurality of infrared cameras for abnormality under the same conditions.

That is, the wiring defect detection device according to the present invention is to solve the above problems,
A wiring defect detection device for detecting defects in a wiring provided in the panel by providing a plurality of infrared cameras, and each of the plurality of infrared cameras obtaining an infrared image of a partial region of the panel. There,
A partial image corresponding to the overlapping region in the infrared image obtained from each of the at least two infrared cameras when the fields of view of at least two of the infrared cameras overlap each other at least partially; On the basis of this, it is further characterized by further comprising determination means for determining whether or not there is an abnormality in the at least two infrared cameras.

  According to the above configuration, for each of at least two infrared cameras, it is determined whether or not there is an abnormality in the at least two infrared cameras by using the overlapping visual field region images. In other words, by imaging the same region in this way, it is possible to detect abnormalities in the infrared camera with higher accuracy than in the case of the conventional configuration in which different objects are in the field of view among multiple infrared cameras. Can do.

  Moreover, according to said structure, since the comparison of the pixel unit of an infrared camera is attained, abnormality detection sensitivity improves.

In addition to the above configuration, the wiring defect detection device according to the present invention includes:
Moving means for moving the plurality of infrared cameras;
It is preferable that the at least two infrared cameras further include control means for controlling the moving means so as to change the field of view between the detection and the determination.

  According to the above configuration, the moving unit is controlled so that the arrangement of the plurality of infrared cameras is different between when detecting a wiring defect and when determining whether there is an abnormality in the infrared camera. Control means is provided. For this reason, when detecting a wiring defect, it is necessary to determine whether there is an abnormality in the infrared camera even if the plurality of infrared cameras are configured to capture different areas. The overlapping area can be imaged by moving the camera by the moving means. In other words, according to the above-described configuration, since the plurality of infrared cameras can detect the defect of the wiring by imaging all the different visual fields, it is possible to efficiently detect the wiring defect and It is possible to accurately detect abnormalities in the outside camera.

In addition to the above configuration, the wiring defect detection device according to the present invention includes:
The control means preferably controls the moving means so that the centers of the fields of view of the at least two infrared cameras coincide when making the determination.

  According to the above configuration, the moving means is controlled so that the centers of the visual fields of the at least two infrared cameras coincide with each other, so that most of the visual fields of the at least two infrared cameras are used for the determination as overlapping regions. Therefore, a wide area for detecting an abnormality can be secured.

In addition to the above configuration, the wiring defect detection device according to the present invention includes:
When performing the detection, it is preferable that the visual fields of the at least two infrared cameras overlap at least partially.

  According to the above configuration, there is no need to change the position of the infrared camera between the case of detecting a wiring defect and the case of determining an abnormality of the infrared camera. Therefore, defect detection and abnormality determination can be performed without increasing the interval.

In addition to the above configuration, the wiring defect detection device according to the present invention includes:
When the partial image of each of the at least two infrared cameras includes an abnormal image derived from heat generated by any of the at least two infrared cameras, the partial image It is preferable that the determination is performed by comparing images corresponding to regions common to the at least two infrared cameras among the visual field regions corresponding to the trimmed image obtained by trimming the abnormal image.

  For example, when the panel is imaged with an infrared camera, the image itself may be reflected depending on the arrangement position of the infrared camera. When the infrared camera generates heat by driving, the heat is reflected by the panel, and an image is formed as if the panel is generating heat in the infrared image. This is the same even when the presence or absence of an abnormality of the infrared camera is determined. The infrared camera heat is reflected on the imaging target, and an abnormal image derived from the heat is formed on a part of the infrared image. Is done. Such an abnormal image is a cause of erroneous determination that there is dirt (abnormality) in determining whether there is an abnormality in the infrared camera. Therefore, according to the above-described configuration of the present invention, such an abnormal image is trimmed off, and an infrared image is obtained using a portion corresponding to the field of view common to each camera in the trimmed image (trimmed image). Determine whether the camera is abnormal. Therefore, there is no possibility of erroneously determining that there is an abnormality as described above (there is dirt), and highly reliable detection can be realized. Such reflection often occurs when the axis passing through the center of the field of view of the infrared camera is positioned perpendicular to the imaging target surface.

  The same applies to the case where the heat of another infrared camera is reflected on a certain infrared camera via the panel. Such reflection often occurs when the axis passing through the axis passing through the center of the field of view of the certain infrared camera is inclined at a predetermined angle that is not perpendicular to the imaging target surface.

Moreover, in order to solve the above-described problem, the infrared camera abnormality detection method according to the present invention,
A camera abnormality detection method for detecting an abnormality of the infrared camera of the wiring defect detection device having the above-described configuration,
A partial image corresponding to the overlapping region in the infrared image obtained from each of the at least two infrared cameras when the fields of view of at least two of the infrared cameras overlap each other at least partially; Based on this, the method includes a determination step of determining whether or not there is an abnormality in the at least two infrared cameras.

  According to the above configuration, for each of at least two infrared cameras, it is determined whether or not there is an abnormality in the at least two infrared cameras by using the overlapping visual field region images. In other words, by imaging the same region in this way, it is possible to detect abnormalities in the infrared camera with higher accuracy than in the case of the conventional configuration in which different objects are in the field of view among multiple infrared cameras. Can do.

  Moreover, according to said structure, since the comparison of the pixel unit of an infrared camera is attained, abnormality detection sensitivity improves.

  According to the present invention, in detecting a wiring defect in which a plurality of infrared cameras are mounted for detecting a wiring defect, an abnormality of the plurality of infrared cameras can be appropriately detected, and therefore, inspection reliability is higher than that of the conventional configuration. It is possible to provide a wiring defect detection device capable of realizing high wiring defect detection and an abnormality detection method for detecting abnormality of the infrared camera.

It is a block diagram which shows the main structures of the defect inspection apparatus which concerns on one Embodiment of this invention. It is a perspective view of the defect inspection apparatus which concerns on one Embodiment of this invention. It is a top view showing the imaging visual field of each infrared camera which comprises a macro sensor. It is a top view showing the imaging field of view of each infrared camera which constitutes a macro sensor when performing dirt detection. It is the figure which showed the flow which performs the detection of dirt. It is a figure of the state in which the heat which another infrared camera emitted in a certain infrared camera was reflected. It is a top view of a liquid crystal panel and a probe. It is the figure which showed the flow which detects a short circuit defect by an infrared test. It is a schematic diagram which shows the defect of a pixel part. In other embodiment of this invention, it is a top view showing the imaging visual field of each infrared camera which comprises a macro sensor when performing the detection of dirt. In other embodiment of this invention, it is the figure which showed the flow which detects a stain | pollution | contamination. It is a figure which shows another embodiment of this invention. It is a figure which shows a prior art.

Embodiment 1
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the present embodiment, by photographing the entire surface of the liquid crystal panel using a plurality of infrared sensors, the trouble of scanning the scanning lines and signal lines with the infrared sensor can be saved, and the time required for defect inspection can be shortened. A defect inspection apparatus capable of appropriately detecting an abnormality in the plurality of infrared sensors and realizing a defect detection with higher inspection reliability than the conventional configuration, and the infrared sensor An abnormality detection method for detecting an abnormality will be described.

  FIG. 1 is a block diagram showing a main configuration of a defect inspection apparatus 100 according to one embodiment. The defect inspection apparatus 100 inspects short-circuit defects such as wirings one by one for a plurality of liquid crystal panels 2 formed on the mother substrate 1 one by one, and includes an infrared sensor 3, a sensor moving means 4, a main control. Unit 5, voltage application unit 6, data storage unit 7, probe 8, and probe moving means 9. Here, the main control unit 5 is a control unit that controls the probe moving unit 9, the infrared sensor 3, the sensor moving unit 4, and the voltage application unit 6, and a determination unit that performs abnormality determination of an infrared camera to be described later. But there is. The voltage application unit 6 is electrically connected to the probe 8 and applies a voltage to the scanning lines and signal lines of the liquid crystal panel 2. The data storage unit 7 is connected to the main control unit 5 and stores image data.

  FIG. 2 is a perspective view showing the defect inspection apparatus 100 according to the present embodiment. The defect inspection apparatus 100 includes a substrate alignment stage 11, an alignment camera 12, and an optical camera 13 in addition to the main components shown in FIG. Details of the defect inspection apparatus 100 will be described with reference to FIGS. 1 and 2.

  A mother substrate 1 is placed on the substrate alignment stage 11 by a substrate moving means (not shown), and the position of the mother substrate 1 is adjusted. The alignment camera 12 is installed above the substrate alignment stage 11 and is controlled by the main control unit 5 to confirm the position of the mother substrate 1. The optical camera 13 is controlled by the main control unit 5 and is used for photographing a short-circuit defect detected by the infrared sensor 3 as a visible image. The optical camera 13 can also be used to photograph the probe 8 and perform alignment.

  Here, the probe 8 is for applying a voltage to the scanning line and the signal line of the liquid crystal panel 2, and the probe moving means 9 sequentially moves the plurality of liquid crystal panels 2 formed on the mother substrate 1 one by one. In order to perform various inspections, the probes 8 are moved so that the probes 8 come into contact with the terminal portions of the liquid crystal panels 2 to be inspected. The probe moving means 9 includes a probe holding portion 9a, a gantry guide rail 9b, an upper and lower guide rail 9c, a guide holding portion 9d, and a shift guide rail 9e. The gantry guide rail 9b, the upper and lower guide rails 9c, and the shift guide rail 9e can move the probe 8 independently along the longitudinal direction of each guide rail. The XYZ coordinate system shown in FIG. 2 has a longitudinal direction of a shift guide rail 9e described later as an X-axis direction, a longitudinal direction of a gantry guide rail 9b as a Y-axis direction, and a longitudinal direction of the upper and lower guide rails 9c as a Z-axis direction. The probe holding portion 9a holds the probe 8 and is slidably installed in the Y axis direction of the gantry guide rail 9b. The upper and lower guide rails 9c are attached so that the gantry guide rail 9b is slidable in the Z axis direction. The guide holding portion 9d holds the upper and lower guide rails 9c and is installed to be slidable in the X-axis direction of the shift guide rail 9e.

  The infrared sensor 3 is for acquiring an infrared image of the liquid crystal panel 2 and includes a macro sensor 3a and a micro sensor 3b. The macro sensor 3a includes four infrared cameras (a plurality of infrared cameras). The field of view can be expanded by combining the imaging areas of the four infrared cameras, and the entire surface of the liquid crystal panel 2 can be photographed at once. . The macro sensor 3a will be described in detail later. Further, the microsensor 3b includes one infrared camera, and can localize the liquid crystal panel 2 in the field of view.

  The sensor moving means 4 moves the infrared sensor 3 onto the liquid crystal panel 2, and includes the sensor holding portions 4a, 4b, 4c, the shift guide rail 4d, the guide holding portion 4e, and the gantry guide rail 4f. Prepare. The sensor holding unit 4a holds the macro sensor 3a, the sensor holding unit 4b holds the microsensor 3b, and the sensor holding unit 4c holds the optical camera 13. The sensor holding portions 4a to 4c are slidably installed on the shift guide rail 4d. The shift guide rail 4d is installed such that its longitudinal direction is parallel to the Y axis, and is held by the guide holding portion 4e. The guide holding part 4e is slidably installed on the gantry guide rail 4f. The gantry guide rail 4f is installed such that its longitudinal direction is parallel to the X axis.

  The probe moving unit 9 and the sensor moving unit 4 have separate guide rails, and can move above the substrate alignment stage 11 without interfering with each other. Therefore, the macro sensor 3a, the micro sensor 3b, and the optical camera 13 can be further moved on the liquid crystal panel 2 in a state where the probe 8 is in contact with the liquid crystal panel 2.

  Hereinafter, the macro sensor 3a composed of four infrared cameras will be described in detail.

  FIG. 3 shows the positional relationship between the liquid crystal panel 2 and the imaging fields of the four infrared cameras when the entire liquid crystal panel 2 is imaged with the imaging fields of the four infrared cameras of the macro sensor 3a. It is a schematic diagram. As shown in FIG. 3, the size of the imaging field of view and the position of the infrared camera are adjusted so that each infrared camera overlaps with a part of the imaging field of the other three cameras in a part of the imaging field of view. Has been. Therefore, the surface of the liquid crystal panel 2 can be imaged without omission and the defect can be detected without omission.

  By the way, in order to detect a defect without omission, in addition to the above-described adjustment of the allocation of the imaging field, the infrared camera itself exhibits its original imaging performance. For example, if something is attached to the light-receiving path such as a lens of an infrared camera or there is a scratch (hereinafter collectively referred to as “dirt”), the light may be blocked. Even if the allocation of the imaging field of view is adjusted appropriately, there is a risk of missing a defect. Therefore, the present invention includes a mechanism for detecting whether or not the light receiving path of the infrared camera is contaminated and performing maintenance so that the infrared camera itself can exhibit its original imaging performance. Specifically, in the present embodiment, the four infrared cameras constituting the macro sensor 3 a are in the state (period) in which the liquid crystal panel (mother substrate) is not arranged on the substrate alignment stage 11. To detect whether each of the four infrared cameras is dirty.

  As a characteristic point in the present embodiment, the four confirmation positions R of the substrate alignment stage 11 are matched with the respective imaging centers of the four infrared cameras constituting the macro sensor 3a. By changing the arrangement of the infrared cameras, each infrared camera images the same region. Thereby, since each infrared camera will image | photograph on the same imaging | photography conditions, the presence or absence of dirt can be detected correctly. FIG. 4 is a schematic diagram for explaining this condition. As shown in FIG. 4, in this embodiment, the imaging centers of all four infrared cameras are aligned with a certain position of the substrate alignment stage 11. As a result, the same object falls within the field of view of all four infrared cameras.

  FIG. 5 is a diagram showing a flow for checking the abnormality of the infrared camera in the absence of the mother board.

  In S31 (Step 31 is referred to as S31. The same applies hereinafter), one infrared camera 331 of the macro sensor 3a is moved to a predetermined confirmation position R on the substrate alignment stage 11 (FIG. 2), and an infrared image is obtained. Image P1. The infrared image P1 is temporarily stored in the data storage unit 7 (FIG. 1).

  In S32, following S31, an infrared camera 332 different from the previous one is moved to the confirmation position R, and an infrared image P2 is captured. The infrared image P2 is temporarily stored in the data storage unit 7 (FIG. 1).

  In S33, following S32, another infrared camera 333 is moved to the confirmation position R, and an infrared image P3 is captured. The infrared image P3 is temporarily stored in the data storage unit 7 (FIG. 1).

  In S34, following S33, the last remaining infrared camera 334 is moved to the confirmation position R, and an infrared image P4 is captured. The infrared image P3 is temporarily stored in the data storage unit 7 (FIG. 1).

  In S35, the infrared images P1 to P4 are compared. Specifically, in S35, the infrared images P1 to P4 stored in the data storage unit 7 (FIG. 1) are read. First, if there is a non-comparison area (abnormal image), The pixel information is set (trimmed) so as not to be used, and only the comparison target region (trimmed image) is extracted (region extraction step).

  Here, the non-comparison area will be described. The four infrared cameras constituting the macro sensor 3a themselves generate heat when driven. Therefore, depending on the positional relationship between the infrared cameras, the substrate alignment stage 11 may be a reflection surface, and heat from another infrared camera being driven may be reflected on a certain infrared camera (FIG. 6). . Such reflections reduce the accuracy of detection. Therefore, by removing this inconvenient reflected image (image of the non-comparison region) from the captured image captured by the certain infrared camera, the substrate alignment stage 11 itself is captured, and a certain infrared camera is captured. It is possible to obtain an image that exactly reflects the imaging performance. The presence / absence of the non-comparison region is determined by the position of the imaging field of a certain infrared camera, the width of the imaging field, and the angle between the optical axis of incident light of the certain infrared camera and the surface of the substrate alignment stage 11. This can be predicted by considering the position and width of the imaging field of another infrared camera and the angle between the optical axis of the incident light of the other infrared camera and the surface of the substrate alignment stage 11 while taking into consideration. This series of image processing is performed by the main controller 5 (FIG. 1).

  In S <b> 35, next, average values M <b> 1 to M <b> 4 of the values of all pixels in the extracted comparison target region are calculated for each of the infrared images P <b> 1 to P <b> 4. Next, the difference DM12 (the difference between M1 and M2 is DM12), DM13 (the difference between M1 and M3 is DM13), DM14 (the difference between M1 and M4 is DM14) of the average values M1 to M4. Is calculated.

  In S36, following S35, a predetermined difference threshold is compared with the values (DM12 to DM14) calculated in S35. For example, if only DM12 is greater than or equal to the difference threshold, the infrared camera 332 is abnormal, if only DM13 is greater than or equal to the difference threshold, the infrared camera 333 is abnormal, and all of DM12 to DM14 are the difference. If it is equal to or greater than the threshold, it can be determined that the infrared camera 331 is abnormal.

  Here, the calculation method of the comparison value in S35 and the comparison method in S36 need not be limited to the method described in this embodiment. For example, as another embodiment, in the comparison between the infrared image P1 and the infrared image P2 in S35, the difference between the value of the infrared image P1 and the value of the infrared image P2 is calculated for each pixel in the comparison target region. Can be considered. In S36, when the ratio of the number of pixels having the above difference equal to or greater than a predetermined difference threshold to the total number of pixels in the comparison target area is larger than a predetermined abnormal pixel ratio threshold, it is determined as abnormal. Can do.

  The above is the detection method (determination process) of the presence or absence of abnormality of the infrared camera. The present invention can detect not only when there is an abnormality in a part of the field of view of an infrared camera (for example, adhesion of dirt), but also when there is an abnormality in the entire field of view (for example, The abnormality of the entire light receiving surface can also be determined.

  The above method is performed before the step of detecting the wiring defect of the liquid crystal panel, and when an abnormality is detected in a part of the area, it is possible to remove the dirt or to separate part or all of the infrared camera. You can take measures such as replacing it with a new one.

  Next, a wiring defect detection method using the macro sensor 3a configured by an infrared camera having no abnormality (or no abnormality) will be described. In this embodiment, a voltage is applied to the scanning line and the signal line of the liquid crystal panel 2 through the probe, and heat generation due to current flowing through the defective portion is measured by the macro sensor 3a and the micro sensor 3b, and A method for specifying the position is used. Hereinafter, the configuration of the probe and the defect inspection method will be described in detail with reference to FIGS.

  FIG. 7A is a plan view of the liquid crystal panel 2 formed on the mother substrate 1. The liquid crystal panel 2 includes a pixel portion 17 in which a TFT is formed at each intersection where a scanning line and a signal line intersect, and a peripheral circuit portion 18 that drives the scanning line and the signal line, respectively. Terminal portions 19 a to 19 d are provided at the edge of the liquid crystal panel 2, and the terminal portions 19 a to 19 d are connected to the wirings of the pixel portion 17 and the peripheral circuit portion 18.

  FIG. 7B is a plan view illustrating an example of a probe for conducting with the terminal portions 19 a to 19 d provided on the liquid crystal panel 2. The probe 8 has a frame shape substantially the same size as the liquid crystal panel 2 and includes a plurality of probe needles 21a to 21d corresponding to the terminal portions 19a to 19d. The plurality of probe needles 21a to 21d can individually connect one probe needle 21 to the voltage application unit 6 via a switching relay (not shown). For this reason, the probe 8 can selectively connect a plurality of wires connected to the terminal portions 19a to 19d, or can connect the plurality of wires together.

  Further, since the probe 8 has a frame shape that is almost the same size as the liquid crystal panel 2, the inside of the frame portion of the probe 8 is aligned when the positions of the terminal portions 19 a to 19 d and the probe needles 21 a to 21 d are aligned. To confirm with the optical camera 13.

  FIG. 8 is a diagram illustrating a flow of detecting a short-circuit defect by infrared inspection. For a plurality of liquid crystal panels 2 formed on the mother substrate 1, defect inspection is sequentially performed in steps S <b> 1 (step 1 is referred to as S <b> 1. The same applies hereinafter) to S <b> 9.

  In S1, the mother substrate 1 is placed on the substrate alignment stage 11 of the defect inspection apparatus 100, and the position of the substrate is adjusted to be parallel to the XY coordinate axes. In S2, the probe moving means 9 moves the probe 8 to the upper part of the liquid crystal panel 2 to be inspected, and the probe needles 21a to 21d are brought into contact with the terminal portions 19a to 19d of the liquid crystal panel 2.

  In S3, the wiring is selected and the probe needle 21 to be conducted is switched corresponding to the various defect modes. In S4, a voltage value to be applied to the wiring in the defective block 24 is set. The voltage value applied to the wiring is adjusted by the voltage application unit 6, and a voltage of about several tens of volts is normally applied.

  FIG. 9 schematically shows the positions of defects generated in the pixel portion 17 as an example. FIG. 9A shows a defective portion 23 that is short-circuited at a position where the wiring X and the wiring Y intersect vertically, such as a scanning line and a signal line. By switching the probe needle 21 to be electrically connected to 21a and 21d, or 21b and 21c shown in FIG. 7, a current flows through the defective portion 23 to generate heat.

  FIG. 9B shows a defective portion 23 that is short-circuited between adjacent wirings X, such as a scanning line and an auxiliary capacitance line. In such a defective portion 23, the probe needle 21 to be conducted is switched between the odd number 21b and the even number 21d, whereby a current flows through the defective portion 23 to generate heat.

  FIG. 9C shows a defective portion 23 short-circuited between adjacent wirings Y, such as a signal line and an auxiliary capacitance line. By switching the probe needle 21 to be electrically connected to the odd number 21a and the even number 21c, a current flows through the defect portion 23 to generate heat.

  In S5, an infrared inspection of the entire surface of the liquid crystal panel 2 is performed by the macro sensor 3a. Here, the macro sensor 3 a can narrow down the position of the defect portion 23 by detecting the infrared light emitted from the defect portion 23. For this reason, the entire surface of the liquid crystal panel 2 can be measured without scanning the macro sensor 3a, and the time for infrared inspection can be shortened.

  In S6, the sensor moving unit 4 moves the microsensor 3b so that the defect detected in S5 is within the field of view of the microsensor 3b. In S7, an infrared inspection of the liquid crystal panel 2 is performed by the microsensor 3b. The defect portion 23 that has generated heat due to the flow of current is photographed by the microsensor 3b, and infrared light emitted from the defect portion 23 is detected. Since the position of the heat generating portion is narrowed down by the macro sensor 3a, the microsensor 3b can be directly adjusted to the heat generating portion, and further details on information such as the type of defect necessary for correcting the defect portion 23 are provided. Measurement can be performed in a short time. In the measured thermal image, since the temperature of the defect portion 23 is displayed higher than that of the periphery, the defect position is specified from the positional relationship between the defect portion 23 and the wiring, and is stored in the data storage unit 7.

  In S8, it is determined whether or not all inspections in various defect modes have been completed for the liquid crystal panel 2 being inspected. If there is an uninspected defect mode, the process returns to S3, and the probe 8 is connected in accordance with the next defect mode. It is switched and the defect inspection is repeated.

  In S9, it is determined whether the array defect inspection of all the liquid crystal panels 2 has been completed for the mother substrate 1 being inspected. If there is any uninspected liquid crystal panel 2, the process returns to S1 and becomes the next inspection object. The probe is moved to the liquid crystal panel 2 and the defect inspection is repeated.

  Thus, the presence or absence of a wiring defect is detected.

(Operational effect of this embodiment)
As described above, according to the defect inspection apparatus 100 of the present embodiment, the temperature measurement result corresponding to the overlapping region where the imaging regions of the four infrared sensors of the macro sensor 3a overlap in at least a part of the regions. In comparison, it is determined whether or not there is an abnormality (dirt). In this way, by imaging the same region, it is possible to detect an abnormality of the infrared sensor with higher accuracy than in the case of the conventional configuration in which different objects among a plurality of infrared sensors are in the field of view. . In addition, since the pixel unit of the infrared sensor can be compared, the abnormality detection sensitivity is improved.

[Embodiment 2]
Another embodiment according to the present invention will be described below with reference to FIGS. 10 and 11. In addition, in this embodiment, in order to demonstrate a difference from the said Embodiment 1, for convenience of explanation, the same member number is attached | subjected to the member which has the same function as the member demonstrated in Embodiment 1, and the description Is omitted.

  In the first embodiment described above, when detecting dirt, the four infrared cameras of the macro sensor 3a image the surface of the substrate alignment stage 11 (FIG. 1). On the other hand, in the present embodiment, the liquid crystal panel 2 is placed on the substrate alignment stage 11 (FIG. 1) when dirt is detected, and the liquid crystal panel 2 is mounted by four infrared cameras of the macro sensor 3a. The image is picked up, and the presence or absence of dirt is detected from the picked-up image by the same method as in the first embodiment.

  FIG. 10 is a diagram showing a state in which the imaging centers of all four infrared cameras are aligned with a certain position of the liquid crystal panel 2 placed on the substrate alignment stage 11. 4 corresponds to FIG. As a result, the same object falls within the field of view of all four infrared cameras.

  FIG. 11 is a diagram showing a flow for checking the abnormality of the infrared camera in the state where the mother board is present.

  In S51, the mother substrate is aligned, and the position of the liquid crystal panel on the substrate is calculated.

  In S52, following S51, the probe 8 (FIG. 1) is moved to a predetermined position of the liquid crystal panel when an abnormality (dirt) of the infrared camera is detected. The liquid crystal panel position is a retracted position of the probe 8 that realizes that the probe 8 does not exist in the panel.

  In S53, following S52, as shown in FIG. 10, the infrared camera 331 is moved so that the center of the visual field of the infrared camera coincides with the center position R of the liquid crystal panel at the time of checking the abnormality of the infrared camera. An outside image P1 ′ is captured.

  In S54, similarly to the infrared camera 331 in S53, the infrared camera 332 is moved so that the center of the visual field of the infrared camera 332 coincides with the center position R of the liquid crystal panel, and the infrared image P2 ′ is moved. Image.

  The same operation is performed for the infrared camera 333 in S55 and for the infrared camera 334 in S56.

  An abnormality (dirt) can be detected by performing the same process as S35 described in the first embodiment in S57 and performing the same process as S36 described in the first embodiment in S58.

  As described above, according to the present embodiment, dirt is detected using the liquid crystal panel 2. In contrast to the first embodiment, the advantage of this embodiment is that when specifying the non-comparison region, it is more accurate to use an actual liquid crystal panel than specifying the presence or absence of reflection on the substrate alignment stage. There is a point that can be specified. Thereby, it is possible to perform more accurate detection of dirt.

[Embodiment 3]
Another embodiment according to the present invention will be described below with reference to FIG. In addition, in this embodiment, in order to demonstrate a difference from the said Embodiment 1, for convenience of explanation, the same member number is attached | subjected to the member which has the same function as the member demonstrated in Embodiment 1, and the description Is omitted.

  In the first embodiment described above, the case where the arrangement of the four infrared cameras of the macro sensor 3a when detecting a wiring defect is different from the arrangement of the four infrared cameras when detecting dirt is described. However, the present invention is not limited to this, and may be an aspect in which the arrangement of the four infrared cameras is not changed between when a wiring defect is detected and when dirt is detected.

  FIG. 12 is a diagram schematically showing the arrangement of the four infrared cameras of the macro sensor 3a of the present embodiment, and FIG. 12 (a) is the same as FIG. 3 of the first embodiment. In this embodiment, dirt is detected without moving the imaging field of view shown in FIG. 12A, and then a wiring defect is detected.

  When detecting dirt, the presence / absence of dirt is detected using an area in which the imaging fields of view overlap each other (a hatched area in FIG. 12B). As the detection method, the method described in the first embodiment can be used.

  In the present embodiment, since the overlapping area is narrower than that in the first embodiment, that is, the area for detecting the presence or absence of abnormality is narrower, the dirt detection accuracy is inferior to that in the first embodiment, but the four infrared rays of the macro sensor 3a. Since there is no need to move the camera, the manufacturing efficiency of the panel is not reduced.

  Note that the configuration of the present embodiment can detect not only when there is an abnormality in a part of the field of view of an infrared camera (for example, adhesion of dirt), but also has an abnormality in the entire field of view. In some cases (for example, abnormality of the entire light receiving surface) can be determined.

  In each of the above-described embodiments, the aspect of detecting the wiring defect of the liquid crystal panel has been described. However, the present invention is not limited to this, and wiring of an organic EL (Electroluminescence) panel, a printed circuit board circuit, and a semiconductor substrate A substrate having wiring such as a circuit can be targeted.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims.

  The present invention can be used for inspection of a wiring state of a semiconductor substrate having wiring such as a liquid crystal panel.

1 Mother board 2 Liquid crystal panel 3 Infrared sensor (infrared camera)
3a Macro sensor (infrared camera)
3b Micro sensor (infrared camera)
4 Sensor moving means (moving means)
4a to 4c Sensor holding portion 4d Shift guide rail 4e Guide holding portion 4f Gantry guide rail 5 Main control portion 6 Voltage application portion 7 Data storage portion 8 Probe 9 Probe moving means 9a Probe holding portion 9b Gantry guide rail 9c Upper and lower guide rail 9d Guide Holding section 9e Shift guide rail 11 Substrate alignment stage 12 Alignment camera 13 Optical camera 17 Pixel section 18 Peripheral circuit sections 19a to 19d Terminal section 21 Probe needle 21a to 21d Probe needle 23 Defect section 24 Defect block 100 Defect inspection apparatus 331 Infrared camera 332 Infrared camera 333 Infrared camera 334 Infrared camera R Check position (center of liquid crystal panel)

Claims (5)

A wiring defect detection device for detecting defects in a wiring provided in the panel by providing a plurality of infrared cameras, and each of the plurality of infrared cameras obtaining an infrared image of a partial region of the panel. There,
A partial image corresponding to the overlapping region in the infrared image obtained from each of the at least two infrared cameras when the fields of view of at least two of the infrared cameras overlap each other at least partially; A determination means for determining whether or not there is an abnormality in the at least two infrared cameras ,
Moving means for moving the plurality of infrared cameras;
The wiring defect characterized in that the at least two infrared cameras further comprise a control means for controlling the moving means so as to change a field of view between the detection and the determination. Detection device. 2. The wiring defect detection apparatus according to claim 1 , wherein the control means controls the moving means so that the centers of the fields of view of the at least two infrared cameras coincide when making the determination. A wiring defect detection device for detecting defects in a wiring provided in the panel by providing a plurality of infrared cameras, and each of the plurality of infrared cameras obtaining an infrared image of a partial region of the panel. There,
A partial image corresponding to the overlapping region in the infrared image obtained from each of the at least two infrared cameras when the fields of view of at least two of the infrared cameras overlap each other at least partially; A determination means for determining whether there is an abnormality in the at least two infrared cameras,
When the partial image of each of the at least two infrared cameras includes an abnormal image derived from heat generated by any of the at least two infrared cameras, the partial image of the field region corresponding to the trimming image by trimming the abnormal image, by comparing the images with each other corresponding to the common regions to each of the at least two infrared cameras, you and performs the determination distribution Line defect detection device.   4. The wiring defect detection device according to claim 1, wherein, when performing the detection, the visual fields of the at least two infrared cameras at least partially overlap each other. 5. . An abnormality detection method for detecting an abnormality of the infrared camera of the wiring defect detection device according to any one of claims 1 to 4 ,
A partial image corresponding to the overlapping region in the infrared image obtained from each of the at least two infrared cameras when the fields of view of at least two of the infrared cameras overlap each other at least partially; An abnormality detection method characterized by including a determination step for determining whether or not there is an abnormality in the at least two infrared cameras.

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