JP5832132B2 - Piezoelectric device - Google Patents

Description

  The present invention relates to a piezoelectric device used in electronic equipment and the like.

  As an example of a conventional piezoelectric device, a structure mainly composed of an element mounting member, a piezoelectric vibration element, an integrated circuit element, and a lid member is known (see, for example, Patent Document 1).

  The element mounting member includes a substrate part, a first frame part, and a second frame part. A first recessed portion space is formed by providing the first frame portion on the main surface of the substrate portion, and a second wall having a wall thickness smaller than that of the first frame portion is formed on the first frame portion. The second recess space is formed by providing the frame portion. A pair of piezoelectric vibration element mounting pads is provided on the upper surface of the first frame exposed in the second recess space. An integrated circuit element mounting pad is provided on the first main surface of the substrate portion exposed in the first recess space. External connection electrode terminals are provided at four corners of the second main surface of the substrate portion. Piezoelectric vibration element measurement terminals that are electrically connected to the piezoelectric vibration element are provided on the outer side surfaces of the first frame portion and the second frame portion of the element mounting member.

  The piezoelectric vibration element is mounted on the piezoelectric vibration element mounting pad, and has a pair of excitation electrodes electrically connected to the piezoelectric vibration element mounting pad via a conductive adhesive.

  The integrated circuit element is mounted on the integrated circuit element mounting pad, and is electrically connected to the integrated circuit element through a conductive bonding material.

  A metal lid member is fixed to the top surface of the second frame portion of the element mounting member surrounding the piezoelectric vibration element so as to cover the piezoelectric vibration element and the integrated circuit element. The first recess space and the second recess space are hermetically sealed by the metal lid member.

JP 2003-101348 A

  However, in the conventional piezoelectric device, with the downsizing, the areas of the outer side surfaces of the first frame portion and the second frame portion of the element mounting member are reduced, and the first frame portion and the second frame of the element mounting member are reduced. The piezoelectric vibration element measurement terminal provided on the outer side surface of the frame portion is also small, and it is difficult to apply a measurement probe for measuring the piezoelectric vibration element. Therefore, there is a problem that the oscillation frequency of the piezoelectric vibration element cannot be measured stably.

  The present invention has been made in view of the above problems, and even when the piezoelectric device is miniaturized, the measurement probe can be applied to the piezoelectric vibration element measurement terminal, and the piezoelectric vibration element can be stably measured. It is an object of the present invention to provide a piezoelectric device that can be used.

The piezoelectric device according to the present invention includes an element mounting member having first and second main surfaces, and an integrated circuit element mounted on an integrated circuit element pad provided on the first main surface of the element mounting member. A circuit element, a piezoelectric vibration element mounted on a piezoelectric vibration element mounting pad provided on the integrated circuit element, and a lid member fixed to the element mounting member so as to cover the integrated circuit element and the piezoelectric vibration element A first connection conductor provided in the integrated circuit element and electrically connected to the piezoelectric vibration element mounting pad; and a piezoelectric vibration provided on a second main surface of the element mounting member. An element measurement terminal; and a second connection conductor provided in the element mounting member and electrically connected to the first connection conductor and the piezoelectric vibration element measurement terminal. The element mounting pad is in front The piezoelectric vibration element measurement terminal is electrically connected via the first connection conductor and the second connection conductor, and the piezoelectric vibration element measurement terminal is connected to the second main body of the element mounting member. One is provided in each of the two recessed spaces on the surface.

  According to the piezoelectric device of the present invention, an element mounting member having first and second main surfaces, an integrated circuit element provided on the first main surface of the element mounting member, and an integrated circuit element Piezoelectric vibration element provided on top, integrated circuit element and lid member fixed to the element mounting member so as to cover the piezoelectric vibration element, and piezoelectric vibration element provided on the second main surface of the element mounting member A measurement terminal, a first connection conductor provided in the integrated circuit element and electrically connected to the piezoelectric vibration element, and a first connection conductor provided in the element mounting member. And the second connecting conductor electrically connected to the piezoelectric vibration element measurement terminal, the measurement probe can be reliably applied to the piezoelectric vibration element measurement terminal. It is possible to measure the piezoelectric vibration element. That.

Further, the piezoelectric vibration element measuring terminal is provided in the two recessed spaces each having the piezoelectric vibration element measuring terminal on the second main surface of the element mounting member. It is possible to reduce the possibility that a part of the conductive bonding material provided on the piezoelectric vibration element measurement terminal that is directly connected directly to the electrode adheres to deteriorate the vibration characteristics of the piezoelectric vibration element.

1 is an exploded perspective view showing a piezoelectric device according to a first embodiment of the present invention. It is AA sectional drawing of FIG. It is sectional drawing which shows the piezoelectric device which concerns on the 2nd Embodiment of this invention.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. A case where quartz is used for the piezoelectric vibration element will be described. In addition, the illustrated dimensions are partially exaggerated.

(First embodiment)
In this embodiment, a piezoelectric oscillator will be described as an example of a piezoelectric device. As shown in FIGS. 1 and 2, the piezoelectric oscillator 100 according to the first embodiment of the present invention mainly includes an element mounting member 110, a piezoelectric vibration element 120, a lid member 130, and an integrated circuit element 140. Yes. In the piezoelectric oscillator 100, the integrated circuit element 140 is mounted on the element mounting member 110, the piezoelectric vibration element 120 is mounted on the main surface of the integrated circuit element 140, and the piezoelectric vibration is generated by the lid member 130 having the recess K1 (see FIG. 2). The element 120 and the integrated circuit element 140 are hermetically sealed.

  As shown in FIGS. 1 and 2, the piezoelectric vibration element 120 is formed by adhering an excitation electrode 122 to a crystal element plate 121, and an alternating voltage from the outside passes through the excitation electrode 122. When applied to 121, excitation occurs in a predetermined vibration mode and frequency. The quartz base plate 121 is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to outer shape processing, and has a planar shape of, for example, a quadrangle. The excitation electrode 122 is formed by depositing and forming metal in a predetermined pattern on both the front and back main surfaces of the quartz base plate 121. Such a piezoelectric vibration element 120 includes a lead electrode 123 extending from an excitation electrode 122 attached to both main surfaces of the piezoelectric vibration element 120 and a piezoelectric vibration element described later formed on a main surface of an element mounting member 110 described later. Mounting is performed by electrically and mechanically connecting the mounting pad 141 via a conductive adhesive DS (see FIG. 2).

  As shown in FIGS. 1 and 2, the integrated circuit element 140 is provided on a first main surface of an element mounting member 110 described later. That is, the integrated circuit element 140 is provided with a piezoelectric vibration element mounting pad 141 for mounting the piezoelectric vibration element 120 on the first main surface, and the integrated circuit element mounting of the element mounting member 110 described later on the second main surface. An element mounting member connection terminal 142 for electrical connection to the pad 111 is provided. The pair of piezoelectric vibration element mounting pads 111 are electrically connected to two of the element mounting member connection terminals 142 via first connection conductors 143 provided inside the integrated circuit element 140, respectively. .

  Further, the integrated circuit element 140 is provided with an oscillation circuit or the like for generating an oscillation output from the piezoelectric vibration element 120 on the circuit forming surface, and an output signal generated by this oscillation circuit is passed through the external connection electrode terminal G. Are output to the outside of the piezoelectric oscillator 100 and used as a reference signal such as a clock signal, for example. In addition, in the integrated circuit element 140, in order to compensate the fluctuation of the oscillation frequency of the oscillation circuit due to the temperature change by applying a control voltage according to the ambient temperature to the variable capacitance element, the temperature is controlled by the cubic function generation circuit and the storage element unit. A compensation circuit unit is provided, and a temperature sensor is connected to the cubic function generation circuit.

  This temperature sensor is configured to output a temperature data signal (voltage value) generated based on the detected temperature and a voltage value applied to the temperature sensor to a cubic function generation circuit. As shown in FIG. 4, the integrated circuit element 140 is mounted on an integrated circuit element mounting pad 111 provided on the first main surface of the element mounting member 110 via a conductive bonding material HD such as solder.

  As shown in FIGS. 1 and 2, the element mounting member 110 has first and second main surfaces, and the second main surface has a recessed space K2. An integrated circuit element mounting pad 111 is provided on the first main surface of the element mounting member 110, and external connection electrode terminals G are provided at four corners of the second main surface. A concave space K2 is provided on the second main surface of the element mounting member 110, and a piezoelectric vibration element measurement terminal 113 is provided in the concave space K2. A sealing conductor pattern 112 provided at the peripheral portion and a sealing member 131 of a lid member 130 described later are joined so as to surround the central portion of the first main surface of the element mounting member 110. Any two of the integrated circuit element mounting pads 111 are connected to the piezoelectric vibration element measuring terminal 113 provided in the recessed space K2 of the element mounting member 110 via the second connection conductor 114. .

  The element mounting member connection terminal 142 of the integrated circuit element 140 is electrically connected to the integrated circuit element mounting pad 111 provided on the first main surface of the element mounting member 110 via a conductive bonding material HD such as solder. Has been. Therefore, the pair of piezoelectric vibration element mounting pads 141 are piezoelectric via the first connection conductor 143 provided in the integrated circuit element 140 and the second connection conductor 114 provided in the element mounting member 110. It is connected to the vibration element measurement terminal 113. That is, by mounting the piezoelectric vibration element 120 on the piezoelectric vibration element mounting pad 141, the first connection conductor 143 provided in the integrated circuit element 140 and the second connection conductor provided in the element mounting member 110. 114 is electrically connected to the piezoelectric vibration element measurement terminal 113 via the terminal 114. Therefore, the frequency characteristic of the piezoelectric vibration element 120 can be measured by applying a measurement probe (not shown) to the piezoelectric vibration element measurement terminal 113.

  As shown in FIG. 2, the lid member 130 is fixed to the element mounting member 110 so as to cover the integrated circuit element 140 and the piezoelectric vibration element 120. The lid member 130 is mainly composed of a lid body portion 130a, a wall portion 130b, a flange portion 130c, and a sealing member 131. The lid body 130 can include the piezoelectric vibration element 120 and the integrated circuit element 140. A recess K1 is formed by the portion 130a and the wall portion 130b. The lid member 130 is made of, for example, an Fe—Ni alloy (42 alloy), an Fe—Ni—Co alloy (Kovar), or the like. An annular sealing member 131 is provided on the collar portion 130 c of the lid member 130. The sealing member 131 is made of, for example, silver brazing material (Ag—Cu). Specifically, the lid member 130 is placed on the sealing conductor pattern 112 of the element mounting member 110, and the sealing member 131 and the sealing conductor pattern 112 provided on the collar portion 130 c of the lid member 130. And are fixed.

  The conductive adhesive DS contains conductive powder as a conductive filler in a binder such as silicone resin. Examples of the conductive powder include aluminum (Al), molybdenum (Mo), tungsten ( W), platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or any combination thereof is used. Yes.

  According to the piezoelectric device 100 according to the first embodiment of the present invention, the element mounting member 110 having the first and second main surfaces and the first main surface of the element mounting member 110 are provided. Integrated circuit element 140, piezoelectric vibration element 120 provided on integrated circuit element 140, lid member 130 joined to element mounting member 110 so as to cover integrated circuit element 140 and piezoelectric vibration element 120, and element mounting The piezoelectric vibration element measurement terminal 113 provided on the second main surface of the member 110 and the first connection conductor 143 provided in the integrated circuit element 140 and electrically connected to the piezoelectric vibration element 120. And a second connection conductor 114 that is provided in the element mounting member 110 and is electrically connected to the first connection conductor 143 and the piezoelectric vibration element measurement terminal 113. Since the measuring probe (not shown) can be shed to ensure piezoelectric vibrating element measuring terminal 113, it is possible to measure the piezoelectric vibrating element 120 stably.

  According to the piezoelectric device 100 according to the first embodiment of the present invention, the piezoelectric vibration element measurement terminal 113 is provided in the recess space K2, and thus is electrically connected directly to the piezoelectric vibration element 120. For example, a part of the conductive bonding material provided on the electrode terminal G for external connection adheres to the piezoelectric vibration element measurement terminal 113 and the possibility that the vibration characteristics of the piezoelectric vibration element 120 are deteriorated is reduced.

  Moreover, according to the piezoelectric device 100 according to the first embodiment of the present invention, the integrated circuit element 140 provided on the first main surface of the element mounting member 110 and the piezoelectric element provided on the integrated circuit element 140. By including the vibration element 120 and the lid member 130 joined to the element mounting member so as to cover the integrated circuit element 140 and the piezoelectric vibration element 120, the element mounting member has a structure without a frame portion. Therefore, it is possible to solve the technical problem of a decrease in strength in the frame portion due to downsizing.

(Second Embodiment)
Next, a piezoelectric device according to a second embodiment of the present invention will be described. A piezoelectric oscillator will be described as an example of the piezoelectric device in the present embodiment. In the piezoelectric oscillator 200 according to the second embodiment of the present invention, two concave spaces K2 are provided on the second main surface of the element mounting member 210, and the piezoelectric vibration element measurement terminal 213 is provided in the two concave spaces K2. Is different from the first embodiment in that one is provided.

  As shown in FIG. 3, the element mounting member 210 has first and second main surfaces, and the second main surface has a recessed space K2. An integrated circuit element mounting pad 211 is provided on the first main surface of the element mounting member 210, and external connection electrode terminals G are provided at four corners of the second main surface. In addition, two concave spaces K2 are provided on the second main surface of the element mounting member 210, and one piezoelectric vibration element measurement terminal 213 is provided in each of the two concave spaces K2. A sealing conductor pattern 212 provided at the peripheral portion and a sealing member 131 of the lid member 130 described later are joined so as to surround the central portion of the first main surface of the element mounting member 210. Any two of the integrated circuit element mounting pads 211 are connected to the piezoelectric vibration element measuring terminal 213 provided in the two recessed spaces K2 of the element mounting member 210 via the second connection conductor 214. ing.

  As shown in FIG. 3, the element mounting member connection terminal 142 of the integrated circuit element 140 is connected to the integrated circuit element mounting pad 211 provided on the first main surface of the element mounting member 210 and a conductive bonding material HD such as solder. It is electrically connected via. Therefore, the pair of piezoelectric vibration element mounting pads 211 is connected to the 2nd via the first connection conductor 143 provided in the integrated circuit element 140 and the second connection conductor 214 provided in the element mounting member 210. The piezoelectric vibration element measurement terminals 213 provided one by one in the two recessed spaces K2 are connected. Therefore, the frequency characteristic of the piezoelectric vibration element 120 can be measured by applying a measurement probe (not shown) to the piezoelectric vibration element measurement terminal 213.

  Thus, even if the piezoelectric oscillator 200 according to the second embodiment of the present invention is configured, the same effects as those of the first embodiment can be obtained.

  In addition, this invention is not limited to the said embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. For example, in the above-described embodiment, the case where crystal is used as the piezoelectric material constituting the piezoelectric vibration element 120 has been described. The piezoelectric vibration element used may be used.

110, 210 ... Element mounting member 111, 211 ... Integrated circuit element mounting pad 112, 212 ... Sealing conductor pattern 113, 213 ... Piezoelectric vibration element measuring terminal 114, 214 ... No. Two connecting conductors 120: piezoelectric vibration element 121: crystal base plate 122 ... excitation electrode 123 ... extraction electrode 130 ... lid member 130a ... lid body 130b ... wall 130c ... collar 131 ... sealing member 140 ... integrated circuit element 141 ... piezoelectric vibration element mounting pad 142 ... element mounting member connection terminal 143 ... first connection conductor 100・ ・ Piezoelectric device DS ・ ・ ・ Conductive adhesive HD ・ ・ ・ Conductive bonding material K1 ・ ・ ・ Recess K2 ・ ・ ・ Recess space G ・ ・ ・ External connection electrode terminal

Claims (1)

An element mounting member having first and second main surfaces;
An integrated circuit element mounted on an integrated circuit element pad provided on the first main surface of the element mounting member;
A piezoelectric vibration element mounted on a piezoelectric vibration element mounting pad provided on the integrated circuit element;
A lid member fixed to the element mounting member so as to cover the integrated circuit element and the piezoelectric vibration element;
A first connection conductor provided in the integrated circuit element and electrically connected to the piezoelectric vibration element mounting pad;
A piezoelectric vibration element measurement terminal provided on the second main surface of the element mounting member;
A second connection conductor provided in the element mounting member and electrically connected to the first connection conductor and the piezoelectric vibration element measurement terminal;
The piezoelectric vibration element mounting pad is electrically connected to the piezoelectric vibration element measurement terminal via the first connection conductor and the second connection conductor;
The piezoelectric vibration element measuring terminal is provided in each of two recessed spaces provided on the second main surface of the element mounting member.

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