JP5825380B2 - 銅／セラミックス接合体、及び、パワーモジュール用基板 - Google Patents

銅／セラミックス接合体、及び、パワーモジュール用基板 Download PDF

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Publication number
JP5825380B2
JP5825380B2 JP2014052594A JP2014052594A JP5825380B2 JP 5825380 B2 JP5825380 B2 JP 5825380B2 JP 2014052594 A JP2014052594 A JP 2014052594A JP 2014052594 A JP2014052594 A JP 2014052594A JP 5825380 B2 JP5825380 B2 JP 5825380B2
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Japan
Prior art keywords
copper
ceramic
active element
power module
ceramic substrate
Prior art date
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JP2014052594A
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English (en)
Japanese (ja)
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JP2015177045A5 (https=
JP2015177045A (ja
Inventor
伸幸 寺▲崎▼
伸幸 寺▲崎▼
長友　義幸
義幸 長友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
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Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2014052594A priority Critical patent/JP5825380B2/ja
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to KR1020167021843A priority patent/KR101758586B1/ko
Priority to PCT/JP2015/053792 priority patent/WO2015122446A1/ja
Priority to EP15749540.9A priority patent/EP3106447B1/en
Priority to US15/117,935 priority patent/US10103035B2/en
Priority to TW104104739A priority patent/TWI567047B/zh
Priority to CN201580008014.0A priority patent/CN105980334B/zh
Publication of JP2015177045A publication Critical patent/JP2015177045A/ja
Publication of JP2015177045A5 publication Critical patent/JP2015177045A5/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Structure Of Printed Boards (AREA)
JP2014052594A 2014-02-12 2014-03-14 銅／セラミックス接合体、及び、パワーモジュール用基板 Active JP5825380B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014052594A JP5825380B2 (ja) 2014-03-14 2014-03-14 銅／セラミックス接合体、及び、パワーモジュール用基板
PCT/JP2015/053792 WO2015122446A1 (ja) 2014-02-12 2015-02-12 銅／セラミックス接合体、及び、パワーモジュール用基板
EP15749540.9A EP3106447B1 (en) 2014-02-12 2015-02-12 Copper-ceramic bonded body and power module substrate
US15/117,935 US10103035B2 (en) 2014-02-12 2015-02-12 Copper-ceramic bonded body and power module substrate
KR1020167021843A KR101758586B1 (ko) 2014-02-12 2015-02-12 구리/세라믹스 접합체 및 파워 모듈용 기판
TW104104739A TWI567047B (zh) 2014-02-12 2015-02-12 銅／陶瓷接合體及電源模組用基板
CN201580008014.0A CN105980334B (zh) 2014-02-12 2015-02-12 铜‑陶瓷接合体及功率模块用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014052594A JP5825380B2 (ja) 2014-03-14 2014-03-14 銅／セラミックス接合体、及び、パワーモジュール用基板

Publications (3)

Publication Number Publication Date
JP2015177045A JP2015177045A (ja) 2015-10-05
JP2015177045A5 JP2015177045A5 (https=) 2015-11-12
JP5825380B2 true JP5825380B2 (ja) 2015-12-02

Family

ID=54255954

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JP2014052594A Active JP5825380B2 (ja) 2014-02-12 2014-03-14 銅／セラミックス接合体、及び、パワーモジュール用基板

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JP (1) JP5825380B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6645368B2 (ja) * 2016-06-23 2020-02-14 三菱マテリアル株式会社 接合体、パワーモジュール用基板、接合体の製造方法、及び、パワーモジュール用基板の製造方法
JP6939596B2 (ja) * 2018-01-24 2021-09-22 三菱マテリアル株式会社 パワーモジュール用基板の製造方法及びセラミックス‐銅接合体
EP3569370A1 (en) * 2018-05-18 2019-11-20 SUPSI (Scuola Universitaria Professionale Della Svizzera Italiana) Device for gripping and welding electronic components and associated actuating head, robot and method
JP7196799B2 (ja) * 2019-08-21 2022-12-27 三菱マテリアル株式会社 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
JP7370222B2 (ja) * 2019-11-05 2023-10-27 Ｄｏｗａメタルテック株式会社 金属－セラミックス接合基板およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63239166A (ja) * 1987-03-27 1988-10-05 株式会社東芝 セラミツクス接合体
JPH04295065A (ja) * 1991-03-22 1992-10-20 Murata Mfg Co Ltd セラミック−金属接合体の製造方法
JP2013049589A (ja) * 2011-08-30 2013-03-14 Kyocera Corp セラミック体と金属体との接合体
JP5935292B2 (ja) * 2011-11-01 2016-06-15 三菱マテリアル株式会社 パワーモジュール用基板の製造方法、ヒートシンク付パワーモジュール用基板の製造方法

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JP2015177045A (ja) 2015-10-05

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