JP5812776B2 - Method for manufacturing piezoelectric device - Google Patents

Description

  The present invention relates to a method for manufacturing a piezoelectric device used in, for example, an electronic apparatus.

  As an example of a piezoelectric device, one having a structure in which a terminal member is joined to a piezoelectric vibrator has been developed. This method for manufacturing a piezoelectric device includes a step of individually joining a terminal member to each of a plurality of piezoelectric vibrators.

JP 2005-159574 A

  However, the above-described method for manufacturing a piezoelectric device requires individual parts to be individually fixed to a jig in order to individually join a terminal member to each of a plurality of piezoelectric vibrators, thereby improving productivity. There was a problem that it was difficult. Furthermore, some piezoelectric devices are required to mount electronic components such as thermistor elements, and it is necessary to study the mounting method of the electronic components.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing a piezoelectric device with improved productivity including mounting of electronic components.

According to one aspect of the present invention, there is provided a method of manufacturing a piezoelectric device, wherein four terminal members are grouped together, and an aggregate terminal member capable of cutting out a plurality of the grouped terminal members constitutes each group 4 An electronic component is mounted while being electrically connected to only two terminal members among the individual terminal members, and is provided on the substrate portion and the first main surface of the substrate portion. Recessed space formed by an element mounting member including a frame portion and terminal member connection electrodes provided at four corners of a second main surface of the substrate portion in a rectangular shape in plan view, and the substrate portion and the frame portion Piezoelectric vibration elements mounted on two pairs of piezoelectric vibration element mounting pads provided on the main surface of the substrate portion exposed inside and electrically connected to two terminal member connection electrodes, and this recess space are hermetically sealed A plurality of lids to be sealed 2 terminal members in which a piezoelectric vibration element mounting pad is electrically connected to two terminal members in which electronic components in each of the four terminal members constituting the collective terminal member are not mounted. In order to electrically connect the connection electrodes, four terminal member connection electrodes and a group of four terminal members are joined to each other, and a plurality of piezoelectric vibrators are joined to the collective terminal member. A step of joining the child, and cutting the collective terminal member to which the piezoelectric vibrator is joined to obtain a plurality of piezoelectric devices including the piezoelectric vibrator, the terminal member, and an electronic component. ” .

  According to a method of manufacturing a piezoelectric device according to one aspect of the present invention, a step of mounting an electronic component on a collective terminal member capable of cutting out a plurality of terminal members, and a step of joining a piezoelectric vibrator to the collective terminal member; Therefore, the joining of the electronic component to the terminal member and the joining of the piezoelectric vibrator and the terminal member can be performed collectively in the state of the collective terminal member. For example, the mounting of the electronic component and the joining of the terminal member can be performed. In this case, it is not necessary to individually fix the separated parts to the jig, and productivity can be improved.

It is a disassembled perspective view which shows the piezoelectric device obtained by the manufacturing method in the 1st Embodiment of this invention. (A) is sectional drawing in AA of the piezoelectric device shown by FIG. 1, (b) is sectional drawing in BB of the piezoelectric device shown by FIG. (A) is a top view of the element mounting member which comprises a piezoelectric device, (b) is a top view of the board | substrate part of the element mounting member which comprises a piezoelectric device, (c) is a piezoelectric device comprising It is a bottom view of an element mounting member. (A) is sectional drawing which shows the process of mounting the electronic component of the manufacturing method of the piezoelectric device in 1st Embodiment, (b) is a piezoelectric vibrator of the manufacturing method of the piezoelectric device in 1st Embodiment. FIG. 6C is a cross-sectional view showing a step of obtaining the piezoelectric device by cutting the collective terminal member of the piezoelectric device manufacturing method according to the first embodiment. It is a perspective view which shows the collection terminal member used with the manufacturing method of the piezoelectric device in 1st Embodiment. (A) is sectional drawing which shows the process of mounting the electronic component of the manufacturing method of the piezoelectric device in 2nd Embodiment, (b) is a piezoelectric vibration element of the manufacturing method of the piezoelectric device in 2nd Embodiment. It is sectional drawing which shows the process of joining this aggregate | assembly, (c) is sectional drawing which shows the process of cut | disconnecting the collection terminal member of the manufacturing method of the piezoelectric device in 2nd Embodiment, and obtaining a piezoelectric device. It is a perspective view which shows the aggregate | assembly and aggregate terminal member used with the manufacturing method of the piezoelectric device in 2nd Embodiment. (A) is sectional drawing which shows the process of joining the piezoelectric vibrator of the manufacturing method of the piezoelectric device in 3rd Embodiment, (b) is an electronic component of the manufacturing method of the piezoelectric device in 3rd Embodiment. (C) is sectional drawing which shows the process of cut | disconnecting the collection terminal member of the manufacturing method of the piezoelectric device in 3rd Embodiment, and obtaining a piezoelectric device. (A) is sectional drawing which shows the state which cut | disconnected the conjugate | zygote with the 1st braid | blade with the manufacturing method of the piezoelectric device in 4th Embodiment, (b) is the piezoelectric device in 4th Embodiment. It is sectional drawing which shows the state which cut | disconnected the conjugate | zygote with the 2nd blade with the manufacturing method. It is a perspective view which shows the joined body used with the manufacturing method of the piezoelectric device in 4th Embodiment.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
A method for manufacturing a piezoelectric device according to the first embodiment of the present invention will be described with reference to FIG. In addition, the manufacturing method in this embodiment is a manufacturing method of the piezoelectric device 100 shown by FIGS.

  Here, the piezoelectric device 100 obtained in the manufacturing method of the present embodiment will be described with reference to FIGS.

  As illustrated in FIGS. 1 to 3, the piezoelectric device 100 includes a piezoelectric vibrator 10, a plurality of terminal members 150 bonded to the lower surface of the piezoelectric vibrator, and two terminals among the plurality of terminal members 150. The electronic component 140 mounted on the member 150 is included.

  The piezoelectric vibrator 10 includes an element mounting member 110, a piezoelectric vibration element 120 mounted on the element mounting member 110, and a lid body 130 that covers the piezoelectric vibration element 120.

  The element mounting member 110 is provided on the substrate portion 110a, a frame portion 110b provided on the substrate portion 110a, a pair of piezoelectric vibration element mounting pads 111 provided on the upper surface of the substrate portion 110a, and a lower surface of the substrate portion 110a. And a plurality of terminal member connection electrodes G. The element mounting member 110 has a recessed space K1 surrounded by the substrate portion 110a and the frame portion 110b.

  The substrate part 110a is made of a ceramic material such as alumina ceramics or glass-ceramics, and has a plurality of layers stacked on each other.

  The frame portion 110b is made of, for example, 42 alloy or iron-nickel-cobalt, and has a frame shape in which a central portion is punched in a plan view. The frame portion 110b is joined to the sealing conductor film HB provided on the upper surface of the substrate portion 110a by brazing or the like.

  The pair of piezoelectric vibration element mounting pads 111 is provided in the recess space K1 on the upper surface of the substrate portion 110a.

  The plurality of terminal member connection electrodes G are provided at the four corners of the lower surface of the substrate portion 110a. The plurality of terminal member connection electrodes G include a pair of piezoelectric vibration element electrodes G1 and a pair of electronic component electrodes G2. The pair of piezoelectric vibration element electrodes G1 is provided along the short side of the lower surface of the substrate portion 110a. The pair of piezoelectric vibration element electrodes G <b> 1 is electrically connected to the piezoelectric vibration element mounting pad 111 by the first via conductor 112. The pair of electronic component electrodes G2 is provided along a short side different from the short side on which the piezoelectric vibrating element electrode G1 is provided. One of the pair of electronic component electrodes G2 is electrically connected to the lid member 130 by a second via conductor 113 formed inside the substrate portion 110a, and is electrically and mechanically connected to the terminal member 150. Connected. The other electronic component electrode G <b> 2 is electrically and mechanically connected to the other terminal member 150.

  The piezoelectric vibration element 120 includes a crystal base plate 121, an excitation electrode 122 formed on the crystal base plate 121, and a lead electrode 123 formed so as to extend from the excitation electrode 122. The piezoelectric vibration element 120 is excited in a predetermined vibration mode and frequency when an alternating voltage is applied to the excitation electrode 122.

  The quartz base plate 121 is cut from the artificial crystalline lens at a predetermined cut angle, and is flat and has a planar shape of, for example, a quadrangle. The excitation electrode 122 is made of a metal material, and is formed by being attached to the front and back main surfaces of the quartz base plate 121 in a predetermined pattern.

  The piezoelectric vibration element 120 is mounted in the recess space K1 by electrically and mechanically connecting the extraction electrode 123 and the piezoelectric vibration element mounting pad 111 via the conductive adhesive DS.

  The electronic component 140 is, for example, a thermistor element. The thermistor element 140 shows a remarkable change in electrical resistance due to a change in temperature. Since the voltage changes from this change in resistance value, the resistance value depends on the relationship between the resistance value and the voltage and the relationship between the voltage and temperature. Temperature information can be obtained from the voltage obtained by converting the voltage into a voltage. The electronic component 140 is fixed to at least two of the plurality of terminal members 150 via the conductive bonding material HD, and is electrically connected to two terminal members 150 (150a and 150b) among the plurality of terminal members 150. It is connected.

  The electronic component 140 has a plurality of connection electrodes 141. Of the plurality of connection electrodes 141, the first connection electrode 141a is mounted on the step main surface of the first terminal member 150a via a conductive bonding material HD such as solder. In addition, the second connection electrode 141b among the plurality of connection electrodes 141 has a conductive bonding material HD such as solder on the main surface of the step of the second terminal member 150b provided adjacent to the first terminal member 150a. Is mounted via.

  The terminal member 150 has a connection portion 151 and an electrode portion 152, and is provided on the lower surface of the substrate portion 110a. When the terminal member 150 is viewed in plan, the area of the connection portion 151 is smaller than the area of the electrode portion 152. In the terminal member 150, the electronic component 140 is connected to a joint portion 154 that is a step main surface formed by the connection portion 151 and the electrode portion 152. That is, the joint portion 154 formed by the connection portion 151 and the electrode portion 152 of the pair of adjacent terminal members 150 and the connection electrode 141 of the electronic component 140 are joined via the conductive joint material HD. The terminal member 150 is used as an external connection electrode terminal serving as a pair of piezoelectric vibration element electrode terminals and a pair of electronic component electrode terminals.

  Further, the joint portion 154 that is the step main surface formed by the first main surface of the connection portion 151 and the second main surface of the electrode portion 152 and the connection portion 151 and the electrode portion 152 constituting the terminal member 150 An electrode film 153 is provided. The electrode film 153 is a multilayer structure formed by laminating a plurality of metal films. The first metal film is formed on the main surface of the joint, and the second metal film is laminated on the upper surface of the first metal film. It is formed as follows. The first metal film is made of, for example, Ni plating, and the second metal film is made of, for example, gold plating. Thereby, the connection strength between the conductive bonding material HD and the terminal member 150 can be maintained.

  The lid 130 is made of, for example, an Fe—Ni alloy or an Fe—Ni—Co alloy. Such a lid 130 is for hermetically sealing the recessed space K1 in a vacuum state or the recessed space K1 filled with nitrogen gas or the like. Specifically, the lid 130 is placed on the frame portion 110b of the element mounting member 110 in a predetermined atmosphere so that the metal on the surface of the frame portion 110b and a part of the metal of the lid 130 are welded. By applying a predetermined current to the plate and performing seam welding, the frame portion 110b is joined.

  The conductive adhesive DS contains a conductive powder as a conductive filler in a binder such as a silicone resin. As the conductive powder, aluminum (Al), molybdenum (Mo), tungsten (W) , Platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or a combination thereof is used.

  Hereinafter, a method for manufacturing the above-described piezoelectric device 100 will be described.

  As shown in FIG. 4, the method for manufacturing the piezoelectric device 100 includes a step of mounting the electronic component 140 on the collective terminal member 15 capable of cutting out the plurality of terminal members 150 (FIG. 4A), It includes a step of bonding the piezoelectric vibrator 10 to the collective terminal member 15 (FIG. 4B) and a step of cutting the collective terminal member 15 to obtain the piezoelectric device 100 (FIG. 4C).

(Process of mounting electronic component 140)
As shown in FIG. 4A, the electronic component 140 is mounted on the joint portion 154 that is the step main surface formed by the connection portion 151 and the terminal portion 152. As shown in FIG. 5, a plurality of terminal members 150 are arranged in series with being connected to the frame body 160, and are disposed facing each other with an interval where the electronic component 140 can be inserted. ing.

  The terminal member 150 is formed of a metal material such as copper, and an electronic component that is formed of a single collective terminal member 15 using a metal material by a conventionally known etching method or the like and protrudes in the piezoelectric vibrator mounting direction. There is a step having a height higher than the height of 140. The terminal member 150 is provided by the connection portion 151 and the electrode portion 152.

  The joining portion 154 of the terminal member 150 and the electronic component 140 are joined together by a conductive joining material HD such as solder or a conductive adhesive.

  Ni plating is applied to the main surface of the connection portion 151 connected to the terminal member connection electrode G on the lower surface of the element mounting member 110, the main surface of the electrode portion 152 connected to an external electronic circuit such as a motherboard, and the main surface of the joint portion 154. By applying the metal film 153 such as Au plating, the bondability of the conductive bonding material HD can be improved.

(Step of joining the piezoelectric vibrator 10)
As shown in FIG. 4B, the piezoelectric vibrator 10 is joined to the collective terminal member 15.

  The electrode G for terminal member connection provided on the element mounting member 110 and the connection portion 151 of the terminal member 150 are joined by the conductive joining material HD. The main surface of the connection portion 151 provided on the predetermined terminal member 150 and the terminal portion connection electrode G provided on the second main surface of the element mounting member 110 are electrically conductively joined by solder, conductive adhesive, or the like. Joined by the material HD.

(Process of cutting the collective terminal member 15 to obtain the piezoelectric device 100)
As shown in FIG. 4C, the collective terminal member 15 is cut to obtain the piezoelectric device 100. By cutting the connecting portion between the frame body 160 and the terminal member 150 of each collective terminal member 15, each terminal member 150 is separated from the frame body 160, and a plurality of piezoelectric devices 100 are obtained simultaneously. The collective terminal member 15 is cut by dicing or the like.

  As described above, the method for manufacturing the piezoelectric device 100 according to the present embodiment includes the step of mounting the electronic component 140 on the collective terminal member 15 from which the plurality of terminal members 150 can be cut, and the piezoelectric vibrator on the collective terminal member 15. 10, the electronic component 140 and the terminal member 150 can be bonded together, and the piezoelectric vibrator 10 and the terminal member 150 can be bonded together in the state of the collective terminal member 15. For example, in mounting the electronic component 140 and joining the terminal member 150, for example, it is not necessary to individually fix the separated components to a jig, and productivity can be improved.

  Further, in the piezoelectric device manufacturing method of the present embodiment, the electronic component 140 is mounted on the collective terminal member 15, so that the mounting pads and wiring patterns for mounting the electronic component 140 are provided on the second main surface of the substrate portion 110a, Since there is no need to provide the inner layer, a piezoelectric device that can be made inexpensive and thin can be produced.

(Second Embodiment)
A method for manufacturing a piezoelectric device according to the second embodiment of the present invention will be described with reference to FIG. The second embodiment is different from the first embodiment in that in the step of joining the piezoelectric vibrators 10, the collective terminals remain in the state of the aggregate 11 in which a plurality of piezoelectric vibrators 10 are integrally formed with each other. In the step of joining the member 15 and cutting the collective terminal member 15 to obtain a piezoelectric device, the collective body 11 is also cut for each piezoelectric vibrator 10. The process of mounting the electronic component 140 is the same as that of the first embodiment as shown in FIG.

(Step of joining the piezoelectric vibrator 10)
As shown in FIG. 6B, a state of an aggregate 11 in which a plurality of piezoelectric vibrators 10 are integrally formed on a collective terminal member 15 from which a plurality of terminal members 150 can be cut out. Join together.

  As shown in FIG. 7, the assembly 11 includes a plurality of piezoelectric vibrators 10 formed integrally with each other. A sheet substrate having a plurality of substrate regions arranged in a matrix of vertical m columns × horizontal n rows (m and n are natural numbers of 2 or more), and a frame portion arranged so as to surround the substrate region ST is prepared, and the piezoelectric vibration element 120 is mounted on each substrate region of the sheet substrate ST. In the case of a sheet substrate, an annular sealing conductor pattern is formed on the entire periphery of the opening side top surface of the frame portion, and the lid 130 is disposed and joined on the sealing conductor pattern. . The piezoelectric vibration element 120 is mounted in a recessed space formed in each substrate region of the sheet substrate ST, and the recessed space is hermetically sealed with a lid 130.

(Process of cutting the collective terminal member 15 to obtain the piezoelectric device 100)
As shown in FIG. 6C, when the collective terminal member 15 is cut, the collective body 11 is also cut for each piezoelectric vibrator 10 to obtain the piezoelectric device 100.

  By cutting along a plurality of substrate regions arranged in a matrix of vertical m columns × horizontal n rows (m and n are natural numbers of 2 or more), the piezoelectric vibrators 10 are separated and each collective terminal member 15 is separated. By disconnecting the connecting portion between the frame body 160 and the terminal member 150, the terminal members 150 are separated from the frame body 160, whereby a plurality of piezoelectric devices 100 are obtained simultaneously. The collective terminal member 15 is cut by dicing or the like.

  According to the method of manufacturing the piezoelectric device 100 of the second embodiment, in the step of joining the piezoelectric vibrators 10, the collective terminals remain in the state of the aggregate 11 in which a plurality of piezoelectric vibrators 10 are integrally formed with each other. In the step of joining the member 15 and cutting the collective terminal member 15 to obtain the piezoelectric device, the collective body 11 is also cut for each piezoelectric vibrator 10 so that the piezoelectric vibrator 10 and the terminal member 150 are individually separated. The piezoelectric vibrator 10 and the terminal member 150 can be cut by batch division, and the productivity is further improved.

(Third embodiment)
A method for manufacturing a piezoelectric device according to the third embodiment of the present invention will be described with reference to FIG. The third embodiment is different from the first embodiment in that a step of joining the piezoelectric vibrator 10 (FIG. 8A) and a step of cutting the collective terminal member 25 to obtain a piezoelectric device (FIG. 8C). )), There is a step of mounting the electronic component 140 on the collective terminal member 25.

(Step of joining the piezoelectric vibrator 10)
As shown in FIG. 8A, the piezoelectric vibrator 10 is joined to the collective terminal member 25 from which a plurality of terminal members 250 can be cut out. The terminal member connection electrode G provided on the second main surface of the piezoelectric vibrator 10 is bonded to the main surface of the connection portion 251 provided on each terminal member 250 of the collective terminal member 25 by the conductive bonding material HD. Is done.

(Process of mounting electronic component 140)
As shown in FIG. 8B, before joining the piezoelectric vibrator 10 between the step of joining the piezoelectric vibrator 10 and the step of cutting the collective terminal member 25, the connecting portion 251 and the electrode portion. The electronic component 140 is bonded to the bonding portion 254 which is the main surface of the step formed by 252.

(Step of obtaining the piezoelectric device 200 by cutting the collective terminal member 25)
As shown in FIG. 8C, this is a step of obtaining the piezoelectric device 200 by cutting the collective terminal member 25. By disconnecting each terminal member 250 from the frame body 260 by cutting the connection portion between the frame body 260 and the terminal member 250 of each collective terminal member 25, a plurality of piezoelectric devices 200 are obtained simultaneously. The collective terminal member 25 is cut by dicing or the like.

  The collective terminal member 25 is configured in such a manner that a plurality of terminal members 250 are connected to the frame body 260 and arranged in series, and the electronic components 140 are arranged face-to-face with an interval in which the width of the electronic component 140 can be inserted. It is integrally formed.

  The terminal member 250 is made of a metal material such as copper, and a single collective terminal member 25 using the metal material is formed by a conventionally known etching method or the like, and is a surface opposite to the piezoelectric vibrator mounting direction. There is a step having a dimension higher than the height dimension of the electronic component 140 protruding to the top. The terminal member 250 is provided by the connection part 251 and the electrode part 252.

  As shown in FIG. 8, the terminal member 250 includes a connection portion 251 and an electrode portion 252 and is provided on the second main surface of the substrate portion 110a. When the terminal member 250 is viewed in plan from the first main surface, the area of the connection portion 251 is larger than the area of the electrode portion 252. In the terminal member 250, the electronic component 140 is mounted on a joint portion 254 formed by the connection portion 251 and the electrode portion 252. That is, the joint portion 254 provided on the adjacent pair of terminal members 250 and the connection electrode 141 of the electronic component 140 are joined via the conductive joining material HD. The terminal member 250 is used as an external connection electrode terminal that serves as a pair of piezoelectric vibration element electrode terminals and a pair of electronic component electrode terminals.

  In addition, the first main surface of the connecting portion 251 constituting the terminal member 250, the second main surface of the electrode portion 252 and the joint portion 254 which is a step main surface formed by the connecting portion 251 and the electrode portion 252, The electrode film 253 is provided. The electrode film 253 is a multilayer structure formed by laminating a plurality of metal films. The first metal film is formed on the main surface of the joint, and the second metal film is laminated on the upper surface of the first metal film. It is formed as follows. The first metal film is made of, for example, Ni plating, and the second metal film is made of, for example, gold plating. Thereby, the connection strength between the conductive bonding material HD and the terminal member 250 can be maintained.

  In the piezoelectric device manufacturing method according to the third embodiment, the electronic component 140 is placed on the collective terminal member 25 between the step of joining the piezoelectric vibrator 10 and the step of cutting the collective terminal member 25 to obtain the piezoelectric device 100. Heat treatment applied to the electronic component 140 by performing heat treatment such as reflow heating for joining the piezoelectric vibrator 10 before connecting the electronic component 140 to the collective terminal member 25. Load is reduced.

  In addition, the method for manufacturing a piezoelectric device according to the third embodiment includes a step of mounting the electronic component 140 after the step of bonding the piezoelectric vibrator 10 so that the heat treatment for connecting the electronic component 140 is performed. The temperature can be made lower than the temperature of the heat treatment for joining the piezoelectric vibrator 10, and the thermal load applied to the electronic component 140 can be reduced.

(Fourth embodiment)
A method for manufacturing a piezoelectric device according to the fourth embodiment of the present invention will be described with reference to FIG. The fourth embodiment differs from the second embodiment in that in the step of cutting the collective terminal member 15 to obtain a piezoelectric device, the collective terminal member 15 is moved along the outer periphery of each terminal member 150 with the first blade B1. The through-groove M1 that penetrates the collective terminal member 15 in the thickness direction is formed in the joined body 12 by cutting at a step, and then the second blade B1 having a narrower blade width than the first blade B1 is passed through the through-groove. It is inserted into M1 and the joined body 12 is cut.

  Then, as shown in FIG. 9A and FIG. 10, a joined body 12 (see FIG. 10) composed of the aggregate terminal member 15 and the aggregate 11 integrated in the step of cutting the aggregate terminal member 15 to obtain a piezoelectric device. A through-groove M1 that penetrates through the aggregate terminal member 11 in the thickness direction so that the aggregate 11 is partially exposed by cutting the aggregate terminal member 15 with the first blade B1 along the outer periphery of each substrate region. Form.

  As the first blade B1, for example, a disk-shaped electroformed blade in which diamond abrasive grains or the like are fixed by electroforming is used. Ni or the like is used as the binder.

  Next, as shown in FIG. 9B, the aggregate 11 is cut and divided by inserting the second blade B2 having a narrower blade width than the first blade B1 into the through groove M1. As a result, a plurality of piezoelectric devices are manufactured simultaneously.

  As the second blade B2, a disk-shaped resin blade is used in which diamond abrasive grains and the like are bonded with a resin such as an epoxy resin as a binder. Various metals may be used as additives. The second blade B2 may be cut while being worn with the ceramic sheet substrate by relatively reducing the hardness.

  According to the piezoelectric device manufacturing method of the fourth embodiment, the joined body 12 formed by joining two kinds of members, the ceramic aggregate 11 and the metal aggregate terminal member 15, is cut into respective materials. Therefore, it is possible to effectively suppress the generation of stress in the bonded body 12 due to the cutting, as compared with the case of cutting using one type of blade. Further, peeling of the piezoelectric vibrator 10 and the terminal member 150 can be reduced. As a result, the assembly process of the piezoelectric device is greatly simplified, and the productivity of the piezoelectric device 100 can be improved.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. For example, in the present embodiment, the case where quartz is used as the piezoelectric material constituting the piezoelectric vibration element 120 has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics was used as the piezoelectric material. A piezoelectric vibration element may be used.

DESCRIPTION OF SYMBOLS 110 ... Element mounting member 110a ... Substrate part 110b ... Frame part 111 ... Piezoelectric vibration element mounting pad 120 ... Piezoelectric vibration element 121 ... Crystal element plate 122 ... Excitation electrode 123 ... Extraction electrode 130 ... Cover 140 ... Electronic component (thermistor element)
150, 250 ... terminal members 151, 251 ... connection parts 152, 252 ... electrode parts 160, 260 ... frame bodies 100, 200 ... piezoelectric devices 11 ... aggregates 12 ... Junction 15 ... Collective terminal member K1 ... Recessed space DS ... Conductive adhesive HD ... Conductive joint HB ... Sealing conductor film G ... Terminal member connecting electrode G1 ... Connection electrode for piezoelectric vibration element G2 ... Connection electrode

Claims (3)

In a collective terminal member in which four terminal members form a group, and a plurality of the terminal members in the group can be cut out, only two of the four terminal members constituting each group are included. Mounting the electronic component while electrically connecting it to the electronic component,
Device mounting comprising a substrate portion, a frame portion provided on a first main surface of the substrate portion, and terminal member connection electrodes provided at four corners of a second main surface of the substrate portion that is rectangular in plan view A pair of piezoelectric elements provided on a main surface of the substrate portion exposed in a recessed space formed by a member, the substrate portion and the frame portion, and electrically connected to the two terminal member connection electrodes A plurality of piezoelectric vibrators each including a piezoelectric vibration element to be mounted on a vibration element mounting pad and a lid body that hermetically seals the recess space, each group of four terminal members constituting the collective terminal member In order to electrically connect the two terminal member connection electrodes to which the piezoelectric vibration element mounting pads are electrically connected to the two terminal members on which the electronic component is not mounted, the four terminals Member connection electrode and a group of four terminal members Each bonded, joining a plurality of the piezoelectric vibrator to the set terminal member, and bonding the piezoelectric vibrator,
Cutting the collective terminal member to which the piezoelectric vibrator is bonded to form a plurality of piezoelectric devices including the piezoelectric vibrator, the terminal member, and the electronic component; and obtaining a piezoelectric device;
A method for manufacturing a piezoelectric device comprising: In the step of joining the piezoelectric vibrators, the piezoelectric vibrators are joined to the aggregate terminal member in a state of an aggregate formed integrally with each other,
2. The method of manufacturing a piezoelectric device according to claim 1, wherein in the step of obtaining the piezoelectric device, the aggregate is also cut for each of the piezoelectric vibrators.   In the step of obtaining the piezoelectric device, by forming a through groove that penetrates the collective terminal member in the thickness direction by cutting the collective terminal member with a first blade along the outer periphery of each terminal member; 3. The method of manufacturing a piezoelectric device according to claim 2, wherein the assembly is cut by inserting a second blade having a narrower blade width than the first blade into the through groove.

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