JP5811391B2 - Method for producing silicon nitride ceramic sintered body and firing container - Google Patents

Description

  The present invention relates to a method for producing a silicon nitride ceramic sintered body and a firing container.

  Prior arts related to the above technical field are disclosed in Patent Documents 1 and 2 below. The manufacturing method of an aluminum nitride substrate disclosed in Patent Document 1 is “inside a firing container comprising a cylindrical container body formed of an aluminum nitride sintered body and a lid body formed of a boron nitride sintered body and covering the container body. And a method for producing an aluminum nitride substrate, comprising sintering in a non-oxidizing atmosphere in a state in which a substrate molded body containing aluminum nitride as a main component is accommodated.

  The method for sintering silicon nitride ceramics disclosed in Patent Document 2 is “a silicon nitride sintered body formed by mixing silicon nitride powder and one or more additives acting as a sintering aid and forming into a block shape. A mixed powder comprising silicon nitride and silica or a mixed powder comprising silicon nitride, silica and boron nitride powder acting as a dispersing material or silicon oxynitride powder is packed in a sheath, and the mixed powder or silicon oxynitride powder is filled with the above powder A method of sintering silicon nitride ceramics characterized in that a silicon nitride powder and one or more additives acting as a sintering aid are mixed to fill a sintered body formed into a block shape and sintered simultaneously. . The sheath is a “sintered body made of boron nitride or silicon nitride” and is housed in a carbon container.

JP-A-5-330924 JP 2002-53376 A

  According to the method for manufacturing an aluminum nitride substrate of Patent Document 1, since the molded body is fired in a state where the molded body is housed in a closed firing container, the molded body can be uniformly heated and further exists in the heating furnace. Since impurities such as carbon can be prevented from directly touching the molded body, a sintered body in which deformation is relatively suppressed can be obtained. However, when this manufacturing method is applied particularly when the firing step is performed in a nitrogen atmosphere pressurized to normal pressure or a low pressure of less than 10 atm, a silicon nitride ceramic sintered body (hereinafter referred to as sintered body) is used. The silicon nitride component and the sintering aid component that constitutes a large amount decompose at high temperatures and vaporize to cause weight loss, resulting in voids inside and on the surface of the sintered body. The density of the sintered body was lowered, and desired mechanical properties (strength, fracture toughness) and thermal properties (thermal conductivity, thermal expansion coefficient) could not be obtained. This problem can be solved by firing the molded body in a nitrogen atmosphere pressurized to a high pressure of 10 atmospheres or more, but the sintering process is performed in a batch manner with a heating furnace configuration that maintains the heating chamber at a high pressure. Inevitably, it is unsuitable for mass production, leading to high product costs.

  On the other hand, according to the sintering method of silicon nitride ceramics of Patent Document 2, a degreased body (a mixed powder of silica and silicon nitride that generates SiO by a high-temperature reaction) or a silicon oxynitride powder (hereinafter referred to as embedded powder) ( Sintering in a state in which the sintered body in Patent Document 2 is buried, the partial pressure of SiO is increased, volatilization of the silicon nitride component is suppressed, weight loss of the sintered body can be prevented, and firing is performed. It is possible to solve the problem of weight loss in the method of manufacturing the aluminum nitride substrate of Patent Document 1 described above when the process is performed under a normal or low pressure nitrogen atmosphere. However, since the method of sintering silicon nitride ceramics of Patent Document 2 embeds and burns the degreased body in the embedding powder, the deformation of the sintered body is caused due to the non-uniform contact state between the degreased body and the embedding powder. There was a problem. That is, in the silicon nitride ceramic sintering method of Patent Document 2, in order to obtain a sintered body in which deformation is suppressed, each surface of the degreased body embedded in the embedded powder and the embedded powder in contact with the respective surface It is necessary to make the contact state uniform, make the frictional force generated between the degreased body and the embedding powder shrinking during firing uniform on each surface, and uniformly shrink the entire sintered body. However, it is very difficult to prepare filling powder with uniform particle size distribution and arrange it uniformly around the object to be sintered, and due to non-uniformity of the filling powder in contact with the degreased body, the sintered body Deformation may occur, and it has been difficult to obtain a sintered body having a desired shape with high precision such as flatness and flatness.

  Further, as in the method of sintering silicon nitride ceramics of Patent Document 2, when the object to be sintered is embedded in the embedded powder and fired at the same time, there is a problem that the embedded powder is baked and adhered to the surface of the sintered body. Even if boron nitride powder, which is a dispersing material for suppressing seizure, is added to the embedding powder, it is not sufficient. For this reason, not only a removal process for removing the adhering filling powder is required, but also the filling powder having a minute particle diameter cannot be completely removed even after the removal process. As a result, there is a problem that the sintered body is cracked.

  The present invention has been made in view of the above-described problems of the prior art, and in particular, even when the firing step is performed in a nitrogen atmosphere at normal pressure or low pressure, the deformation and weight loss can be suppressed. Another object of the present invention is to provide a method for producing a silicon nitride ceramic sintered body and a firing container.

  One aspect of the present invention for solving the above problems is a method for producing a silicon nitride ceramic sintered body, which comprises degreasing a molded body obtained by molding a raw material powder in which a silicon nitride powder and a sintering aid powder are mixed. A degreasing step for forming a degreased body, a first storage step for storing the degreased body in a storage chamber of a storage container made of boron nitride or silicon nitride through which the outside air can flow after the degreasing step, and an air passage through which the outside air can flow A second storage step of storing the storage container in the storage portion of the baking container, and a baking step of placing the baking container in a heating furnace and baking the degreased body in a nitrogen atmosphere after the second storage step. The firing container has a partition made of boron nitride or silicon nitride formed between a storage container stored in the storage portion and an inner wall surface thereof, and the partition between the partition and the firing container In addition, silicon nitride powder and sintering aid powder were mixed. A method for producing a silicon nitride ceramic sintered body which comprises a packed powder placement step of placing the fit powder. In the second storing step, it is preferable to store the storage container so that the degreased body does not face the air passage.

  Note that the partition wall is preferably arranged so as to surround the storage container in a plan view as viewed from above the baking container.

  Furthermore, it is desirable that the firing container has a cylindrical wall body having one opening that constitutes the partition wall and a lid body that closes the opening of the wall body. In addition, it is preferable that the firing container is silicon nitride or carbonaceous.

  Furthermore, the storage container has a bottom body on which the degreased body is placed on one surface, a wall body having an opening disposed on one surface of the bottom body so as to surround the degreased body placed on the bottom body, A lid that closes the opening of the wall, and the storage chamber is defined by the bottom, the wall, and the lid, and has an air passage formed between the wall and the lid. Is preferable. In this case, a stuffing powder similar to the above can be disposed between the storage container and the partition wall. In addition, when the storage container is placed in the storage part of the baking container, the bottom of the upper storage container may be the lid of the lower storage container.

  Another aspect of the present invention that solves the above problems is a firing container used in a firing process of a silicon nitride ceramic sintered body, and molding raw material powder in which silicon nitride powder and sintering aid powder are mixed. A storage part capable of storing a storage container made of boron nitride or silicon nitride having a storage chamber for storing outside air for storing a degreased body that has been degreased, and outside air communicating with the storage part can flow And a partition wall formed between the storage container stored in the storage unit and the inner wall surface thereof, and between the partition wall and the inner wall surface, silicon nitride powder and sintered It is a baking container characterized by providing the area | region which can arrange | position the filling powder which mixed the binder powder. It is preferable that the storage container stored in the storage unit is disposed so that the stored degreased body does not face the vent hole.

  Note that the partition wall is preferably arranged so as to surround the storage container in a plan view as viewed from above the baking container.

  Furthermore, it is desirable that the firing container has a cylindrical wall body having one opening that constitutes the partition wall and a lid body that closes the opening of the wall body. In addition, the firing container is desirably boron nitride, silicon nitride, or carbon.

  Further, the storage container stored in the storage unit is disposed on one surface of the bottom body so as to surround the bottom body on which the degreased body is placed on one surface and the degreased body placed on the bottom body. A cylindrical wall having an opening and a lid that closes the opening of the wall, and the storage chamber is defined by the bottom body, the wall, and the lid, and is defined between the wall and the lid. It is preferable if it has a ventilation path formed in the. In this case, an area where the same stuffing powder as above can be placed can be set between the storage container and the partition wall.

  According to the present invention, since it is configured as described above, the problem can be solved.

It is a flowchart explaining the manufacturing process of a silicon nitride ceramic sintered body. It is a figure explaining the detailed flow of the preparation process of FIG. It is front sectional drawing of the storage container which accommodates the degreased body used in the degreasing process of FIG. It is front sectional drawing of the storage container and baking container which are used in the preparation process of FIG. FIG. 5 is a cross-sectional plan view of the firing container and storage container of FIG. 4 and a modification thereof. FIG. 5 is a plan cross-sectional view of a more preferable example of the firing container of FIG. 4.

  The present invention will be described based on the embodiment with reference to FIGS. In the following, a rectangular thin plate-like substrate (hereinafter sometimes referred to as a silicon nitride substrate) composed of a silicon nitride ceramic sintered body and used for electronic and electrical applications on which electronic components such as semiconductor devices are mounted. The present invention will be described specifically by way of example, but it goes without saying that the present invention can be used for silicon nitride ceramic sintered bodies used for machine structural parts, building structural parts, and other various applications. In addition, the present invention can be suitably applied to the production of a silicon nitride ceramic sintered body in which the sintering process is performed in a normal or low pressure nitrogen atmosphere, but the sintering process is performed in a high pressure nitrogen atmosphere. It can also be applied in the case of performing.

[composition]
The silicon nitride substrate composed of the sintered body according to this embodiment has Mg (magnesium) as the sintering aid in an amount of 1.5 to 5.5% by weight in terms of oxide and at least one rare earth element as an oxide. Containing 0.5 to 15% by weight. Examples of rare earth element oxides include Y, La, Ce, Nd, Pm, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb, and Lu. Among them, Y oxide Y ₂ O ₃ Is effective for increasing the density of the silicon nitride substrate, and is more preferable. Since magnesium and rare earth elements function as a sintering aid for growing columnar particles of silicon nitride, if the content is small, the columnar particles are insufficiently grown and the columnar particles having a short length in the major axis direction are formed. Become more. For this reason, the bending strength, fracture toughness, etc. of the silicon nitride substrate are lowered. On the other hand, when the contents of magnesium and rare earth elements are increased, the growth of columnar particles is promoted, and the columnar particles having a long length in the major axis direction are increased. For this reason, the degree of orientation fa of the silicon nitride substrate increases and the surface roughness increases. In the silicon nitride substrate of this embodiment, in order to adjust these characteristics, the contents of magnesium and rare earth elements are in the above ranges.

[Production method]
Next, the manufacturing method is demonstrated with reference to FIG. 1 which shows the manufacturing flow of the sintered compact of this aspect. In FIG. 1, reference sign S <b> 1 is a raw material adjustment / mixing step, in which magnesium is added to silicon nitride raw material powder in an amount of 1.5 to 5.5% by weight in terms of oxide, and at least one rare earth element is converted to 0.5 in terms of oxide. It mixes so that it may become a ratio of -15.0 weight%, It mixes with a ball mill etc. with an organic binder, a plasticizer, etc., and forms raw material slurry. Here, as the rare earth element oxide, it is preferable to use the above-described Y ₂ O ₃ .

  Next, the forming step S2. In the forming step S2, the mixed raw material slurry is defoamed and thickened, and then formed into a sheet having a predetermined thickness by a doctor blade method. The sheet thickness of the sheet molded body at this time can be appropriately determined according to the application, but in the case of a silicon nitride substrate, it is usually about 0.1 to 1.0 mm. Since the molded body (green sheet) molded in the molding step S2 is usually large, it is cut into a card-shaped molded body of a desired size in the cutting step S3. This card-shaped molded body is sized to include a plurality of small pieces of silicon nitride substrates as final products. After the molded body is fired to form a card-shaped sintered body, it is divided into small pieces. Thus, a silicon nitride substrate as a final product can be obtained.

After the cutting step S3, boron nitride powder is applied to both sides or one side of the compact in the BN coating step S4. A plurality of the boron nitride powders are laminated in the laminating step S5 after this step, and the silicon nitride substrates are prevented from adhering to each other when the degreasing step S6 and the firing step S8 are fired. In addition to improving, it has a function of suppressing deformation of the silicon nitride substrate. The boron nitride powder has an oxygen content of 0.01 to 0.5% by weight, an average particle size of 4 to 20 μm, a specific surface area of 20 m ² / g or less, and an oxygen content of 0.01 to 0.5 from the viewpoint of its function. It is preferable to use the weight percent. Further, impurities contained in the boron nitride powder, particularly carbon, may combine with a minute amount of oxygen contained in the nitrogen gas to form carbon monoxide, which may reduce the silicon nitride component in the silicon nitride substrate and cause deformation. Therefore, the content is desirably 1% by weight or less. Furthermore, the preferable coating amount of boron nitride powder is 0.05 to 1.4 mg / cm ^2.
It is. Further, the method for applying boron nitride powder is not particularly limited, and a solution obtained by mixing silicon nitride powder with a solvent may be applied to the surface of the molded body with a spray or a brush. In order to apply the boron nitride powder in an amount, it is preferably applied by a screen printing method.

  Then, it is lamination process S5. As shown in FIG. 3, which is also a diagram for explaining the state of the silicon nitride substrate in the degreasing step S6, the molded body w1 coated with the boron nitride powder b on the surface was coated with the boron nitride powder b in the laminating step S5. A plurality of sheets are laminated on the plate 1c so that the surfaces are in contact with each other.

  In the degreasing step S6, the plurality of molded bodies w1 stacked in the stacking step S5 are degreased in order to remove organic components such as a binder contained in the molded body w1, thereby forming a degreased body w2. Degreasing is preferably performed, for example, by placing the molded body w1 in a heating furnace or a heating table and in an atmosphere of 900 ° C. or lower, or in an inert atmosphere such as atmospheric nitrogen or argon. Here, as shown in FIG. 3, in the degreasing step, it is desirable to store the laminated molded body w1 in the storage container 1 and perform degreasing.

  As shown in FIG. 3A, which is a front cross-sectional view, and FIG. 3B, which is a cross-sectional view taken along line AA of FIG. 3A, the storage container 1 includes a plurality of stacked molded bodies w1. A rectangular flat plate-like bottom body 1c (also a plate body on which the molded body w1 is laminated in the laminating process) and a rectangular frame shape having an open top and bottom arranged in close contact with the top surface of the bottom plate 1c. Wall 1b and a rectangular flat lid 1a arranged to close the upper opening of the wall 1b. The wall 1b is disposed so as to surround the molded body w1 placed on the bottom plate 1c, and is laminated in a storage chamber 1d defined by the bottom 1c, the wall 1b, and the lid 1a. The molded body w1 is accommodated. Here, the lid body 1a and the wall body 1b or the bottom body 1c and the wall body 1b are not in close contact with each other, and the interface between which a minute gap is formed becomes the air passage 1f, and is stored via the air passage 1f. The chamber 1d communicates with the outside. Therefore, in the degreasing step S6, as indicated by an arrow C in the figure, outside air flows from the outside into the storage chamber 1d through the air passage 1f, and gas generated from the molded body flows out from the storage chamber 1d to the outside. Since 1d is surrounded by the bottom body 1c, the wall body 1b, and the lid body 1a, the molded body w1 stored in the storage chamber 1d is not directly exposed to the outside air. For this reason, even if a change occurs in temperature, humidity, wind speed, etc. in the environment outside the storage container 1, the molded body w1 stored in the storage chamber 1d is hardly affected, and further relatively Since the molded body w1 is heated uniformly in the sealed storage chamber 1d, deformation (warping) of the degreased body w2 can be suppressed in the degreasing step.

  In addition, since the material which forms the bottom body 1c, the wall body 1b, and the cover body 1a which comprise the storage container 1 performs a degreasing process at comparatively low temperature, it is necessary to consider reaction of the said material and the molded object w1 Therefore, alumina, zirconia, and other suitable ceramics can be used. When only degreasing of the molded body w1 is considered, as shown in FIG. 3C, support columns 5b that are interposed between the lid body 1a and the bottom body 1c and support both are provided on the four sides. You may utilize the storage container 5 which improved the flowability of. However, since the storage container for storing the molded body is also used in the firing step S8 following the degreasing step S6, the storage container used in the degreasing step S6 and the firing step S8 has a common structure from the viewpoint of work efficiency. It is preferable to form the bottom body 1c, the wall body 1b, and the lid body 1a with silicon nitride or boron nitride having low reactivity with the sintered body in the firing step S8.

  As shown in FIG. 1, in the manufacturing method of this aspect, preparation process S7 is implemented after degreasing process S6. Preparatory step S7 interposed between degreasing step S6 and firing step S8 is a step of storing degreased body w2 fired in firing step S8 in firing container 2 in a predetermined state, as shown in FIG. , The first storage step S71, the second storage step S72, and the filling powder arrangement step S73. Hereinafter, before explaining the details of the preparation step S7, the configurations of the firing container 2 and the storage container 7 used in this step will be described with reference to FIGS.

  The storage container 7 used in the preparation step S7 has basically the same structure as the storage container 1 used in the degreasing step S6. That is, as shown in FIGS. 3A and 3B, the storage container 7 includes a rectangular plate-like bottom body 7c and a rectangular frame-like wall body 7b arranged so that its bottom surface is in close contact with the upper surface of the bottom plate 7c. And a rectangular plate-like lid body 7a arranged so as to close the upper opening of the wall body 7b, and a plurality of degreased degreased bodies w2 include a bottom body 7c, a wall body 7b, a lid body 7a, It is stored in a storage chamber 7d in which the outside air defined by can be circulated. Here, as mentioned in the description of the degreasing step, the storage container 1 used at the time of degreasing is not particularly limited in material and structure, but in the firing step S8 subsequent to the preparation step S7, the degreased body w2 is baked. It is necessary to consider the reactivity of the silicon nitride component and the sintering aid component contained in the bonded body w3 and the material constituting the container 7, and the bottom body 7c is made of silicon nitride or boron nitride which does not react with both. -The wall 7b and the lid 7a must be formed. Therefore, when the materials of the storage containers 1 and 7 are different, it is necessary to take out the degreased body w2 from the storage container 1 and transfer it to the storage container 7 after the degreasing step S6. The storage containers 1 and 7 can be used in common in the degreasing step S6 and the firing step S8 as described above. If both are formed of silicon nitride or boron nitride, the storage described in the degreasing step S6 is performed. A storage container having a structure like the container 5 can also be used.

  As shown in FIG. 4 which is a front cross-sectional view thereof and FIG. 5A which is a BB cross-sectional view of FIG. In the heating chamber 3b of the furnace 3, a cross section that is open on both the upper and lower sides arranged in a state where the bottom surface is in contact with the hearth 3c is arranged so as to block the rectangular frame-shaped wall body 2a and the upper opening of the wall body 2a. The housing 2d is defined by the hearth 3c, the wall 2a, and the lid 2b. Here, the lid body 2b and the wall body 2a are not in close contact with each other, and an interface between them where a minute gap is formed becomes the air passage 2f, and the storage portion 2d and the heating chamber 3b (external) are provided via the air passage 2f. ) Communicate with each other, and as shown by an arrow D in the figure, the gas in the storage portion 2d flows out through the ventilation path 2f. Furthermore, in the firing container 2 of this embodiment, as a preferred embodiment, since the storage container 7 is stored in the storage portion 2d so that the degreased body w2 does not face the air passage 2f, the degreased body is introduced into the outside air flowing in through the air passage 2f. w2 is not touched directly. For this reason, even if it is a case where temperature, humidity, a wind speed, etc. change in the environment outside the baking container 2, the degreased body w2 is hardly affected. In addition, the storage container 7 which accommodated the degreased body w2 is arrange | positioned on the hearth 3c of the approximate center part of the storage part 2d of the baking container 2, as shown to Fig.5 (a).

  4 and 5A, reference numeral 2c denotes a partition wall, which is disposed between the storage container 7 stored in the storage portion 2d of the baking container 2 and the inner wall surface of the wall 2a of the baking container 2 in the above-described manner. Has been. The cylindrical partition wall 2c of this embodiment has a rectangular frame shape in cross section surrounding the storage container 7, and the bottom 4 sides of the gap 2e between the outer wall surface and the wall body 2a of the baking container 2 It arrange | positions in the state with which the fixed amount packing powder T1 was filled. In addition, the arrangement | positioning aspect of the partition in a baking container is not limited above, As shown in the baking container 4 which shows a plane sectional view in FIG. You may arrange | position packing powder T1 in the space | interval 2e of each partition 4c and wall 2a, arrange | positioning at a side. Further, by arranging such partition walls 2c and 4c, the degreased body 2w together with the wall body 2a is double-isolated from the outside, and the influence of changes in the external environment becomes more difficult.

Here, silicon nitride and magnesium oxide contained in the degreased body w2 have a high vapor pressure, and in firing in a nitrogen atmosphere at normal pressure or low pressure, the following formula 1 and 2 are reacted by the reaction from the left side to the right side of the following formulas 1 and 2. The decomposition reaction of silicon nitride, which is Si ₃ N ₄ on the left side, and magnesium oxide, which is MgO on the left side of the following formula 2, proceeds to the SiO gas and Mg gas on the right side of the following formulas 1 and 2, and the degreased body w2 during firing As a result, weight loss of the sintered body occurs. Note that the supply source of SiO _{2 on} the left side of Formula 1 is a silicon oxide layer formed on the surface of silicon nitride particles. The filling powder T1 disposed in the storage part 2d of the baking container 2 has a function of increasing the gas partial pressure of SiO and Mg on the right side of the formulas 1 and 2 and suppressing the decomposition and volatilization of the silicon nitride and magnesium oxide. . The rare earth element oxide which is another sintering aid component has a relatively low vapor pressure and is difficult to volatilize when the defatted body w2 is fired. Therefore, it may be added to the filling powder T1 as necessary.

Si ₃ N ₄ (s) + 3SiO ₂ (l) → 6SiO (g) + 2N ₂ (g): Formula 1
Si ₃ N ₄ (s) + 3MgO (s) → 3SiO (g) + 3Mg (g) + 2N ₂ (g): Formula 2
Where s: solid phase, l: liquid phase, g: gas phase

  In order to express the above function, the filling powder T1 includes a silicon nitride powder and a magnesium oxide powder as a sintering aid, and is preferably nitrided as a dispersing material for preventing adhesion of the silicon nitride powder due to high-temperature heating. Add boron powder. The filling powder T1 disposed in the gap 2e of the baking container 2 is decomposed according to the reaction from the left side to the right side of the above formulas 1 and 2 at a high temperature in the baking process, and SiO gas and Mg gas are generated. As a result, the gas partial pressure of SiO and Mg in the storage portion 2d is increased, and the progression from the left side to the right side of the formulas 1 and 2 during firing of the degreased body w2 is suppressed, and as a result, the weight loss of the sintered body is suppressed. Is done.

The filling powder T1 is preferably configured such that the compounding ratio of the silicon nitride powder and the magnesium oxide powder (magnesium oxide powder / silicon nitride powder) is 1.0 to 0.25. If the magnesium oxide powder / silicon nitride powder is less than 0.25, a sufficient SiO gas that suppresses the weight loss of the sintered body w3 obtained by firing the degreased body w2 cannot be generated. MgO vapor pressure becomes higher and diffuses to the silicon nitride sintered body, MgSiN ₂ is generated, and the strength of the fired body w3 is reduced. Moreover, when adding boron nitride powder, it is preferable to add 10-50 wt%. If it is less than 10 wt%, the effect of suppressing the adhesion of silicon nitride particles is difficult to occur, and if it exceeds 50 wt%, it is difficult to obtain the effect of suppressing weight loss. In addition, the silicon nitride powder is preferably constituted to be 25 to 72 wt% and the magnesium oxide powder to be 10 to 45 wt%.

  It is desirable that the wall 2a and the lid 2b constituting the main body portion of the firing container 2 are made of boron nitride, silicon nitride, or carbon which is a material having low reactivity with the degreased body w2. In particular, it is desirable to form with a carbonaceous material for the following reasons. That is, the wall 2a and the lid 2b that are exposed to a high temperature atmosphere and are heavily consumed and frequently exchanged can be made of a carbonaceous material, so that the cost can be reduced and the affinity with oxygen is good. This is because the inside of the firing container is in a reducing atmosphere, and it is possible to reduce the oxygen content in the fired body and produce a sintered body with good heat conduction characteristics. In addition, it is essential for the material which comprises the storage container 7 and the partition 2c which are arrange | positioned around the degreased body w2 to be fired to be silicon nitride or boron nitride which does not react with silicon nitride contained in the degreased body w2.

  Details of the preparation step 71 using the storage container 7 and the baking container 2 will be described with reference to FIGS. 2, 4, and 5 (a). First, it is 1st accommodation process S71 (refer FIG. 2). In the first storage step S71, the degreased body w2 is stored in the storage chamber 7d of the storage container 7 through which outside air can circulate as described above. Note that the boron nitride powder applied to the compact in the BN coating step S4 is maintained as it is on the surface of the degreased body w2. When the storage container 7 is shared with the storage container 1 used in the degreasing step S6, the step of storing the molded body w1 in the storage container 1 in the degreasing step S6 for forming the degreased body w2 is the first storage step. It will also serve as S71. Furthermore, the shape of the degreased body w2 stored in the storage portion 7d is not a state in which a plurality of degreased bodies w2 are stacked as shown in FIG.

  Then, it is 2nd accommodation process S72. In the second storage step S72, the storage container 7 in which the degreased body w2 is stored in the storage portion 2d of the firing container 2 having the ventilation path 2f through which the outside air can flow as described above, preferably the degreased body w2 is vented. It stores so that it may not oppose the path 2f. In FIG. 4, a plurality of storage containers 7 are stacked and stored in the storage unit 7d. However, only one storage container 7 may be stored, and stored in the storage unit 7d in a state of being parallel in the horizontal direction. May be. Further, when the storage containers 7 are arranged in a stacked manner as shown in the drawing, the bottom body 1c of the upper storage container 7 may be arranged so as to become the lid 1a (see FIG. 3) of the lower storage container 7. .

  Then, it is packing powder arrangement | positioning process S73. In the packing powder arranging step S73, the above-described packing powder T1 is arranged in the gap 2e between the partition wall 2c of the baking container 2 and the baking container 2a. The composition of the filling powder T1 is as described above, but the filling amount takes into consideration the mass of the degreased body w2 stored in the storage container 7, the capacity of the storage portion 2d, the baking conditions (firing temperature and baking time) in the baking step, and the like. An appropriate amount may be filled. The first storage step S71, the second storage step S72, and the filling powder arrangement step S73 do not have to be performed in this order. For example, after the filling powder T1 is placed in the gap 2e of the baking container 2 (packing) The powder arrangement step), the degreased body w2 may be stored in the storage container 7 (first storage step), and the storage container 7 may be stored in the baking container 2 (second storage step).

  Subsequent to the preparation step S7, the firing step S8 is performed. In the sintering step S7, the degreased body w2 housed in the firing container 2 as described above is fired at a temperature of 1700 to 2000 ° C. for 1 to 20 hours in a normal or low pressure nitrogen atmosphere. At the time of firing, the filling powder T1 disposed in the firing container 2 acts as follows.

  As described above, the filling powder T1 containing the silicon nitride powder and the magnesium oxide powder is gasified by a decomposition reaction from the left side to the right side of the formulas 1 and 2 at a high temperature, and as a result, SiO gas and Mg gas are generated. The This gas fills the inside of the storage portion 2d of the baking container 2, increases the partial pressure of the SiO gas and the Mg gas, and forms silicon nitride particles and magnesium oxide particles contained in the degreased body w2 stored in the storage container 7. The decomposition reaction due to the reactions of Formulas 1 and 2 is prevented, and weight loss of the sintered body w3 is prevented.

  Here, since the pressure of the SiO gas and the Mg gas filling the storage portion 2d as described above is higher than the pressure of the heating chamber 3b (external) of the heating furnace 3, these gases are used as the lid 2b of the baking container 2. And it flows out into the heating chamber 3b through the ventilation path 2f between the wall bodies 2a. In this way, the gap is sealed by the gas flowing out from the air passage 2f. Thereby, in the firing step S8, the storage part 2d is hermetically sealed, the inflow of carbon and oxygen as impurities contained in the nitrogen gas in the heating chamber 3b into the storage part 2d is suppressed, and the degreased body w2 is formed. Weight loss of the fired sintered body is further prevented. As described above, the outside air does not flow into the storage portion 2d from the gap between the lid 2b and the wall 2a, and the lid 2b and the wall 2a prevent the substantially sealed storage 2d from coming into direct contact with the outside air. Since the temperature in the storage chamber 2d is kept uniform, deformation of the fired body is suppressed. Further, nitrogen gas is usually blown into the heating chamber 3b at a constant flow rate, but since the degreased body w2 is not opposed to the ventilation path 2f, the nitrogen gas (outside air) flowing in through the ventilation path 2f is directly degreased. There is no direct contact with w2, and deformation of the degreased body w2 due to the pressure of this gas is also suppressed.

  And since the stuffing powder T1 is disposed separately from the degreased body w2 in the gap 2e between the partition wall 2c and the wall body 1a, it can be baked on the degreased body 2w in the firing step and remain in the sintered body. No. As a result, for the sintered body obtained by firing the degreased body w2, not only the process of removing the baked packing powder T1 becomes unnecessary, but also the defect of the silicon nitride substrate due to the baked packing powder T1 can be avoided. Moreover, since the degreased body w2 does not come into direct contact with the filling powder T1, deformation of the sintered body w3 due to variations in the composition and arrangement of the filling powder T1 is prevented. In order to enhance the effect of the filling powder, the filling powder T2 may be separately provided on the upper portion of the storage container 7, for example, as shown in FIG. 4 separately from the filling powder T1 disposed in the gap 2e.

  After the firing step S8, as shown in FIG. 1, a heat treatment step S9 is performed as necessary. The heat treatment step S9 is a step of correcting the deformation of the sintered body generated during firing to obtain the necessary flatness as a silicon nitride substrate, and is necessary if the amount of deformation of the sintered body after firing is within a desired range. is not. When the sintered body is used as a silicon nitride substrate, the amount of deformation allowed in industrial production is approximately 2.0 μm / mm or less. In the heat treatment step S9, a weight is placed on the sintered body after firing and inserted into a heating furnace, and a load (pressure) of 0.2 to 8.0 KPa is vertically applied to the sintered body from the weight. And heated at 1550 to 1900 ° C. in a nitrogen atmosphere. Thus, the warp of the silicon nitride substrate can be corrected by performing the heat treatment while applying a load. In addition, when the heat processing temperature at this time becomes lower than 1550 degreeC, the inhibitory effect of curvature will become inadequate and a deformation | transformation of a sintered compact will become larger. Moreover, when it becomes higher than 1900 degreeC, the growth of the columnar particle | grains contained in a sintered compact will be accelerated | stimulated, the orientation degree of columnar particle | grains will become large and surface roughness will increase. Therefore, the above range is preferable for the heat treatment temperature. Further, when the load applied during the heat treatment is lower than 0.2 kPa, the effect of suppressing warpage is insufficient, and when it is higher than 8.0 kPa, the surface penetration of the grain boundary glass phase contained in the sintered body is insufficient. When the defatted bodies are laminated and fired, the sintered bodies are bonded together by the glass phase. Therefore, the above range is suitable for the load applied during the heat treatment. Furthermore, it is preferable that a plurality of sintered bodies are stacked and a weight body is placed on the stacked body and heat-treated. As a result, the volatilization amount of the sintering aids such as magnesium oxide and yttrium oxide is suppressed, the growth of columnar particles contained in the sintered body is suppressed, and the degree of orientation of the columnar particles can be suppressed from becoming excessively high. .

  A blasting step S10 is performed after the firing step S8 or the heat treatment step S9. In the blasting step S10, abrasive grains or other media made of ceramics are sprayed on the surface of the sintered body to remove the columnar particles protruding from the surface of the sintered body, thereby reducing the surface roughness. As a result, when the copper or aluminum plate forming the circuit board and the heat dissipation board is bonded to the surface of the silicon nitride substrate, the formation of voids at the bonding interface can be suppressed when the silicon nitride circuit substrate is configured. .

  FIG. 6 shows a firing container 6 which is a preferred example of the firing container 2 shown in FIG. In FIG. 6, the same components as those in FIG. 4 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 6, the basic structure of the baking container 6 is almost the same as that of the baking container 2, but a flat lid disposed so as to close the upper opening of the partition wall 2c provided in the storage part 2d. It has a body 6f and is different from the firing container 2 in that the filling powder T1 is filled in the entire gap 2e including between the lid 6f and the lid 2b disposed on the wall 2a. Here, the lid body 6f and the partition wall 2c are not in close contact with each other, and an interface between them where a minute gap is formed becomes the air passage 6h, and the lid body 6f and the partition wall 2c are defined via the air passage 6h. The internal space 6g and the gap 2e communicate with each other. Therefore, as indicated by an arrow E in the figure, the SiO gas and Mg gas generated by the above reaction from the filling powder T1 arranged in the gap 2e flow into the internal space 6g through the air passage 6h, and the SiO gas in the internal space 6g. Increase the partial pressure of gas and Mg gas.

  Further, according to the firing container 6, even when oxygen or carbon contained in the heating chamber 3 b enters through the ventilation path 2 f, the oxygen or carbon that has entered enters the vicinity of the molded body w 2 before being diffused. It reacts with silicon nitride and magnesium oxide contained in the powder T1, and is inhibited from reacting with the compact w2. Then, silicon nitride that has reacted with oxygen generates SiO gas, and the SiO gas touches the molded body w2, so that oxidation of the molded body w2 can be suppressed.

1 (7) Storage container 1a (7a) Lid 1b (7b) Wall 1c (7c) Bottom 1d (7d) Storage chamber 2 (4, 6) Firing container 2a Wall 2b Lid 2c (4c) Partition 2d Storage T1 (T2) Packing powder w1 Molded body w2 Degreased body b Boron nitride

Claims (7)

A method of manufacturing a silicon nitride ceramic sintered substrate ,
A degreasing step of degreasing a molded body obtained by molding a raw material powder in which silicon nitride powder and sintering aid powder are mixed, and forming a degreased body;
A first storage step of storing a degreased body in a storage chamber of a storage container made of boron nitride or silicon nitride through which external air can flow after the degreasing step;
A second storage step of storing the storage container in the storage part of the baking container having a ventilation path through which outside air can circulate;
After the second storage step, the firing container is placed in a heating furnace, and the degreasing body is fired in a nitrogen atmosphere.
The firing container includes a storage container housed in the housing portion, and a partition made of boron nitride or silicon nitride formed between an inner wall surface of the firing container and the storage container, the partition and the firing container A filling powder arranging step, in which a filling powder in which silicon nitride powder and sintering aid powder are mixed is arranged so that the degreased body and the filling powder are not in direct contact with each other. A method for producing a sintered silicon nitride ceramic substrate . 2. The method for producing a silicon nitride ceramic sintered substrate according to claim 1, wherein the silicon nitride ceramic sintered substrate contains Mg and at least one rare earth element. The silicon nitride based ceramic sintered substrate contains 1.5 to 5.5 wt% of Mg in terms of oxide and 0.5 to 15 wt% of at least one rare earth element in terms of oxide. 2. A method for producing a silicon nitride based ceramic sintered substrate according to 1. The storage container includes a bottom body on which the degreased body is placed on one surface, a wall body having an opening disposed on one surface of the bottom body so as to surround the degreased body placed on the bottom body, and the wall A lid body that closes an opening of a body is provided, and the storage chamber is defined by the bottom body, a wall body, and a lid body, and has an air passage formed between the wall body and the lid body. 4. A method for producing a silicon nitride ceramic sintered substrate according to any one of 3 above. The method for manufacturing a silicon nitride based ceramic sintered substrate according to any one of claims 1 to 4, wherein the storage container and the partition walls are made of boron nitride. A firing container used in a firing process of a silicon nitride ceramic sintered substrate , which contains a degreased body obtained by degreasing a molded body formed by molding a raw material powder in which a silicon nitride powder and a sintering aid powder are mixed. A storage unit that can store a storage container made of boron nitride having a storage chamber through which outside air can circulate, and an air passage that allows the outside air to communicate with the storage unit and that is stored in the storage unit. A partition made of boron nitride formed between the container and the inner wall surface of the firing container, and a mixture of silicon nitride powder and sintering aid powder mixed between the partition wall and the inner wall surface of the firing container The baking container characterized by providing the area | region which can arrange | position a powder | flour. The storage container stored in the storage unit includes a bottom body on which the degreased body is placed on one surface, and an opening disposed on one surface of the bottom body so as to surround the degreased body placed on the bottom body. A cylindrical wall body having a lid that closes the opening of the wall body, and the storage chamber is defined by the bottom body, the wall body, and the lid body, and is formed between the wall body and the lid body The firing container according to claim 6 , which has a vented air passage.

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