JP5801824B2 - ジビニルアレーンジオキシド樹脂組成物 - Google Patents
ジビニルアレーンジオキシド樹脂組成物 Download PDFInfo
- Publication number
- JP5801824B2 JP5801824B2 JP2012553940A JP2012553940A JP5801824B2 JP 5801824 B2 JP5801824 B2 JP 5801824B2 JP 2012553940 A JP2012553940 A JP 2012553940A JP 2012553940 A JP2012553940 A JP 2012553940A JP 5801824 B2 JP5801824 B2 JP 5801824B2
- Authority
- JP
- Japan
- Prior art keywords
- divinylarene dioxide
- composition
- curing agent
- curing
- diphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title claims description 36
- 239000000203 mixture Substances 0.000 claims description 83
- 239000003795 chemical substances by application Substances 0.000 claims description 52
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 claims description 29
- YDIZFUMZDHUHSH-UHFFFAOYSA-N 1,7-bis(ethenyl)-3,8-dioxatricyclo[5.1.0.02,4]oct-5-ene Chemical compound C12OC2C=CC2(C=C)C1(C=C)O2 YDIZFUMZDHUHSH-UHFFFAOYSA-N 0.000 claims description 23
- 229920001187 thermosetting polymer Polymers 0.000 claims description 23
- 239000003054 catalyst Substances 0.000 claims description 22
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 21
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 claims description 12
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 claims description 10
- ZSBDGXGICLIJGD-UHFFFAOYSA-N 4-phenoxyphenol Chemical compound C1=CC(O)=CC=C1OC1=CC=CC=C1 ZSBDGXGICLIJGD-UHFFFAOYSA-N 0.000 claims description 10
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 10
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims description 10
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 9
- 150000002118 epoxides Chemical class 0.000 claims description 9
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 7
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 claims description 6
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 claims description 6
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 claims description 5
- 229950011260 betanaphthol Drugs 0.000 claims description 5
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 150000003512 tertiary amines Chemical class 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 150000004714 phosphonium salts Chemical class 0.000 claims description 4
- ILSRXKFYTXYKJS-UHFFFAOYSA-N 2,4-bis(ethenyl)-3,6-dioxatetracyclo[6.4.0.02,4.05,7]dodeca-1(12),8,10-triene Chemical compound C=CC12OC1(C=C)C1=CC=CC=C1C1C2O1 ILSRXKFYTXYKJS-UHFFFAOYSA-N 0.000 claims description 3
- GLPDXGJXUWGMQJ-UHFFFAOYSA-N 4-ethenyl-7-(4-ethenylphenyl)-3,8-dioxatricyclo[5.1.0.02,4]oct-5-ene Chemical compound C(=C)C1=CC=C(C=C1)C12C(C3C(C=C1)(C=C)O3)O2 GLPDXGJXUWGMQJ-UHFFFAOYSA-N 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 3
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- 238000001723 curing Methods 0.000 description 57
- 239000003822 epoxy resin Substances 0.000 description 25
- 229920000647 polyepoxide Polymers 0.000 description 25
- 239000000047 product Substances 0.000 description 15
- 238000009472 formulation Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 12
- -1 polyphenol compound Chemical class 0.000 description 12
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 11
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 11
- KVNYFPKFSJIPBJ-UHFFFAOYSA-N 1,2-diethylbenzene Chemical compound CCC1=CC=CC=C1CC KVNYFPKFSJIPBJ-UHFFFAOYSA-N 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 7
- 238000005266 casting Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
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- 238000000113 differential scanning calorimetry Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- 235000013824 polyphenols Nutrition 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
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- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical group 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000004382 potting Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 230000000930 thermomechanical effect Effects 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 150000007942 carboxylates Chemical class 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
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- 239000000463 material Substances 0.000 description 2
- MTCBLMPRPUTXHZ-UHFFFAOYSA-N n-(oxomethylidene)nitramide Chemical group [O-][N+](=O)N=C=O MTCBLMPRPUTXHZ-UHFFFAOYSA-N 0.000 description 2
- 238000006384 oligomerization reaction Methods 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 150000008442 polyphenolic compounds Chemical class 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000012745 toughening agent Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- BWHLFAZDBDUSDO-UHFFFAOYSA-N 6-ethenyl-1-ethyl-7-oxabicyclo[4.1.0]hepta-2,4-diene Chemical compound C1=CC=CC2(CC)C1(C=C)O2 BWHLFAZDBDUSDO-UHFFFAOYSA-N 0.000 description 1
- 241001120493 Arene Species 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- SRWLXBHGOYPTCM-UHFFFAOYSA-M acetic acid;ethyl(triphenyl)phosphanium;acetate Chemical compound CC(O)=O.CC([O-])=O.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 SRWLXBHGOYPTCM-UHFFFAOYSA-M 0.000 description 1
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- 229920001400 block copolymer Polymers 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
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- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
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- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
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- 238000001595 flow curve Methods 0.000 description 1
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- 230000005484 gravity Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
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- 238000007654 immersion Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 1
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- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
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- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 1
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 1
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
以下の実施例において、使用した様々な用語及び名称は以下のとおりである:「Tg」はガラス転移温度を表し;「Td」は熱分解温度を表し;「PTBP」はp−t−ブチルフェノール(モノフェノール)を表し;「DER 332」は173のエポキシド当量(EEW)を有し、ザ・ダウ・ケミカル・カンパニー(The Dow Chemical Company)から商業的に入手可能である従来のエポキシ樹脂であり;「THF」はテトラヒドロフランを表し;「A−1」はエチルトリフェニルホスホニウムアセテート−酢酸錯体(メタノール中70質量%)を表し、モートン・インターナショナル・カンパニー(Morton International Co.)から商業的に入手可能な触媒であり;「1B2MZ」は1−ベンジル−2−メチルイミダゾールを表し、エア・プロダクツ・インコーポレイティド(Air Products Inc.)から商業的に入手可能な触媒であり;「DSC」は示差走査熱量測定を表し;「CTE」は熱膨張係数を表し;「E」は引張弾性率を表し;「K1C」は臨界応力強度因子(破壊靱性)を表す。
実施例1〜7において、表Iに示した量でDVBDOをビスフェノールA(ジフェノール)及び必要に応じて触媒と混合して硬化性配合物を形成した。比較例Aにおいて、DER 332をビスフェノールAと混合して非硬化性配合物を形成した。上記配合物を、次に、200℃で60分間加熱した。A−1は、約0.1質量%で触媒として使用し、1B2MZは約2wt%で触媒として使用した。DSCの結果は、配合物を硬化させた後に得た。エポキシド/フェノール当量比はrである。成分及び結果を表Iに記載する。比較例Aはこれらの条件下では硬化せず、そのため、テトラヒドロフラン中に完全に溶解したままであった。
表Iの配合物から得られた硬化生成物の特性を求め、表IIに記載した。実施例8は実施例4の配合物を硬化させることにより得られた硬化生成物であり、実施例9は実施例5の配合物を硬化させることにより得られた硬化生成物であり、実施例10は実施例6の配合物を硬化させることにより得られた硬化生成物である。
[態様1]
(a)少なくとも1種のジビニルアレーンジオキシド及び(b)少なくとも1種のジフェノール硬化剤を含む硬化性ジビニルアレーンジオキシド樹脂組成物。
[態様2]
前記ジビニルアレーンジオキシドが、ジビニルベンゼンジオキシド、ジビニルナフタレンジオキシド、ジビニルビフェニルジオキシド、ジビニルジフェニルエーテルジオキシド、及びこれらの混合物からなる群から選ばれる、上記態様1に記載の組成物。
[態様3]
前記ジビニルアレーンジオキシドがジビニルベンゼンジオキシドである、上記態様1に記載の組成物。
[態様4]
前記ジビニルアレーンジオキシドの濃度が、約10質量%〜約90質量%である、上記態様1に記載の組成物。
[態様5]
前記少なくとも1種のジフェノール硬化剤が、ジフェノール、ビスフェノール、又は二官能性フェノール系オリゴマーを含む、上記態様1に記載の組成物。
[態様6]
前記ジフェノール硬化剤の濃度が、エポキシドとフェノール基との当量比rとして、約0.10〜約10である、上記態様1に記載の組成物。
[態様7]
フェノール;o−、m−又はp−クレゾール;p−tert−ブチルフェノール;m−クロロフェノール;アニソール;p−フェニルフェノール;4−ヒドロキシジフェニルエーテル;1−又は2−ナフトール;及びこれらの混合物からなる群から選ばれたモノフェノールを含む、上記態様1に記載の組成物。
[態様8]
前記モノフェノールの濃度が約0.01質量%〜約50質量%である、上記態様7に記載の組成物。
[態様9]
第三級アミン、イミダゾール類、アンモニウム塩、ホスホニウム塩、及びこれらの混合物からなる群から選ばれた触媒を含む、上記態様1に記載の組成物。
[態様10]
前記触媒の濃度が、約0.01質量%〜約20質量%である、上記態様9に記載の組成物。
[態様11]
共硬化剤を含む、上記態様1に記載の組成物。
[態様12]
前記共硬化剤の濃度が、全硬化剤の合計の当量に対するジフェノール硬化剤の当量の百分率が概して約10〜約100当量%になるような濃度である、上記態様11に記載の組成物。
[態様13]
(a)少なくとも1種のジビニルアレーンジオキシド樹脂及び(b)少なくとも1種のジフェノール硬化剤を混合することを含む硬化性ジビニルアレーンジオキシド樹脂組成物の製造方法。
[態様14]
(i)(a)少なくとも1種のジビニルアレーンジオキシド樹脂及び(b)少なくとも1種のジフェノール硬化剤を混合することを含む、硬化性ジビニルアレーンジオキシド樹脂組成物を調製する工程;及び
(ii)工程(i)の組成物を約25℃〜約300℃の温度で加熱する工程、
を含む、硬化した熱硬化物の製造方法。
[態様15]
上記態様1に記載の組成物を硬化させることにより製造された熱硬化生成物であって、硬化生成物がコーティング、接着剤、複合材料又はラミネートを構成する、熱硬化組成物。
Claims (13)
- (a)少なくとも1種のジビニルアレーンジオキシドと、
(b)少なくとも1種のジフェノール硬化剤と、
(c)硬化触媒と、
(d)フェノール、o−、m−又はp−クレゾール、p−tert−ブチルフェノール、m−クロロフェノール、アニソール、p−フェニルフェノール、4−ヒドロキシジフェニルエーテル、1−又は2−ナフトール、及びこれらの混合物からなる群から選ばれた1種又は2種以上のモノフェノール、
を含み、前記ジフェノール硬化剤の濃度が、エポキシドとフェノール基との当量比rとして、1.2〜10である、硬化性ジビニルアレーンジオキシド樹脂組成物。 - 前記ジビニルアレーンジオキシドが、ジビニルベンゼンジオキシド、ジビニルナフタレンジオキシド、ジビニルビフェニルジオキシド、ジビニルジフェニルエーテルジオキシド、及びこれらの混合物からなる群から選ばれる、請求項1に記載の組成物。
- 前記ジビニルアレーンジオキシドがジビニルベンゼンジオキシドである、請求項1に記載の組成物。
- 前記ジビニルアレーンジオキシドの濃度が、10質量%〜90質量%である、請求項1〜3のいずれか一項に記載の組成物。
- 前記少なくとも1種のジフェノール硬化剤が、ジフェノール、ビスフェノール、又は二官能性フェノール系オリゴマーを含む、請求項1〜4のいずれか一項に記載の組成物。
- 前記モノフェノールの濃度が0.01質量%〜50質量%である、請求項1〜5のいずれか一項に記載の組成物。
- 前記硬化触媒が、第三級アミン、イミダゾール類、アンモニウム塩、ホスホニウム塩、及びこれらの混合物からなる群から選ばれた触媒を含む、請求項1〜6のいずれか一項に記載の組成物。
- 前記触媒の濃度が、0.01質量%〜20質量%である、請求項1〜7のいずれか一項に記載の組成物。
- 共硬化剤を含む、請求項1〜8のいずれか一項に記載の組成物。
- 前記共硬化剤の濃度が、全硬化剤の合計の当量に対するジフェノール硬化剤の当量の百分率が概して10〜100当量%になるような濃度である、請求項9に記載の組成物。
- (a)少なくとも1種のジビニルアレーンジオキシド樹脂と、
(b)少なくとも1種のジフェノール硬化剤と、
(c)硬化触媒と、
(d)フェノール、o−、m−又はp−クレゾール、p−tert−ブチルフェノール、m−クロロフェノール、アニソール、p−フェニルフェノール、4−ヒドロキシジフェニルエーテル、1−又は2−ナフトール、及びこれらの混合物からなる群から選ばれた1種又は2種以上のモノフェノール、
を混合することを含み、前記ジフェノール硬化剤の濃度が、エポキシドとフェノール基との当量比rとして、1.2〜10である硬化性ジビニルアレーンジオキシド樹脂組成物の製造方法。 - (i)(a)少なくとも1種のジビニルアレーンジオキシド樹脂と、
(b)少なくとも1種のジフェノール硬化剤と、
(c)硬化触媒と、
(d)フェノール、o−、m−又はp−クレゾール、p−tert−ブチルフェノール、m−クロロフェノール、アニソール、p−フェニルフェノール、4−ヒドロキシジフェニルエーテル、1−又は2−ナフトール、及びこれらの混合物からなる群から選ばれた1種又は2種以上のモノフェノール、
を混合することを含む、硬化性ジビニルアレーンジオキシド樹脂組成物を調製する工程;及び
(ii)工程(i)の組成物を25℃〜300℃の温度で加熱する工程、
を含む、硬化した熱硬化物の製造方法。 - 請求項1〜10のいずれか一項に記載の組成物を硬化させることにより製造された熱硬化生成物であって、硬化生成物がコーティング、接着剤、複合材料又はラミネートを構成する、熱硬化生成物。
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US30622010P | 2010-02-19 | 2010-02-19 | |
US61/306,220 | 2010-02-19 | ||
PCT/US2011/024288 WO2011103014A1 (en) | 2010-02-19 | 2011-02-10 | Divinylarene dioxide resin compositions |
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US20110315916A1 (en) * | 2010-06-29 | 2011-12-29 | Dow Global Technologies Inc. | Curable composition |
US20140256909A1 (en) * | 2011-11-08 | 2014-09-11 | Dow Global Technologies Llc | Curable compositions |
US20150093320A1 (en) * | 2012-06-11 | 2015-04-02 | Dow Global Technologies Llc | Carbon precursor composition |
WO2013188070A1 (en) * | 2012-06-15 | 2013-12-19 | Dow Global Technologies Llc | Curable compositions |
RU2015101136A (ru) * | 2012-06-15 | 2016-08-10 | БЛЮ КЬЮБ АйПи ЭлЭлСи | Композиция углеродного прекурсора |
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GB854679A (en) | 1958-10-11 | 1960-11-23 | Union Carbide Corp | Improvements in and relating to polymerisable epoxide compositions |
US2912389A (en) * | 1957-08-08 | 1959-11-10 | Union Carbide Corp | Polymers of divinylbenzene dioxide |
US2924580A (en) * | 1957-08-08 | 1960-02-09 | Union Carbide Corp | Divinyl benzene dioxide compositions |
GB855025A (en) | 1958-10-11 | 1960-11-30 | Union Carbide Corp | Improvements in and relating to polymerisable epoxide compositions |
US4358578A (en) | 1981-08-24 | 1982-11-09 | Shell Oil Company | Process for reacting a phenol with an epoxy compound |
US4808692A (en) | 1988-02-18 | 1989-02-28 | The Dow Chemical Company | Preparation of advanced epoxy resins from epoxy resins and dihydric phenols in the presence of phosphonium compounds |
EP0878472A1 (en) * | 1997-05-16 | 1998-11-18 | National Starch and Chemical Investment Holding Corporation | Reactive radiation- or thermally- initiated cationically-curable epoxide monomers and compositions made from those monomers |
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WO2011103014A1 (en) | 2011-08-25 |
US9359468B2 (en) | 2016-06-07 |
JP2013520528A (ja) | 2013-06-06 |
EP2536775A1 (en) | 2012-12-26 |
CN102762628A (zh) | 2012-10-31 |
KR20130008540A (ko) | 2013-01-22 |
TWI515217B (zh) | 2016-01-01 |
TW201136978A (en) | 2011-11-01 |
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