JP5793434B2 - Component mounting apparatus, component mounting substrate production method, and component mounting system - Google Patents

Description

  The present invention relates to a technology for producing a component mounting board by mounting a component on a board using a so-called multi-lane type component mounting apparatus having a plurality of lanes for transporting the board at a position where the component is mounted.

  When an electronic component is mounted on a board to produce a component-mounted board, it may be necessary to consider the effective expiration date of the member used for the production. For example, some electronic components may become unusable due to moisture absorption, oxidation, etc. if left in the open air. Further, with respect to solder, the flux volatilizes with time, and thereby the wettability deteriorates, which causes the generation of solder defects. Furthermore, in the case of a substrate, an oxide film is formed on the pattern surface, causing a solder failure with a component. In order to eliminate such inconveniences, for example, in the invention described in Patent Document 1, if the boards are produced in a predetermined production order at the stage of production planning, the effective use time limit of the use parts such as electronic parts and solder is limited. When it is determined that it will arrive, change the production order of the board and re-determine, and when there is no expiration date due to redetermination, production control is performed so that the board is produced in the changed production order Is going.

Specification of Japanese Patent No. 4657035

  In the above prior art, it is determined whether or not the member to be used will reach the effective expiration date at the stage of the production plan. This is based on the assumption that the production is performed smoothly while the substrate is being produced. It is based on. However, in an actual production site, there may be a short stop (sometimes referred to as a “choco stop” in the production site) or a plan shift due to a trouble or the like. In this invention, there is a problem that an event occurring at the production site cannot be quickly and flexibly handled.

  The present invention has been made in view of the above-mentioned problems, and by preferentially using a time limit approaching member that has approached the effective use time limit and producing a substrate, the time limit approaching member is used before the effective use time limit has passed. It is an object of the present invention to provide a component mounting apparatus, a component mounting board production method, and a component mounting system that can improve production efficiency.

In order to achieve the above object, the component mounting apparatus according to the present invention transports a first board along a first lane and positions the first board at a first mounting work position, and a first board transporting means different from the first board. A second board transfer means for transferring the two boards along a second lane different from the first lane and positioning the second board at a second mounting work position different from the first mounting work position; and a first board positioned at the first mounting work position. A plurality of head units that access both the substrate and the second substrate positioned at the second mounting work position to mount components, and control the plurality of head units to control the production of the first substrate and the second substrate. and control means, the control means, when are lines Tsu parts of mounting to the first substrate and the second substrate in a predetermined order, whether or not the materials used to be used for production nearing enabled expiration date Repeatability And confirms the deadline approaching members approaching the effective expiration date in the use members used in the production, performed with priority component implementation for the priority substrate used deadlines approach member of the first substrate and the second substrate It is characterized by speeding up the production of priority substrates.

The component mounting board production method according to the present invention includes a first board transporting means for transporting the first board along the first lane and positioning it at the first mounting work position, and a second board different from the first board. A second substrate transport means for transporting the substrate along a second lane different from the first lane and positioning the second substrate at a second mounting work position different from the first mounting work position, a first substrate positioned at the first mounting work position, and A component mounting board that produces a first board and a second board using a component mounting apparatus including a plurality of head units that access both of the second boards positioned at the second mounting work position and mount components. a production method, in order to achieve the above object, when performing the component mounting for the first substrate and the second substrate in a predetermined order a plurality head units, using members valid expiration date for use in the production By repeatedly confirm whether approaching, confirmed by the confirmation process and a confirmation step of the first substrate and the second substrate to ensure a deadline approaching members approaching the effective expiration date in the use members used in the production And a production management process for speeding up the production of the priority board by preferentially mounting the components on the priority board using the expiration date approaching member.

Furthermore, in the component mounting system according to the present invention, the first substrate transport means for transporting the first substrate along the first lane and positioning the first substrate at the first mounting work position, and the second substrate different from the first substrate are the first. A second substrate transporting means for transporting along a second lane different from the lane and positioning at a second mounting work position different from the first mounting work position; a first substrate positioned at the first mounting work position; and a second mounting A component that has a plurality of component mounting apparatuses each including a plurality of head units that access both of the second substrates positioned at work positions and mount components, and that controls the component mounting by the plurality of head units to produce a substrate. the mounting system, in order to achieve the above object, when performing the component mounting for the first substrate and the second substrate in a predetermined order, to use members valid expiration date for use in the production By repeatedly confirm whether Zui, a confirmation means for confirming the deadline approaching members approaching the effective expiration date in the use members for use in production, while the confirmation means does not confirm the time limit proximity member, While each component mounting apparatus causes components to be mounted on the first board and the second board in a predetermined order, when the confirmation unit confirms the deadline approaching member, priority is given to using the deadline approaching member among the first board and the second board. It is characterized by comprising production management means for speeding up the production of the priority board by preferentially mounting the components on the board.

  In the invention thus configured (component mounting apparatus, component mounting board production method, and component mounting system), two lanes for transporting the board are provided, and a so-called multi-lane structure is constructed. The first board is transported along the first lane and positioned at the first mounting work position, and the second board is transported along the second lane and positioned at the second mounting work position. A plurality of head units access these substrates to mount components. Here, when the expiry member approaching the effective expiry date is confirmed among the used members used for production, the substrate on which the expiry member is mounted is selected as the priority substrate among the first substrate and the second substrate. The component mounting on the priority board is preferentially executed. For this reason, the expiry member approaching the effective expiration date is preferentially used, and the expiry member is used before the effective expiration date is passed. As a result, it is possible to reduce the discarding of the used member due to the expiration of the expiration date and improve the production efficiency.

  Here, when the warning member is confirmed and the warning state is reached, the parts are preferentially mounted on the priority board. On the other hand, when the warning state is canceled, the preferential mounting of the parts on the priority board is canceled and the parts are mounted in the original order. You may comprise so that it may perform. When the warning state is resolved in this way, the component mounting is performed by returning to the original order, so that the component mounting can be performed stably. Note that the mounting order is often optimized in advance, and in this respect, even if the throughput decreases due to the occurrence of a warning condition, the throughput is restored to the original by returning the mounting order after the warning condition is canceled. It can be returned to a high state.

  In addition, a plurality of component supply units that store the same component or alternative components may be provided, and each head unit may be selected from a plurality of component supply units according to a predetermined order, and the components may be mounted. When a component housed in any of the plurality of component supply units approaches the effective expiration date, it is preferable to preferentially use the component supply unit that houses the component from among the plurality of component supply units. As a result, the parts that have approached the expiration date are sequentially used from the same part or the substitute part, so that the number of parts discarded due to the expiration of the use period can be reduced, and the production efficiency is further improved. In addition, when a component housed in any of the plurality of component supply units is in a warning state that is approaching the expiration date, the component supply unit is preferentially used, and when the warning state is canceled, the component supply unit You may comprise so that priority use may be canceled and a component supply part may be selected and used in the original order.

  As described above, since the production of the board is accelerated by prioritizing the mounting of components on the board that uses the expiry member approaching the expiry date, the used member is used before the expiry date. As a result, production efficiency can be improved.

It is a figure which shows schematic structure of one Embodiment of the component mounting system concerning this invention. It is a top view which shows schematic structure of the mounting machine with which the component mounting system of FIG. 1 is equipped. It is a block diagram which shows partially the electric structure of server PC and a mounting machine. It is a figure which shows typically the change of the component mounting operation | movement by the presence or absence of a priority lane. It is a flowchart which shows the time limit management operation | movement performed with a mounting machine. It is a flowchart which shows the operation | movement which mounts components on a board | substrate by the component mounting system shown in FIG. It is a figure which shows an example of the determination information table. It is a figure which shows typically an example of the task order when the operation | movement shown in FIG. 6 is performed. It is a figure which shows typically an example of the task order when the operation | movement shown in FIG. 6 is performed. It is a figure which shows typically an example of the task order when the operation | movement shown in FIG. 6 is performed. It is a figure which shows typically an example of the task order when the operation | movement shown in FIG. 6 is performed.

  FIG. 1 is a diagram showing a schematic configuration of an embodiment of a component mounting system according to the present invention. In this component mounting system 1, as shown in the figure, from the upstream side (right hand side in the figure) to the downstream side (left hand side in the figure) of the board carrying direction X along the carrying line 2 for carrying the board, A board carry-in machine 3, a printing machine 4, a plurality of mounting machines (component mounting apparatuses) 5, an inspection machine 6, a board carry-out machine 7 and the like are arranged in parallel. Among these line configuration apparatuses, the substrate carry-in machine 3 has a substrate accommodation unit (not shown) that accommodates unprocessed substrates, and sequentially carries substrates into the printing machine 4 from this substrate accommodation unit. Further, the printing machine 4 applies cream solder to the processing region of the carried-in substrate by printing.

  In addition, a plurality of (three in this embodiment) mounting machines 5 are arranged in parallel along the transport line 2 in order to mount components on the board on which the solder is printed. In this specification, in order to distinguish and explain these three mounting machines, the mounting machine 5 located on the upstream side in the substrate transport direction X is referred to as “mounting machine A”, and the mounting machine 5 located on the downstream side is referred to as “mounting machine A”. While referred to as “mounting machine C”, the mounting machine 5 located between them is referred to as “mounting machine B”, and when these are not distinguished, they are simply referred to as “mounting machine 5”.

  The board on which the component is mounted by the three mounting machines 5, that is, the component mounting board, is transferred to the inspection machine 6, and the component mounting board is inspected to determine pass / fail. Then, the inspected component mounting boards conveyed from the inspection machine 6 are sequentially accommodated in a mounting board accommodation portion (not shown) of the board unloader 7.

  Each substrate processing apparatus (printing machine 4, plural mounting machines 5, inspection machine 6), board carry-in machine 3, and board carry-out machine 7 constituting this component mounting system 1 are connected to a local area network LAN. The local area network LAN is also referred to as a server PC (data creation device or the like) that creates a processing program for executing predetermined processing in each substrate processing device and controls the entire component mounting system 1. 8) is connected. Various programs and data can be communicated between the server PC 8 and the substrate processing apparatus via the local area network LAN. The server PC 8 also has a function of collecting information such as the degree of component deterioration in each mounting machine 5 and specifying a priority lane based on various information and data sent from the mounting machine 5. This point will be described in detail later.

  FIG. 2 is a plan view showing a schematic configuration of a mounting machine installed in the component mounting system of FIG. FIG. 3 is a block diagram partially showing the electrical configuration of the server PC and the mounting machine. In FIG. 2, a three-dimensional coordinate system corresponding to the substrate transport direction X, the horizontal direction Y orthogonal to the substrate transport direction X, and the vertical direction Z is employed.

  In the mounting machine 5, two substrate transport mechanisms 520 </ b> A and 520 </ b> B are arranged in parallel in the Y direction on a base (not shown), and the substrates PBA and PBB are respectively along the transport path extending in the substrate transport direction X. It can be transported. Thus, the conveyance paths provided in the substrate conveyance mechanisms 520A and 520B correspond to the “first lane” and the “second lane” of the present invention, and the mounting machine 5 has a so-called dual lane structure. More specifically, both the substrate transport mechanisms 520A and 520B have the same configuration. Here, the substrate transport mechanism 520A that transports the substrate PBA along the first lane (hereinafter referred to as “first lane LA”) will be described, while the second lane (hereinafter referred to as “second lane LB”). The substrate transport mechanism 520B that transports the substrate PBB along the same line is denoted by the same or corresponding reference numerals, and description thereof is omitted.

  The substrate transport mechanism 520A has a pair of conveyors 521 and 522 that transport the substrate PBA from the right side to the left side of FIG. These conveyors 521 and 522 extend along the X-axis direction, and are arranged while being separated by a predetermined interval in the Y-axis direction. In this way, the first lane LA is defined by the conveyors 521 and 522.

  In the substrate transport mechanism 520A, the substrate PBA transported from the upstream side in the substrate transport direction X (the right hand side in FIG. 2) is drawn into the mounting machine body and transported by the conveyors 521 and 522. The conveyors 521 and 522 stop the board PBA at a mounting work position (a position of the board PBA shown in FIG. 2) corresponding to the “first mounting work position” of the present invention. The substrate PBA is fixed and held by a holding device (not shown).

  Then, electronic components (not shown) supplied from the component housing portion 550 are transferred to the substrate PBA fixed at the mounting operation position by the suction nozzles 561 mounted on the head units 560A and 560B. That is, the head unit 560A reciprocates a plurality of times between above the (+ Y) side component housing portion 550 and above the substrate PBA, and the head unit 560B moves above the (−Y) side component housing portion 550 and above the substrate PBA. When the mounting process is completed for all of the components to be mounted on the board PBA by the mounting machine, the board transport mechanism 520A unloads the board PBA in accordance with a drive command from the mounting machine controller 530.

  The component storage portions 550 described above are arranged on both sides of the substrate transport mechanisms 520A and 520B in the Y-axis direction, and a plurality of tape feeders 551 can be attached to these component storage portions 550. Further, in the component storage unit 550, reels (not shown) wound with tapes that store and hold electronic components at a constant pitch are arranged corresponding to each feeder 551, and supply of electronic components by each feeder 551 is performed. It is possible. In the present embodiment, the component accommodating portions 550 are provided at a total of four locations on the (+ Y) side and the (−Y) side, respectively, on the (+ Y) side and the (−Y) side with respect to the conveyors 521 and 522. In unit 550, a plurality of feeders 551 are mounted in a setup corresponding to the substrate data.

  Further, the mounting machine 5 is provided with a head drive mechanism (not shown) in addition to the substrate transport mechanisms 520A and 520B. This head drive mechanism is a mechanism for moving the head units 560A and 560B in the X-axis direction and the Y-axis direction over a predetermined range of the base, and for the movement in the X-axis direction and the Y-axis direction, respectively, A Y-axis motor is used. In this embodiment, as shown in FIG. 2, the head unit 560A can move in a range 562A from the upper position of the (+ Y) side component housing portion 550 to the upper position of the substrate PBB in the second lane LB. 560B is movable in a range 562B from the upper position of the component housing portion 550 on the (−Y) side to the upper position of the board PBA in the first lane LA. Thus, each head unit 560A, 560B can access both the substrates PBA and PBB, and components are mounted on both the substrates PBA and PBB as will be described later. Since such an arrangement relationship is employed, the head units 560A and 560B can simultaneously access the substrates PBA and PBB, respectively. However, to prevent mutual interference between the head units 560A and 560B, the head unit 560B cannot access the substrate PBA while the head unit 560A is accessing the substrate PBB, and vice versa. is there.

  The electronic components sucked by the suction nozzle 561 by the movement of the head units 560A and 560B are conveyed to positions above the substrates PBA and PBB. In each of the head units 560A and 560B, eight mounting heads (not shown) extending in the vertical direction Z are arranged at regular intervals in the X-axis direction (substrate PBA and PBB transport direction by the substrate transport mechanisms 520A and 520B). Has been placed. Further, a suction nozzle 561 is attached to each tip of the mounting head.

  Each mounting head can be moved up and down (moved in the Z-axis direction) with respect to the head units 560A and 560B by a nozzle lifting and lowering driving mechanism using a Z-axis motor as a driving source, and by a nozzle rotating and driving mechanism using an R-axis motor as a driving source. It can rotate around the center axis of the nozzle. Of these drive mechanisms, the nozzle lift drive mechanism lifts and lowers the mounting head between a lowered position when suctioning or mounting and a raised position when carrying or imaging. On the other hand, the nozzle rotation drive mechanism is a mechanism for rotating the component suction nozzle as necessary to match the mounting direction of the electronic component or to correct the suction displacement in the R-axis direction. It is possible to position the electronic component in a predetermined R-axis direction during mounting.

  The head units 560A and 560B are moved above the component housing portion 550 by the head driving mechanism, and the suction nozzle 561 is positioned above the component suction position of the feeder 551 on which the suction target component is mounted by the Z-axis motor. The nozzle 561 descends and the tip of the suction nozzle 561 comes into contact with and holds the electronic component supplied from the component housing 550, and the suction nozzle 561 moves up. In this way, the head units 560A and 560B are conveyed above the substrates PBA and PBB while the electronic components are attracted and held by the suction nozzle 561, and the electronic components are transferred to the substrates PBA and PBB in a predetermined direction at a predetermined position.

  The controller 530 that controls the entire mounting machine 5 configured as described above includes an arithmetic processing unit 531, a storage unit 532 such as a hard disk drive, a motor control unit 533, an image processing unit 534, and a communication control unit 535. I have. The arithmetic processing unit 531 is configured by a CPU or the like, and performs component mounting by controlling each part of the mounting machine according to a mounting program created by the server PC 8 and written in the storage unit 532 as will be described later. In addition, the arithmetic processing unit 531 has a function of executing a component expiration date confirmation program during production based on the mounting program and confirming a component that is approaching the expiration date within the component.

  The motor controller 533 is electrically connected to a motor that drives each part of the mounting machine 5 and controls the driving of each motor. The image processing unit 534 is electrically connected to a component recognition camera that captures and recognizes a component and a substrate recognition camera that recognizes and recognizes a substrate. It is captured by the image processing unit 534. Then, in the image processing unit 534, the analysis of the component image and the analysis of the board image are performed based on the captured imaging signal.

  In the mounting machine 5, a display / operation unit 540 is provided to display a mounting program and the like. The display / operation unit 540 is also used by the operator to input information such as various data and commands to the controller 530. Further, the mounting machine 5 is provided with a communication control unit 535 for exchanging various data such as a mounting program with the server PC 8 and other substrate processing apparatuses.

  The server PC 8 has a controller 810 that creates a mounting program. The controller 810 creates a printing program, an inspection program, and the like in addition to the mounting program, and controls the entire component mounting system 1. The controller 810 is provided with an arithmetic processing unit 811 configured by a CPU or the like, a storage unit 812 such as a hard disk drive, and a communication control unit 813.

  The arithmetic processing unit 811 not only creates a mounting program as described above, but also creates priority information such as a priority lane for the mounting machine 5 that produces a board using a component approaching the expiration date. The production management operation is performed, and the component mounting process is executed while appropriately setting the priority lane by giving the priority information to the mounting machine 5. Note that reference numeral 820 in FIG. 3 displays a print program, an inspection program, a mounting program, priority information, and the like created by the arithmetic processing unit 811, and an operator displays information such as various data and commands to the controller 810. It is a display / operation unit for inputting.

  Next, the time limit confirmation operation and component mounting operation in the mounting machine 5 and the production management operation in the server PC 8 will be described with reference to the drawings. The arithmetic processing unit 811 of the server PC 8 performs an optimization process on the distribution of components to be mounted on the boards PBA and PBB for each type of component mounting board manufactured by the component mounting system 1, and creates a mounting program. Then, the mounting machine 5 that has received this mounting program is positioned at the mounting work positions of the lanes LA and LB by the head units 560A and 560B, for example, as shown in the column “priority lane = not set” in FIG. Components are mounted on the boards PBA and PBB, and the component mounting in the lanes LA and LB is completed at almost the same timing. As a result, the efficiency of component mounting is improved.

Here, the white rectangular blocks in FIG. 4 (and FIGS. 8 to 11 described later) are the component suction holding operation by the suction nozzle 561, the component recognition operation by the component recognition camera, and the suction nozzle 561. The task of mounting the component on the board as one cycle is shown, and the number of these white rectangular blocks is the number of mounting points. On the other hand, the satin- finished block indicates that it is not possible to mount the component and is waiting time. This is because, for example, when component mounting is performed on the board PBA of the first lane LA using the head unit 560B on the second lane LB side, the head unit 560A on the first lane LA side interferes with the head unit 560B. This is because, in order to avoid this, it is necessary to wait without mounting components on the board PBB in the second lane LB. In addition, a waiting time may occur even when there is a restriction on the order in which components are mounted (in the figure, the second matte pattern block in the first lane LA corresponds to this). Furthermore, in order to facilitate understanding of the following description, numbers indicating task orders are attached to the respective blocks, and the operation of the present embodiment will be described with appropriate reference.

  As described above, in the mounting machine 5, component mounting is performed in parallel in the first lane LA and the second lane LB, but the effective use period of the component may be different for each lane. Therefore, in the present embodiment, while the mounting machine 5 is in operation, the arithmetic processing unit 531 of the mounting machine 5 repeatedly executes the time limit confirmation process shown in FIG. 5 at regular time intervals. That is, the arithmetic processing unit 531 executes steps S11 to S17 in accordance with a time limit confirmation program stored in advance in the storage unit 812.

  In step S11, the arithmetic processing unit 531 determines whether or not a mode for confirming the expiration date of the component is set. If the mode is set (“YES” in step S11), steps S12 to S17 are performed. Repeat.

  In step S12, the arithmetic processing unit 531 checks the status of the part. For example, a reel storing electronic components is attached to the feeder 551 after opening a moisture-proof package (dry pack), and the electronic components stored in the reel begin to deteriorate under the influence of outside air at this timing. However, the deterioration progresses while the reel is removed from the feeder 55 and stored in a shelf or a dry warehouse, or while the reel is attached to the feeder 55 or stored in the feeder 55 or stored in the feeder 55. do not do. Therefore, in this embodiment, instead of simply counting the number of storage days of the electronic component after opening the moisture-proof package, when entering the storage location, the barcode that functions as the reel identification code is read to determine in which management state By notifying the server PC 8 whether or not there is, the server PC 8 manages the exact storage days, and the count days are given from the server PC 8 to the controller 530 of the mounting machine 5. In this way, the moisture absorption state of the electronic component is grasped based on the number of days counted. Then, the arithmetic processing unit 531 confirms whether or not the part is approaching the effective use period by comparing the value obtained by the situation check with the effective use period set in advance for each part (step S13). In the present embodiment, the effective expiration date for each component is stored in the storage unit 532 or the storage unit 812.

  In step S13, while it is determined that none of the parts has approached the effective use time limit and do not correspond to the time limit approaching part, the process returns to step S11 and the above steps S11 and S12 are repeated. On the other hand, if there is a component approaching the expiration date that has approached the effective expiration date (“YES” in step S13), the arithmetic processing unit 531 determines whether or not the value has passed the effective expiration date (step S14). If the valid use period has expired, a message to that effect is output to the display / operation unit 540 as an error (step S15) and the machine stops (step S16).

  On the other hand, if a so-called warning-approaching component that is in the so-called warning state that has not approached the effective expiration date is confirmed, the arithmetic processing unit 531 identifies the component and the component is in the warning state. Is output (step S17). Then, after outputting the warning information, the process returns to step S11 to repeat the above processing. In this embodiment, the deadline checking operation is individually executed in each mounting machine 5, but of course, the deadline checking in each mounting machine 5 may be collectively performed in the server PC 8, and the deadline checking operation is constant. What is necessary is just to be comprised so that the deadline approaching part used as the warning state may be found at an early stage by repeatedly performing at a time interval.

  The mounting machine 5 receives the mounting program given from the server PC 8 and mounts the components on the boards PBA and PBB in the optimized mounting order, separately from the above-described time limit confirmation operation. In addition, when a component approaching the expiry date has been confirmed, the lane that mounts the component approaching the expiration date and produces the board is set as the priority lane, and the board conveyed along the priority lane is set as the priority board. Give priority to implementation. Specifically, as shown in FIG. 6, component mounting is executed in cooperation with the server PC 8 while appropriately setting priority lanes.

  FIG. 6 is a flowchart showing an operation of mounting a component on a board by the component mounting system shown in FIG. In the mounting machine 5, the arithmetic processing unit 531 checks the status of the parts in the mounting machine 5 based on the warning information obtained by the time limit confirmation operation (step S 21), whether there is a warning status part (time limit approaching part), warning The server PC 8 is notified of a warning situation including information on the state component (step S22). This notification is not only to report the status of the mounting machine 5 to the server PC 8 but also to priority information according to the warning status (whether or not priority lanes are set and which lanes LA and LB are set as priority lanes). Requesting the creation and notification of information etc.).

  When the server PC 8 receives the request from the mounting machine 5 (step S31), the determination information stored in the storage unit 812 by the arithmetic processing unit 811 based on the warning status transmitted from the mounting machine 5 in the server PC 8 The table is updated (step S32). In other words, when there is a part that has newly entered a warning state, that is, a part that is due for expiration, information on the part that is approaching a deadline is added. On the contrary, when the warning state is canceled due to the reason that the expiring component that has been in the warning state has been used or removed, information related to the expiring component is deleted. For example, as shown in FIG. 7, this determination information table lists information related to expiring parts that are in a warning state in each of the mounting machines A to C for each lane LA and LB. In the figure, the numbers in the circles indicate the order in which the warning states occurred. For example, the component “PARTS00A” to be mounted on the board PBA transported in the first lane LA of the mounting machine A is notified first. It has been shown. The numbers in parentheses indicate the priority, and the higher the number, the higher the priority, indicating that preferential component mounting is desired. In the drawing, the fields of the second lane LB of the mounting machine A and the first lane LA of the mounting machine C are blank, indicating that no warning parts (expiring parts) are included. Yes.

  Then, the arithmetic processing unit 811 executes steps S33 to S41 based on the determination information table, updates the priority information (step S42), and transmits the updated priority information to the mounting machine 5. In step S33, when all the warning states are canceled because the parts that have been in the warning state have been used, the process proceeds to step S42 and the priority information is updated. Specifically, the priority lane is not provided, and the component mounting is performed in the original order, that is, the priority information is updated to indicate that the component mounting is performed according to the mounting program.

  If the arithmetic processing unit 811 determines “NO” in step S <b> 33, the operation processing unit 811 proceeds to the next step S <b> 34 and determines whether or not the priority information needs to be updated. When a new part enters a warning state, conversely, when a part of the part that was in a warning state is used up or removed, the type and location of the part in the warning state changes. Therefore, there are cases where it is preferable to update the priority information each time (anytime change mode). On the other hand, when a priority lane is determined, the priority lane is frequently fixed (priority lane fixing mode) in which priority is given to component mounting on a board conveyed along the priority lane. It may be preferable to switching. These differ depending on the type of the board and the operating status of the component mounting system 1. Therefore, in this embodiment, an operator, a user, or the like previously selects “anytime change mode” or “priority lane fixing mode”, and the mode selection information is stored in the storage unit 812.

  In step S34, when the mode selection information is “priority lane fixed mode”, the arithmetic processing unit 811 determines that there is no need to update, and proceeds to step S42 as it is to maintain the previously set priority lane. Is transmitted to the mounting machine 5. On the other hand, in step S34, when the mode selection information is “anytime change mode”, the arithmetic processing unit 811 determines that updating is necessary, and the components listed in the determination information table (hereinafter, “expiration due components”). Lane determination information for determining a priority lane based on the priority (numbers in parentheses), the notification order (numbers in circles), and the number of parts (steps S35 to S41).

In this embodiment, as the lane determination information,
・ MAX: The highest value among the priorities of components approaching the deadline,
・ Average: Average priority for each lane,
・ Order: The earliest order in the notification order,
・ Number of pieces: Finding the number of parts approaching the deadline for each lane. That is, when based on the lane determination information “MAX”, priority is given to a lane on which a time limit approaching component having the highest priority is mounted. Further, when based on the lane determination information “average”, priority is given to a lane with a high average priority. In addition, when based on the lane determination information “order”, priority is given to a lane in which a component that has approached the effective expiration date first is mounted among the components approaching the expiration date. Furthermore, when based on the lane determination information “number”, priority is given to a lane having a larger number of approaching parts. Which of these four lane determination information is used is preset by an operator or user via the display / operation unit 820, and the setting value is stored in the storage unit 812.

Returning to FIG. 6, the description will be continued. In this embodiment, in order to identify the lane determination information, whether or not priority rank determination is performed (step S35), whether it is “MAX” or “Ave (average)” (step S36), “order” Or “number” (step S39), the arithmetic processing unit 811 executes lane determination information corresponding to the determination result (steps S37, S38, S40, and S41). For example, when the determination information table is as shown in FIG.
Lane determination information “MAX”: Lane LA “10”
-Lane determination information “average”: “6.75” of lane LB
-Lane decision information "Order" ... Lane LA "1"
Lane determination information “number”: “4” of lane LB
Thus, for example, when “MAX” or “order” is set as the lane determination information, the arithmetic processing unit 811 updates the priority information with the lane LA as the priority lane (step S42), and transmits it to the mounter 5.

  When the mounting machine 5 receives the priority information from the server PC 8 (step S23), the arithmetic processing unit 531 controls each part of the apparatus based on the priority information and executes table task processing to execute the priority lane board (priority board). The component mounting on the board is preferentially performed (step S24). These series of processes (steps S21 to S24) are repeatedly executed until the mounting of all components is completed (step S25). As a result, component mounting is executed, for example, in the task order shown in the lower part of FIG. 4, and component mounting in the first lane that is the priority lane is completed early.

  8 to 11 are diagrams schematically showing an example of the task order when the operation shown in FIG. 6 is executed. By executing the operation shown in FIG. 6, the tasks are executed in an order different from the task order when the priority lane is not set (upper stage in FIG. 4). More specifically, roughly four types of order change are substantially executed. Here, a part of the component (component “PARTS00A” in FIG. 7) to be mounted on the board PBA positioned at the mounting work position of the first lane LA is in a warning state, and the first lane LA is set as the priority lane in the priority lane fixing mode. An example will be described.

  In the first order change, the head unit 560B corresponding to the non-priority lane LB always gives priority to component mounting on the board PBA in the priority lane LA. In the present embodiment, the dual lane structure is adopted as described above, and the head unit 560B accesses not only the board PBB of the non-priority lane LB but also the board PBA of the priority lane LA to perform component mounting. As indicated by the thick dotted line and the thick solid line, the head unit 560B mounts the component on the board PBA in the priority lane LA before executing the task “2” for mounting the component on the board PBB in the non-priority lane LB. The task “3” is performed. The task arrangement immediately after the execution of the first order change is as shown in the upper part of FIG.

  In the second order change, in order to perform component mounting on the board PBB in the non-priority lane LB, the task of waiting for component mounting on the board PBA in the priority lane LA is postponed. Specifically, as shown in FIG. 9, component mounting on the board PBB in the non-priority lane LB is skipped, and is executed when there is no component mounting on the board PBA in the priority lane LA. When this second order change is executed, as shown in the lower part of FIG. 9 and the upper part of FIG. 10, the production of the board PBB is delayed because the component mounting on the board PBB in the non-priority lane LB is postponed.

  In order to suppress this delay, the third order change is executed. Component mounting on the substrate PBB in the non-priority lane LB is performed by the head units 560A and 560B. In the third order change, the task of mounting components on the substrate PBB by the head unit 560A is performed, and components are mounted on the substrate PBB by the head unit 560B. By executing the component mounting on the substrate PBB by the head unit 560B in parallel with the component mounting on the substrate PBA by the head unit 560A, as shown by the thick solid line in the lower part of FIG. The delay caused by the second order change is minimized.

  As shown in the upper part of FIG. 11, when the component mounting on the board PBA in the priority lane LA is completed, the component mounting task on the board PBB by the head unit 560A (enclosed in bold in FIG. 11), the head unit When the component mounting task on the board PBB by 560B is mixed, by giving priority to the former over the latter, the work of the head unit 560A is completed early as shown in FIG. Preparation for executing the next component mounting can be started early. This is the fourth order change.

  As described above, according to the present embodiment, when a component that is close to the expiration date is confirmed among components that are used for production of a component mounting board, the component that is due to be expired is mounted out of the substrates PBA and PBB. Priority board (in the above-described embodiment, the case where the board PBA corresponds to the priority board is illustrated), and mounting of components on this priority board is preferentially executed. In this way, the expiring parts whose expiry date is approaching are preferentially used, and the expiring parts are used before the expiring date. As a result, it is possible to suppress parts from being discarded due to the expiration of the expiration date, and it is possible to improve production efficiency.

  In addition, when the warning state is canceled, the priority mounting of the components on the priority board is canceled and the components are mounted in the original order, that is, the optimized mounting program, so that the throughput can be returned to the original high state. .

  In the above embodiment, the priority lanes of a plurality of (three in the above embodiment) mounting machines 5 are collectively managed by the server PC 8, so that component mounting between the mounting machines 5 is associated with each other. The component mounting board can be produced efficiently.

  In addition, it is possible to switch between “priority lane fixed mode” and “anytime change mode” according to the mode selection information, and it is possible to switch the priority lane in a manner according to the request of the operator or user. Yes. In addition, four types of lane determination information (“MAX”, “average”, “order”, number ”) are prepared as modes for determining the priority lanes, the types of boards and parts to be produced, and the operation of the production line It is possible to switch appropriately according to the situation. As described above, the component mounting system 1 can flexibly cope with the types and operating conditions of the boards, and is a system with excellent versatility.

  In the present embodiment, the effective use time limit is considered only for the component, but the priority lane may be determined in consideration of the effective use time limit for other use members such as solder and board, or together with the component. Solder or the like corresponds to the “used member” of the present invention. In addition, the arithmetic processing unit 531 of the controller 530 functions as a confirmation unit that executes a deadline confirmation process (corresponding to the “confirmation process” of the present invention) for confirming a component approaching the deadline. Equivalent to. In addition, the arithmetic processing unit 811 of the controller 810 functions as a production management unit that executes a production management operation (corresponding to the “production management process” of the present invention) that creates priority information and accelerates the production of priority substrates. It corresponds to “production management means” of the invention.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, a plurality of tape feeders 551 can be attached to the component storage unit 550, but two or more tape feeders 551 among them may be stored with the same component or an alternative component. In this case, however, it may be configured as follows. That is, when a part stored in any one of these common tape feeders 551 approaches the expiration date, the tape feeder 551 that stores the part is preferentially used from among the common tape feeders 551. Good. As a result, the parts that are near the expiration date are used sequentially from the same part or alternative parts, so the number of parts discarded due to the expiration of the expiration date can be reduced, and production efficiency can be further improved. Can do. Also in this case, when the warning state is canceled, the priority use of the tape feeder 551 may be canceled and the tape feeder 551 may be selected and used in the original order.

  Moreover, in the said embodiment, although only the tape feeder 551 is equipped as a "component supply part" of this invention, with respect to the system incorporating the mounting machine using component supply parts, such as another feeder and a component tray. The present invention can also be applied.

  Further, in the above embodiment, for a system in which a mounting machine having three or more lanes is incorporated instead of a so-called dual lane mounting machine having two lanes for transporting a board to a position where component mounting is performed. The present invention can also be applied. That is, the present invention is applicable to all techniques for producing a component mounting board by mounting components on a board using a so-called multi-lane type component mounting apparatus.

  Furthermore, in the above embodiment, the time limit confirmation process and the production management process are performed by the arithmetic processing units 531 and 811, respectively, but both may be performed by either one of the arithmetic processing units. For example, in one mounting machine 5, the arithmetic processing unit 531 may be configured to perform a time limit confirmation process and a production management process.

DESCRIPTION OF SYMBOLS 1 ... Component mounting system 5 ... Mounting machine (component mounting apparatus)
520A, 520B ... substrate transport mechanism 530 ... controller (control means, confirmation means)
531: Arithmetic processing section (control means, confirmation means)
551 ... Tape feeder (component supply unit)
560A, 560B ... head unit 810 ... controller (production management means)
811 ... arithmetic processing unit (production management means)
LA, LB ... Lane PBA, PBB ... Substrate

Claims (6)

First substrate transport means for transporting the first substrate along the first lane and positioning the first substrate at a first mounting work position;
A second substrate transfer means for transferring a second substrate different from the first substrate along a second lane different from the first lane and positioning the second substrate at a second mounting work position different from the first mounting work position;
A plurality of head units that access both the first board positioned at the first mounting work position and the second board positioned at the second mounting work position to mount components;
Control means for controlling the production of the first substrate and the second substrate by controlling the plurality of head units,
Wherein, when that line Tsu parts of mounting to said first substrate and said second substrate in a predetermined order repeatedly checks whether or not the materials used to be used for production nearing enabled expiration date When the expiry member approaching the effective expiry date is confirmed among the used members used for production, priority is given to mounting of components on the priority substrate using the expiry member of the first substrate and the second substrate. To speed up the production of the priority board.   When the control means confirms the expiring member and enters a warning state, the control unit preferentially mounts the component on the priority board, and when the warning state is released, cancels the preferential mounting of the component on the priority board. The component mounting apparatus according to claim 1, wherein the components are mounted in the following order. 3. The device according to claim 1, further comprising: a plurality of component supply units that store the same component or a substitute component, wherein each head unit mounts a component by selecting from the plurality of component supply units according to the predetermined order. A component mounting apparatus,
The control means, when a component stored in any of the plurality of component supply units approaches the effective expiration date, the component supply unit storing the component is preferentially used from among the plurality of component supply units Mounting device.   The control means preferentially uses the component supply unit when a component housed in any of the plurality of component supply units approaches a valid expiration date and enters a warning state. On the other hand, when the warning state is canceled, the component The component mounting apparatus according to claim 3, wherein priority use of the supply unit is canceled and the component supply unit is selected and used in the original order. A first substrate transfer means for transferring the first substrate along the first lane and positioning the first substrate at a first mounting work position; and a second substrate different from the first substrate along a second lane different from the first lane. A second substrate transport means for transporting and positioning at a second mounting work position different from the first mounting work position; a first substrate positioned at the first mounting work position; and a second substrate working position positioned at the second mounting work position A component mounting board production method for producing a first board and a second board using a component mounting apparatus having a plurality of head units that access both of the second boards and mount components,
Repetitively confirming whether or not a member used for production is approaching the expiration date when mounting the components on the first substrate and the second substrate in a predetermined order by the plurality of head units. In the confirmation process of confirming the expiry member approaching the effective expiration date among the used members used for production,
A production management step of accelerating the production of the priority substrate by preferentially mounting components on the priority substrate using the time limit approaching member confirmed by the confirmation step of the first substrate and the second substrate. A component mounting board production method characterized by the above. A first substrate transfer means for transferring the first substrate along the first lane and positioning the first substrate at a first mounting work position; and a second substrate different from the first substrate along a second lane different from the first lane. A second substrate transport means for transporting and positioning at a second mounting work position different from the first mounting work position; a first substrate positioned at the first mounting work position; and a second substrate working position positioned at the second mounting work position A component mounting system that includes a plurality of component mounting apparatuses each including a plurality of head units that access both of the second substrates and mount components, and controls the component mounting by the plurality of head units to produce a substrate. ,
When mounting components on the first board and the second board in a predetermined order, it is used for production by repeatedly checking whether or not the member used for production is approaching the expiration date. Confirming means for confirming the expiry member approaching the effective expiry date among the used members to be used,
While the confirmation means does not confirm the time limit proximity member, while causing the component mounting for the first substrate and the second substrate at the predetermined order in each component mounting apparatus, the confirmation means the deadline approaches member Confirming, the production management means for speeding up the production of the priority board by preferentially mounting components on the priority board using the deadline approaching member of the first board and the second board. A component mounting system characterized by that.

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