JP5785972B2 - ヒートシンク及びその製造方法 - Google Patents

ヒートシンク及びその製造方法 Download PDF

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Publication number
JP5785972B2
JP5785972B2 JP2013075495A JP2013075495A JP5785972B2 JP 5785972 B2 JP5785972 B2 JP 5785972B2 JP 2013075495 A JP2013075495 A JP 2013075495A JP 2013075495 A JP2013075495 A JP 2013075495A JP 5785972 B2 JP5785972 B2 JP 5785972B2
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Japan
Prior art keywords
fins
fin
heat sink
base portion
component
Prior art date
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Expired - Fee Related
Application number
JP2013075495A
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English (en)
Japanese (ja)
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JP2013131779A (ja
JP2013131779A5 (enExample
Inventor
深川 栄生
栄生 深川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sankyo Tateyama Inc
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Sankyo Tateyama Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Sankyo Tateyama Inc filed Critical Sankyo Tateyama Inc
Priority to JP2013075495A priority Critical patent/JP5785972B2/ja
Publication of JP2013131779A publication Critical patent/JP2013131779A/ja
Publication of JP2013131779A5 publication Critical patent/JP2013131779A5/ja
Application granted granted Critical
Publication of JP5785972B2 publication Critical patent/JP5785972B2/ja
Expired - Fee Related legal-status Critical Current
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2013075495A 2013-03-30 2013-03-30 ヒートシンク及びその製造方法 Expired - Fee Related JP5785972B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013075495A JP5785972B2 (ja) 2013-03-30 2013-03-30 ヒートシンク及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013075495A JP5785972B2 (ja) 2013-03-30 2013-03-30 ヒートシンク及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2011034377A Division JP5285097B2 (ja) 2011-02-21 2011-02-21 ヒートシンク

Publications (3)

Publication Number Publication Date
JP2013131779A JP2013131779A (ja) 2013-07-04
JP2013131779A5 JP2013131779A5 (enExample) 2013-09-05
JP5785972B2 true JP5785972B2 (ja) 2015-09-30

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ID=48909058

Family Applications (1)

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JP2013075495A Expired - Fee Related JP5785972B2 (ja) 2013-03-30 2013-03-30 ヒートシンク及びその製造方法

Country Status (1)

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JP (1) JP5785972B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017216665A1 (de) * 2017-09-20 2019-03-21 Robert Bosch Gmbh Kühlkörpersegment, Kühlkörper sowie Verfahren zum Kühlen von Bauteilen
CN107943258A (zh) * 2018-01-04 2018-04-20 钦州学院 仿甲壳虫鞘翅微结构表面的仿生风冷式微型散热器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102378U (enExample) * 1977-01-21 1978-08-18
JPS59229844A (ja) * 1983-06-13 1984-12-24 Fuji Electric Co Ltd 半導体素子のヒ−トシンク
JPH0529505A (ja) * 1991-07-23 1993-02-05 Sansha Electric Mfg Co Ltd 放熱器および電力制御機器
JP4651702B2 (ja) * 2008-10-17 2011-03-16 三洋電機株式会社 照明装置

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Publication number Publication date
JP2013131779A (ja) 2013-07-04

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