JP5779155B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5779155B2 JP5779155B2 JP2012187624A JP2012187624A JP5779155B2 JP 5779155 B2 JP5779155 B2 JP 5779155B2 JP 2012187624 A JP2012187624 A JP 2012187624A JP 2012187624 A JP2012187624 A JP 2012187624A JP 5779155 B2 JP5779155 B2 JP 5779155B2
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- lead
- light receiving
- receiving element
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- 239000004065 semiconductor Substances 0.000 title claims description 44
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 239000012212 insulator Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 230000035945 sensitivity Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000023077 detection of light stimulus Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/165—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the semiconductor sensitive to radiation being characterised by at least one potential-jump or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by at least one potential or surface barrier
Description
Claims (9)
- 1次側リードと、
前記1次側リードに電気的に接続された発光素子と、
第1、第2および第3リードを有する2次側リードと、
前記発光素子が放射する光を検知する第1の面と、前記第1の面とは反対側の第2の面と、を有する受光素子であって、前記第1の面に設けられたアノード電極およびカソード電極と、ゲート電極と、を有し、前記2次側リードに電気的に接続されたサイリスタ型の受光素子と、
を備え、
前記第1リードは、前記アノード電極に電気的に接続され、
前記第2リードは、前記カソード電極に電気的に接続され、
前記第3リードは、絶縁体を介して前記受光素子がマウントされたマウント部を有し、前記ゲート電極に電気的に接続された半導体装置。 - 前記受光素子は、
第1導電形の半導体層と、
前記半導体層の表面に選択的に設けられた第2導電形の第1の領域と、
前記第1の領域から離間して、前記半導体層の表面に選択的に設けられた第2導電形の第2の領域と、
前記第2の領域の表面に選択的に設けられた第1導電型の第3の領域と、
を有し、
前記アノード電極は、前記第1の領域および前記第3の領域の一方に接続され、
前記カソード電極は、前記第1の領域および前記第3の領域の他方に接続され、
前記ゲート電極は、前記第2の領域または前記半導体層のいずれかに接続された請求項1記載の半導体装置。 - 前記受光素子は、前記第1の領域と前記第2の領域との間の前記半導体層、または、前記第2の領域において前記発光素子から放射された光を検知する請求項2記載の半導体装置。
- 前記アノード電極と前記第1リードとの間、および、前記カソード電極と前記第2リードとの間は、それぞれ金属ワイヤを介して接続された請求項1〜3のいずれか1つに記載の半導体装置。
- 前記ゲート電極は、前記第1の面に設けられ、
前記ゲート電極と前記第3リードとの間は、金属ワイヤを介して接続された請求項1記載の半導体装置。 - 前記発光素子および前記受光素子は、前記受光素子の前記第1の面が前記発光素子に向き合うように配置される請求項1〜5のいずれか1つに記載の半導体装置。
- 前記発光素子と、前記1次側リードの前記発光素子に接続された部分と、前記受光素子と、前記第1リード、前記第2リードおよび前記第3リードのそれぞれの前記受光素子に接続された部分と、を覆う成形体をさらに備えた請求項1〜6のいずれか1つに記載の半導体装置。
- 前記成形体は、前記発光素子および前記受光素子を覆い前記発光素子の光を透過する透明樹脂と、前記透明樹脂を覆い前記受光素子が感度を有する波長帯の光を遮断する遮光樹脂と、を含む請求項7記載の半導体装置。
- 前記1次側リード、前記第1リード、前記第2リードおよび前記第3リードのそれぞれは、前記成形体より延出する部分を有する請求項7または8に記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012187624A JP5779155B2 (ja) | 2012-08-28 | 2012-08-28 | 半導体装置 |
US13/845,287 US9257591B2 (en) | 2012-08-28 | 2013-03-18 | Photocoupler semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012187624A JP5779155B2 (ja) | 2012-08-28 | 2012-08-28 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014045127A JP2014045127A (ja) | 2014-03-13 |
JP5779155B2 true JP5779155B2 (ja) | 2015-09-16 |
Family
ID=50186207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012187624A Active JP5779155B2 (ja) | 2012-08-28 | 2012-08-28 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9257591B2 (ja) |
JP (1) | JP5779155B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6445947B2 (ja) * | 2015-09-04 | 2018-12-26 | 株式会社東芝 | 光結合装置 |
JP6416800B2 (ja) * | 2016-01-26 | 2018-10-31 | 株式会社東芝 | 半導体装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0367301A3 (en) * | 1984-06-22 | 1990-05-16 | Hitachi, Ltd. | Semiconductor switch circuit |
JPS6195581A (ja) * | 1984-10-16 | 1986-05-14 | Toshiba Corp | 光結合素子 |
JPH0716015B2 (ja) * | 1985-04-18 | 1995-02-22 | 株式会社東芝 | フォトカプラ |
US5647034A (en) * | 1994-10-03 | 1997-07-08 | Matsushita Electric Works, Ltd. | Operation displaying semiconductor switch |
JPH09223791A (ja) | 1996-02-15 | 1997-08-26 | Toshiba Corp | 半導体装置 |
JPH10209487A (ja) * | 1997-01-23 | 1998-08-07 | Nec Corp | 固体リレーおよびその製造方法 |
JP4040858B2 (ja) * | 2001-10-19 | 2008-01-30 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP2005203553A (ja) * | 2004-01-15 | 2005-07-28 | Matsushita Electric Ind Co Ltd | 光送受信モジュールおよび光送受信装置 |
JP2006005102A (ja) | 2004-06-16 | 2006-01-05 | Matsushita Electric Works Ltd | フォトサイリスタとその実装方法及びプロセス方法 |
WO2006070581A1 (ja) * | 2004-12-28 | 2006-07-06 | Kokusan Denki Co., Ltd. | 半導体装置 |
US20070040108A1 (en) * | 2005-08-16 | 2007-02-22 | Wenstrand John S | Optical sensor light switch |
GB2439358B (en) * | 2006-06-19 | 2010-12-15 | Cambridge Display Tech Ltd | Organic electroluminescent optocouplers |
-
2012
- 2012-08-28 JP JP2012187624A patent/JP5779155B2/ja active Active
-
2013
- 2013-03-18 US US13/845,287 patent/US9257591B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20140061678A1 (en) | 2014-03-06 |
US9257591B2 (en) | 2016-02-09 |
JP2014045127A (ja) | 2014-03-13 |
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