JP5777002B2 - 旋回可能な弁閉鎖体ビームを持つフラップ移送弁 - Google Patents

旋回可能な弁閉鎖体ビームを持つフラップ移送弁 Download PDF

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Publication number
JP5777002B2
JP5777002B2 JP2011021349A JP2011021349A JP5777002B2 JP 5777002 B2 JP5777002 B2 JP 5777002B2 JP 2011021349 A JP2011021349 A JP 2011021349A JP 2011021349 A JP2011021349 A JP 2011021349A JP 5777002 B2 JP5777002 B2 JP 5777002B2
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JP
Japan
Prior art keywords
valve
axis
valve closure
closure beam
support
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JP2011021349A
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English (en)
Japanese (ja)
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JP2011163557A (ja
JP2011163557A5 (enExample
Inventor
フリードリヒ・ガイザー
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VAT Holding AG
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VAT Holding AG
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Publication of JP2011163557A5 publication Critical patent/JP2011163557A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
    • F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
    • F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
    • F16K1/2007—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member specially adapted operating means therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
    • F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
    • F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
    • F16K1/2028—Details of bearings for the axis of rotation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
    • F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
    • F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
    • F16K1/2042—Special features or arrangements of the sealing
    • F16K1/205—Special features or arrangements of the sealing the sealing being arranged on the valve member
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H10P72/0441—
    • H10P72/3308—
    • H10P72/3406—

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sliding Valves (AREA)
  • Lift Valve (AREA)
  • Mechanically-Actuated Valves (AREA)
  • Details Of Valves (AREA)
JP2011021349A 2010-02-04 2011-02-03 旋回可能な弁閉鎖体ビームを持つフラップ移送弁 Active JP5777002B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP10152682.0A EP2355132B1 (de) 2010-02-04 2010-02-04 Klappen-Transferventil mit schwenkbarem Ventilverschlussbalken
EP10152682.0 2010-02-04

Publications (3)

Publication Number Publication Date
JP2011163557A JP2011163557A (ja) 2011-08-25
JP2011163557A5 JP2011163557A5 (enExample) 2014-03-06
JP5777002B2 true JP5777002B2 (ja) 2015-09-09

Family

ID=42813443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011021349A Active JP5777002B2 (ja) 2010-02-04 2011-02-03 旋回可能な弁閉鎖体ビームを持つフラップ移送弁

Country Status (5)

Country Link
US (1) US8622368B2 (enExample)
EP (1) EP2355132B1 (enExample)
JP (1) JP5777002B2 (enExample)
KR (1) KR101770990B1 (enExample)
CN (1) CN102192337B (enExample)

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CN103174841A (zh) * 2011-12-21 2013-06-26 麦丰密封科技股份有限公司 密封组件
EP2834545B1 (en) * 2012-04-02 2016-03-30 Velan ABV S.P.A. Joint linkage actuating means for a valve
KR101385132B1 (ko) * 2012-06-18 2014-04-14 주식회사 씨엘디 가압 장치
WO2014085497A1 (en) * 2012-11-30 2014-06-05 Applied Materials, Inc Process chamber gas flow apparatus, systems, and methods
GB2517904A (en) * 2013-07-31 2015-03-11 Ingegneria Ceramica S R L An Improved Obturator and Method of Fabrication Thereof
US9530623B2 (en) * 2013-11-26 2016-12-27 Applied Materials, Inc. Process chamber apparatus, systems, and methods for controlling a gas flow pattern
US9970105B2 (en) * 2013-12-23 2018-05-15 Taiwan Semiconductor Manufacturing Co., Ltd Method for sealing processing module
DE202014005077U1 (de) 2014-06-23 2014-10-01 European Trailer Systems Gmbh Planenaufbau
JP2018520326A (ja) 2015-04-23 2018-07-26 ジェネラル・プラズマ・インコーポレーテッド チャンバ弁
US11629406B2 (en) 2018-03-09 2023-04-18 Asm Ip Holding B.V. Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
CN208014647U (zh) * 2018-04-24 2018-10-26 君泰创新（北京）科技有限公司 一种沉淀室的隔离设备
US10748727B2 (en) * 2018-05-30 2020-08-18 Mei Mei Memie WONG Electrical switch
EP3587243B1 (en) * 2018-06-29 2022-12-21 Hamilton Sundstrand Corporation Door closure mechanism
CN111089187B (zh) * 2018-10-23 2021-10-29 日扬科技股份有限公司 翻板输送阀
CN114286906A (zh) 2019-07-31 2022-04-05 应用材料公司 隔离阀
US11953113B2 (en) * 2020-02-14 2024-04-09 Crane Chempharma & Energy Corp. Valve with unobstructed flow path having increased flow coefficient
DE102020001179A1 (de) 2020-02-24 2021-08-26 Vat Holding Ag Vakuumventil zur Bereitstellung eines symmetrischen Fluidflusses
US11408530B2 (en) * 2020-08-05 2022-08-09 Applied Materials, Inc. Valve for varying flow conductance under vacuum
DE102021102283A1 (de) * 2021-02-01 2022-08-04 Vat Holding Ag Verschlussvorrichtung zum vakuumdichten Verschließen einer Öffnung in einer Wand
CN115306905B (zh) * 2022-10-10 2022-12-13 常州市彬达干燥制粒设备有限公司 一种具有阀片组件的排料阀门机构
DE102023000251A1 (de) 2023-01-27 2024-08-01 Vat Holding Ag Klappenventil und Dichtung mit verbesserter Dichtgeometrie für ein solches Ventil
CN118391488A (zh) * 2024-07-01 2024-07-26 艾庞半导体科技(四川)有限公司 一种真空传输阀门自锁装置

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Also Published As

Publication number Publication date
CN102192337B (zh) 2015-04-08
US8622368B2 (en) 2014-01-07
JP2011163557A (ja) 2011-08-25
CN102192337A (zh) 2011-09-21
KR20110090823A (ko) 2011-08-10
US20110186762A1 (en) 2011-08-04
EP2355132A1 (de) 2011-08-10
EP2355132B1 (de) 2014-05-21
KR101770990B1 (ko) 2017-08-24

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