JP5777002B2 - 旋回可能な弁閉鎖体ビームを持つフラップ移送弁 - Google Patents
旋回可能な弁閉鎖体ビームを持つフラップ移送弁 Download PDFInfo
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- 238000007789 sealing Methods 0.000 claims description 142
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- 229910001220 stainless steel Inorganic materials 0.000 description 2
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
- F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
- F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
- F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
- F16K1/2007—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member specially adapted operating means therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
- F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
- F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
- F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
- F16K1/2028—Details of bearings for the axis of rotation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
- F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
- F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
- F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
- F16K1/2042—Special features or arrangements of the sealing
- F16K1/205—Special features or arrangements of the sealing the sealing being arranged on the valve member
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
- F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sliding Valves (AREA)
- Lift Valve (AREA)
- Mechanically-Actuated Valves (AREA)
- Details Of Valves (AREA)
Description
しかし、弁閉鎖体ビームは、開放位置のときに、例えば5〜30度の非常に小さな旋回角度のみによって旋回させて閉鎖位置から離れさせ、そして、例えば旋回軸に対して横向きの移動、もしくは、例えば第一の密封平面に平行な直線移動、または、さらなる旋回軸が第一の密封平面への垂線を本質的に形成することになる更なる旋回移動、といった更なる移動の形態で、開口部横断面から横向きに移動させることも可能である。
Claims (14)
- ガスが漏れない方法で隔離することができる半導体または基材加工プロセスチャンバ内に半導体素子または基材を移送するためのフラップ移送弁であって、:
・第一の長手方向軸(2)に沿って延伸し、第一の密封平面(41)上に存在する第一の密封表面(3)により、フレームの形態に取り囲まれた、細長い第一の開口部(1)と、
・−前記第一の長手方向軸(2)に平行な第二の長手方向軸(5)に沿って延伸し、
−前記第一の開口部(1)を閉鎖するために、前面(6)上の閉鎖体表面(8)を有し、
−前記第一の密封表面(3)に対応し、それにガスが漏れないように接触させることができ、前記閉鎖体表面(8)の縁端領域内かつ第二の密封平面(42)上に位置する、第二の密封表面(9)を有する、
細長い弁閉鎖体ビーム(4)と、
・前記前面(6)に対向する背面(7)上の、前記弁閉鎖体ビーム(4)の支持体(40)であって、前記弁閉鎖体ビーム(4)が、前記第二の長手方向軸(5)に平行な軸(44)を中心として、支持体(40)の旋回可能な接続部(43)を介して、限定された旋回角度によって旋回可能に配置された前記支持体(40)と、
・−前記弁閉鎖体ビーム(4)の前記閉鎖体表面(8)が前記第一の開口部(1)を覆って閉鎖し、前記支持体(40)により、前記背面(7)に加えられる力の作用により、前記第一の密封表面(3)および前記第二の密封表面(9)が共通の前記第一の密封平面(41)および前記第二の密封平面(42)上でガスが漏れないように接触している、閉鎖位置(C)と、
−前記弁閉鎖体ビーム(4)が前記第一の開口部(1)から旋回して離れ、少なくとも部分的に前記第一の開口部(1)を解放する、開放位置(O)と、
の間で、前記第二の長手方向軸(5)に平行である旋回軸(10)を中心として、前記支持体(40)が前記弁閉鎖体ビーム(4)と合わせて旋回することができる、旋回軸受(60)と、
を有し、
・前記旋回軸(10)が、本質的に前記第一の密封平面(41)上に存在し、
・前記軸(44)が、本質的に前記第二の密封平面(42)上に存在する
ことを特徴とする、フラップ移送弁。 - 前記支持体(40)と前記弁閉鎖体ビームとの間の前記旋回可能な接続部(43)が、少なくとも一つの
・傾斜継手(43a)、
・ボール継手(43b)または
・旋回継手(43c)
によって形成されていることを特徴とする、請求項1記載のフラップ移送弁。 - ・前記第二の密封表面(9)は、前記閉鎖体表面(8)の縁端領域内に位置し、
−少なくとも弁閉鎖体ビーム(4)の中央領域内において、
−前記閉鎖体表面(8)が前記弁閉鎖体ビーム(4)の前記前面(6)の方向に前記第二の密封平面(42)を越えて突出するように、前記第二の密封表面(9)が前記背面(7)の方向に後退し、
・少なくとも一つの凹部(45)が、
−少なくとも前記弁閉鎖体ビーム(4)の中央領域内において、
−前記弁閉鎖体ビーム(4)の前記背面(7)上に形成され、前記前面(6)の方向に少なくとも前記第二の密封平面(42)上に延伸し、前記軸(44)が前記凹部(45)の領域内で延伸し、
前記旋回可能な接続部(43)が前記凹部(45)に配置されている
ことを特徴とする、請求項1または2のいずれか一項記載のフラップ移送弁。 - 前記旋回可能な接続部(43)が、
・少なくとも一つの前記凹部(45)と、
・前記支持体(40)上の少なくとも一つの凸部(46)と、
から形成され、
・前記凸部(46)が前記凹部(45)内に突出し、前記支持体(40)に対する相対的な前記軸(44)を中心として、前記弁閉鎖体ビーム(4)が旋回できるように、前記凸部(46)と前記凹部(45)との間に接触がある、
ことを特徴とする、請求項3記載のフラップ移送弁。 - ・前記旋回可能な接続部(43)は、傾斜継手(43a)の形態であり、
・前記凹部(45)は、ベース(47)を有し、
・前記凸部(46)は、点に収束する横断面を有し、前記軸(44)および前記第二の長手方向軸(5)が直角に通過する、前記平面に対する尖頭(48)を有する
ことを特徴とし、
前記尖頭(48)と前記ベース(47)との間の前記軸(44)上に点またはライン接触があり、これが前記傾斜継手(43a)を形成している、
請求項4記載のフラップ移送弁。 - 前記凸部(46)は、V字形状の横断面を有し、点に収束するV字角度により、前記尖頭(48)が形成されている
ことを特徴とする、請求項5記載のフラップ移送弁。 - 前記凹部(45)は、前記軸(44)および前記第二の長手方向軸(5)が直角で通過する前記平面に対し、内方に収束する横断面を有する
ことを特徴とする、請求項5または6のいずれか一項記載のフラップ移送弁。 - 前記凹部(45)は、V字形状の横断面を有し、前記ベース(47)が緩やかに収束するV字角度によって形成されている
ことを特徴とする、請求項7記載のフラップ移送弁。 - ・前記凹部(45)は、少なくとも部分的に前記軸(44)に沿って延伸する溝の形態であり、前記溝(45)のベース(47)が前記第二の密封平面(42)上を伸び、
・前記凸部(46)は、前記軸(44)に沿って延伸するくさびの形態である
ことを特徴とする、請求項4〜8のいずれか一項記載のフラップ移送弁。 - ・前記弁閉鎖体ビーム(4)と前記支持体(40)との間のばね配置(49)であって、
該ばね配置(49)は、
・前記弁閉鎖体ビーム(4)が前記支持体(40)上に保持され、
・前記凸部(46)が前記凹部(45)内に押し当てられる、
ように配置されている、
ことを特徴とする、請求項4〜9のいずれか一項記載のフラップ移送弁。 - 前記ばね配置(49)は、
前記弁閉鎖体ビーム(4)の前記背面(7)上に配置され、前記凸部(46)を前記凹部(45)内に押し付け、前記凹部(45)内に突出する前記凸部(46)の後方で前記軸(44)に対して横向きに配置されている、少なくとも一つのリーフばねの形態である
ことを特徴とする、請求項10記載のフラップ移送弁。 - ・前記弁閉鎖体ビーム(4)と前記支持体(40)との間で前記旋回角度を限定する、旋回止め具(50)と、
・前記弁閉鎖体ビーム(4)と前記支持体(40)との間の少なくとも一つのばね(51)と、を有し、
・前記開放位置(O)において、前記少なくとも一つのばね(51)が前記弁閉鎖体ビーム(4)を前記旋回止め具(50)に押し付け、
・前記弁閉鎖体ビーム(4)が前記開放位置(O)のときに前記支持体(40)に対して傾斜し、前記旋回軸受(60)により、前記支持体(40)および前記弁閉鎖体ビーム(4)が前記開放位置(O)から前記閉鎖位置(C)に旋回する一方、前記第一の密封表面(3)と前記第二の密封表面(9)との間の前記接触が生じている間、これらの前記各密封表面(3、9)が互いの上にフラットに載置されるようになる請求項1〜11のいずれか一項記載のフラップ移送弁。 - 前記第一の開口部(1)の前記第一の長手方向軸(2)に平行に、かつ、前記旋回軸(10)に沿って延伸する旋回シャフト(61)が、前記第一の開口部(1)に隣接して配置され、旋回シャフト(61)には、前記旋回軸(10)を中心として旋回するための前記支持体(40)が取り付けられている
ことを特徴とする、請求項1〜12のいずれか一項記載のフラップ移送弁。 - ・前記第二の長手方向軸(5)に本質的に平行であり、前記旋回軸(10)から距離がある、シャフト軸(12)を中心として回転することができる、シャフト(11)と、
・前記シャフト軸(12)を中心として前記シャフト(11)を回転させ、前記開放位置(O)と前記閉鎖位置(C)との間で前記弁閉鎖体ビーム(4)を移動させるため、前記シャフト(11)に結合されている、少なくとも一つの駆動装置(13)と、
・共に回転するようにシャフト(11)上に配置され、自由端が直接的または前記支持体(40)を介して間接的に、前記弁閉鎖体ビーム(4)の前記背面(7)に係合する少なくとも1つの第一のアーム(29)であって、シャフト軸(12)を中心としたシャフト(11)の回転と、これによる前記第一のアーム(29)の旋回との結果、前記開放位置(O)と前記閉鎖位置(C)との間で前記旋回軸(10)を中心として前記弁閉鎖体ビーム(4)を旋回するための力が前記弁閉鎖体ビーム(4)の前記背面(7)に加えることができる、少なくとも一つの前記第一のアーム(29)と、
を特徴とする、請求項1〜13のいずれか一項記載のフラップ移送弁。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10152682.0A EP2355132B1 (de) | 2010-02-04 | 2010-02-04 | Klappen-Transferventil mit schwenkbarem Ventilverschlussbalken |
EP10152682.0 | 2010-02-04 |
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JP2011163557A JP2011163557A (ja) | 2011-08-25 |
JP2011163557A5 JP2011163557A5 (ja) | 2014-03-06 |
JP5777002B2 true JP5777002B2 (ja) | 2015-09-09 |
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JP2011021349A Active JP5777002B2 (ja) | 2010-02-04 | 2011-02-03 | 旋回可能な弁閉鎖体ビームを持つフラップ移送弁 |
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Country | Link |
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US (1) | US8622368B2 (ja) |
EP (1) | EP2355132B1 (ja) |
JP (1) | JP5777002B2 (ja) |
KR (1) | KR101770990B1 (ja) |
CN (1) | CN102192337B (ja) |
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CN103174841A (zh) * | 2011-12-21 | 2013-06-26 | 麦丰密封科技股份有限公司 | 密封组件 |
US9732877B2 (en) * | 2012-04-02 | 2017-08-15 | Nicola Lucchesi | Joint linkage actuating means for a valve |
KR101385132B1 (ko) * | 2012-06-18 | 2014-04-14 | 주식회사 씨엘디 | 가압 장치 |
JP6180541B2 (ja) * | 2012-11-30 | 2017-08-16 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 処理チャンバガス流装置、システム、及び方法 |
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2010
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- 2011-02-01 KR KR1020110010177A patent/KR101770990B1/ko active IP Right Grant
- 2011-02-01 CN CN201110063229.6A patent/CN102192337B/zh active Active
- 2011-02-03 US US13/020,248 patent/US8622368B2/en active Active
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EP2355132A1 (de) | 2011-08-10 |
CN102192337B (zh) | 2015-04-08 |
US8622368B2 (en) | 2014-01-07 |
EP2355132B1 (de) | 2014-05-21 |
CN102192337A (zh) | 2011-09-21 |
KR20110090823A (ko) | 2011-08-10 |
KR101770990B1 (ko) | 2017-08-24 |
JP2011163557A (ja) | 2011-08-25 |
US20110186762A1 (en) | 2011-08-04 |
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