JP5769825B2 - ウェハーの恒久的な接合のための方法及び装置、並びに切削器具 - Google Patents
ウェハーの恒久的な接合のための方法及び装置、並びに切削器具 Download PDFInfo
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- JP5769825B2 JP5769825B2 JP2013554827A JP2013554827A JP5769825B2 JP 5769825 B2 JP5769825 B2 JP 5769825B2 JP 2013554827 A JP2013554827 A JP 2013554827A JP 2013554827 A JP2013554827 A JP 2013554827A JP 5769825 B2 JP5769825 B2 JP 5769825B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
- B29C65/741—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area characterised by the relationships between the joining step and the severing step
- B29C65/7411—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area characterised by the relationships between the joining step and the severing step characterised by the temperature relationship between the joining step and the severing step
- B29C65/7412—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area characterised by the relationships between the joining step and the severing step characterised by the temperature relationship between the joining step and the severing step the joining step and the severing step being performed at different temperatures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
−ラインの前工程(Front−end−of−line)の適合性。これは、電気的に能動素子の製造時のプロセスの適合性として定義されている。したがって接合プロセスは、ウェハー構造体上にすでに存在しているトランジスタのような能動素子が、プロセス中に危険にさらされる、又は損傷を受けることがないように設計されなくてはならない。適合性の基準は、特定の化学元素の純度(主にCMOS構造体)、及び特に熱応力に起因する負荷に対する機械的負荷容量を主に含んでいる。
−低汚染。
−負荷が無い、又は可能な限り少量の負荷。
−異なる熱膨張係数を持つ材料の場合特に、可能な限り低い温度。
− Cu−Fe、Cu−Ge、Cu−In、Cu−Li、Cu−Mg、Cu−Mn、Cu−Nb、Cu−Nd、Cu−Ni、Cu−Si、Cu−Sn、Cu−Zn、Cu−Zr、Cu−Ti、Cu−W、Cu−Ti、Cu−Ta、Cu−Au、Cu−Al、Cu−Cu− W−Fe、W−Ge、W−In、W−Li、W−Mg、W−Mn、W−Nb、W−Nd、W−Ni、W−Si、W−Sn、W−Zn、W−Zr、W−Ti、W−Ti、W−Ta、W−Au、W−Al− Ti−Fe、Ti−Ge、Ti−In、Ti−Li、Ti−Mg、Ti−Mn、Ti−Nb、Ti−Nd、Ti−Ni、Ti−Si、Ti−Sn、Ti−Zn、Ti−Zr、Ti−Ta、Ti−Au、Ti−Al− Ta−Fe、Ta−Ge、Ta−In、Ta−Li、Ta−Mg、Ta−Mn、Ta−Nb、Ta−Nd、Ta−Ni、Ta−Si、Ta−Sn、Ta−Zn、Ta−Zr、Ta−Ti、Ta−W、Ta−Ti、Ta−Ta、Ta−Au、Ta−Al− Au−Fe、Au−Ge、Au−In、Au−Li、Au−Mg、Au−Mn、Au−Nb、Au−Nd、Au−Ni、Au−Si、Au−Sn、Au−Zn、Au−Zr、Au−Ti、Au−W、Au−Ti、Au−Au、Au−Au、Au−Al− Al−Fe、Al−Ge、Al−In、Al−Li、Al−Mg、Al−Mn、Al−Nb、Al−Nd、Al−Ni、Al−Si、Al−Sn、Al−Zn、Al−Zr、Al−Ti、Al−W、Al−Ti、Al−Al、Al−Al、Al−Al
−III−V:GaP、GaAs、InP、InSb、InAs、GaSb、GaN、AlN、InN、AlxGa1−xAs、InxGa1−xN
−IV−IV:SiC、SiGe、
−III−VI:InAlP。
−非線形光学:LiNbO3、LiTaO3、KDP(KH2PO4)
−太陽電池:CdS、CdSe、CdTe、CuInSe2、CuInGaSe2、CuInS2、CuInGaS2
−導電性酸化物:In2−xSnxO3―y
−特に臨界速度vk以下である速度vsで、並びに臨界温度Tk以上である温度Tsで少なくとも表面に近い領域内に準安定構造体を作成するための切削器具による、並びに1μm未満、好ましくは100nm未満、最も好ましくは10nm未満、及び最も特に1nmの二次粗さ(Rq)までの好ましくは同時の又は連続する平坦化による第一及び又は第二接合面の処理、
−第一固体基板と第二固体基板との接合面での接触、並びに
−再結晶化温度を超える接合温度TBで接合面の表面粗さOよりも大きい再結晶化深さRに至るまでいずれの場合も、接合面にて再結晶化によって少なくとも主に作成される恒久的な接合を形成するための、接触している固体基板の熱への暴露。
−特に臨界速度vk以下である速度vsで、並びに臨界温度Tk以上である温度Tsで、少なくとも表面に近い領域内に準安定構造体を作成し、1μm未満、好ましくは100nm未満、最も好ましくは10nm未満、及び最も特に1nm未満の表面粗さOまで下げるために第一及び/又は第二接合面を処理するための切削器具、
−接合面にて第一固体基板を第二固体基板に接触させる手段、並びに
−再結晶化温度を超える接合温度TBで、接合面の表面粗さOよりも大きい再結晶化深さRにいずれの場合も至るまで、接合面にて少なくとも主に再結晶化によって作成される恒久的な接合を形成するために、接触している固体基板を熱に暴露する手段。
1o 接合面
1s 接合側面
2 第二固体基板
2o 接合面
2s 接合側面
3,3’、3’’、3’’’ 表面近傍領域
4 アモルファス材料
5 切削器具
6 結晶領域
7 接合された固体基板
8 複数の切削器具用器具保持器
Ts 温度
Tk 臨界温度
TB 接合温度
vs 速度
vk 臨界速度
O 表面粗さ
R 再結晶化深さ
E 接触面
α 切削挿入角度
Claims (12)
- 第一材料から成る第一固体基板(1)の第一接合面(1o)を、第二材料から成る第二固体基板(2)の第二接合面(2o)に接合するための方法であって、
−少なくとも表面近傍領域内で準安定構造体を、100nm未満に減少された表面粗さOで生成するために、切削器具(5)による前記第一接合面(1o)及び/又は前記第二接合面(2o)の処理を行うステップであって、前記処理を行う間、前記切削器具(5)の速度及び温度を、前記第一固体基板及び前記第二固体基板の材料破壊が延性破壊で行われる速度及び温度に調整する、ステップと、
−前記接合面(1o、2o)で前記第一固体基板(1)を前記第二固体基板(2)に接触させるステップと、
−再結晶化温度を超える接合温度TBで、前記接合面(1o、2o)の表面粗さOよりも大きい再結晶化深さRにいずれの場合も至る、前記接合面(1o、2o)における再結晶化によって少なくとも生成される恒久的な接合を形成するために、接触している前記固体基板(1,2)を熱へ暴露するステップとを含む、
方法。 - 前記第一及び前記第二材料が同一であるように選択される、請求項1に記載の方法。
- 前記第一及び/又は前記第二材料が金属である、請求項1又は2に記載の方法。
- 前記第一接合面(1o)及び/又は前記第二接合面(2o)で、前記切削器具(5)による前記処理前の第一固体基板と比較して増加した転位密度を有する層(2)及び/又はアモルファス層(3)が形成されるように前記切削器具(5)による前記処理が行われる、請求項1から3の何れか一項に記載の方法。
- 前記切削器具(5)による前記処理を行うステップが行われた後且つ前記接触させるステップが行われる前に、前記表面粗さOが100nm未満に達していない場合に、前記表面粗さOを100nm未満に減少させるための、前記第一接合面(1o)及び/又は前記第二接合面(2o)の処理を、前記切削器具(5)によって、前記第一固体基板及び前記第二固体基板の材料破壊が脆性破壊によって行われる速度vo及び温度Toで実施する、請求項1から4の何れか一項に記載の方法。
- 前記再結晶化温度を最低まで低下させるために、合金元素の追加、又は、高純度金属を用いた不純物導入を行う、請求項1から5の何れか一項に記載の方法。
- 前記切削器具(5)による前記処理を行うステップは、第一モジュールで行われ、前記接触させるステップおよび前記熱へ暴露するステップは、前記第一モジュールとは別の第二モジュールにおいて行われる、請求項1から6の何れか一項に記載の方法。
- 第一材料から成る第一固体基板(1)の第一接合面(1o)を、第二材料から成る第二固体基板(2)の第二接合面(2o)に接合する装置であって、
−少なくとも表面近傍領域内で準安定構造体を、100nm未満に減少された表面粗さOで生成するための、前記第一接合面(1o)及び/又は前記第二接合面(2o)を処理するための切削器具(5)であって、前記処理を行う間、前記切削器具(5)の速度及び温度は、前記第一固体基板(1)及び前記第二固体基板(2)の材料破壊が延性破壊で行われる速度及び温度に調整されている、切削器具(5)と、
−前記接合面(1o、2o)で前記第一固体基板(1)を前記第二固体基板(2)に接触させるための手段と、
−再結晶化温度よりも高い接合温度TBで、前記接合面(1o、2o)の表面粗さOを超える再結晶化深さRにいずれの場合も至る、前記接合面(1o、2o)における再結晶化によって少なくとも生成される恒久的な接合を形成するために、接触している前記固体基板(1、2)を熱へ暴露する手段とを備える装置。 - 前記表面粗さOが100nm未満に達していない場合に、前記表面粗さOを100nm未満に減少させるための処理を、前記第一固体基板(1)及び前記第二固体基板(2)の材料破壊が脆性破壊によって行われる速度vo及び温度Toで実施するように、前記切削器具(5)が調整可能である、請求項8に記載の装置。
- 前記再結晶化温度を最低まで低下させるために、合金元素の追加、又は、高純度金属を用いた不純物導入を行う、請求項8又は9に記載の装置。
- 第一材料からなる第一固体基板(1)及び第二材料からなる第二固体基板(2)の材料破壊が延性破壊によって行われる速度vs及び温度Tsに調整可能であり、且つ、1μm未満の表面粗さOを有するように、前記第一固体基板(1)の第一接合面(1o)及び/又は前記第二固体基板(2)の第二接合面(2o)を処理するための切削器具(5)。
- 前記切削器具(5)は、前記第一材料および前記第二材料の材料破壊に影響する形状を有する、請求項11に記載の切削器具(5)。
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Application Number | Priority Date | Filing Date | Title |
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PCT/EP2012/050974 WO2013110315A1 (de) | 2012-01-23 | 2012-01-23 | Verfahren und vorrichtung zum permanenten bonden von wafern sowie spanwerkzeug |
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JP2014511278A JP2014511278A (ja) | 2014-05-15 |
JP5769825B2 true JP5769825B2 (ja) | 2015-08-26 |
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US (1) | US9067363B2 (ja) |
EP (1) | EP2646193B1 (ja) |
JP (1) | JP5769825B2 (ja) |
KR (1) | KR101447390B1 (ja) |
CN (1) | CN103328147B (ja) |
SG (1) | SG186759A1 (ja) |
TW (1) | TWI517204B (ja) |
WO (1) | WO2013110315A1 (ja) |
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DE102014106231A1 (de) * | 2014-05-05 | 2015-11-05 | Ev Group E. Thallner Gmbh | Verfahren und Vorrichtung zum permanenten Bonden |
KR102306977B1 (ko) | 2014-06-24 | 2021-09-30 | 에베 그룹 에. 탈너 게엠베하 | 기판의 표면 처리를 위한 방법 및 장치 |
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EP2200077B1 (en) * | 2008-12-22 | 2012-12-05 | Soitec | Method for bonding two substrates |
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- 2012-01-22 SG SG2012093357A patent/SG186759A1/en unknown
- 2012-01-23 JP JP2013554827A patent/JP5769825B2/ja active Active
- 2012-01-23 KR KR1020137002005A patent/KR101447390B1/ko active IP Right Grant
- 2012-01-23 WO PCT/EP2012/050974 patent/WO2013110315A1/de active Application Filing
- 2012-01-23 CN CN201280002216.0A patent/CN103328147B/zh active Active
- 2012-01-23 US US13/808,415 patent/US9067363B2/en active Active
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TWI517204B (zh) | 2016-01-11 |
JP2014511278A (ja) | 2014-05-15 |
KR101447390B1 (ko) | 2014-10-06 |
US20140196842A1 (en) | 2014-07-17 |
EP2646193A1 (de) | 2013-10-09 |
WO2013110315A1 (de) | 2013-08-01 |
CN103328147B (zh) | 2016-11-09 |
TW201334027A (zh) | 2013-08-16 |
KR20130103707A (ko) | 2013-09-24 |
SG186759A1 (en) | 2013-02-28 |
US9067363B2 (en) | 2015-06-30 |
EP2646193B1 (de) | 2015-07-08 |
CN103328147A (zh) | 2013-09-25 |
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