JP5764482B2 - Electronic component mounting system and method - Google Patents

Description

  The present invention relates to a structure of an electronic component mounting system and a method for mounting an electronic component using the system.

  As a method of mounting electronic components such as semiconductor chips and LEDs on the printed circuit board, apply cream solder to the printed circuit board, place the semiconductor chip or LED on it, put it in a reflow oven, heat it, and melt the solder A method of fixing electronic components on a printed circuit board is used. In addition, chip mounting devices that continuously apply cream solder, place electronic components, and reflow heat while transporting the substrate are used. However, if the lines are arranged in a plane, the installation area will increase. A device has been proposed in which a line for applying cream solder and placing electronic components and a line for reflowing are vertically two-story, and the printed circuit board is conveyed in the opposite direction on each line (for example, Patent Documents) 1).

JP 2011-96960 A

  By the way, when a printed circuit board is transported by a chip mounting device, a method is used in which the printed circuit board is transported on a pallet of a certain size so that a variety of printed circuit boards can be transported by a single transport device. . Also, when mounting electronic components on both the front and back sides of the printed circuit board, first place the electronic components on the pallet with the front side facing up, and then attach the electronic components to the front surface of the printed circuit board. A method is often used in which a pallet is placed on top and an electronic component is attached to the back surface. In this way, when mounting electronic components on both sides of the board, a front opening for placing the printed circuit board with the front side up and a back opening for placing the back side of the printed circuit board up are provided. Using the pallet, the two substrates, the substrate with the front side up and the substrate with the back side up, are placed on one pallet, and the electronic component is attached to the front surface and the electronic component is attached to the back surface at the same time. Thus, the production efficiency is improved. This method is particularly efficient when the number of types of printed circuit boards to be produced is small and the number of production is large.

  On the other hand, in recent years, many kinds and small quantities are often produced in order to meet various demands of users. In some cases, substrates corresponding to various products are mixed and produced so that a type of substrate suitable for the product can be provided according to the production status of the product to which the substrate is attached. Since the opening of the pallet varies depending on the type of substrate, when manufacturing a different type of substrate, it is necessary to replace the pallet, but if there is only one transfer device, it is in the transfer device. It is necessary to discharge all the pallets and finish mounting the electronic components on the board of one type of lot, and then set the next type of board on the next type of pallet and mount the electronic components. There are many losses for changing the type of board on which electronic components are mounted, and it has been difficult to simultaneously mount electronic components on multiple types of boards.

  An object of the present invention is to simultaneously mount electronic components on a plurality of types of substrates.

Electronic component mounting system of the present invention is an electronic component mounting system for mounting electronic components on both sides of a base plate, a pallet the board in a common opening can be set to any direction of the face up or face down, Pas a plurality of configured pallet conveying line conveying direction opposite to the upper transport line and the lower conveyor line together with Rett, provided in each upper transport line, the solder coating of applying a cream solder on the surface or back surface of the base plate apparatus and, it is provided the upper transport line downstream of the I's coating apparatus, and an electronic component mounting apparatus for mounting electronic components on the surface or back surface of the base plate, provided in each of the lower conveying line and electronic components a reflow furnace for heating the onboard board, and each of the upper conveyor line and each of the lower transport line includes a first guide rail for guiding the pallet, respectively, upper, lower transport La The second guide rail is provided in the vertical direction so that the first guide rail of the upper transport line and the first guide rail of the lower transport line are respectively in series. Placing the pallet on each second guide rail of the elevator on the upstream side of each upper transport line and taking out the pallet from each second guide rail, and A robot arm that takes out the substrate placed on the pallet on the second guide rail of the elevator, turns it over and places it on the pallet on the second guide rail of the other elevator, and has an electronic component on its front or back surface The first pallet on which the mounted first substrate is mounted, and the electronic component is not mounted on one or both of the front surface and the back surface of the first pallet. A first pallet and shape different second pallet carrying Jo of different second substrate is transported in parallel by the pallet conveying line, and the solder coating device provided in each line, mounting the electronic components a device, first by the reflow furnace, to each mounting electronic components on each side of the second substrate, wherein.

Electronic component mounting method of the present invention, composed of a substrate in a common opening and the pallet that can be set on any orientation of the face up or face down, upper transport line of the transport directions opposite to each other of the pallet and the lower transport line a plurality of pallet conveying line is provided in the upper conveyance line, the solder coating apparatus for applying a cream solder on the surface or back surface of the base plate, is provided in the upper conveyor line downstream of the I's coating apparatus, It has an electronic component mounting apparatus for mounting electronic components on the surface or back surface of the base plate, provided in each of the lower conveyor line, and a reflow furnace which electronic components heats the onboard board, and each upper conveying line And the lower transport lines include first guide rails for guiding the pallets, respectively, and the upper and lower transport lines on the upstream side and the downstream side in the pallet transport direction are the first guides of the upper transport line. Elevators for moving the second guide rail in the vertical direction so as to be in series with the first guide rails of the rail and the lower transport line, respectively, and each second guide of the elevator upstream of each upper transport line Place the pallet on the rail and take out the pallet from above each second guide rail, take out the substrate placed on the pallet on the second guide rail of one elevator, turn it over, and a second guide electronic component mounting method and a robot arm for placing the pallet on the rail, with the electronic component mounting system comprising a mounting electronic components on both sides of a base plate of the elevator, the electronic on its surface or back surface A first pallet on which a first board on which components are mounted is mounted, and electronic components are not mounted on one or both of the front surface and the back surface of the first pallet. And a first pallet and a different second pallet shapes carrying the different second substrate shapes is transported in parallel by the pallet conveying line, and the solder coating device provided in each line, each of the electronic component a mounting device, first by the reflow furnace, to each mounting electronic components on each side of the second substrate, wherein.

  The present invention has an effect that electronic components can be simultaneously mounted on a plurality of types of substrates.

It is a perspective view which shows the structure of the electronic component mounting system in embodiment of this invention. It is a perspective view which shows the upper unit of the electronic component mounting system in embodiment of this invention. It is a perspective view which shows the lower unit of the electronic component mounting system in embodiment of this invention. It is the top view and side sectional view which show the pallet used for the electronic component mounting system in embodiment of this invention. It is explanatory drawing which shows the process of mounting an electronic component by the electronic component mounting system in embodiment of this invention. It is explanatory drawing which shows the process of changing a board | substrate in the electronic component mounting system in embodiment of this invention. It is explanatory drawing which shows the mixed flow process of a board | substrate in the electronic component mounting system in embodiment of this invention. It is explanatory drawing which shows the state which the change of the board | substrate was completed in the electronic component mounting system in embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIG. 1, an electronic component mounting system 100 according to an embodiment of the present invention includes an upper unit 10 including a solder coating device and an electronic component mounting device therein, and a lower unit 30 including a reflow furnace therein. Yes. The upper unit 10 has a substrate supply port 11 for supplying a printed circuit board 50 for mounting electronic components, a substrate dispensing port 12 for delivering a mounted printed circuit board 60 on which both electronic components have been mounted, and each substrate 50. , 60 is provided with a pallet loading / unloading port 13 for supplying and discharging the pallet 70.

  As shown in FIG. 2, the upper unit 10 includes two rows of pallet conveying lines 19 for conveying the pallets 70 therein, and cream solder on the back surface B or the front surface A of the printed circuit board 50 placed on the pallets 70. The solder application devices 14 and 15 for applying the electronic components, the electronic component mounting devices 16 and 17 for mounting the electronic components on the back surface B or the front surface A of the printed circuit board 50 placed on the pallet 70, and the pallet 70 on the upper side. The lowering elevator 18 that lowers from the unit 10 to the lower unit 30, the lifting elevator 21 that raises the pallet 70 from the lower unit 30 to the upper unit 10, and the pallet 70, the printed circuit board 50, or the mounted printed circuit board 60 are held in place. A robot arm 20 to be moved is included.

  As shown in FIG. 3, the lower unit 30 includes a lowering elevator 18 that lowers the pallet 70 from the upper unit 10, a lifting elevator 21 that raises the pallet 70 to the upper unit 10, and two rows of pallet transports that transport the pallets 70 therein. It includes a line 32 and a reflow furnace 31 that heats the printed board 50 on which electronic components are mounted to melt the solder and then cools and solders the mounted electronic parts to the printed board 50.

  As shown in FIG. 2, the pallet conveyance line 19 of the upper unit 10 is arranged on both sides and the center, and between the linear guide rails 19 a to 19 c that guide the movement to the pallet 70, and the guide rails 19 a and 19 b, And drive mechanisms 19d and 19e which are arranged between the guide rails 19b and 19c and move the pallet 70. The guide rails 19a and 19b and the drive mechanism 19d constitute one transport line for transporting the pallet 70 on which the printed circuit board 50 is placed with the back surface B up. The guide rails 19b and 19c and the drive mechanism 19e Another transport line for transporting the pallet 70 on which the printed circuit board 50 is placed is configured. Therefore, the upper unit 10 includes two pallet transfer lines 19. Similarly, the pallet conveyance line 32 of the lower unit 30 is disposed on both sides and in the center, and between the linear guide rails 32a to 32c for guiding movement to the pallet 70, between the guide rails 32a and 32b, and the guide rails 32b, The drive mechanism 32d and 32e which are arrange | positioned between 32c and move the pallet 70 are included. The guide rails 32a and 32b and the drive mechanism 32d constitute one conveyance line for conveying the pallet 70 on which the printed circuit board 50 is placed with the back surface B up. The guide rails 32b and 32c and the drive mechanism 32e Another transport line for transporting the pallet 70 on which the printed circuit board 50 is placed is configured. Therefore, the lower unit 30 also includes two pallet transfer lines 32.

  The two pallet conveyance lines 19 of the upper unit 10 convey the pallet 70 from the side where the printed circuit board 50 and the pallet 70 are supplied, discharged or discharged to the lowering elevator 18, and the two pallet conveyance lines of the lower unit 30. The line 32 is configured to convey the pallet 70 from the descending elevator 18 toward the ascending elevator 21 side. The lift elevator 21 is disposed between the pallet loading / unloading port 13 and the upper and lower pallet transport lines 19 and 32. The descent elevator 18 is connected to each pallet by guide rails 18a to 18c arranged in series with the respective guide rails 19a to 19c and 32a to 32c constituting the pallet transport lines 19 and 32 of the upper and lower units 10 and 30. The pallet 70 is received from the conveying line 19 and moved up and down the guide rails 18a to 18c to lower the pallet 70 from the upper unit 10 to the lower unit 30, and the pallet 70 placed on the guide rails 18a to 18c is moved. Delivered to the pallet conveyance line 32 of the lower unit 30. Similarly, the lift elevator 21 has guide rails 21a to 21c arranged in series with the guide rails 19a to 19c and 32a to 32c constituting the pallet transport lines 19 and 32 of the upper and lower units 10 and 30, respectively. The pallet 70 is received from each pallet conveying line 32, and the guide rails 21a to 21c are moved up and down to raise the pallet 70 from the lower unit 30 to the upper unit 10. Further, the pallet 70 placed on the guide rails 21 a to 21 c at the raised position is transferred to the pallet transport line 19 of the upper unit 10.

  As shown in FIG. 2, the solder application device 14 for applying cream solder to the back surface B of the printed circuit board 50 and the solder application device 15 for applying cream solder to the surface A of the printed circuit board 50 are composed of two pallet conveying lines 19. The pallet 70 is arranged side by side in the conveying direction. However, the solder application ports of the solder application devices 14 and 15 are arranged so as to be between the guide rails 19a and 19b and the guide rails 19b and 19c, respectively. The electronic component mounting apparatus 16 that mounts electronic components on the back surface B of the printed circuit board 50 is disposed across the guide rails 19a and 19b, and the electronic component mounting apparatus 17 that mounts electronic components on the front surface A of the printed circuit board 50 is The guide rails 19b and 19c are arranged across the rails. That is, the electronic component mounting apparatuses 16 and 17 are arranged in parallel along the pallet transport line 19.

  As shown in FIG. 3, the reflow furnace 31 is arranged so as to straddle two pallet conveying lines 32 arranged in the lower unit 30. The interior of the reflow furnace 31 is divided into a plurality of furnace chambers having different heating temperatures, and a cooler that cools the printed circuit board 50 and hardens the molten solder is incorporated on the lift elevator 21 side (exit side of the reflow furnace 31). Yes.

  As shown in FIG. 4, the pallet 70 on which the printed circuit board 50 used in the electronic component mounting system 100 of the present embodiment is placed has guide rails 19 a to 19 c and 32 a shown in FIGS. The flat plate 71 is provided with a stepped portion 74 on which the peripheral edge of the printed circuit board 50 is placed, and the inside of the stepped portion 74 is an opening 73. . In the present embodiment, since the printed circuit board 50 is bilaterally symmetric, the printed circuit board 50 can be fitted into the stepped portion 74 shown in FIG. The opening 73 is sized so that the printed circuit board 50 can be placed so that the surface on which the electronic component is attached is on the lower side and the surface on which the electronic component is not attached is on the upper side.

  Next, with reference to FIGS. 5 to 8, a process of mounting electronic components on the printed circuit board 50 by the electronic component mounting system 100 configured as described above and fixing them with solder will be described.

  As shown in FIG. 5, a printed circuit board 50 with the back surface B facing upward is supplied into the upper unit 10 from the substrate supply port 11 of the upper unit 10 shown in FIG. 2. Further, the pallet 70 is carried into the upper unit 10 from the pallet loading / unloading port 13 shown in FIG. The pallet 70 carried into the upper unit 10 is placed on the guide rails 21 a and 21 b of the lift elevator 21 at the lift position by the robot arm 20. Then, the printed circuit board 50 is placed on the stepped portion 74 of the pallet 70 placed on the guide rails 21a and 21b with the back surface B facing upward.

  As shown in FIGS. 5 and 2, the pallet 70 on which the printed circuit board 50 is placed is applied with cream solder on the back surface B by the solder application device 14 while being conveyed by the pallet conveyance line 19. Thus, an electronic component is mounted on the back surface B. The printed circuit board 50 on which the electronic components are mounted on the back surface B is transferred from the pallet transfer line 19 to the lowering elevator 18 and is lowered from the upper unit 10 to the lower unit by the lowering elevator 18. The pallet 70 lowered to the lower unit 30 is transferred from the lowering elevator 18 to the pallet conveyance line 32 of the lower unit 30 and is conveyed by the pallet conveyance line 32 in the opposite direction to the pallet conveyance line 19 of the upper unit 10. Enter 31. When heated in the reflow furnace 31, the cream solder applied to the printed circuit board 50 melts and enters between the electronic component and the printed circuit board 50, and is cooled by a cooler disposed at the outlet of the reflow furnace 31. When the printed circuit board 50 is cooled, the melted solder is solidified and the electronic component is fixed to the back surface B of the printed circuit board 50. As shown in FIGS. 3 and 5, the pallet 70 that has exited the reflow furnace 31 is transferred to the lift elevator 21 and is lifted up to the upper unit 10 by the lift elevator 21.

  As shown in FIG. 5, the robot arm 20 grasps and inverts the printed circuit board 50 placed on the pallet 70 raised to the raised position, and the guide rails 21b, It is placed on another pallet 70 placed on 21c. The pallet 70 is transported toward the descending elevator 18 on another pallet transport line 19 parallel to the pallet transport line 19 that transports the printed circuit board 50 with the back surface B up, and the solder coating device 15 is transported during transport. By this, cream solder is applied to the surface A, and the electronic component is mounted by the electronic component mounting device 17. Then, it is lowered to the lower unit 30 by the lowering elevator 18 and enters the reflow furnace 31 by another pallet conveying line 32 of the lower unit 30. The printed circuit board 50 heated and cooled by the reflow furnace 31 and having the electronic component fixed to the surface A by the solder is raised to the raised position by the lift elevator 21.

  The printed circuit board 50 that has risen has been mounted with the electronic components on both the back surface B and the front surface A to form a mounted printed circuit board 60. The mounted printed circuit board 60 is carried out from the board dispensing port 12 of the upper unit 10 to the outside by the robot arm 20. As described above, the electronic component mounting system according to the present embodiment is configured so that the back surface B and the front surface A of the printed circuit board 50 are transported in parallel by the transport lines 19 and 32, and the electronic components are respectively disposed on the back surface B and the front surface A. Can be implemented.

  Next, a process of changing the printed board 50 on which the electronic component is mounted to another type of printed board 55 will be described with reference to FIG. About the apparatus similar to the apparatus demonstrated with reference to FIG. 5, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  Another type of printed circuit board 55 is conveyed by another type of pallet 75. The external dimensions of the pallet 75 are the same as those of the pallet 70, and the pallet 75 is transported, lifted and lowered by the pallet transport lines 19 and 32 and the lift and drop elevators 21 and 18. As shown in FIG. 6, another type of printed circuit board 55 is supplied to the upper unit 10 with the back surface C facing upward, and is placed on another type of pallet 75 by the robot arm 20. At that time, the pallet 70 on which the printed circuit board 50 that has been subjected to the mounting process is placed is positioned on the lowering elevator 18. In addition, the pallet 70 on which the surface A is placed upward remains on the pallet conveyance line 32 of the lower unit 30 and the pallet conveyance lines 19 and 32 for mounting electronic components on the surface A of the printed circuit board 50. .

  As shown in FIG. 7, the pallet transport line 19 transports another kind of pallet 75, and the solder coating device 14 and the electronic component mounting device 16 apply the cream solder and mount the electronic component on the back surface C. The elevator 18 is lowered to the lower unit 30 to pass through the reflow furnace 31, electronic components are mounted on the back surface C of another printed circuit board 55, and the pallet 75 is raised to the raised position by the lift elevator 21. Then, the printed circuit board 55 on which the electronic component has been mounted on the back surface C is reversed by the robot arm 20 and placed on another kind of pallet 75 placed on the lift elevator 21 with the front surface D facing up. The At this time, the pallet 70 on which the printed circuit board 50 that has been subjected to the mounting process is placed is placed on the descending elevator 18 that is arranged in series with the pallet transport line 19 for mounting the electronic component on the surface A. ing.

  As described above, in the state shown in FIG. 7, the electronic component of the electronic component is conveyed while being conveyed on the pallet conveying lines 19 and 32 in a state where the printed board 50 previously subjected to the mounting process and the next type printed board 55 are mixed. Implementation is done.

  When the mounting of the electronic components on the back surface B and the front surface A of all the printed circuit boards 50 that have been previously mounted is completed and is carried out to the outside as the mounted printed circuit board 60 from the circuit board discharge port 12, FIG. As shown in FIG. 4, the electronic component mounting system 100 is replaced with the next type of printed circuit board 55, and the next type of mounted printed circuit board 65 is carried out from the board discharge port 12.

  As described above, in the present embodiment, electronic components can be simultaneously mounted on a plurality of types of printed boards 50 and 55, and there is little loss for changing the type of substrate, and electronic components on a variety of substrates. Can be implemented efficiently.

  In the present embodiment, the reflow furnace 31 has been described as heating the back surface B and the front surface A in the same furnace chamber. However, the back surface B and the front surface A may be heated by separate furnace chambers. . Moreover, although this embodiment demonstrated as a structure containing the upper unit 10 containing the solder application apparatuses 14 and 15 and the electronic component mounting apparatuses 16 and 17, and the lower unit 30 containing the reflow furnace 31, it is on one plane. The solder application devices 14 and 15, the electronic component mounting devices 16 and 17, and the reflow furnace 31 may be arranged.

  DESCRIPTION OF SYMBOLS 10 Upper unit, 11 Substrate supply port, 12 Substrate discharge port, 13 Pallet loading / unloading port, 14, 15 Solder application device, 16, 17 Electronic component mounting device, 18 Descent elevator, 18a-18c, 19a-19c, 21a-21c, 32a-32c Guide rail, 19, 32 Pallet transfer line, 19d, 19e, 32d, 32e Drive mechanism, 20 Robot arm, 21 Lift elevator, 30 Lower unit, 31 Reflow furnace, 50, 55 Printed circuit board, 60, 65 Mounted Printed circuit board, 70, 75 pallet, 71 flat plate, 72 protrusion, 73 opening, 74 steps, 100 electronic component mounting system.

Claims (2)

An electronic component mounting system for mounting electronic components on both sides of a substrate,
A palette common opening in the base plate can be set in either orientation of face up or face down,
A plurality of configured pallet conveying line conveying direction of the pallet is opposite to the upper transport line and the lower conveyor line with one another,
Provided in each upper transfer line, and the solder coating apparatus for coating a cream solder on the surface or back surface of the base plate,
Provided each of the upper conveyor line downstream of I the coating apparatus, and an electronic component mounting apparatus for mounting electronic components on the surface or back surface of the base plate,
Provided each of the lower conveyor line, comprising: a reflow furnace electronic components heats the onboard board, and
Each upper conveyance line and each lower conveyance line includes a first guide rail for guiding a pallet,
The second guide is provided on the upstream side and the downstream side in the pallet transport direction of the upper and lower transport lines, respectively, and is in series with the first guide rail of the upper transport line and the first guide rail of the lower transport line. An elevator that moves the rail up and down;
The pallet is placed on each second guide rail of the elevator on the upstream side of each upper conveyance line, the pallet is taken out from above each second guide rail, and the second guide of one elevator A robot arm that takes out the substrate placed on the pallet on the rail, reverses it, and places it on the pallet on the second guide rail of the other elevator,
A first pallet on which a first substrate on which electronic components are mounted is mounted on the front surface or the back surface thereof, and a second pallet having an electronic component not mounted on either or both of the front surface and the back surface and having a different shape from the first substrate. a first pallet and shape different second pallet loaded with the substrate is conveyed in parallel by the pallet conveying line, and the solder coating device provided in each line, and each electronic component mounting apparatus, reflow Mounting electronic components on each surface of the first and second substrates by a furnace,
Electronic component mounting system characterized by A pallet the substrate to a common opening can be set to any direction of the face up or face down, a plurality of configured pallet conveying line conveying direction of the pallet is opposite to the upper transport line and the lower conveyor line with one another, provided in the upper conveyance line, the solder coating apparatus for applying a cream solder on the surface or back surface of the base plate, is provided in the upper conveyor line downstream of the I's coating apparatus, the electronic component on the surface or back surface of the base plate and the electronic component mounting apparatus for mounting, provided in the lower transport line, electronic components have a reflow furnace for heating the onboard board, each of the upper conveyor line and each of the lower conveyor line, each pallet The first guide rail of the upper conveyance line and the first guide rail of the lower conveyance line are arranged on the upstream and downstream sides of the upper and lower conveyance lines in the pallet conveyance direction. An elevator for moving the second guide rail in the vertical direction so as to be in series with each of the guide rails is provided, and placing the pallet on each second guide rail of the elevator on the upstream side of each upper conveyance line; The pallet is taken out from above each second guide rail, and the board placed on the pallet on the second guide rail of one elevator is taken out and turned over, and the second guide rail of the other elevator is placed on the second guide rail. an electronic component mounting method for mounting electronic components on both sides of a base plate by using the robot arm to place the pallet, the electronic component mounting system comprising,
A first pallet on which a first substrate on which electronic components are mounted is mounted on the front surface or the back surface thereof, and a second pallet having an electronic component not mounted on either or both of the front surface and the back surface and having a different shape from the first substrate. a first pallet and shape different second pallet loaded with the substrate is conveyed in parallel by the pallet conveying line, and the solder coating device provided in each line, and each electronic component mounting apparatus, reflow Mounting electronic components on each surface of the first and second substrates by a furnace,
An electronic component mounting method characterized by the above.

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