JP5750907B2 - Device for stabilizing the protrusion state of liquid material and method for stabilizing the protrusion state - Google Patents

Description

  The present invention places an electronic component on a weighed liquid material applied to a substrate, presses the electronic component toward the substrate, spreads the liquid material on the lower surface of the electronic component, and spreads the electronic material on the substrate. TECHNICAL FIELD The present invention relates to a liquid material protrusion state stabilization device and a protrusion state stabilization method for stabilizing the protrusion state of a liquid material that protrudes from between a substrate and an electronic component when mounting.

An electronic component such as an IC chip is placed on a measured liquid material applied to various substrates such as a lead frame, for example, an epoxy resin or cream solder, and a predetermined load is applied in advance. Electronic component mounting devices such as die bonders and mounters that already press the electronic component toward the substrate for a set time and spread the liquid material on the lower surface of the electronic component to mount the electronic component on the substrate are already known. is there.
At this time, it is preferable that the adhesive surface of the electronic component, that is, the entire lower surface is wet with the liquid material, and the liquid material is evenly protruded from the outer periphery of the electronic component. As a result, the wettability of the liquid material is deteriorated, and due to this, there is a disadvantage that quality defects such as peeling due to shear strength deterioration, deterioration of heat radiation performance, and package cracks are likely to occur.

  In order to cope with such quality defects, technological development has been made so far to stabilize the application amount and shape of the liquid material.

For example, in Patent Document 1, the liquid material applied on the substrate is imaged by the imaging means, the liquid material application area is calculated, and compared with a preset reference value of the application area, the difference is eliminated. Thus, there has been proposed a semiconductor manufacturing apparatus in which a dispenser for applying a liquid material is controlled to adjust the application amount of the liquid material.
However, this is to adjust the coating area of the liquid material in the stage before mounting the electronic component on the substrate. Therefore, when mounting the electronic component on the substrate, it protrudes from between the substrate and the electronic component. The protruding state of the liquid material cannot be predicted.
Further, the semiconductor manufacturing apparatus disclosed in Patent Document 1 is configured to control a dispenser that applies a liquid material by measuring the application area of the liquid material discharged on the substrate as it is and comparing it with a reference value. Therefore, when the viscosity change with time occurs in the liquid material, it is impossible to keep the application amount of the liquid material, that is, the volume constant. This is because if the viscosity of the liquid material is low, the liquid material easily spreads and the coating area increases. Conversely, if the viscosity of the liquid material is high, the liquid material does not spread easily and the coating area decreases. . In general, the viscosity of a liquid material increases with the passage of time, so if the application area is simply made constant, the amount of application of the liquid material should increase with the passage of time. Inconveniences such as excessive liquid material will occur when the is mounted.

Patent Document 2 proposes an inspection method in which a liquid material is applied on a substrate and an electronic component is mounted, and then the periphery of the electronic component is imaged to determine whether the liquid material spreads. ing.
However, this only determines whether the spread of the liquid material is good or not, and no adaptive control is performed to optimize the protrusion of the liquid material.

JP 2001-338938 A (paragraphs 0008,0027) JP2003-4660 (paragraphs 0005, 0028)

  The object of the present invention is to diversify the surface state and adhesion area of the substrate and electronic component, and even when the electronic component is mounted on the substrate even when the liquid material changes in viscosity over time. It is another object of the present invention to provide a liquid material protrusion state stabilization apparatus and a protrusion state stabilization method capable of stabilizing the protrusion state of a liquid material protruding from between a substrate and an electronic component.

In order to achieve the above object, the liquid material protrusion state stabilizing device of the present invention receives a supply of a weighed liquid material and an electronic component to be mounted on the substrate, and is applied to the substrate. An electronic component mounting means for mounting the electronic component on the substrate by placing the electronic component on the liquid material, pressing the electronic component toward the substrate, spreading the liquid material on the lower surface of the electronic component, and
An imaging means for capturing an image of an electronic component and its surroundings by imaging the electronic component that has been mounted by the electronic component mounting means and its surroundings; and
A protrusion information extracting means for extracting information for specifying the protrusion state of the liquid material that protrudes from between the substrate and the electronic component by capturing image data from the imaging means and performing image processing;
A protrusion information storage means for storing information for specifying the appropriate protrusion state of the liquid material;
Based on the information extracted by the protrusion information extracting means and the information stored in the protrusion information storage means, the electronic parts newly mounted by the electronic component mounting means and their surroundings are imaged by the imaging means. The pressing time of the electronic component in the electronic component mounting means is adjusted so that the degree of similarity between the information extracted by the protrusion information extracting means and the information stored in the protrusion information storage means increases. Load application time adjusting means, and in particular ,
The information includes the width of the liquid material protruding from between the substrate and the electronic component, and the width of the liquid material protruding from between the substrate and the electronic component. Consists of the section length of the outer periphery ,
The protrusion information storage means includes an allowable value of the maximum protrusion width of the liquid material and a maximum allowable value of the section length of the outer peripheral portion of the electronic component where the protrusion width of the liquid material is continuously zero. Is remembered ,
The protrusion information extracting means is configured such that the maximum protrusion width of the liquid material that protrudes between the substrate and the electronic component and the protrusion width of the liquid material that protrudes between the substrate and the electronic component are continuous. Extract the maximum value of the section length of the outer periphery of the electronic component that becomes zero ,
The load application time adjustment means is configured to provide an electronic component when the maximum value of the section length extracted by the protrusion information extraction means exceeds the maximum allowable length of the section length stored in the protrusion information storage means. While the pressing time of the electronic component in the mounting means is increased, the maximum protrusion width extracted by the protrusion information extraction means exceeds the allowable value of the maximum protrusion width stored in the protrusion information storage means. In some cases, the electronic component mounting unit is configured to adjust the electronic component pressing time so as to reduce the electronic component pressing time in the electronic component mounting unit .
Instead of the load application time adjusting means, based on the information extracted by the protrusion information extracting means and the information stored in the protrusion information storage means, an electronic component newly mounted by the electronic component mounting means, Electronic components mounted so that the amount of protrusion is appropriate from the information extracted by the protrusion information extracting means and the information stored in the protrusion information storage means when the surrounding situation is imaged by the imaging means And a mounting load adjusting means for adjusting the pressing load of the electronic component in the means.

The liquid material protrusion state stabilization method of the present invention places an electronic component on a weighed liquid material applied to a substrate, presses the electronic component against the substrate, and A liquid material protrusion state stabilization method that stabilizes the liquid material protrusion state that protrudes between the substrate and the electronic component when the liquid material is spread and mounted on the substrate. Yes, to achieve the same purpose as above,
After acquiring the image data of the electronic component and its surroundings by imaging the electronic component that has been mounted and its surroundings with the imaging means,
The maximum bite of the liquid material that protrudes between the substrate and the electronic component as information for specifying the state of the liquid material that protrudes between the substrate and the electronic component by performing image processing on the image data Extract the maximum value of the outer width of the electronic component where the protruding width and the protruding width of the liquid material protruding from between the substrate and the electronic component are continuously zero ,
When the maximum value of the extracted section length exceeds the maximum allowable value of the appropriate section length, the pressing time of the electronic component is increased, while the extracted maximum protrusion width is considered appropriate. The electronic component pressing time is adjusted so as to reduce the pressing time of the electronic component when the allowable value of the maximum protrusion width is exceeded .
Instead of the configuration characterized by adjusting the pressing time of the electronic component, newly based on the extracted protrusion information and information for specifying the appropriate liquid state protrusion state, The degree of similarity between the information extracted from the image data obtained by imaging the mounted electronic component and its surroundings, and the information for specifying the appropriate state of the liquid material protruding is increased. In addition, the electronic component pressing load is adjusted.

  The liquid material protrusion state stabilization device and the protrusion state stabilization method of the present invention are an electronic component that has been mounted and its surroundings imaged by an imaging means to After acquiring the image data, the image data is subjected to image processing to extract information for specifying the protruding state of the liquid material protruding from between the substrate and the electronic component. Information extracted from the image data obtained by imaging the newly mounted electronic component and its surroundings with the imaging means based on the information for specifying the protruding state of the liquid material to be carried out, and the above Since the pressing time or mounting load of the electronic component is adjusted so that the degree of similarity with the information for specifying the proper protruding state of the liquid material is increased, the surface state of the substrate or electronic component Diversified adhesive area Furthermore, even when the liquid material undergoes a change in viscosity over time, the liquid material protruding from between the substrate and the electronic component when mounting the electronic component on the substrate varies. Can be suppressed to stabilize the protruding state.

  In addition, as a result of automatically stabilizing the protruding state of the liquid material protruding from between the board and the electronic component, the setup work associated with changing the type of electronic component to be mounted or replacing the liquid material is performed. It can be simplified.

  In addition, the electronic component mounting means and the imaging means are equipped as standard in electronic component mounting apparatuses such as die bonders and mounters, and the protrusion information extracting means and load application time adjusting means are included in the control unit of the electronic component mounting apparatus. It can be configured with a microprocessor, and the protrusion information storage means can be constructed using a non-volatile memory used by the microprocessor provided in the control unit of the electronic component mounting device, so a new mechanism is added. There is no need to do so, and the protruding state stabilizing device and the protruding state stabilizing method can be introduced at low cost.

It is the functional block diagram which showed the outline of the structure of the protrusion state stabilization apparatus of one Embodiment of this invention. It is the schematic diagram which simplified and showed the structure of the electronic component mounting apparatus which mounted the protrusion state stabilization apparatus of the embodiment. The configuration of the controller for driving and controlling the board conveying means and dispenser of the electronic component mounting apparatus of the embodiment, and the electronic component mounting means and imaging means of the electronic component mounting apparatus and protrusion state stabilization device of the embodiment. It is the block diagram simplified and shown. 5 is a flowchart illustrating an outline of a configuration of a control program stored in a ROM of a control unit (first embodiment). It is a continuation of the flowchart which showed the outline of the structure of the control program (Embodiment 1). It is a continuation of the flowchart which showed the outline of the structure of the control program (Embodiment 1). It is a continuation of the flowchart which showed the outline of the structure of the control program (Embodiment 1). It is a continuation of the flowchart which showed the outline of the structure of the control program (Embodiment 1). It is the conceptual diagram which simplified and showed about the logical structure of the operation data storage table which functions as a protrusion information storage means and a reference | standard press time storage means (embodiment 1). Simplified logical configuration of an extracted data storage table that temporarily stores information for specifying the protruding state extracted by the protruding information extracting means in time series over the latest m mounting operations. (Embodiment 1). FIG. 11A is a conceptual diagram showing an example of a state of a liquid material protruding from between a substrate and an electronic component, and FIG. 11A is a plan view thereof, and FIG. 11B is a side view thereof (Embodiment 1). ). It is the flowchart which showed the outline of the structure of the control program preserve | saved in ROM of the control part of other embodiment (Embodiment 2). It is a continuation of the flowchart which showed the outline of the structure of the control program (Embodiment 2). It is a continuation of the flowchart which showed the outline of the structure of the control program (Embodiment 2). It is the conceptual diagram which simplified and showed about the logical structure of the operation data storage table which functions as a protrusion information storage means and a reference | standard press time storage means (embodiment 2). The maximum length, the maximum protrusion width, and the minimum protrusion of the outer peripheral section of the electronic component where the protrusion width of the liquid material that protrudes between the substrate and the electronic component by the actual mounting operation becomes zero continuously. FIG. 10 is a conceptual diagram showing a simplified logical configuration of an extracted data storage table used for obtaining a protrusion width (second embodiment). It is the conceptual diagram which showed an example of the state of the liquid material which protruded from between the board | substrate and the electronic components (Embodiment 2).

  Next, some examples of the mode for carrying out the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a functional block diagram showing an outline of a configuration of a protruding state stabilizing device 1 according to an embodiment.

  The protruding state stabilizing device 1 is supplied with a substrate such as a lead frame coated with a measured liquid material and electronic components to be mounted on the substrate, and a wafer is placed on the liquid material coated on the substrate. Place electronic components such as pellets, IC chips, resistors, capacitors, etc. cut out from the substrate, press the electronic components against the substrate with a preset load, and spread the liquid material on the lower surface of the electronic components on the substrate Electronic component mounting means A for mounting electronic components, and imaging means B for imaging the electronic components that have been mounted by the electronic component mounting means A and their surroundings to obtain image data of the electronic components and their surroundings The extraction information extracting unit extracts the information for specifying the protruding state of the liquid material protruding from between the substrate and the electronic component by taking the image data from the imaging unit B and performing image processing. C, The information extracted by the protrusion information extraction means C and the information extracted by the protrusion information extraction means C are stored in the protrusion information storage means D for storing information for specifying the protrusion state of the liquid material to be positive. Based on the stored information, the information extracted by the protrusion information extracting means C when the image pickup means B picks up the electronic component newly mounted by the electronic component mounting means A and its surroundings. Load application time adjusting means E for adjusting the pressing time of the electronic component in the electronic component mounting means A is provided so that the degree of similarity with the information stored in the protruding information storage means D increases.

  Further, the protruding state stabilizing device 1 further includes a reference pressing time storage unit F that stores a reference value of the pressing time of the electronic component in the electronic component mounting unit A for each type of electronic component, and a continuous electronic component. The final pressing time / type storage means G for storing the pressing time of the electronic component at the time when the mounting operation is completed and the type of the electronic component targeted for mounting at the time, and the final pressing time / Corresponding to the type of electronic component stored in the type storage means G, the reference value of the pressing time stored in the reference pressing time storage means F and the electronic component stored in the final pressing time / type storage means G Correction coefficient calculation means H for calculating a correction coefficient for pressing time based on the ratio to the pressing time, and stored in the reference pressing time storage means F corresponding to the type of electronic component that is newly mounted. A pressing time initial setting means for setting an initial value of the pressing time of the electronic component corresponding to the type of electronic component newly targeted for mounting by multiplying the reference value of the pressing time by the correction coefficient obtained by the correction coefficient calculating means H I.

  FIG. 2 is a schematic diagram showing a simplified configuration of the electronic component mounting device 2 on which the protruding state stabilizing device 1 is mounted.

  The main part of the electronic component mounting apparatus 2 includes a substrate transport unit 4 for transporting the substrate 3 such as a lead frame, and a liquid material 5 such as epoxy resin or cream solder on the substrate 3 at an upstream position of the substrate transport unit 4. It comprises a dispenser 6 for weighing and applying, an electronic component mounting means A and an imaging means B, and a control unit 7 (see FIG. 3) for driving and controlling these components. The electronic component mounting means A and the imaging means B are not only the components of the electronic component mounting device 2 but also the components of the protruding state stabilizing device 1.

  The substrate transport means 4 is constituted by, for example, a belt transport device using a servo motor M0 as a drive source, and the substrate 3 supplied from the outside is subjected to the liquid material application stage ST1 immediately below the dispenser 6, and then the electronic component mounting means A. Are sequentially sent to the electronic component mounting stage ST2 immediately below and the imaging stage ST3 immediately below the imaging means B.

  As described above, the electronic component mounting means A places the electronic component 8 on the substrate 3 on which the liquid material 5 measured by the dispenser 6 is applied, and places the electronic component 8 on the substrate 3 with a preset load. And the liquid material 5 is spread on the lower surface of the electronic component 8 to mount the electronic component 8 on the substrate 3.

  The electronic component mounting means A of this embodiment also functions as a handling robot for taking out one electronic component 8 from a pallet or magazine (not shown). A vacuum chuck 9 for holding the electronic component 8 by suction is provided. Provided at the lower end of the mounting head 10. The mounting head 10 is attached to a column (not shown) that holds the electronic component mounting means A. For example, the servo motors Mx, My, Mz, and Mθ are used as drive sources to move in the three orthogonal directions of the left, right, front, back, and top and bottom and the vertical axis. Rotation around is allowed. The rotation θ around the vertical axis realized by the servo motor Mθ is used for adjusting the attitude of the electronic component 8 relative to the substrate 3.

  The minimum function required for the mounting head 10 of the electronic component mounting means A is vertical movement, that is, a predetermined load applied to the electronic component 8 placed on the liquid material 5 applied to the substrate 3. In this configuration, the electronic component 8 is taken out from the pallet or magazine, the electronic component 8 is transferred to the vacuum chuck 9, and the liquid material is not provided in the configuration without the vacuum chuck 9. 5 may be entrusted to other handling robots, manipulators, etc., including the work of placing electronic component 8 on 5.

  The imaging means B is specifically constituted by the CCD camera 11 and the configuration of the dispenser 6 is already known.

  FIG. 3 is a block diagram showing a simplified configuration of the substrate transport unit 4 and the dispenser 6 of the electronic component mounting apparatus 2 and the control unit 7 that drives and controls the electronic component mounting unit A and the imaging unit B.

  The control unit 7 includes a servo motor M0 and a dispenser 6 of the substrate transport unit 4, a vacuum chuck 9 and servo motors Mx, My, Mz, and Mθ of the electronic component mounting unit A, and a CCD camera 11 that functions as the imaging unit B. A microprocessor 12 is provided for driving and controlling the components. The control unit 7 includes a ROM 13 that stores a control program of the microprocessor 12, a nonvolatile memory 14 that stores various parameters, setting values, and the like, and a RAM 15 that is used for temporary storage of calculation data. And an interface 16 for connecting to a cell controller (not shown) installed in the production factory and transmitting information to each other, and further, an operation for inputting a command related to changing the type of electronic component to be mounted, A manual operation panel 17 used for setting value input operations and the like, and a display 18 used for visual confirmation of setting values and alert display are provided.

  The servo motor M0 of the substrate transfer means 4 is driven and controlled by the microprocessor 12 via the input / output circuit 19 and the motor drive circuit 20, and the substrate 3 supplied to the substrate transfer means 4 is supplied to the liquid material immediately below the dispenser 6. The coating stage ST1, the electronic component mounting stage ST2 immediately below the electronic component mounting means A, and the imaging stage ST3 immediately below the imaging means B are sequentially sent. Positioning control of the substrate 3 with respect to the liquid material application stage ST1, the electronic component mounting stage ST2, and the imaging stage ST3 is performed by pulsing a movement command output from the microprocessor 12 to the motor drive circuit 20 based on a feedback signal from the pulse coder P0. This is done by adjusting the distribution process. The separation distance between the liquid material application stage ST1 and the electronic component mounting stage ST2 and the separation distance between the electronic component mounting stage ST2 and the imaging stage ST3 are equal.

Servo motors Mx, My, Mz, Mθ for driving the mounting head 10 of the electronic component mounting means A are driven and controlled by the microprocessor 12 via the input / output circuit 19 and the respective motor driving circuits 21, 22, 23, 24, The vacuum chuck 9 of the electronic component mounting means A is driven and controlled by the microprocessor 12 via the input / output circuit 19 and the chuck drive circuit 25.
The position of the mounting head 10 shown in FIG. 2 is the standby position of the mounting head 10, and the movement of the mounting head 10 from the standby position to the pallet or magazine is realized by cooperative control of the servo motors Mx, My, Mz. The operation of taking out the electronic component 8 from the magazine is realized by operating the vacuum chuck 9.
Similarly, the movement of the mounting head 10 from the pallet or magazine to the standby position is realized by cooperative control of the servo motors Mx, My, and Mz, and the attitude adjustment of the electronic component 8 with respect to the substrate 3 positioned on the electronic component mounting stage ST2 is performed. This is realized by rotating the vacuum chuck 9 around the vertical axis by the servo motor Mθ.
Further, the operation of placing the electronic component 8 on the liquid material 5 applied to the substrate 3 and pressing and mounting the electronic component 8 toward the substrate 3 with a preset load drives the servo motor Mz. This is realized by lowering the mounting head 10 from the standby position in FIG. The load when the electronic component 8 is pressed toward the substrate 3 is detected by the motor drive circuit 23 detecting the drive current of the servo motor Mz and fed back to the microprocessor 12, or the command position and the current position of the mounting head 10 The value of the error register for the motor drive circuit 23 that stores the positional deviation between and is easily obtained by feeding back to the microprocessor 12.
When the mounting operation of the electronic component 8 on the substrate 3 is finished, the operation of the vacuum chuck 9 is released, the servo motor Mz is driven, the mounting head 10 is raised, and the mounting head 10 is returned to the standby position shown in FIG. It is.
Servo motors Mx, My, Mz, and Mθ are controlled based on the movement commands for the X, Y, Z, and θ axes output by the pulse distribution processing of the microprocessor 12 and feedback signals from the pulse coders Px, Py, Pz, and Pθ. Is done. Movement of the mounting head 10 from the standby position to the pallet or magazine, removal of the electronic component 8 from the pallet or magazine by the operation of the vacuum chuck 9, movement of the mounting head 10 from the pallet or magazine to the standby position, electronic component to the substrate 3 In order to achieve this, the posture adjustment of 8, the mounting operation of the electronic component 8 by the lowering of the mounting head 10, the stoppage of the operation of the vacuum chuck 9 and the movement of the mounting head 10 to the standby position are fixed operation cycles. The control program is stored in the ROM 13 in advance.

  The CCD camera 11 functioning as the image pickup means B is connected to the microprocessor 12 via the input / output circuit 19, receives the image pickup command from the microprocessor 12, and the electronic component 8 that has finished mounting work by the electronic component mounting means A The surrounding situation is imaged on the imaging stage ST3, and the image data of the electronic component 8 and the surrounding situation is obtained.

  The dispenser 6 is driven and controlled by the microprocessor 12 through the input / output circuit 19 and the dispenser drive circuit 26, and measures the liquid material 5 in the hopper of the dispenser 6 and applies it to the substrate 3 on the liquid material application stage ST1.

  In this embodiment, the microprocessor 12 (see FIG. 3) of the control unit 7 in the electronic component mounting apparatus 2 is used as the protrusion information extracting means C and the load application time adjusting means E of the protrusion state stabilizing apparatus 1. , The correction coefficient calculating means H and the pressing time initial setting means I (see FIG. 1), and the non-volatile memory 14 (see FIG. 3) of the control unit 7 is protruded by the protruding state stabilizing device 1. It functions as information storage means D, reference pressing time storage means F, and final pressing time / type storage means G (see FIG. 1).

  A control program for causing the microprocessor 12 to function as the protrusion information extracting means C, the load application time adjusting means E, the correction coefficient calculating means H, and the pressing time initial setting means I is stored in the ROM 13 in advance.

  Next, a configuration in which the total area of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 is used as information for specifying the protruding state of the liquid material 5, and the eating of the liquid material 5 As the information for specifying the protruding state, the maximum protruding width and the maximum length of the section where the protruding width is continuously zero and the configuration in the case of using the minimum protruding width together, This configuration will be described more specifically.

Embodiment 1
First, an example of a configuration in the case where the total area of the liquid material 5 that protrudes between the substrate 3 and the electronic component 8 is used as information for specifying the protruding state of the liquid material 5 will be described.

  FIG. 9 shows a simplified logical configuration of the operation data storage table 27 constructed by using a part of the storage area of the nonvolatile memory 14 that functions as the protrusion information storage means D and the reference pressing time storage means F. It is a conceptual diagram. In the first embodiment, the operation data storage table 27 functions as the protrusion information storage means D and the reference pressing time storage means F in the protrusion state stabilization device 1.

  The operation data storage table 27 corresponds to each type of electronic component 8 having various sizes and shapes, that is, each of the component names Ai of the electronic component 8, and is a liquid that should protrude from between the substrate 3 and the electronic component 8. A reference value for the total area of the material 5 (hereinafter referred to as a protruding area reference value B (Ai)) and a reference value for the pressing time when the electronic component 8 is pressed against the substrate 3 (hereinafter referred to as a load application time reference value). t (Ai)).

  In the first embodiment, the appropriate protruding area reference value B (Ai) and the total area B of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation of the electronic component 8 ( The pressing time t of the electronic component 8 in the electronic component mounting means A is adjusted according to the ratio to the actual measurement value), but the size and the peripheral length of the electronic component 8 are extremely different depending on the type of the electronic component 8. In a simple proportional calculation, the adjustment amount of the pressing time t tends to be excessive when the electronic component 8 is small, and the adjustment amount of the pressing time t tends to be insufficient when the electronic component 8 is large. Therefore, in order to eliminate such inconvenience, an adjustment coefficient k (Ai) corresponding to the size and peripheral length of the electronic component 8 is further calculated, and the area reference value B (Ai) and the load application time reference value t (Ai) together with the part name Ai So that is stored in the use data storage table 27.

  Although it is desirable to experimentally determine the adjustment coefficient k (Ai) for each type of electronic component 8, in general, the adjustment coefficient k (Ai) has a relatively large value for a large-sized electronic component 8, and In the small electronic component 8, the value of the adjustment coefficient k (Ai) is relatively small.

Further, FIG. 10 shows information for specifying the protrusion state extracted by the protrusion information extraction means C, that is, the total area of the liquid material 5 actually protruded from between the substrate 3 and the electronic component 8. The logic of the extracted data storage table 28 that temporarily stores the relationship between the value of B and the actual pressing time t at the time of the mounting operation in time series over several recent mounting operations (for example, m times). It is the conceptual diagram simplified about the structure.
The extracted data storage table 28 is a table constructed using a part of the storage area of the RAM 15, and can be used for adjusting the pressing time t using statistical processing.

  4 to 8 are flowcharts showing an outline of the configuration of the control program stored in the ROM 13 of the control unit 7.

  Next, with reference to FIGS. 4-8, the specific operation | movement of the electronic component mounting apparatus 2 and the protrusion state stabilization apparatus 1 in Embodiment 1, a protrusion information extraction means C, a load application time adjustment means E, the processing operation of the microprocessor 12 of the control unit 7 functioning as the correction coefficient calculating means H and the pressing time initial setting means I and the protrusion state stabilization method will be described in detail.

  First, using the component names A1 to An registered in the operation data storage table 27, the type of the electronic component 8 to be mounted by the operator is input from the manual operation panel 17 to the CPU 12 of the control unit 7 (step S0).

  Then, the microprocessor 12 detects this operation, and designates a designated part name, that is, any one part name among A1 to An as a part name of the electronic part 8 to be mounted as a part name storage register. A is stored in A (step S1).

  Next, the microprocessor 12 accesses the final press time storage register Tp and the final type storage register Ap of the non-volatile memory 14 functioning as the final press time / type storage means G. It is determined whether the part name is stored (step S2).

  Here, if the determination result in step S2 is true and it is clear that some pressing time or component name is stored in the registers Tp, Ap, this electronic component mounting apparatus at a time before this. 2 means that some electronic component 8 has been mounted, and the microprocessor 12 further selects the component name A specified by the operator in the processing of step S0 and the mounting target in the previous mounting operation. It is determined whether or not the selected part name Ap matches (step S3).

When the determination result in step S3 is true, that is, when the part name A specified by the operator in the process of step S0 matches the part name Ap selected as the mounting target in the previous mounting operation. In that case, there is a high possibility that the mounting operation of the electronic component 8 with the component name Ap = A has been temporarily interrupted due to a malfunction of the production line.
Therefore, in this case, the microprocessor 12 reads from the final pressing time storage register Tp the value of the pressing time Tp of the electronic component 8 with the component name Ap = A optimized by the continuous mounting work performed immediately before. The value is set in the pressing time storage register t as it is as the initial value of the pressing time of the electronic component 8 with the component name A (step S5).

If the determination result in step S3 is false and the part name A specified by the operator in the process of step S0 does not match the part name Ap selected as the mounting target in the previous mounting operation. This means that the type of the electronic component 8 has been actively changed by the operator.
Therefore, in this case, the microprocessor 12 functioning as the correction coefficient calculation means H is stored in the operation data storage table 27 corresponding to the electronic component 8 with the component name Ap stored in the final type storage register Ap. The reference value of the pressing time, that is, the load application time reference value t (Ap) and the pressing time Tp of the electronic component 8 with the part name Ap stored in the final pressing time storage register Tp, that is, finally used at the time of the previous mounting operation A correction factor [Tp / t (Ap)] for the pressing time is calculated based on the ratio to the actual pressing time Tp, and a microprocessor 12 that functions as pressing time initial setting means I is newly installed. The reference value of the pressing time stored in the operation data storage table 27 corresponding to the electronic component 8 with the component name A selected as the target, that is, the load application time base Multiply the value t (A) by the correction coefficient [Tp / t (Ap)] obtained by the correction coefficient calculation means H, and the initial pressing time corresponding to the electronic component 8 of the part name A newly targeted for mounting The value [Tp / t (Ap)] · t (A) is calculated, and this value is set in the pressing time storage register t as an initial value of the pressing time suitable for the electronic component 8 of the component name A (step S4).

  The final pressing time Tp of the electronic component 8 with the component name Ap and the load application time reference of the electronic component 8 with the component name Ap optimized by the continuous mounting operation performed immediately before by the processing of step S4 or step S5. Since the correspondence relationship with the value t (Ap) is inherited as it is in the mounting operation of the electronic component 8 with the component name A newly set as the mounting target, the type of the electronic component 8 is changed Even so, in particular, there is a possibility that an appropriate pressing time t can be used from the initial stage of the start of the mounting operation, accurately responding to changes in the viscosity of the liquid material 5 over time, changes in environmental temperature, or humidity. Get higher. Therefore, the processing of step S4 and step S5 is effective for simplifying the setup work and speeding up the start-up of the mounting work.

  More specifically, for example, the final pressing time Tp in the continuous mounting work performed immediately before the viscosity of the liquid material 5 increases due to a change with time is longer than the load application time reference value t (Ap). If it has been increased, Tp / t (Ap)> 1, so that the initial value t of the pressing time is determined based on the load application time in consideration of the high viscosity of the liquid material 5 even in a newly started continuous mounting operation. It is possible to immediately start a continuous mounting operation that is set to a value larger than the value t (A) and copes with a high viscosity, and conversely, the viscosity of the liquid material 5 is increased by an increase in the environmental temperature. If the final pressing time Tp in the continuous mounting operation performed immediately before by the decrease is smaller than the load application time reference value t (Ap), Tp / t (Ap) <1. Even in the newly started continuous loading operation, the initial value t of the pressing time is set to a value smaller than the load application time reference value t (A) in consideration of the low viscosity of the liquid material 5 and the low viscosity is dealt with continuously. The loading operation can be started immediately.

  On the other hand, when the determination result of step S2 is false and it is determined that the pressing time and the component name are not stored in the registers Tp and Ap, the mounting operation of the electronic component 8 has not been performed at this time. This means that the registers Tp and Ap are positively reset by the operation of the manual operation panel 17 by the operator, so that the microprocessor 12 corresponds to the part name A designated in the process of step S0. The load application time reference value t (A) stored in the operation data storage table 27 is read, and this value is set as it is in the pressing time storage register t as the initial value of the pressing time of the electronic component 8 with the component name A. (Step S6).

  In the case where a new liquid material 5 is introduced into the hopper of the dispenser 6 and the mounting operation of the electronic component 8 is started, the liquid material 5 that has been used so far, that is, the viscosity change with time is strongly increased. Since there is a high possibility that a large viscosity change and a discontinuous viscosity change occur between the received liquid material 5 and the newly introduced liquid material 5, the operator sets the registers Tp and Ap by operating the manual operation panel 17. It is desirable to positively reset and set the load application time reference value t (A) that does not reflect past correction characteristics as the initial value of the press time in the press time storage register t.

  Next, the microprocessor 12 operates the dispenser 6 via the input / output circuit 19 and the dispenser drive circuit 26, and measures the liquid material 5 in the built-in hopper by the dispenser 6, and applies it to the substrate 3 on the liquid material application stage ST1. After that (step S7), the servo motor M0 is driven to operate the substrate transport means 4, thereby feeding the substrate 3 by one stage (step S8).

  At this point, the substrate 3 on the liquid material application stage ST1 coated with the liquid material 5 moves to the electronic component mounting stage ST2 directly below the electronic component mounting means A, and at the same time, a new substrate is placed on the liquid material application stage ST1. 3 is supplied. At this stage, the substrate 3 does not yet exist on the imaging stage ST3.

  Next, the microprocessor 12 operates the servo motors Mx, My, Mz of the respective axes of the electronic component mounting means A via the input / output circuit 19 and the motor drive circuits 21, 22, 23, so that the mounting head 10 is shown in FIG. It moves from the standby position as shown to the position of the pallet or magazine, and operates the vacuum chuck 9 of the mounting head 10 via the input / output circuit 19 and the chuck drive circuit 25 to pick up one electronic component 8 from the pallet or magazine. After being held by the vacuum chuck 9, the servo motors Mx, My, Mz are operated again to return the mounting head 10 to the standby position, and the servo motor Mθ is operated via the input / output circuit 19 and the motor drive circuit 24. Then, the posture of the electronic component 8 with respect to the substrate 3 on the electronic component mounting stage ST2 is corrected by rotating the vacuum chuck 9 (steps). Flop S9).

  Next, the microprocessor 12 starts a pulse distribution process for the servo motor Mz that drives the mounting head 10 in the vertical direction to lower the mounting head 10 at a very low speed (step S10), and drives the servo motor Mz drive current or motor drive circuit. 23 is referred to (step S11), and it is determined whether or not the drive current or the error value has reached a value corresponding to a preset pressing force (step S12).

  If the determination result in step S12 is false and the drive current or error value does not reach a value corresponding to a preset pressing force, the lower surface of the electronic component 8 held by the vacuum chuck 9 is on the electronic component mounting stage ST2. This means that the liquid material 5 applied to the substrate 3 is not reached, or the lower surface of the electronic component 8 reaches the liquid material 5 but sufficient pressing force is not applied. The processor 12 continues the pulse distribution process for the servo motor Mz as it is, and repeatedly executes the drive current and error value reference process and the determination process (steps S11 to S12).

  When the lower surface of the electronic component 8 held by the vacuum chuck 9 comes into contact with the liquid material 5 applied to the substrate 3 on the electronic component mounting stage ST2 and the drive resistance of the servo motor Mz increases, the servo motor Mz is driven. The current and the value of the error register for the motor drive circuit 23 are gradually increased.

  Finally, the determination result in step S12 becomes true, and the drive current and error value of the servo motor Mz reach a value corresponding to a preset pressing force, that is, the electronic component 8 held by the vacuum chuck 9 When it is confirmed that the lower surface is pressed against the liquid material 5 of the substrate 3 on the electronic component mounting stage ST2 with a preset pressing force, the microprocessor 12 stops the pulse distribution process for the servo motor Mz ( Step S13), the timer T for measuring the actual pressing time of the electronic component 8 is restarted, and the process of measuring the pressing time of the electronic component 8 is started (step S14).

  Next, the microprocessor 12 determines whether or not the actual pressing time T of the electronic component 8 has reached the pressing time t set in the pressing time storage register t, that is, the target value t (step S15).

  If the determination result in step S15 is true, that is, if the actual pressing time T has not reached the pressing time t, which is the target value, the lower surface of the electronic component 8 is applied to the liquid material 5 with a constant force. Since it is necessary to continue pressing, the microprocessor 12 again refers to the drive current of the servo motor Mz or the value of the error register for the motor drive circuit 23 (step S16), and the drive current or the error value is set to a predetermined pressing force. (Step S17), and if the drive current or error value does not match a value corresponding to a preset pressing force, the drive current or error value is set in advance. While the pulse distribution process for the servo motor Mz is executed in a direction that matches the value corresponding to the pressed pressure (step S18), the drive current and error value are If it matches the value corresponding to the set pressing force, the lower surface of the electronic component 8 held by the vacuum chuck 9 is always maintained by maintaining the drive current and error value of the servo motor Mz as they are. Then, it is pressed against the liquid material 5 of the substrate 3 on the electronic component mounting stage ST2 with a preset pressing force.

  Therefore, for example, if the drive current or the error value does not reach a value corresponding to a preset pressing force, the pulse distribution process in the direction in which the servo motor Mz is driven to lower the mounting head 10 is the process in step S18. If the drive current or error value exceeds the value corresponding to the preset pressing force, the pulse distribution process in the direction of driving the servo motor Mz to raise the mounting head 10 is performed in step S18. Will be executed.

  During this time, the liquid material 5 pressed on the lower surface of the electronic component 8 is gradually spread on the substrate 3, and the drive current and error value of the servo motor Mz are maintained at values corresponding to the preset pressing force. As the liquid material 5 is flattened, the mounting head 10 is lowered.

  Finally, the determination result in step S15 becomes false, and the lower surface of the electronic component 8 is continuously pressed against the liquid material 5 with a preset pressing force over the pressing time t set in the pressing time storage register t. If confirmed, the microprocessor 12 releases the operation of the vacuum chuck 9, executes the pulse distribution processing for the servo motor Mz that drives the mounting head 10 in the vertical direction, raises the mounting head 10 and waits. Returning to the position (step S19), the dispenser 6 is operated via the input / output circuit 19 and the dispenser driving circuit 26, and the liquid material 5 in the built-in hopper is measured by the dispenser 6 to the substrate 3 on the liquid material application stage ST1. Applying (step S20), driving the servo motor M0 and operating the substrate transport means 4 to the substrate 3 Multiplied by the feed of the stage minute (step S21).

  At this point, the substrate 3 that has finished mounting the electronic component 8 by the electronic component mounting means A moves from the electronic component mounting stage ST2 to the imaging stage ST3, and the liquid material application stage ST1 to which the liquid material 5 has been newly applied. The upper substrate 3 moves to the electronic component mounting stage ST2 immediately below the electronic component mounting means A, and a new substrate 3 is supplied onto the liquid material application stage ST1.

  Next, the microprocessor 12 performs the same processing as in steps S9 to S19 described above, thereby picking up one electronic component 8 from the pallet or magazine and holding it on the vacuum chuck 9 of the electronic component mounting means A ( In step S22), the mounting head 10 in the standby position is lowered and the lower surface of the electronic component 8 newly picked up with the pressing force set in advance over the pressing time t set in the pressing time storage register t is applied to the liquid material 5. (Step S23 to step S31), the mounting head 10 is raised and returned to the initial standby position (step S32).

  Next, the microprocessor 12 outputs an imaging command to the CCD camera 11 functioning as the imaging means B via the input / output circuit 19, and at this time, the mounting operation by the electronic component mounting means A is finished and the position is set on the imaging stage ST3. The electronic component 8 mounted on the substrate 3 to be moved, that is, the electronic component 8 mounted on the substrate 3 moved from the electronic component mounting stage ST2 to the imaging stage ST3 in the process of step S21 described above, and its surroundings are imaged by the CCD camera 11 and electronic. The image data of the component 8 and its surrounding situation is acquired, and this image data is temporarily stored in the data storage area of the RAM 15 functioning as a frame memory (step S33).

  Then, the microprocessor 12 functioning as the protrusion information extracting means C applies a grayscale shading process and an edge extraction process to the image data, and the liquid material 5 protruding from between the substrate 3 and the electronic component 8 is obtained. After obtaining the contour (steps S34 to S35), counting the number of pixels in the contour (step S34 to step S36), and further adding 1 to the counted number of pixels based on the imaging magnification and the area of one pixel of the CCD. Information for specifying the protruding state of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by performing image processing that multiplies the actual area corresponding to the pixels, that is, the substrate 3 and the electronic component The total area B of the liquid material 5 that actually protrudes between 8 is obtained (step S37).

  An example of the state of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 is shown in the plan view of FIG. 11A and the side view of FIG.

  Next, the microprocessor 12 extracts in time series the relationship between the value of the total protrusion area B extracted by the latest m mounting operations and the actual pressing time t at that time. , And shift and move all data stored at addresses 1 to m in the extracted data storage table 28 by one address toward the lower address (step S38), and then move to the address m which is the final address. Then, the total area B obtained in the process of step S37 is stored in association with the current value t of the pressing time storage register t corresponding to the total area B (step S39).

  Next, the microprocessor 12 newly performs one mounting operation by incrementing the value of the execution count counter C that counts the number of executions of the mounting operation after the start of the continuous mounting operation. (Step S40) and whether or not the current value of the counter C has reached the storable number m of data in the extracted data storage table 28, that is, already obtained m times in the extracted data storage table 28. It is determined whether or not the value of the total protrusion area B and the actual pressing time t at that time are stored (step S41).

  If the determination result in step S41 is false and it is clear that m times of loading work data is not stored in the extracted data storage table 28, statistical processing is used because of insufficient data at this time. This means that it is difficult to adjust the pressing time, and the microprocessor 12 functioning as the load application time adjusting means E corresponds to the operation data corresponding to the electronic component 8 of the component name A that is currently mounted. The values of the protruding area reference value B (A) and the adjustment coefficient k (A) stored in the storage table 27 are read (step S43), and the protruding area reference value B (A) and the actual protruding area are read out. The ratio [B (A) / B] with the total area B is obtained, and the ratio [B (A) to the pressing time t applied at this time, that is, the pressing time t currently stored in the pressing time storage register t. B] and the adjustment factor k (A) are multiplied to obtain a pressing time value [[B (A) / B] · k (A) · t]] that seems to be more appropriate, and this value is stored in the pressing time storage register. Update to t and store (step S44).

  Therefore, the actual total protrusion area B of the liquid material 5 extracted by the protrusion information extraction means C is the protrusion area reference value B (A of the liquid material 5 stored in the protrusion information storage means D. [B (A) / B]> 1, the correction in the direction of increasing the pressing time t of the electronic component 8 in the electronic component mounting means A is applied, while the protrusion information extracting means When the actual total area B of the liquid material 5 extracted by C exceeds the standard area B (A) of the liquid material 5 stored in the information storage means D [ B (A) / B] <1, and correction of the direction in which the pressing time t of the electronic component 8 in the electronic component mounting means A is reduced is applied. The total protrusion area B is stored in the protrusion information storage means D. Protruding area reference value of the liquid material 5 B (A) that is going to converge towards the optimum value.

  In the first embodiment, the total area of the liquid material 5 that protrudes from between the substrate 3 and the electronic component 8 functions as information for specifying the protrusion state. The correction in step S44 for converging the total area B toward the protrusion area reference value B (A) is the information extracted by the protrusion information extraction means C and the information stored in the protrusion information storage means D. Correction to increase the degree of similarity with the electronic component, more specifically, the total protruding area of the liquid material 5 in the electronic component 8 newly mounted by the electronic component mounting means A is an ideal protruding area reference value This corresponds to the correction of the direction approaching B (A).

  If the determination result in step S41 is true and it is clear that m times of loading work data is stored in the extracted data storage table 28, the pressing time can be adjusted using statistical processing. Therefore, the microprocessor 12 further stores the current protrusion total area Bm stored in the mth address of the extracted data storage table 28 and the m−1th address of the extracted data storage table 28. Compared with the previous total area Bm-1 (which may be the average of B1 to Bm-1), the current total area Bm is a single value, that is, an abnormally large value or abnormally. It is determined whether or not the value is a small value (step S42).

  If the determination result in step S42 is false and it is clear that the value is not a single value, the microprocessor 12 functioning as the load application time adjustment means E performs steps S43 to S43 in the same manner as described above. The process of S44 is executed, and the protruding area reference value B (A) and the adjustment coefficient k stored in the operation data storage table 27 corresponding to the electronic component 8 with the component name A that is currently mounted are stored. The correction process based on (A) and the actual actual protruding area B and the current value of the pressing time storage register t is executed.

On the other hand, when the determination result in step S42 is true and it is clear that the value is a single value, the actual actual total area B of the current projection, which is a single value, is used as it is. When the correction process is executed, there is a high possibility that an appropriate correction process will not be performed. Therefore, the microprocessor 11 determines the actual amount of actual protrusion stored in the first to m-1th addresses of the extracted data storage table 28. By performing statistical processing using the areas B1 to Bm-1 and the pressing times t1 to tm-1 corresponding to each of the areas B1 to Bm-1, a pressing time value t that seems to be more appropriate is obtained, and this value is stored as the pressing time. The register t is updated and stored (step S45).
As statistical processing for removing the influence of abnormal data extracted in a single shot, for example, a method using an average value, standard deviation, or the like is already known.

  Next, the microprocessor 12 determines whether or not the current value of the execution count counter C that counts the number of executions of the mounting work after the start of the continuous mounting work has reached the planned production number N (step). S46).

  If the current value of the counter C has not reached the planned production number N, the microprocessor 12 operates the dispenser 6 via the input / output circuit 19 and the dispenser driving circuit 26, and the dispenser 6 causes the liquid material in the built-in hopper to be activated. 5 is weighed and applied to the substrate 3 on the liquid material application stage ST1 (step S47).

  At this time, the substrate 3 newly coated with the liquid material 5 is positioned on the liquid material application stage ST1, and the electronic component mounting means A is still mounted on the electronic component mounting stage ST2. The substrate 3 that has not been left is left as it is, and the substrate 3 that has been subjected to the extraction processing of the actual total area B by the CCD camera 11 and the information extraction means C is left as it is on the imaging stage ST3. It becomes.

  Next, the microprocessor 12 repeatedly executes the same processing as in steps S22 to S32 described above, thereby picking up one electronic component 8 from the pallet or magazine and holding it on the vacuum chuck 9 of the electronic component mounting means A. Then, the mounting head 10 at the standby position is lowered and the lower surface of the newly picked-up electronic component 8 is pressed against the liquid material 5 with a preset pressing force over the pressing time t set in the pressing time storage register t. Thereafter, the mounting head 10 is raised and returned to the initial standby position (step S48), and the substrate conveying means 4 is operated by driving the servo motor M0 to feed the substrate 3 by one stage. (Step S49).

  At this point, the substrate 3 on which the electronic component 8 has been mounted by the electronic component mounting means A moves from the electronic component mounting stage ST2 to the imaging stage ST3, and the liquid material 5 is already applied on the liquid material application stage ST1. The substrate 3 moves to the electronic component mounting stage ST2 directly below the electronic component mounting means A, and a new substrate 3 is supplied onto the liquid material application stage ST1.

  Next, the microprocessor 12 repeatedly executes the same processing as in Steps S33 to S45 described above, thereby actually protruding the substrate 3 newly moved to the imaging stage ST3 by the CCD camera 11 and the information extraction means C. Extraction processing of the total area B, registration processing of the current values of the total area B and the pressing time t in the extraction data storage table 28, correction of the pressing time t, and update of the corrected pressing time t to the pressing time storage register t The storing process and the count-up process of the execution count counter C are executed (step S50).

  At this time, the substrate 3 to which the liquid material 5 is not applied is positioned on the liquid material application stage ST1, and the electronic component mounting means A is still mounted on the electronic component mounting stage ST2. A substrate 3 that has not been extracted, and the substrate 3 that has been subjected to the extraction processing of the actual total area B by the CCD camera 11 and the information extraction means C is left on the imaging stage ST3. Become.

  Next, the microprocessor 12 determines again whether or not the current value of the execution count counter C that counts the number of executions of the mounting work has reached the planned production number N (step S46).

  If the current value of the counter C has not reached the planned production number N, the microprocessor 12 operates the dispenser 6 via the input / output circuit 19 and the dispenser driving circuit 26, and the dispenser 6 causes the liquid material in the built-in hopper to be activated. 5 is weighed and applied to the substrate 3 on the liquid material application stage ST1 (step S47).

  At this time, the substrate 3 newly coated with the liquid material 5 is positioned on the liquid material application stage ST1, and the electronic component mounting means A is still mounted on the electronic component mounting stage ST2. The substrate 3 that has not been left is left as it is, and the substrate 3 that has been subjected to the extraction processing of the actual total area B by the CCD camera 11 and the information extraction means C is left as it is on the imaging stage ST3. It becomes.

  Since this situation is exactly the same as when the determination result in step S46 is first true and the process in step S47 is executed, steps S48, S49, S50, and step S50 are performed in the same manner as described above. By repeating the processes of S46, S47, S48,..., It is possible to continue the work of continuously mounting the electronic component 8.

  During this time, since the value of the pressing time storage register t is also continuously corrected, the actual total protrusion area B is the protrusion area reference value of the liquid material 5 stored in the protrusion information storage means D. B (A), that is, it will surely converge toward the optimum value.

  In particular, in the first embodiment, when an abnormal value is extracted as the actual total area B of protrusion, an inappropriate correction process is prevented from being performed by using a statistical process. Therefore, even when various disturbances, for example, measurement failures in the dispenser 6 occur, excessive correction is not applied to the pressing time t, and the liquid material 5 is maintained in a stable protruding state. Therefore, it is possible to efficiently eliminate the waste of quality improvement and defect occurrence.

  Further, as described above, the final pressing time Tp of the electronic component 8 with the component name Ap optimized by the continuous mounting operation performed immediately before and the load application time reference value t of the electronic component 8 with the component name Ap. This is a case where the type of electronic component 8 is changed because the correspondence relationship with (Ap) can be handed over to the mounting operation of electronic component 8 of component name A newly targeted for mounting. However, it is possible to use an appropriate pressing time t from the initial stage of starting the mounting work, and it is possible to simplify the setup work and speed up the mounting work.

  And while repeating the process of step S46-step S50 and continuing the continuous mounting operation | work of the electronic component 8, the determination result of step S46 becomes false and the present value of the execution frequency counter C which counts the execution frequency of mounting operation | work Is confirmed to have reached the planned production number N, the microprocessor 12 repeats the same processes as in steps S22 to S32 described above without operating the dispenser 6, thereby removing 1 from the pallet or magazine. One electronic component 8 is picked up and held on the vacuum chuck 9 of the electronic component mounting means A, and the mounting head 10 in the standby position is lowered and set in advance for the pressing time t set in the pressing time storage register t. The lower surface of the electronic component 8 newly picked up by the pressing force is pressed against the liquid material 5 so that the electronic component 8 is mounted on the electronic component. After mounting on the substrate 3 on the stage ST2, the mounting head 10 is raised and returned to the initial standby position (step S51), and the electronic that has been targeted for mounting in the final type storage register Ap in the current continuous mounting operation. The part name A of the part 8 is stored, and the final pressing time t value optimized in the continuous mounting operation corresponding to the part name A, that is, the current value of the pressing time storage register t is stored as the final pressing time. The value is stored in the register Tp, the value of the execution count counter C is reset to 0, and all the processes are finished (step S52).

Here, as an example, a configuration example in which the protruding area reference value B (Ai) is set and registered in the operation data storage table 27 by user processing has been described, but the size and adhesion of the electronic component 8 are described. When the shape of the protrusion is easily determined by an empirical rule or a physical law without depending on the state of the surface, the state of the liquid material 5, etc., the protrusion area reference value B (Ai) is determined by the microprocessor. 12 may be calculated.
For example, if the size of the electronic component 8 is a 3 mm square and the appropriate protrusion width is 0.5 mm, the peripheral length of the electronic component 8 is 12 millimeters. For example, if 0.5 millimeter is multiplied, the protrusion area reference value B (Ai) can be obtained as 6 square millimeters.

[Embodiment 2]
Next, as the information for specifying the protruding state of the liquid material 5, the maximum protruding width and the maximum value of the section length where the protruding width is continuously zero and the minimum protruding width are used in combination. An example of the configuration of the case will be described.

  FIG. 15 shows a simplified logical configuration of the operation data storage table 27 ′ constructed by using a part of the storage area of the nonvolatile memory 14 functioning as the protrusion information storage means D and the reference pressing time storage means F. It is a conceptual diagram. In the second embodiment, the operation data storage table 27 ′ functions as the protrusion information storage means D and the reference pressing time storage means F in the protrusion state stabilization device 1.

  The operation data storage table 27 ′ is a liquid that protrudes from between the substrate 3 and the electronic component 8 in correspondence with the types of electronic components 8 having various sizes and shapes, that is, the component names Ai of the electronic components 8. The maximum allowable value of the section length of the outer peripheral portion of the electronic component 8 where the protrusion width of the material 5 is continuously zero (hereinafter referred to as the protrusion zero length allowable value L1 (Ai)), the substrate 3 and The allowable value of the maximum protrusion width of the liquid material 5 protruding from between the electronic components 8 (hereinafter referred to as the maximum protrusion width allowable value L2 (Ai)), and the protrusions from between the substrate 3 and the electronic component 8 This is a table for storing an appropriate value of the minimum protrusion width of the liquid material 5 to be discharged (hereinafter referred to as the minimum protrusion width appropriate value L3 (Ai)), and when the electronic component 8 is pressed toward the substrate 3 The reference value of the pressing time (hereinafter referred to as the load application time reference value t (Ai)) is stored. There.

  In the second embodiment, the section length of the outer peripheral portion of the electronic component 8 in which the protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation of the electronic component 8 is continuously zero. Maximum value L1max. Exceeds the allowable zero length L1 (Ai), and the maximum protrusion width L2max. Of the liquid material 5 that protrudes from between the substrate 3 and the electronic component 8 by the actual mounting operation. If the maximum protrusion width allowable value L2 (Ai) is not exceeded, the protrusion zero length allowable value L1 (Ai) and the electronic component 8 in which the protrusion width is actually zero continuously. The maximum value L1max. The pressing time t of the electronic component 8 is adjusted according to the ratio to the actual maximum protrusion width L2max. Exceeds the maximum protrusion width allowable value L2 (Ai), and the maximum value L1max. Of the section length of the outer peripheral portion of the electronic component 8 where the protrusion width is actually zero continuously. Is not greater than the allowable zero protrusion length L1 (Ai), the maximum allowable protrusion width L2 (Ai) and the actual maximum protrusion width L2max. The pressing time t of the electronic component 8 is adjusted in accordance with the ratio to the maximum length L1max. Of the section length of the outer peripheral portion of the electronic component 8 where the protrusion width is actually zero. Does not exceed the allowable zero protrusion length L1 (Ai), and the actual maximum protrusion width L2max. If the maximum protrusion width allowable value L2 (Ai) is not exceeded, the minimum protrusion width appropriate value L3 (Ai) and the liquid that protrudes from between the substrate 3 and the electronic component 8 by the actual mounting operation. Minimum protrusion width of material 5 L3 min. The pressing time t of the electronic component 8 is adjusted in accordance with the deviation from the above. However, if the size and the peripheral length of the electronic component 8 are extremely different depending on the type of the electronic component 8, a simple proportional calculation has a small size. In the case of the electronic component 8, the adjustment amount of the pressing time t tends to be excessive, and in the case of the large-sized electronic component 8, the adjustment amount of the pressing time t tends to be insufficient. In order to solve the problem, the adjustment coefficient k ′ (Ai) corresponding to the size and the peripheral length of the electronic component 8 is further protruded, and the zero protrusion allowable length L1 (Ai), the maximum protrusion width allowable value L2 (Ai), Along with the minimum protrusion width appropriate value L3 (Ai) and the load application time reference value t (Ai), it is stored in the operation data storage table 27 ′ in association with the part name Ai.

Although it is desirable to experimentally determine the adjustment coefficient k ′ (Ai) for each type of the electronic component 8, in general, the value of the adjustment coefficient k ′ (Ai) is relatively large for a large-sized electronic component 8. In addition, in the small-sized electronic component 8, the value of the adjustment coefficient k ′ (Ai) is relatively small.

  FIG. 16 shows the section length of the outer peripheral portion of the electronic component 8 in which the protrusion width of the liquid material 5 that protrudes from between the substrate 3 and the electronic component 8 by the actual mounting operation of the electronic component 8 becomes zero continuously. Maximum value L1max. And the maximum protrusion width L2max. Of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation of the electronic component 8. , And the minimum protrusion width L3min. Of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation of the electronic component 8. It is the conceptual diagram which simplified and showed the logical structure of the extraction data storage table 28 'utilized in order to obtain | require. The extracted data storage table 28 ′ is constructed using a part of the storage area of the RAM 15.

  12 to 14 are flowcharts showing an outline of the configuration of the control program stored in the ROM 13 of the control unit 7.

  Next, with reference to FIGS. 12-14, the specific operation | movement of the electronic component mounting apparatus 2 and the protrusion state stabilization apparatus 1 in Embodiment 2, the protrusion information extraction means C, a load application time adjustment means The processing operation of the microprocessor 12 of the control unit 7 functioning as E and the protruding state stabilization method will be described in detail.

  The overall processing operation of the electronic component mounting apparatus 2 and the processing operations of the correction coefficient calculation means H and the pressing time initial setting means I are the same as the processing in steps S0 to S32 and steps S46 to S52 of the first embodiment described above. Therefore, only the parts different from the first embodiment, that is, the processes of step T1 to step T36 instead of step S33 to step S45 of the first embodiment will be specifically described.

  In the same manner as in the first embodiment, the substrate 3 on which the electronic component 8 has been mounted by the electronic component mounting means A is moved from the electronic component mounting stage ST2 to the imaging stage ST3, and the liquid material 5 is newly applied. The substrate 3 on the material application stage ST1 is moved to the electronic component mounting stage ST2 immediately below the electronic component mounting means A, and a new substrate 3 is supplied onto the liquid material application stage ST1, and the base on the electronic component mounting stage ST2 The microprocessor 12 that has finished the work of mounting the electronic components on 3 (see Steps S0 to S32) outputs an imaging command to the CCD camera 11 functioning as the imaging means B via the input / output circuit 19, and at this point in time. The electronic component 8 mounted on the substrate 3 positioned on the imaging stage ST3 after mounting by the electronic component mounting means A and its periphery The situation by imaging by the CCD camera 11 acquires the image data of its surrounding conditions and the electronic components 8, temporarily stored in the data storage area of the RAM15 functioning the image data as a frame memory (step T1).

  Then, the microprocessor 12 functioning as the protrusion information extracting means C applies a grayscale shading process and an edge extraction process to the image data, and the liquid material 5 protruding from between the substrate 3 and the electronic component 8 is obtained. The contour is obtained (step T2 to step T3).

  An example of the state of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 is shown in FIG.

  Next, the microprocessor 12 functioning as the protrusion information extracting means C once clears the extracted data storage table 28 '(step T4), and specifies an address specifying index for specifying the data storage address in the extracted data storage table 28'. After initializing the value of i to 0 (step T5), the value of the index i is incremented by 1 again (step T6).

  Then, the microprocessor 12 functioning as the protrusion information extracting means C extracts one pixel forming the contour image of the electronic component 8 obtained by the edge extraction process, and the board 3 and the electronic component 8 are extracted. The number of pixels V corresponding to the protrusion width of the liquid material 5 protruding from the space is obtained in a direction orthogonal to the side of the electronic component 8 including the extracted point (step T7), and this value is specified as an address. The data is stored in the data storage area at the i-th address in the extracted data storage table 28 ′ according to the current value of the index i (step T8).

  Next, the microprocessor 12 functioning as the protrusion information extraction means C extracts pixels for each point forming the contour image of the electronic component 8 and pixels corresponding to the protrusion width corresponding to these points. It is determined whether or not the operation for obtaining the number V has been performed once along the contour of the electronic component 8 (step T9).

  In the case where the determination result in step T9 is false, that is, the extraction of pixels for each point forming the contour image of the electronic component 8 and the operation for obtaining the number V of pixels corresponding thereto are still in progress of the electronic component 8. When it is clear that the processing is not performed in a round along the contour, the microprocessor 12 functioning as the protrusion information extracting unit C repeatedly executes the same processing as described above, and the address identification index i. The pixel forming the contour image of the electronic component 8 is extracted one by one along the contour of the electronic component 8 while incrementing the value of the extracted data storage table 28 specified by the current value of the index i. The value of the number of pixels V corresponding to the protrusion width of the liquid material 5 is successively stored in the data storage area of the i-th address (step T6 to step T9).

  The determination process of step T9 related to whether or not the extraction of the pixels for each point and the operation for obtaining the number of pixels V corresponding to the extraction is performed once along the contour of the electronic component 8 is performed by the first extracted 1 This can be realized by determining whether or not a point has been extracted again.

  Finally, it is confirmed that the determination result in step T9 is true, and that the extraction of the pixels for each point and the operation for obtaining the number of pixels V corresponding to this are performed around the contour of the electronic component 8. Then, the microprocessor 12 functioning as the protrusion information extracting means C stores the current value of the address identification index i, that is, the total number of pixel number data corresponding to the protrusion width in the data number storage register j. (Step T10).

As shown in FIG. 2, in this embodiment, since the liquid material 5 is applied so as to intersect along the diagonal direction of the electronic component 8, the liquid material is formed at the corner portion of the electronic component 8. 5 may be insufficient, that is, the actual protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 at the corner of the electronic component 8 may be zero. If there is a portion that is low and the protrusion width of the liquid material 5 that actually protrudes from between the substrate 3 and the electronic component 8 is zero, it can be any of the four sides of the electronic component 8. In particular, there is a high possibility of being near the center of any side.
For this reason, in the second embodiment, the maximum value L1max. Of the section length of the outer peripheral portion of the electronic component 8 where the protruding width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 is continuously zero. Therefore, the first pixel of one point (one point corresponding to i = 1) forming the contour image of the electronic component 8 obtained by the edge extraction process is a corner portion in the contour of the electronic component 8. For example, it is extracted from P1 in FIG. 17, and the value of the number of pixels V is continuously stored on the extracted data storage table 28 ′ for at least each of the four sides.
However, when the liquid material 5 is not applied along the diagonal direction of the electronic component 8, that is, the liquid material 5 that actually protrudes from between the substrate 3 and the electronic component 8 also at the corner portion of the electronic component 8. When there is a possibility that the width becomes zero, when the section length of the outer peripheral portion of the electronic component 8 where the protrusion width of the liquid material 5 is continuously zero is extracted by the same method as described above, i = The pixel number V1 representing the protrusion width corresponding to the first point Q1 corresponding to 1 is located at the head on the extracted data storage table 28 ', while the bite corresponding to the last point Qj corresponding to i = j. As a result, the pixel number Vj representing the extraction width is located at the end on the extracted data storage table 28 ', and even if both the pixel number V1 and the pixel number Vj become zero, the protrusion width is zero at the points Q1 and Qj. There are cases where the continuity of That.
Therefore, in such a case, the result of the determination in step T9 is true, and the extraction of the pixels for each point and the operation for obtaining the number of pixels V corresponding thereto are completed along the contour of the electronic component 8. After confirming that this has been done, the distance along the contour of the electronic component 8 protrudes from the start point Q1 by the number of pixels reaching the length corresponding to the zero length allowable value L1 (A). Further, it is assumed that data of the number of pixels V corresponding to the actual protrusion width is extracted and stored in the extracted data storage table 28 ′.

  Next, the microprocessor 12 functioning as the protrusion information extracting means C initializes the value of the address specifying index i for specifying the data storage address in the extracted data storage table 28 'to 0 again, and the electronic component 8 The section length of the outer peripheral portion of the electronic component 8 where the protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation is continuously zero is counted for each section. The section-specific protrusion zero length count counters C1 to Cx are all initialized to 0, and at the same time, the counter specific index n for specifying the section-specific protrusion zero length count counter to be used is initialized to Set the value 1. In addition, a value 0 indicating that the protrusion width is not zero is set as an initial value in the protrusion zero length detection flag F (step T11).

  Next, the microprocessor 12 functioning as the protrusion information extraction means C calculates the number of pixels corresponding to the maximum protrusion width of the liquid material 5 that protrudes between the substrate 3 and the electronic component 8 by the actual mounting operation. The maximum value storage register Vmax. Is set to 0 as an initial value, and is used to extract the number of pixels corresponding to the minimum protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation. Minimum value storage register Vmin. Is set to the maximum settable value as an initial value (step T12).

  Then, the microprocessor 12 functioning as the protrusion information extracting means C increments the value of the address identification index i by 1 (step T13), and based on the current value of the index i, the microprocessor 12 of the extracted data storage table 28 ′ The value of the pixel number Vi corresponding to the protrusion width of the liquid material 5 protruding from the data storage area of the i address at the position of the point Qi on the contour from between the substrate 3 and the electronic component 8 is read (step T14). ), The value of the number of pixels Vi is the maximum value storage register Vmax. Is exceeded (step T15), and the maximum value storage register Vmax. The value of the pixel number Vi is updated and stored (step T16), otherwise the maximum value storage register Vmax. The current value of is kept as it is.

  Further, the microprocessor 12 functioning as the protrusion information extracting means C has a value of the number of pixels Vi of the minimum value storage register Vmin. (Step T17), and only if the current value is lower than the current value of the minimum value storage register Vmin. The value of the number of pixels Vi is updated and stored (step T18). Otherwise, the minimum value storage register Vmin. The current value of is kept as it is.

  Next, the microprocessor 12 functioning as the protrusion information extracting means C determines whether or not the value of the pixel number Vi is 0, that is, the actual protrusion width of the liquid material 5 at the position of the point Qi on the contour. Is determined to be 0 (step T19).

  If the value of the pixel number Vi is a value other than 0 and it is clear that the liquid material 5 is protruding in some form at the position of the point Qi on the contour, the protrusion information extracting means C The microprocessor 12 functioning as follows further determines whether or not the protrusion zero length detection flag F has already been set at this time, that is, the detection state where the protrusion width becomes zero has already been detected at this time. It is determined whether or not it has occurred (step T22).

  If the protrusion zero length detection in-progress flag F is not set and the determination result in step T22 is false, there is no detection state in which the protrusion width is zero at the present time. The microprocessor 12 functioning as the information extracting means C determines whether or not the current value of the address specifying index i has reached the total number j of pixel number data in the extracted data storage table 28 '(step T25). If not, after proceeding to the process of step T13 again and incrementing the value of the index i, the same processing operation as described above is repeatedly executed, and the maximum value among the number of pixels V stored in the extracted data storage table 28 ′ Storage register Vmax. The number V of pixels having a value exceeding the current value of the maximum value storage register Vmax. Of the number V of pixels stored in the extracted data storage table 28 '. The number V of pixels having a value lower than the current value of the minimum value storage register Vmin. Only the processing operation such as newly storing the data is repeatedly executed.

  On the other hand, the value of the pixel number Vi corresponding to the protrusion width of the liquid material 5 at the position of the point Qi on the image forming the contour of the electronic component 8 is true when the determination result in step T19 is true. If it becomes clear, the microprocessor 12 functioning as the protrusion information extraction means C determines the section-specific protrusion zero length count counter Cn to be used based on the current value of the counter specific index n. By selecting and incrementing the value of the selected section-by-section projection zero length count counter Cn by 1, the section of the outer peripheral portion of the electronic component 8 where the projection width of the liquid material 5 is continuously zero is obtained. The fact that the length has been increased by an amount equivalent to one pixel is stored (step T20). Then, the microprocessor 12 stores the fact that the detection situation in which the protrusion width becomes zero has started or is continuing by setting the protrusion zero length detection flag F to 1 (step S1). T21).

  As long as the detection state where the protrusion width becomes zero continues, that is, as long as the protrusion zero length detection flag F is set, the value of the counter specific index n remains unchanged. As long as 0 continues to be detected as the value of the number of pixels Vi corresponding to, the processing of step T19 to step T21 is repeatedly executed, and the same section-extruded zero length count counter Cn as used so far The value will continue to be incremented sequentially.

  In addition, when a detection situation in which the protrusion width does not become zero after the detection situation in which the protrusion width becomes zero occurs once again, the determination result in step T19 becomes false and it has been used until then. The increment processing of the section-specific zero-length counting counter Cn ends.

  Then, the microprocessor 12 functioning as the protrusion information extracting means C executes a process for determining whether or not the protrusion zero length detection flag F is set (step T22). In this case, since the protrusion zero length detection flag F remains set, the determination result in step T22 is true, and the microprocessor 12 functioning as the protrusion information extraction means C is used. When a detection situation occurs in which the protrusion width becomes zero again by incrementing the value of the counter specifying index n for specifying the power-specific protrusion zero length counting counter, the new section In step T23, a section-specific zero length counting counter Cn for counting the number of pixels corresponding to the continuous length where the protrusion width becomes zero is designated again.Next, the microprocessor 12 stores the fact that the detection state in which the protrusion width becomes zero is once canceled by resetting the protrusion zero length detection flag F (step T24).

  Therefore, when the detection situation in which the protrusion width becomes zero starts to occur again, another counter different from the section-specific protrusion zero length count counter Cn used so far, that is, increment. The number of pixels corresponding to the length of a new section in which the protrusion width continuously becomes zero is counted by another section protrusion zero length count counter Cn specified by the value of n. It will be.

Until the current value of the address identification index i reaches the total number j of the pixel number data in the extracted data storage table 28 ′, the above-described processing of Step T13 to Step T25 is repeatedly executed. As a result, the maximum value storage register Vmax. Stores the value of the number of pixels corresponding to the maximum protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation of the electronic component 8, while the minimum value storage register Vmin. The value of the number of pixels corresponding to the minimum protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation of the electronic component 8 is stored.
In addition, each of the section-specific zero length counting counters C1, C2, C3,..., Cn has a protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8. The section length of the outer peripheral portion of the electronic component 8 that is continuously zero is stored by the value of the number of pixels for each section.

  Next, the microprocessor 12 functioning as the protrusion information extracting means C obtains a counter that stores the maximum number of pixels among the section-specific protrusion zero length count counters C1, C2, C3,. (Step T26).

Then, the microprocessor 12 functioning as the protrusion information extracting means C has one pixel in the value of the section-specific protrusion zero length count counter having the maximum value based on the photographing magnification and the length of one pixel of the CCD. The protrusion width, which is one of information for specifying the protrusion state of the liquid material 5 that protrudes from between the substrate 3 and the electronic component 8 by performing image processing that multiplies the actual length by a considerable amount. Is the maximum value L1max. Of the section length of the outer peripheral portion of the electronic component 8 where the value is continuously zero. And the maximum value storage register Vmax. And the minimum value storage register Vmin. Further information for specifying the protruding state of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by performing the same process as described above on the number of pixels stored in A certain maximum protrusion width L2max. And minimum protrusion width L3 min. Is obtained (step T27).
In the example of FIG. 17, a section where the protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 is continuously zero is one in the left side portion of the contour image of the electronic component 8. Therefore, the section-based protrusion zero length count counter actually used is only one of the section-specific protrusion zero length count counter C1.

  Next, the microprocessor 12 functioning as the load application time adjusting means E corresponds to the electronic component 8 with the component name A that is currently mounted, and the protrusion zero stored in the operation data storage table 27 'is stored. Read each value of allowable length L1 (A), maximum protrusion width allowable value L2 (A), minimum protrusion width appropriate value L3 (A), adjustment coefficient k ′ (A) (step T28), First, the maximum section length of the outer peripheral portion of the electronic component 8 in which the protruding width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation of the electronic component 8 becomes zero continuously. Value L1max. Is greater than the protrusion zero length allowable value L1 (A) (step T29), and the maximum section length L1max. Is larger than the allowable zero length L1 (A), the maximum protrusion width L2max. Of the liquid material 5 that protrudes from between the substrate 3 and the electronic component 8 by the actual mounting operation. Is determined not to exceed the maximum protrusion width allowable value L2 (A) (step T30).

  Here, when the determination result in step T30 is true, that is, an electron in which the protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation is continuously zero. The maximum value L1max. Exceeds the allowable zero length L1 (A), and the maximum protrusion width L2max. Of the liquid material 5 that protrudes from between the substrate 3 and the electronic component 8 by the actual mounting operation. If the maximum protrusion width allowable value L2 (A) is not exceeded, the microprocessor 12 functioning as the load application time adjusting means E is located between the board 3 and the electronic component 8 by the actual mounting operation. The maximum value L1max. Of the section length of the outer peripheral portion of the electronic component 8 where the protrusion width of the liquid material 5 that protrudes becomes zero continuously. And the protrusion zero length allowable value L1 (A) [L1max. / L1 (A)], and the ratio [L1max. / L1 (A)] and the adjustment coefficient k '(A), the value of the pressing time [[L1max. / L1 (A)] · k ′ (A) · t] is obtained, and this value is updated and stored in the pressing time storage register t (step T31).

  In this case, L1max. > L1 (A), so [[L1max. / L1 (A)]> 1, and correction in the direction of increasing the pressing time t that has been applied to the electronic component 8 having the component name A until then is performed.

When the electronic component 8 is mounted on the substrate 3, the problem is that the liquid material 5 is insufficiently protruded, in particular, a gap between the electronic component 8 and the substrate 3 is generated due to poor filling of the liquid material 5, and the top, bottom, left, or right In other words, unevenness in the direction occurs, a defect occurs in the subsequent wire bonding operation, or the electronic component 8 is peeled off due to insufficient shear strength. Further, the mold resin is sealed in a later process. In the product, there is a possibility that a mold material enters the gap and stress is generated due to the difference in thermal expansion, leading to a serious quality defect such as chip crack or package crack.
In the second embodiment, in particular, the section length of the outer peripheral portion of the electronic component 8 in which the protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation is continuously zero. Maximum value L1max. Exceeds the allowable zero length L1 (A), that is, when there is a possibility that a gap is generated between the electronic component 8 and the substrate 3 due to poor filling of the liquid material 5, the electronic component 8 Since the correction in the direction in which the pressing time t is increased is performed, even when the viscosity of the liquid material 5 is increased due to a change with time or the like, the liquid material 5 is surely expanded to be electronic. It is possible to eliminate the gap between the component 8 and the substrate 3 and prevent various inconveniences caused by the defective gap.

  On the other hand, the determination result in step T29 is false, and the outer periphery of the electronic component 8 in which the protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation becomes zero continuously. Maximum section length L1max. , The microprocessor 12 functioning as the load application time adjusting means E further performs the substrate 3 by an actual mounting operation when it is clear that the protrusion does not exceed the allowable zero length L1 (A). And the maximum protrusion width L2max. Of the liquid material 5 protruding from between the electronic components 8. Is determined to exceed the maximum protrusion width allowable value L2 (A) (step T33).

  Here, when the determination result in step T33 is true, that is, the maximum protrusion width L2max. Exceeds the maximum protrusion width allowable value L2 (A), and the maximum length L1max. Of the section length of the outer peripheral portion of the electronic component 8 where the protrusion width of the liquid material 5 is continuously zero. , The microprocessor 12 functioning as the load application time adjusting means E determines the maximum protrusion width allowable value L2 (A) and the maximum protrusion. Protrusion width L2max. [L2 (A) / L2max. ] And the ratio [L2 (A) / L2max.] To the pressing time t applied at this time, that is, the pressing time t currently stored in the pressing time storage register t. ] And the adjustment coefficient k ′ (A), the value of the pressing time that seems to be more appropriate [[L2 (A) / L2max. ] K '(A) .t] is obtained, and this value is updated and stored in the pressing time storage register t (step T34).

  In this case, L2max. > L2 (A), so [L2 (A) / L2max. ] <1, and correction in a direction to reduce the pressing time t that has been applied to the electronic component 8 having the component name A is performed.

  Thus, the maximum protrusion width L2max. Is more than the maximum protrusion width allowable value L2 (A), that is, when the liquid material 5 tends to protrude excessively, particularly when the liquid material 5 is cream solder or the like. Although there is a concern about a short circuit between the electronic component 8 mounted at this time and another electronic component or wiring, in the second embodiment, the actual maximum protrusion width L2max. Since the correction in the direction of decreasing the pressing time t of the electronic component 8 is performed on the basis of the relationship between the maximum protrusion width allowable value L2 (A) and the liquid material 5 is specified from the electronic component 8. Even when a phenomenon occurs that protrudes in a biased direction, the maximum protrusion width L2max. Therefore, short circuit with other electronic components or wirings can be surely prevented.

  On the other hand, the determination result of step T33 is false, and the maximum protrusion width L2max. Is not exceeding the maximum protrusion width allowable value L2 (A), that is, the section length of the outer peripheral portion of the electronic component 8 where the protrusion width of the liquid material 5 is continuously zero. Maximum value L1max. Does not exceed the allowable zero protrusion length L1 (A), and the maximum protrusion width L2max. If it is clear that the maximum protrusion width allowable value L2 (A) has not been exceeded, the microprocessor 12 functioning as the load application time adjusting means E is further connected to the substrate 3 by the actual mounting operation. The minimum protrusion width L3min. Of the liquid material 5 protruding from between the electronic components 8 is obtained. Is determined whether or not the minimum protrusion width appropriate value L3 (A) has been reached (step T35), and only when it has not reached the minimum protrusion width appropriate value L3 (A) and the minimum protrusion width Width L3 min. [L3 (A) -L3min. ] Obtained by multiplying this deviation by the adjustment coefficient k ′ (A) [L3 (A) −L3min. K ′ (A) is added to the pressing time t applied at this time, that is, the pressing time t currently stored in the pressing time storage register t, and the value of the pressing time that seems to be more appropriate [t + [L3 (A) -L3min. K ′ (A)] is obtained, and this value is updated and stored in the pressing time storage register t (step T36).

  In this case, [L3 (A) -L3min. ]> 0, and the correction in the direction of increasing the pressing time t that has been applied to the electronic component 8 having the component name A until then is performed.

The maximum value L1max. Of the section length of the outer peripheral portion of the electronic component 8 where the protrusion width of the liquid material 5 is continuously zero. Does not exceed the allowable zero protrusion length L1 (A), and the maximum protrusion width L2max. If the maximum allowable protrusion width L2 (A) is not exceeded, problems such as poor filling of the liquid material 5 and excessive protrusion should not occur. Minimum protrusion width L3 min. Is increased, the pressing time t is increased so that the minimum protrusion width L3min. By correcting the pressing time t of the electronic component 8 in such a direction as to approach the minimum protrusion width appropriate value L3 (A), it becomes possible to obtain a more appropriate protrusion width.
In the second embodiment, in particular, considering the general characteristic that the viscosity of the liquid material 5 increases with time and the protrusion width gradually decreases, the minimum protrusion width L3 min. Is corrected so as to increase the pressing time t of the electronic component 8.

If the determination result in step T30 is false, the protrusion width of the liquid material 5 that protrudes from between the substrate 3 and the electronic component 8 by the actual mounting operation becomes zero continuously. The maximum value L1max. Of the section length of the outer peripheral portion of the electronic component 8 is obtained. Exceeds the allowable zero length L1 (A) (see step T29), and the maximum protrusion width of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 by the actual mounting operation. L2max. Means that the maximum protrusion width allowable value L2 (A) is exceeded.
However, the maximum section length L1max. Exceeds the zero length allowable value L1 (A) because the pressing time t of the electronic component 8 is relatively short compared to the conditions such as the viscosity of the liquid material 5, and the maximum bite. Out width L2max. Is exceeding the maximum protrusion width allowable value L2 (A) because the pressing time t of the electronic component 8 is relatively excessive as compared with the conditions such as the viscosity of the liquid material 5, basically, The situation in which the determination result in step T29 is true and the situation in which the determination result in step T30 is false are in a trade-off relationship, and the determination result in step T30 is never false.
If the determination result in step T30 is false, the liquid material 5 is moved in a specific direction from the electronic component 8 because the application position of the liquid material 5 on the substrate 3 and the application shape of the liquid material 5 are abnormal. Whether it is unevenly protruding, or a section where the protruding width of the liquid material 5 is continuously zero in a specific portion of the outer peripheral portion of the electronic component 8 continues for a long time, or is considered to be mounted. Means that there is a problem in setting the allowable zero protrusion length L1 (Ai) and the maximum protrusion width allowable value L2 (Ai) related to the electronic component 8, and these are naturally This is not a problem that can be solved only by adjusting the pressing time t of the electronic component 8 in the mounting means A. In this case, the microprocessor 12 does not perform special correction processing related to the pressing time t, and the setup or setting is abnormal. Indicating Executing only the process of displaying over preparative the display 18 (step T32).

  After the processing related to the correction of the pressing time t of the electronic component 8 is performed in this way, the processing corresponding to step S46 to step S52 is continuously performed in the same manner as in the first embodiment described above. become. However, in this case, the process corresponding to step S50 is not the process of step S33 to step S45 but the process of step T1 to step T36.

[Embodiment 3]
In Embodiment 1 and Embodiment 2 described above, the pressing state t of the electronic component 8 in the electronic component mounting means A is adjusted to optimize the protruding state of the liquid material 5. In place of time t, the pressure of the electronic component 8 in the electronic component mounting means A, that is, the load of pressing the electronic component 8 against the substrate 3 is adjusted to optimize the protruding state of the liquid material 5. It is also possible to deal with.

  In that case, the pressing time t of the electronic component 8 is set to a fixed value, and the same processing as described above (the processing from step S33 to step S45 in the first embodiment / the processing from step T1 to step T36 in the second embodiment). When a determination result that requires correction for increasing the pressing time t is obtained, correction in the direction in which the pressing force of the electronic component 8 in the electronic component mounting means A is increased is performed (processing in place of step S44 in the first embodiment). / Processing in place of step T31 and step T36 of the second embodiment) On the contrary, when a determination result that requires correction for reducing the pressing time t is obtained, the electronic component mounting means A performs electronic processing. Correction of the direction in which the pressing force of the component 8 is reduced (processing in place of step S44 in the first embodiment / process in place of step T31 and step T34 in the second embodiment) is performed. It will be Unisuru.

  In the configuration for adjusting the pressing time t of the electronic component 8 in the electronic component mounting means A and the configuration for adjusting the pressing force of the electronic component 8 in the electronic component mounting means A, the load applied to the electronic component and the electronic component mounting means A There are differences in restrictions on the drive system mechanism.

First, if only the pressing time t is adjusted, the correction when increasing the protrusion of the liquid material 5, that is, when the pressing time t is increased, the cycle time, which is the electronic component mounting work time, is increased. There is a risk that the target production volume cannot be realized in time. On the other hand, in the configuration for adjusting the pressing force of the electronic component 8, the cycle time does not change because the pressing time t is constant, but the correction for increasing the protrusion of the liquid material 5, that is, the pressing force is not changed. When the correction in the increasing direction is performed, the load per unit time acting on the electronic component 8 increases, and if the electronic component 8 is a very thin chip or is fragile like GaAs, the electronic component 8 is deformed. There is also a risk of damage.
Further, in the configuration for adjusting the pressing force of the electronic component 8, as shown in FIGS. 2 and 3, a servo motor capable of strictly controlling the driving torque is used as a source of pressing force so as to make the mounting load variable. Although there is no particular problem when the electronic component mounting apparatus 2 is used, an electronic component that obtains a substantially constant pressing force by interposing an elastic body such as a spring between the mounting head 10 and the vacuum chuck 9. In the case of a mounting device, it is not always easy to finely adjust the force with which the vacuum chuck 9 presses the electronic component 8, and even if such adjustment is possible, load detection means such as a load cell. Need to be newly provided.

  In other words, whether to adopt a configuration that adjusts only the pressing time t or a configuration that adjusts the pressing force depends on the load resistance performance of the electronic component 8, the emphasis on productivity, and the mechanical configuration of the electronic component mounting device. And decide.

  Regardless of which of the first embodiment, the second embodiment, and the third embodiment described above is applied, the information extracted by the protrusion information extraction means C and the protrusion information storage means D are stored. Based on the information, the information extracted by the protrusion information extracting means C when the image pickup means B images the electronic component 8 newly mounted by the electronic component mounting means A and its surroundings, and the protrusion. Electrons so that the degree of similarity with the information stored in the information storage means D is increased, that is, the difference between the actual protruding state and the ideal protruding state of the liquid material 5 is eliminated. Since the pressing time t of the electronic component 8 in the component mounting means A and the pressing force of the electronic component 8 in the electronic component mounting means A are adjusted, the board 3 and the electronic component 8 can be separated from the above-mentioned differences in merits and demerits. Surface condition and adhesion in Appropriately copes with diversification of product and viscosity change of liquid material 5 over time to stabilize the protruding state of liquid material 5 and achieve almost the same effect on improvement of product quality and yield. Moreover, as a result of automatically stabilizing the protruding state of the liquid material 5, it is possible to change the type of the electronic component 8 to be mounted, change the liquid material 5, etc. Simplification is also achieved.

Among these, the most reliable stabilization of the protruding state of the liquid material 5 is the configuration and method by adjusting the pressing time t or adjusting the pressing force shown in the second embodiment. As described above, in the first embodiment, the protruding state of the liquid material 5 is grasped by the size of a simple protruding area, whereas in the second embodiment, the protruding state of the liquid material 5 is changed to an electronic component. 8 and the maximum value L1max. Of the section length of the outer peripheral portion of the electronic component 8 where the protrusion width of the liquid material 5 is continuously zero. (Essential information related to the presence or absence of a gap between the electronic component 8 and the substrate 3 that may also lead to chip cracks or package cracks) or the maximum eclipse of the liquid material 5 protruding from between the substrate 3 and the electronic component 8 Protrusion width L2max. (Significant information that may also cause a short circuit with other electronic components or wiring) is specifically extracted, and the minimum protrusion width L3min. This is because the adjustment of the pressing time t or the adjustment of the pressing force is performed in such a direction as to approach the minimum protrusion width appropriate value L3 (Ai).
The configuration of the second embodiment is particularly effective for the substrate 3 and the electronic component 8 that may be biased in the protrusion of the liquid material 5 in a specific portion of the outer peripheral portion of the electronic component 8.

  Further, the electronic component mounting means A and the imaging means B are equipment that is normally provided in the electronic component mounting apparatus 2 such as a die bonder or mounter, and the protrusion information extracting means C and the load application time adjusting means E are electronic component mounting apparatuses. 2, and the protrusion information storage means D uses a nonvolatile memory 14 used by the microprocessor 12 provided in the control unit 7 of the electronic component mounting apparatus 2. Since it can be constructed, the projecting state stabilization device 1 and the projecting state stabilization method can be introduced at a low cost without adding a new mechanism. It is an effect.

  A part or all of the embodiment disclosed above can be appropriately expressed by the description shown in the following supplementary notes, but the form for carrying out the invention and the technical idea of the invention are not limited to these. Absent.

[Appendix 1]
Receives a substrate coated with a weighed liquid material and an electronic component to be mounted on the substrate, places the electronic component on the liquid material coated on the substrate, and places the electronic component on the substrate with a preset load. An electronic component mounting means that presses toward the electronic component and spreads the liquid material on the lower surface of the electronic component to mount the electronic component on the substrate;
An imaging means for capturing an image of an electronic component and its surroundings by imaging the electronic component that has been mounted by the electronic component mounting means and its surroundings; and
A protrusion information extracting means for extracting information for specifying the protrusion state of the liquid material that protrudes from between the substrate and the electronic component by capturing image data from the imaging means and performing image processing;
A protrusion information storage means for storing information for specifying the appropriate protrusion state of the liquid material;
Based on the information extracted by the protrusion information extracting means and the information stored in the protrusion information storage means, the electronic parts newly mounted by the electronic component mounting means and their surroundings are imaged by the imaging means. The pressing time of the electronic component in the electronic component mounting means is adjusted so that the degree of similarity between the information extracted by the protrusion information extracting means and the information stored in the protrusion information storage means increases. An apparatus for stabilizing a protrusion state of a liquid material, characterized by comprising a load application time adjusting means.

[Appendix 2]
The information is constituted by the total area of the liquid material protruding from between the substrate and the electronic component,
The protrusion information storage means stores a reference value of the total area of the liquid material that protrudes from between the substrate and the electronic component,
The protrusion information extracting means extracts the total area of the liquid material protruding from between the substrate and the electronic component,
The load application time adjusting means is an electronic component when the total area of the liquid material extracted by the protrusion information extracting means is less than the reference value of the total area of the liquid material stored in the protrusion information storage means. While the pressing time of the electronic component in the mounting means is increased, the total area of the liquid material extracted by the protrusion information extracting means exceeds the reference value of the total area of the liquid material stored in the protrusion information storage means. In such a case, the liquid material according to appendix 1, characterized in that the pressing time of the electronic component in the electronic component mounting means is adjusted so as to reduce the pressing time of the electronic component in the electronic component mounting means. Projection state stabilization device.

[Appendix 3]
The information indicates the width of the liquid material that protrudes between the substrate and the electronic component, and the width of the liquid material that protrudes between the substrate and the electronic component. Consists of the section length of the outer periphery,
The protrusion information storage means includes an allowable value of the maximum protrusion width of the liquid material and a maximum allowable value of the section length of the outer peripheral portion of the electronic component where the protrusion width of the liquid material is continuously zero. Is remembered,
The protrusion information extracting means is configured such that the maximum protrusion width of the liquid material that protrudes between the substrate and the electronic component and the protrusion width of the liquid material that protrudes between the substrate and the electronic component are continuous. Extract the maximum value of the section length of the outer periphery of the electronic component that becomes zero,
The load application time adjustment means is configured to provide an electronic component when the maximum value of the section length extracted by the protrusion information extraction means exceeds the maximum allowable length of the section length stored in the protrusion information storage means. While the pressing time of the electronic component in the mounting means is increased, the maximum protrusion width extracted by the protrusion information extraction means exceeds the allowable value of the maximum protrusion width stored in the protrusion information storage means. In such a case, the liquid material according to appendix 1, characterized in that the pressing time of the electronic component in the electronic component mounting means is adjusted so as to reduce the pressing time of the electronic component in the electronic component mounting means. Projection state stabilization device.

[Appendix 4]
The protrusion information storage means further stores an appropriate value of the minimum protrusion width of the liquid material,
The protrusion information extraction means further extracts the minimum protrusion width of the liquid material that protrudes between the substrate and the electronic component,
The load application time adjusting means is such that the maximum value of the section length extracted by the protrusion information extracting means does not exceed the maximum allowable value of the section length stored in the protrusion information storage means, and The minimum extracted by the protrusion information extraction means in a situation where the maximum protrusion width extracted by the protrusion information extraction means does not exceed the allowable value of the maximum protrusion width stored in the protrusion information storage means. When the protrusion width is less than the appropriate value of the minimum protrusion width stored in the protrusion information storage means, the electronic component mounting means increases the pressing time of the electronic component in the electronic component mounting means. The apparatus for stabilizing a protruding state of a liquid material according to appendix 3, wherein the pressing time of the part is adjusted.

[Appendix 5]
Further, a reference pressing time storage means for storing a reference value of the pressing time of the electronic component in the electronic component mounting means for each type of electronic component,
A final pressing time and type storage means for storing the pressing time of the electronic component at the time when the continuous mounting operation of the electronic component is completed and the type of the electronic component that is the mounting target at the time,
When changing the type of the electronic component, the reference value of the pressing time stored in the reference pressing time storage unit and the final pressing time corresponding to the type of electronic component stored in the final pressing time / type storage unit Correction coefficient calculating means for calculating a correction coefficient for pressing time based on the ratio to the pressing time of the electronic component stored in the type storage means;
A new mounting target is obtained by multiplying the reference value of the pressing time stored in the reference pressing time storage means corresponding to the type of electronic component newly set as the mounting target by the correction coefficient obtained by the correction coefficient calculating means. Any one of Supplementary Note 1, Supplementary Note 2, Supplementary Note 3 and Supplementary Note 4, further comprising: a pressing time initial setting means for setting an initial value of the pressing time of the electronic component corresponding to the type of electronic component. The liquid material protrusion state stabilization device according to Item.

[Appendix 6]
The liquid according to any one of Supplementary note 1, Supplementary note 2, Supplementary note 3, Supplementary note 4 or Supplementary note 5, wherein the load for pressing the electronic component toward the substrate is adjusted instead of adjusting the pressing time of the electronic component. Equipment for stabilizing the protruding state of materials.

[Appendix 7]
An electronic component is placed on a weighed liquid material applied to a substrate, the electronic component is pressed against the substrate with a preset load, and the liquid material is spread on the lower surface of the electronic component to be placed on the substrate. A liquid material protrusion state stabilization method for stabilizing a liquid material protrusion state that protrudes between a substrate and an electronic component when mounting an electronic component,
After acquiring the image data of the electronic component and its surroundings by imaging the electronic component that has been mounted and its surroundings with the imaging means,
Extracting information for specifying the protruding state of the liquid material that protrudes from between the substrate and the electronic component by performing image processing on the image data,
An image obtained by imaging a newly mounted electronic component and its surroundings with an imaging unit based on the extracted information and information for specifying the proper protruding state of the liquid material The liquid time characterized by adjusting the pressing time of the electronic component so that the degree of similarity between the information extracted from the data and the information for specifying the appropriate liquid material protrusion state increases. A method for stabilizing the protruding state of materials.

[Appendix 8]
From the image data, as information for specifying the protruding state, extract the total area of the liquid material protruding from between the substrate and the electronic component,
When the total area of the extracted liquid material is less than the standard value of the total area of the liquid material that is appropriate, the pressing time of the electronic component is increased, while the total area of the extracted liquid material is determined to be appropriate. The protruding state of the liquid material according to appendix 7, wherein the pressing time of the electronic component is adjusted so as to reduce the pressing time of the electronic component when the total value of the total area of the liquid material exceeds the reference value Stabilization method.

[Appendix 9]
From the image data, as information for specifying the protrusion state, the maximum protrusion width of the liquid material that protrudes between the substrate and the electronic component, and the liquid material that protrudes between the substrate and the electronic component. Extract the maximum value of the section length of the outer periphery of the electronic component where the protrusion width is continuously zero,
When the maximum value of the extracted section length exceeds the maximum allowable value of the appropriate section length, the pressing time of the electronic component is increased, while the extracted maximum protrusion width is considered appropriate. Supplementary state stabilization of the liquid material according to appendix 7, wherein the pressing time of the electronic component is adjusted so as to reduce the pressing time of the electronic component when the allowable value of the maximum protruding width is exceeded. Method.

[Appendix 10]
From the image data, as information for specifying the protrusion state, further extract the minimum protrusion width of the liquid material that protrudes between the substrate and the electronic component,
The maximum value of the extracted section length does not exceed the maximum allowable value of the appropriate section length, and the extracted maximum protrusion width is the appropriate allowable value of the maximum protrusion width. The pressing time of the electronic component is increased so that the pressing time of the electronic component is increased when the extracted minimum protruding width is less than the appropriate value of the minimum protruding width under the condition not exceeding The method for stabilizing a protruding state of a liquid material according to supplementary note 9, characterized in that the liquid material is adjusted.

[Appendix 11]
Furthermore, a reference value for the pressing time of the electronic component is stored in advance for each type of electronic component,
Stores the pressing time of the electronic component at the time when the continuous mounting operation of the electronic component is completed and the type of the electronic component that was the mounting target at the time,
When changing the type of electronic component, the ratio between the reference value of the pressing time corresponding to the type of electronic component at the time when the continuous mounting operation of the electronic component is completed and the pressing time of the electronic component at the time when the continuous mounting operation of the electronic component is completed Calculate the pressing time correction coefficient based on
Multiplying the correction factor by the reference value of the pressing time corresponding to the type of electronic component newly targeted for mounting, sets the initial value of the pressing time of the electronic component corresponding to the type of electronic component newly targeted for mounting. The method for stabilizing a protruding state of a liquid material according to any one of Supplementary Note 7, Supplementary Note 8, Supplementary Note 9, and Supplementary Note 10, wherein:

[Appendix 12]
The liquid according to any one of appendix 7, appendix 8, appendix 9, appendix 10 or appendix 11, wherein the load for pressing the electronic component toward the substrate is adjusted instead of adjusting the pressing time of the electronic component. A method for stabilizing the protruding state of materials.

  The liquid material protrusion state stabilization device and protrusion state stabilization method according to the present invention is a liquid material such as epoxy resin or solder paste previously applied to a lead frame or a substrate as in an electronic component mounting device such as a die bonder or mounter. The present invention can be applied to an apparatus for mounting electronic parts such as pellets and IC chips cut out from a wafer to be mounted after applying a material.

DESCRIPTION OF SYMBOLS 1 Projection state stabilization apparatus 2 Electronic component mounting apparatus 3 Board | substrate 4 Board | substrate conveyance means 5 Liquid material 6 Dispenser 7 Control part 8 Electronic component 9 Vacuum chuck 10 Mounting head 11 CCD camera 12 Microprocessor 13 ROM
14 Nonvolatile memory 15 RAM
16 Interface 17 Manual operation panel 18 Display 19 Input / output circuits 20 to 24 Motor drive circuit 25 Chuck drive circuit 26 Dispenser drive circuit 27 Operation data storage table 27 'Operation data storage table 28 Extraction data storage table 28' Extraction data storage table A Electronics Component mounting means B Imaging means C Extrusion information extraction means D Extrusion information storage means E Load application time adjustment means F Reference pressing time storage means G Final pressing time / type storage means H Correction coefficient calculation means I Initial setting of pressing time Means ST1 Liquid material application stage ST2 Electronic component mounting stage ST3 Imaging stage M0, Mx, My, Mz, Mθ Servo motor

Claims (12)

Receives a substrate coated with a weighed liquid material and an electronic component to be mounted on the substrate, places the electronic component on the liquid material coated on the substrate, and places the electronic component on the substrate with a preset load. An electronic component mounting means that presses toward the electronic component and spreads the liquid material on the lower surface of the electronic component to mount the electronic component on the substrate;
An imaging means for capturing an image of an electronic component and its surroundings by imaging the electronic component that has been mounted by the electronic component mounting means and its surroundings; and
A protrusion information extracting means for extracting information for specifying the protrusion state of the liquid material that protrudes from between the substrate and the electronic component by capturing image data from the imaging means and performing image processing;
A protrusion information storage means for storing information for specifying the appropriate protrusion state of the liquid material;
Based on the information extracted by the protrusion information extracting means and the information stored in the protrusion information storage means, the electronic parts newly mounted by the electronic component mounting means and their surroundings are imaged by the imaging means. The pressing time of the electronic component in the electronic component mounting means is adjusted so that the degree of similarity between the information extracted by the protrusion information extracting means and the information stored in the protrusion information storage means increases. Load application time adjustment means,
The information includes the width of the liquid material protruding from between the substrate and the electronic component, and the width of the liquid material protruding from between the substrate and the electronic component. Consists of the section length of the outer periphery ,
The protrusion information storage means includes an allowable value of the maximum protrusion width of the liquid material and a maximum allowable value of the section length of the outer peripheral portion of the electronic component where the protrusion width of the liquid material is continuously zero. Is remembered ,
The protrusion information extracting means is configured such that the maximum protrusion width of the liquid material that protrudes between the substrate and the electronic component and the protrusion width of the liquid material that protrudes between the substrate and the electronic component are continuous. Extract the maximum value of the section length of the outer periphery of the electronic component that becomes zero ,
The load application time adjustment means is configured to provide an electronic component when the maximum value of the section length extracted by the protrusion information extraction means exceeds the maximum allowable length of the section length stored in the protrusion information storage means. While the pressing time of the electronic component in the mounting means is increased, the maximum protrusion width extracted by the protrusion information extraction means exceeds the allowable value of the maximum protrusion width stored in the protrusion information storage means. In some cases, the liquid material protrusion state is configured to adjust the pressing time of the electronic component in the electronic component mounting means so as to reduce the pressing time of the electronic component in the electronic component mounting means. Stabilizer. The protrusion information storage means further stores an appropriate value of the minimum protrusion width of the liquid material,
The protrusion information extraction means further extracts the minimum protrusion width of the liquid material that protrudes between the substrate and the electronic component,
The load application time adjusting means is such that the maximum value of the section length extracted by the protrusion information extracting means does not exceed the maximum allowable value of the section length stored in the protrusion information storage means, and The minimum extracted by the protrusion information extraction means in a situation where the maximum protrusion width extracted by the protrusion information extraction means does not exceed the allowable value of the maximum protrusion width stored in the protrusion information storage means. When the protrusion width is less than the appropriate value of the minimum protrusion width stored in the protrusion information storage means, the electronic component mounting means increases the pressing time of the electronic component in the electronic component mounting means. The apparatus for stabilizing a protruding state of a liquid material according to claim 1 , wherein the pressing time of the part is adjusted. Further, a reference pressing time storage means for storing a reference value of the pressing time of the electronic component in the electronic component mounting means for each type of electronic component,
A final pressing time and type storage means for storing the pressing time of the electronic component at the time when the continuous mounting operation of the electronic component is completed and the type of the electronic component that is the mounting target at the time,
When changing the type of the electronic component, the reference value of the pressing time stored in the reference pressing time storage unit and the final pressing time corresponding to the type of electronic component stored in the final pressing time / type storage unit Correction coefficient calculating means for calculating a correction coefficient for pressing time based on the ratio to the pressing time of the electronic component stored in the type storage means;
A new mounting target is obtained by multiplying the reference value of the pressing time stored in the reference pressing time storage means corresponding to the type of electronic component newly set as the mounting target by the correction coefficient obtained by the correction coefficient calculating means. 3. The liquid material protrusion according to claim 1, further comprising pressing time initial setting means for setting an initial value of the pressing time of the electronic component corresponding to the type of the electronic component. State stabilization device. Receives a substrate coated with a weighed liquid material and an electronic component to be mounted on the substrate, places the electronic component on the liquid material coated on the substrate, and places the electronic component on the substrate for a preset time. An electronic component mounting means that presses toward the electronic component and spreads the liquid material on the lower surface of the electronic component to mount the electronic component on the substrate;
An imaging means for capturing an image of an electronic component and its surroundings by imaging the electronic component that has been mounted by the electronic component mounting means and its surroundings; and
A protrusion information extracting means for extracting information for specifying the protrusion state of the liquid material that protrudes from between the substrate and the electronic component by capturing image data from the imaging means and performing image processing;
A protrusion information storage means for storing information for specifying the appropriate protrusion state of the liquid material;
Based on the information extracted by the protrusion information extracting means and the information stored in the protrusion information storage means, the electronic parts newly mounted by the electronic component mounting means and their surroundings are imaged by the imaging means. Mounting that is the pressing force of the electronic component in the electronic component mounting means so that the degree of similarity between the information extracted by the protrusion information extracting means and the information stored in the protrusion information storage means increases. A load adjusting means for adjusting the load,
The information includes the width of the liquid material protruding from between the substrate and the electronic component, and the width of the liquid material protruding from between the substrate and the electronic component. Consists of the section length of the outer periphery ,
The protrusion information storage means includes an allowable value of the maximum protrusion width of the liquid material and a maximum allowable value of the section length of the outer peripheral portion of the electronic component where the protrusion width of the liquid material is continuously zero. Is remembered ,
The protrusion information extracting means is configured such that the maximum protrusion width of the liquid material that protrudes between the substrate and the electronic component and the protrusion width of the liquid material that protrudes between the substrate and the electronic component are continuous. Extract the maximum value of the section length of the outer periphery of the electronic component that becomes zero ,
The mounting load adjusting means mounts an electronic component when the maximum value of the section length extracted by the protrusion information extracting means exceeds the maximum allowable section length stored in the protrusion information storage means. When the load of electronic components in the means is increased, while the maximum protrusion width extracted by the protrusion information extraction means exceeds the allowable maximum protrusion width stored in the protrusion information storage means The liquid material is characterized in that the loading load of the electronic component in the electronic component mounting means is adjusted so as to reduce the mounting load of the electronic component in the electronic component mounting means. Device. The protrusion information storage means further stores an appropriate value of the minimum protrusion width of the liquid material,
The protrusion information extraction means further extracts the minimum protrusion width of the liquid material that protrudes between the substrate and the electronic component,
The mounted load adjustment means does not exceed the maximum allowable section length stored in the protrusion information storage means, and the maximum value of the section length extracted by the protrusion information extraction means does not exceed The minimum meal extracted by the protrusion information extraction means in a situation where the maximum protrusion width extracted by the information extraction means does not exceed the allowable value of the maximum protrusion width stored in the protrusion information storage means. The electronic component in the electronic component mounting means so as to increase the mounting load of the electronic component in the electronic component mounting means when the protrusion width is less than the appropriate value of the minimum protrusion width stored in the protrusion information storage means The apparatus for stabilizing a protruding state of a liquid material according to claim 4 , wherein the pressing time is adjusted. Further, reference mounting load storage means for storing a reference value of the mounting load of the electronic component in the electronic component mounting means for each type of electronic component,
A final mounting load / type storage means for storing the mounting load of the electronic component at the time when the continuous mounting operation of the electronic component is completed and the type of the electronic component that is the mounting target at the time,
When changing the type of electronic component, the reference value of the mounting load stored in the reference mounting load storage unit and the final mounting load corresponding to the type of electronic component stored in the final mounting load / type storage unit A load correction coefficient calculating means for calculating a correction coefficient of the mounting load based on a ratio with the mounting load of the electronic component stored in the type storage means;
Newly mounted by multiplying the reference value of the mounted load stored in the reference mounted load storage means corresponding to the type of electronic component newly targeted for mounting by the correction coefficient obtained by the load correction coefficient calculating means. 6. The liquid material bite according to claim 4, further comprising mounting load initial setting means for setting an initial value of the mounting load of the electronic component corresponding to the type of the electronic component targeted. Out state stabilization device. An electronic component is placed on a weighed liquid material applied to a substrate, the electronic component is pressed against the substrate with a preset load, and the liquid material is spread on the lower surface of the electronic component to be placed on the substrate. A liquid material protrusion state stabilization method for stabilizing a liquid material protrusion state that protrudes between a substrate and an electronic component when mounting an electronic component,
After acquiring the image data of the electronic component and its surroundings by imaging the electronic component that has been mounted and its surroundings with the imaging means,
The maximum bite of the liquid material that protrudes between the substrate and the electronic component as information for specifying the state of the liquid material that protrudes between the substrate and the electronic component by performing image processing on the image data Extract the maximum value of the outer width of the electronic component where the protruding width and the protruding width of the liquid material protruding from between the substrate and the electronic component are continuously zero ,
When the maximum value of the extracted section length exceeds the maximum allowable value of the appropriate section length, the pressing time of the electronic component is increased, while the extracted maximum protrusion width is considered appropriate. A method for stabilizing a protruding state of a liquid material, wherein the pressing time of an electronic component is adjusted so as to reduce the pressing time of the electronic component when an allowable value of the maximum protruding width is exceeded . From the image data, as information for specifying the protrusion state, further extract the minimum protrusion width of the liquid material that protrudes between the substrate and the electronic component,
The maximum value of the extracted section length does not exceed the maximum allowable value of the appropriate section length, and the extracted maximum protrusion width is the appropriate allowable value of the maximum protrusion width. The pressing time of the electronic component is increased so that the pressing time of the electronic component is increased when the extracted minimum protruding width is less than the appropriate value of the minimum protruding width under the condition not exceeding The method for stabilizing the protruding state of the liquid material according to claim 7 , wherein the liquid material is adjusted so as to adjust the amount . Furthermore, a reference value for the pressing time of the electronic component is stored in advance for each type of electronic component,
Stores the pressing time of the electronic component at the time when the continuous mounting operation of the electronic component is completed and the type of the electronic component that was the mounting target at the time,
When changing the type of electronic component, the ratio between the reference value of the pressing time corresponding to the type of electronic component at the time when the continuous mounting operation of the electronic component is completed and the pressing time of the electronic component at the time when the continuous mounting operation of the electronic component is completed Calculate the pressing time correction coefficient based on
Multiplying the correction factor by the reference value of the pressing time corresponding to the type of electronic component newly targeted for mounting, sets the initial value of the pressing time of the electronic component corresponding to the type of electronic component newly targeted for mounting. The method for stabilizing the protruding state of a liquid material according to claim 7 or 8 , wherein The electronic component is placed on the weighed liquid material applied to the substrate, the electronic component is pressed against the substrate for a preset time, and the liquid material is spread on the lower surface of the electronic component to be placed on the substrate. A liquid material protrusion state stabilization method for stabilizing a liquid material protrusion state that protrudes between a substrate and an electronic component when mounting an electronic component,
After acquiring the image data of the electronic component and its surroundings by imaging the electronic component that has been mounted and its surroundings with the imaging means,
The maximum bite of the liquid material that protrudes between the substrate and the electronic component as information for specifying the state of the liquid material that protrudes between the substrate and the electronic component by performing image processing on the image data Extract the maximum value of the outer width of the electronic component where the protruding width and the protruding width of the liquid material protruding from between the substrate and the electronic component are continuously zero ,
If the maximum value of the extracted section length exceeds the maximum allowable section length, the mounting load, which is the pressing force of the electronic component, is increased, while the maximum protrusion width is A method for stabilizing the protruding state of a liquid material, characterized in that the mounting load is adjusted so as to reduce the mounting load when an allowable maximum protrusion width is exceeded . From the image data, as information for specifying the protrusion state, further extract the minimum protrusion width of the liquid material that protrudes between the substrate and the electronic component,
The maximum value of the extracted section length does not exceed the maximum allowable value of the appropriate section length, and the extracted maximum protrusion width is the appropriate allowable value of the maximum protrusion width. In order to increase the mounting load, which is the pressing force of the electronic component, when the extracted minimum protrusion width is less than the appropriate value of the minimum protrusion width under the condition that does not exceed The method for stabilizing a protruding state of a liquid material according to claim 10 , wherein the load is adjusted. Furthermore, a reference value for the pressing time of the electronic component is stored in advance for each type of electronic component,
Store the mounting load, which is the pressing force of the electronic component at the time when the continuous mounting operation of the electronic component is completed, and the type of the electronic component that was the mounting target at the time,
When changing the type of electronic component, based on the ratio between the reference value of the mounting load corresponding to the type of electronic component when the continuous mounting operation of the electronic component is completed and the mounting load when the continuous mounting operation of the electronic component is completed Calculate the loading load correction factor,
Multiplying the reference value of the mounting load corresponding to the type of electronic component newly targeted for mounting by the correction coefficient to set the initial value of the mounting load corresponding to the type of electronic component newly targeted for mounting The method for stabilizing a protruding state of a liquid material according to claim 10 or 11 , wherein the liquid material is in a protruding state.

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