JP5740305B2 - 高い表装面品質を有するステンレススチールのレーザ微細加工方法 - Google Patents

高い表装面品質を有するステンレススチールのレーザ微細加工方法 Download PDF

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Publication number
JP5740305B2
JP5740305B2 JP2011529071A JP2011529071A JP5740305B2 JP 5740305 B2 JP5740305 B2 JP 5740305B2 JP 2011529071 A JP2011529071 A JP 2011529071A JP 2011529071 A JP2011529071 A JP 2011529071A JP 5740305 B2 JP5740305 B2 JP 5740305B2
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JP
Japan
Prior art keywords
coating layer
protective coating
laser
micromachining
metal part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011529071A
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English (en)
Japanese (ja)
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JP2012503555A5 (enExample
JP2012503555A (ja
Inventor
レイ，ウェイシェン
アルペイ，メーメット，イー．
松本　久
久 松本
ホートン，ジェフリー
リ，グアングユ
ピログフスキィ，ピーター
リュ，ウィルソン
シメンソン，グレン
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/238,995 external-priority patent/US20100078416A1/en
Application filed by エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド, エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド filed Critical エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Publication of JP2012503555A publication Critical patent/JP2012503555A/ja
Publication of JP2012503555A5 publication Critical patent/JP2012503555A5/ja
Application granted granted Critical
Publication of JP5740305B2 publication Critical patent/JP5740305B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2011529071A 2008-09-26 2009-09-04 高い表装面品質を有するステンレススチールのレーザ微細加工方法 Expired - Fee Related JP5740305B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12/238,995 2008-09-26
US12/238,995 US20100078416A1 (en) 2008-09-26 2008-09-26 Method of laser micro-machining stainless steel with high cosmetic quality
US12/413,272 US20100078418A1 (en) 2008-09-26 2009-03-27 Method of laser micro-machining stainless steel with high cosmetic quality
US12/413,272 2009-03-27
PCT/US2009/056016 WO2010036503A2 (en) 2008-09-26 2009-09-04 Method of laser micro-machining stainless steel with high cosmetic quality

Publications (3)

Publication Number Publication Date
JP2012503555A JP2012503555A (ja) 2012-02-09
JP2012503555A5 JP2012503555A5 (enExample) 2012-10-11
JP5740305B2 true JP5740305B2 (ja) 2015-06-24

Family

ID=42056279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011529071A Expired - Fee Related JP5740305B2 (ja) 2008-09-26 2009-09-04 高い表装面品質を有するステンレススチールのレーザ微細加工方法

Country Status (6)

Country Link
US (1) US20100078418A1 (enExample)
JP (1) JP5740305B2 (enExample)
KR (1) KR20110073483A (enExample)
CN (1) CN102149511A (enExample)
TW (1) TWI405635B (enExample)
WO (1) WO2010036503A2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8524127B2 (en) * 2010-03-26 2013-09-03 Electro Scientific Industries, Inc. Method of manufacturing a panel with occluded microholes
US20120148769A1 (en) * 2010-12-13 2012-06-14 General Electric Company Method of fabricating a component using a two-layer structural coating
US20120243995A1 (en) * 2011-03-21 2012-09-27 General Electric Company Components with cooling channels formed in coating and methods of manufacture
US20120295061A1 (en) * 2011-05-18 2012-11-22 General Electric Company Components with precision surface channels and hybrid machining method
KR101358332B1 (ko) * 2012-04-27 2014-02-06 한국기계연구원 레이저를 이용한 금속 표면 폴리싱 방법
JP5908009B2 (ja) * 2013-08-20 2016-04-26 三菱重工業株式会社 レーザ加工方法及びレーザ加工装置
US9844834B2 (en) * 2013-10-21 2017-12-19 United Technologies Corporation Mitigating distortion of coated parts during laser drilling
JP6113299B2 (ja) * 2013-11-14 2017-04-12 三菱電機株式会社 レーザ加工方法およびレーザ加工装置
CN106181054A (zh) * 2015-04-30 2016-12-07 西酉电子科技（上海）有限公司 一种表面光滑的铁氧体产品激光成型方法
CN106181055B (zh) * 2015-04-30 2019-01-04 元壤实业（上海）有限公司 一种从铁氧体材料胶面激光成型铁氧体产品的方法
US10487664B2 (en) 2015-11-09 2019-11-26 General Electric Company Additive manufacturing method for making holes bounded by thin walls in turbine components
CN105583532A (zh) * 2016-01-28 2016-05-18 江苏大学 一种减少激光打孔表面飞溅物的方法
EP3296054B1 (de) * 2016-09-19 2020-12-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur herstellung eines mikrobearbeiteten werkstücks mittels laserabtrag
US12077432B2 (en) 2019-11-08 2024-09-03 Massachusetts Institute Of Technology Laser-assisted material phase-change and expulsion micro-machining process
JP7098211B1 (ja) * 2021-02-26 2022-07-11 国立大学法人 名古屋工業大学 レーザ加工装置、厚さ検出方法および厚さ検出装置
CN113927185B (zh) * 2021-09-09 2024-05-10 中国航发南方工业有限公司 利用激光在金属零件体上加工通气孔的方法

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440388A (en) * 1966-04-04 1969-04-22 Monsanto Co Method for machining with laser beam
GB1235653A (en) * 1969-01-10 1971-06-16 Nat Res Dev Improvements relating to cutting processes employing a laser
US4156807A (en) * 1978-03-24 1979-05-29 United Technologies Corporation Method for preventing burr formation during electron beam drilling
JPS54148145A (en) * 1978-05-13 1979-11-20 Citizen Watch Co Ltd Hard armour parts for watch and production thereof
US4549063A (en) * 1979-04-09 1985-10-22 Avery International Corporation Method for producing labels having discontinuous score lines in the backing
GB2049102A (en) * 1979-05-03 1980-12-17 Csi Corp Transfer roll
JPS594934A (ja) * 1982-07-01 1984-01-11 Nippon Piston Ring Co Ltd ピストンリングの製造方法
US4668314A (en) * 1983-10-25 1987-05-26 Casio Computer Co., Ltd. Method of manufacturing a small electronic device
US4968383A (en) * 1985-06-18 1990-11-06 The Dow Chemical Company Method for molding over a preform
US4861407A (en) * 1985-06-18 1989-08-29 The Dow Chemical Company Method for adhesive bonding articles via pretreatment with energy beams
US4716270A (en) * 1985-11-04 1987-12-29 Rockwell International Corporation Non-contact scribing process for organic maskants on metals or alloys thereof
US4978583A (en) * 1986-12-25 1990-12-18 Kawasaki Steel Corporation Patterned metal plate and production thereof
US4857698A (en) * 1987-06-20 1989-08-15 Mcdonnell Douglas Corporation Laser perforating process and article produced therein
JPH01298113A (ja) * 1988-05-26 1989-12-01 Hajime Watanabe レーザー光による加工用の塗布剤
US5089062A (en) * 1988-10-14 1992-02-18 Abb Power T&D Company, Inc. Drilling of steel sheet
US5072091A (en) * 1989-04-03 1991-12-10 The Local Government Of Osaka Prefecture Method and apparatus for metal surface process by laser beam
EP0391848B1 (de) * 1989-04-06 1993-09-01 Ciba-Geigy Ag Laserbeschriftung von keramischen Materialien, Glasuren, keramischen Gläsern und Gläsern
JPH0313286A (ja) * 1989-06-09 1991-01-22 Mitsubishi Materials Corp 薄肉貴金属複合板の製造方法
US5214261A (en) * 1990-09-10 1993-05-25 Rockwell International Corporation Method and apparatus for dicing semiconductor substrates using an excimer laser beam
US5233157A (en) * 1990-09-11 1993-08-03 Hughes Aircraft Company Laser pattern ablation of fine line circuitry masters
JPH06170822A (ja) * 1992-12-02 1994-06-21 Ngk Spark Plug Co Ltd シート加工品及びその製造方法
DE69425943T2 (de) * 1993-11-05 2001-04-12 Vari Lite Inc Lichtmusterschablone und Laserablationsverfahren bzw. -gerät zu deren Herstellung
US5622540A (en) * 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet
JP3119090B2 (ja) * 1994-10-05 2000-12-18 株式会社日立製作所 水中レーザ加工装置及びその装置を用いた水中施工方法
JPH08215865A (ja) * 1995-02-16 1996-08-27 Sumitomo Electric Ind Ltd 弗素樹脂被覆物及びその製造方法
US5641416A (en) * 1995-10-25 1997-06-24 Micron Display Technology, Inc. Method for particulate-free energy beam cutting of a wafer of die assemblies
US6025256A (en) * 1997-01-06 2000-02-15 Electro Scientific Industries, Inc. Laser based method and system for integrated circuit repair or reconfiguration
US6852948B1 (en) * 1997-09-08 2005-02-08 Thermark, Llc High contrast surface marking using irradiation of electrostatically applied marking materials
JPH11243224A (ja) * 1997-12-26 1999-09-07 Canon Inc 光起電力素子モジュール及びその製造方法並びに非接触処理方法
JPH11266068A (ja) * 1998-01-14 1999-09-28 Canon Inc 配線基板及び配線基板の製造方法
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US6173886B1 (en) * 1999-05-24 2001-01-16 The University Of Tennessee Research Corportion Method for joining dissimilar metals or alloys
US6406991B2 (en) * 1999-12-27 2002-06-18 Hoya Corporation Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board
FR2809646B1 (fr) * 2000-05-31 2002-09-27 Air Liquide Procede et dispositif de soudage hybride laser-arc avec controle du positionnement des prises de masse
US6677549B2 (en) * 2000-07-24 2004-01-13 Canon Kabushiki Kaisha Plasma processing apparatus having permeable window covered with light shielding film
JP2002129346A (ja) * 2000-10-20 2002-05-09 Konica Corp 無電解メッキの処理方法及びインクジェットヘッド及びその製造方法
US6811888B2 (en) * 2001-09-07 2004-11-02 Siemens Vdo Automotive Corporation Anti-spatter coating for laser machining
JP4397571B2 (ja) * 2001-09-25 2010-01-13 株式会社半導体エネルギー研究所 レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法
JP2005507796A (ja) * 2001-10-31 2005-03-24 スリーエム イノベイティブ プロパティズ カンパニー 非自立性高分子フィルムの熱成形方法およびそれから作製される物品
US7396493B2 (en) * 2002-05-21 2008-07-08 3M Innovative Properties Company Multilayer optical film with melt zone to control delamination
JP2004188475A (ja) * 2002-12-13 2004-07-08 Disco Abrasive Syst Ltd レーザー加工方法
US7387740B2 (en) * 2003-01-17 2008-06-17 Sutech Trading Limited Method of manufacturing metal cover with blind holes therein
WO2004096483A1 (ja) * 2003-04-25 2004-11-11 Nitto Denko Corporation レーザー加工品の製造方法、およびそれに用いるレーザー加工用粘着シート
WO2005063435A1 (ja) * 2003-12-25 2005-07-14 Nitto Denko Corporation レーザー加工用保護シート及びレーザー加工品の製造方法
AT413667B (de) * 2004-05-10 2006-04-15 Fronius Int Gmbh Schweissverfahren und laser-hybrid-schweissbrenner
US7985942B2 (en) * 2004-05-28 2011-07-26 Electro Scientific Industries, Inc. Method of providing consistent quality of target material removal by lasers having different output performance characteristics
JP4854061B2 (ja) * 2005-01-14 2012-01-11 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用保護シート
JP4873863B2 (ja) * 2005-01-14 2012-02-08 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用粘着シート
JP4791745B2 (ja) * 2005-03-28 2011-10-12 パナソニック電工株式会社 光学媒質の光入出射部処理方法
JP4978195B2 (ja) * 2005-06-27 2012-07-18 三菱電機株式会社 レーザ加工方法およびレーザ加工ヘッド
JP2007118070A (ja) * 2005-10-31 2007-05-17 Olympus Corp レーザ加工方法及びレーザ加工装置
US7968820B2 (en) * 2006-06-02 2011-06-28 Electro Scientific Industries, Inc. Method of producing a panel having an area with light transmissivity
US8394301B2 (en) * 2006-06-02 2013-03-12 Electro Scientific Industries, Inc. Process for forming panel with an optically transmissive portion and products related thereto
KR100801535B1 (ko) * 2006-12-20 2008-02-12 이상태 금속접합시트와 기기명판 및 그 제조방법

Also Published As

Publication number Publication date
CN102149511A (zh) 2011-08-10
WO2010036503A2 (en) 2010-04-01
TW201021954A (en) 2010-06-16
JP2012503555A (ja) 2012-02-09
KR20110073483A (ko) 2011-06-29
US20100078418A1 (en) 2010-04-01
WO2010036503A3 (en) 2010-06-10
TWI405635B (zh) 2013-08-21

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