JP5729719B2 - Component supply device and mounting device - Google Patents

Description

  The present invention relates to a component supply apparatus, and more particularly, to a component supply apparatus that supplies radial components with leads to a mounting apparatus that mounts electronic components on a substrate.

  2. Description of the Related Art Conventionally, as a component supply device, one that supplies stick-shaped components to a mounting device by vibration is known (for example, see Patent Document 1). In this component supply apparatus, a plurality of components are accommodated in a cylindrical bowl having an open upper surface along a spiral conveyance path provided on the inner peripheral surface of the bowl by applying vibration to the bowl. Transport parts. Further, a conveyance rail extending toward the mounting apparatus is provided at the outlet of the bowl, and the parts carried out of the bowl are aligned and conveyed to the mounting apparatus along the conveyance rail.

JP 2010-180016 A

  However, the component supply apparatus described in Patent Document 1 is for aligning and conveying stick (single in-line package) shaped components, and conveying electronic components such as odd-shaped components and connectors with leads in a desired posture. I can't. For this reason, it is necessary to change the posture of the component to a posture that can be picked up by the mounting head on the mounting device side. It is possible to determine the orientation of the component using a plurality of sensors and to align the desired orientation by repeating the selection of the component, but the processing on the mounting apparatus side becomes complicated. Also, depending on the shape and material of the part, the posture may not be determined using a sensor.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a component supply device that can supply a deformed component and a component such as a connector with leads in a desired posture to a mounting device. To do.

A component supply apparatus according to the present invention is a component supply apparatus that aligns and supplies a component to a mounting device that mounts the component on a base material by vibration. A divergence portion provided in the conveyance path for passing a part having a predetermined posture in one direction and removing a part other than the predetermined posture from the conveyance path, and a posture of the part aligned in the distribution part A drop portion that changes the posture to a posture that is taken out by the mounting device, and the distribution portion passes a part with the mounting surface directed to one side, and the drop portion is formed by the depression by the distribution portion. The posture of the component that has passed through is changed so that the mounting surface faces downward .

According to this configuration, even if the component is an electronic component such as a deformed component or a connector, only the component in a predetermined posture is selected by the sorting unit, and converted into a posture in which the mounting apparatus can be taken out by the dropping unit. Therefore, it is not necessary to change the posture to allow the component to be taken out on the mounting apparatus side, and a complicated process for determining the posture of the component using the sensor becomes unnecessary. Further, even when the component cannot determine the posture of the component using the sensor, the component can be supplied to the mounting apparatus in an appropriate posture. In addition, since the component is supplied to the mounting apparatus with the mounting surface facing downward, it is easy to mount the component on the horizontal mounting surface of the base material in the mounting apparatus.

  The component supply apparatus according to the present invention further includes a storage container for storing the component on the upstream side of the transport path, and the component removed from the transport path in the sorting unit is returned to the storage container. According to this configuration, it is possible to automatically return a component whose mounting surface is directed in a direction other than a predetermined direction to the receiving container.

  Further, in the component supply apparatus of the present invention, the component has a vertical orientation in which the lead protrudes outward from the mounting surface of the rectangular parallelepiped component main body, and the component main body is raised so that the lead is directed vertically. However, the height of the component is low when the component body is tilted sideways so that the lead faces sideways.

  Further, in the component supply apparatus of the present invention, the sorting unit traverses above the horizontally oriented component on the transport path, and guides the vertically oriented component toward the outside of the transport path. have. According to this configuration, it is possible to sort the component in the horizontal posture and the component in the vertical posture with a simple configuration.

  In the component supply apparatus of the present invention, the transport path is open on one side in the transport width direction, and the sorting section includes a width reducing section that narrows the transport width of the transport path, and the width reducing section. The conveyance path narrowed by the passage of the parts in the horizontal posture passes the parts in the basic attitude with the lead directed to the open side of the conveyance path, and allows the parts other than the basic attitude from one side of the conveyance path. Drop off. According to this configuration, with a simple configuration, it is possible to distribute a component other than the basic posture and the basic posture in which the lead is directed to the open side of the conveyance path among the components in the horizontal posture.

  In the component supply apparatus of the present invention, the sorting unit abuts against a component other than the basic posture on one side of the narrow portion of the conveyance path, and guides the component toward the width reducing unit. The second guide portion is formed so as not to contact the component in the basic posture. According to this configuration, with a simple configuration, components other than the basic posture and the basic posture can be accurately sorted in the horizontal posture.

  Further, in the component supply apparatus of the present invention, the depression of the drop-in portion is formed so as to narrow the conveyance width of the conveyance path so that the component in the horizontal posture rolls over due to its own weight, and the component in the horizontal posture is By being dropped into the recess, the posture is changed to the vertical posture with the lead facing downward. According to this configuration, it is possible to change the posture of the component in the horizontal posture to the vertical posture with the leads facing downward with a simple configuration.

  In the component supply apparatus of the present invention, a guide surface for guiding the tip of the lead is formed in the recess so that the laterally oriented lead faces downward when the orientation of the laterally oriented component is changed. According to this configuration, the guide is guided by the guide surface until the tip of the lead is directed downward, thereby preventing the component from being clogged in the recess. For this reason, it is possible to reliably drop the component into the recess, and it is possible to smoothly supply the component in an appropriate posture to the mounting apparatus.

  In addition, the mounting apparatus of the present invention includes a determination unit that determines whether or not the component conveyed by the component supply device is reversed in the conveyance direction. According to this configuration, it is possible to reliably prevent erroneous mounting of the component on the base material by determining whether the component is reversed in the transport direction.

  In the mounting apparatus of the present invention, the determination unit is provided in a mounting head that takes out the component from the component supply device and mounts the component on the base material. The determination unit includes the mounting head. It is determined whether the part is reversed upside down between the removal of the part and the mounting. According to this configuration, the component can be efficiently mounted on the substrate by determining whether the component is reversed in the front-rear direction and performing rotation correction while the component is being conveyed by the mounting head.

  According to the present invention, parts such as odd-shaped parts and connectors with leads can be supplied to the mounting apparatus in a desired posture.

It is a perspective view of the mounting apparatus and component supply apparatus which concern on this Embodiment. It is an upper surface schematic diagram of the component supply apparatus which concerns on this Embodiment. It is a perspective view of the component which concerns on this Embodiment which concerns on this Embodiment. It is a one part perspective view of the components supply apparatus which concerns on this Embodiment. It is a figure which shows a mode that components are distributed by the distribution part which concerns on this Embodiment. It is a figure which shows a mode that components are guided by the arch-shaped guide part which concerns on this Embodiment. It is a figure which shows a mode that components are attitude | position changed by the dropping part which concerns on this Embodiment. It is a figure which shows an example of ONCE measurement with respect to the large sized component which concerns on this Embodiment. It is a figure which shows an example of ONCE measurement with respect to the small components which concern on this Embodiment. It is a flowchart of the direction discrimination | determination process which concerns on this Embodiment. It is a figure which shows an example of ONCE measurement with respect to components without a lead concerning this Embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is an overall view of a mounting apparatus and a component supply apparatus according to the present embodiment. FIG. 2 is a schematic top view of the component supply apparatus according to the present embodiment. In the following description, a bowl feeder that conveys components by a vibration method will be described as an example of the component supply device. However, the component supply device is not limited to this, and can be changed as appropriate. Further, in the following description, the vertical orientation of the component indicates an attitude raised so that the lead is vertically oriented, and the horizontal orientation of the component indicates an attitude tilted so that the lead is horizontally oriented.

  As shown in FIG. 1, the mounting apparatus 1 according to the present embodiment mounts a component P supplied from a pair of component supply apparatuses 2 on a substrate W (base material) on a base 11 by a mounting head 3. It is configured as follows. A mounting head moving mechanism 12 that moves the mounting head 3 in the X-axis direction and the Y-axis direction is provided on the base 11. The mounting head moving mechanism 12 is supported by support columns 13a and 13b erected at the four corners of the base 11, and the mounting head 3 is moved at a predetermined height from the upper surface of the base 11 in the X-axis direction and the Y-axis direction. Move.

  The mounting head moving mechanism 12 has Y-axis rails 14a and 14b supported on a pair of support columns 13a and 13b, respectively, and an X-axis table 15 moved on the Y-axis rails 14a and 14b in the Y-axis direction. doing. The X-axis table 15 extends in the X-axis direction and is supported at both ends by Y-axis rails 14a and 14b. The mounting head 3 is supported on the X-axis table 15 so as to be movable in the X-axis direction. Further, on the Y-axis rail 14 b and the X-axis table 15, cable bearers 16 and 17 that accommodate various cables are provided.

  The mounting head moving mechanism 12 moves the mounting head 3 along the X-axis table 15 by an X-axis motor (not shown), and moves the mounting head 3 on the X-axis table 15 to the Y-axis rail 14 by a Y-axis motor (not shown). Move along. With such a configuration, the mounting head 3 is horizontally moved above the substrate W in the X-axis direction and the Y-axis direction, and can transport the component P to a desired position with respect to the substrate W.

  The mounting head 3 has a plurality of nozzles 21 (only one is shown in FIG. 1) that can adsorb the component P. Each nozzle 21 is rotated about the Z axis by a not-shown θ motor and is moved up and down in the Z-axis direction by a not-shown Z-axis motor. The mounting head 3 is configured to be able to suck a plurality of components P from the component supply device 2 by individually driving the nozzles 21. The nozzle 21 of the mounting head 3 only needs to be able to take out the component P from the component supply device 2, and may be constituted by a gripper nozzle, for example.

  Further, the mounting head 3 is provided with a laser unit 22 for performing SWEEP measurement and ONCE measurement. The laser unit 22 includes a laser light source and a CCD line sensor arranged with the component P interposed therebetween. The laser unit 22 irradiates a laser beam toward the component P held by the nozzle 21 from the laser light source, and detects a shadow of the component P by a CCD line sensor. Data detected by the laser unit 22 is output to the control unit 18 (determination unit) in the base 11. The control unit 18 includes a processor that executes various processes of the mounting apparatus 1, a memory, and the like. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application. Details of SWEEP measurement and ONCE measurement according to this embodiment will be described later.

  A substrate transport unit 19 that takes in the substrate W onto the base 11 is provided at a substantially intermediate position in the Y-axis direction on the base 11. The substrate transport unit 19 extends in the X-axis direction and is configured to transport the substrate W by a transport belt (not shown). The substrate transport unit 19 takes in the substrate W from one end side in the X-axis direction when the component P is mounted, and positions it below the mounting head 3. Moreover, the board | substrate conveyance part 19 carries out the board | substrate W from the other end side in a X-axis direction after completion of mounting of the component P. FIG.

  In the present embodiment, the component P is supplied from the pair of component supply devices 2 to the mounting device 1. As shown in FIG. 2, each component supply device 2 is a bowl feeder that conveys the component P to the mounting device 1 by a vibration method, and the component P is delivered to the front of the substrate conveyance unit 19 via the linear conveyance rail 4. Conveying. The component supply device 2 has a metal bowl 31 (accommodating container) formed in a cylindrical shape with an open upper surface, and a plurality of components P are accommodated in the bowl 31 in a rose shape. In the bowl 31, a conveyance path 33 for conveying the component P from the bottom toward the opening side is spirally provided along the inner peripheral surface 32.

  Below the bowl 31, a vibrating portion 36 that applies vibration to the bowl 31 is provided. When vibration is applied to the bowl 31 by the vibration unit 36, the component P placed on the bottom moves on the conveyance path 33 toward the opening side. In the vicinity of the exit of the spiral conveyance path 33, a resin delivery section 41 that is sent to the conveyance rail 4 with the direction of the component P aligned is attached. The delivery unit 41 is formed with a linear conveyance path 42 connected to the spiral conveyance path 33, and the linear conveyance path 42 also receives the vibration of the vibration unit 36 and directs the component P toward the conveyance rail 4. To move.

  The delivery unit 41 is provided with a sorting unit 43 near the outlet of the spiral conveyance path 33 that allows only a part P having a predetermined direction to pass therethrough. In addition, the sending unit 41 is provided with a dropping unit 44 in the vicinity of the entrance of the transport rail 4 for changing the parts P arranged by the sorting unit 43 into a posture that can be sucked by the nozzles 21. The component P that has passed through the delivery unit 41 is transferred to the transport rail 4 and transported toward the mounting apparatus 1. The transport rail 4 is made of a pair of linear metal plates and extends so as to be slightly inclined downward from the component supply device 2 toward the mounting device 1. The transport rail 4 also receives the vibration of the vibration unit 36 and transports the component P toward the mounting apparatus 1.

  Here, the sending unit will be described in detail with reference to FIG. 3 and FIG. 4. In the following description, it is assumed that the two component supply devices respectively supply a large component and a small component to the mounting device. FIG. 3 is a perspective view of a component according to the present embodiment. FIG. 4 is a perspective view of a part of the component supply apparatus according to the present embodiment. 3A is a perspective view of a large component, and FIG. 3B is a perspective view of a small component. 4A is a perspective view of a component supply device that conveys a large component, and FIG. 4B is a perspective view of the component supply device that conveys a small component.

  As shown in FIG. 3A, the large component Pa has a rectangular parallelepiped shape where X> Z> Y, where the X axis direction is the length dimension X, the Y axis direction is the width dimension Y, and the Z axis direction is the height dimension Z. The component main body 71a is provided. The component main body 71a is provided with a plurality of leads 73a protruding outward from the mounting surface 72a mounted on the substrate W. On the mounting surface 72a, four leads 73a and five leads 73a arranged in the X-axis direction are arranged in two rows. The component Pa is attached to the substrate W by inserting the leads 73a into the mounting holes formed in the substrate W.

  As shown in FIG. 3B, the small component Pb has a rectangular parallelepiped shape where X> Z> Y, where the X-axis direction is the length dimension X, the Y-axis direction is the width dimension Y, and the Z-axis direction is the height dimension Z. The component main body 71b is provided. The component main body 71b is provided with a plurality of leads 73b protruding outward from the mounting surface 72b mounted on the substrate W. On the mounting surface 72b, three leads 73b arranged in the X-axis direction are arranged in one row. The component main body 71b has a recess 75b so that the central lead 73b is exposed to the outside. The component Pb is attached to the substrate W by inserting the lead 73b into the mounting hole formed in the substrate W.

  As shown in FIG. 4A, a spiral conveyance path 33a is formed along the peripheral wall 34a in the bowl 31a of the component supply device 2a. That is, the conveyance path 33a has one end side in the conveyance width direction surrounded by the peripheral wall portion 34a, and the other end side in the conveyance direction is opened toward the bowl 31a. On this conveyance path 33a, the parts Pa are conveyed in various postures along the peripheral wall portion 34a. For example, the component Pa has a standing posture in which the length direction (X-axis direction) of the component main body 71a is vertically oriented, a horizontal posture in which the width direction (Y-axis direction) of the component main body 71a is vertically oriented, and the height of the component main body 71a. It is conveyed in a vertical orientation with the vertical direction (Z-axis direction) oriented vertically. In the standing posture and the horizontal posture, the lead 73a is oriented sideways, and in the vertical posture, the lead 73a is oriented vertically.

  The delivery part 41a is provided in the vicinity of the exit of the conveyance path 33a of the bowl 31a, and has a conveyance path 42a that connects the spiral conveyance path 33a of the bowl 31 and the conveyance rail 4a. An outer wall portion 45a connected to the peripheral wall portion 34a of the bowl 31a is formed on one end side in the conveyance width direction of the conveyance path 42a. The other end side in the conveyance width direction of the conveyance path 42a is opened toward the bowl 31a. The delivery unit 41a is provided with a sorting unit 43a that sorts out parts Pa that come in various postures from the spiral conveyance path 33a.

  The distribution unit 43a allows only the parts Pa conveyed in a predetermined posture to pass therethrough, and is formed in the metal guide unit 51a (first guide unit) provided on the conveyance path 42a and the conveyance path 42a. And a chamfered portion 52a (width reduction portion). The guide portion 51a is provided on an attachment plate 53a attached to the outer wall portion 45a, and is formed by folding back a belt plate extending forward from the attachment plate 53a. The guide portion 51a extends so as to cross obliquely above the transport path 42a from the upstream side toward the downstream side in the transport direction.

  In this case, the lower end of the guide portion 51a crosses a position slightly higher than the width dimension Y of the component Pa from the road surface of the conveyance path 42a. Therefore, the component Pa in the horizontal posture passes below the guide portion 51a, and the passage of the component Pa in the standing posture and the vertical posture is restricted by the guide portion 51a. The component Pa in the standing posture and the vertical posture is guided along the extending direction of the guide portion 51a, falls off the conveyance path 42a, and is returned into the bowl 31a (see FIG. 5). In this way, the guide portion 51a passes only the component Pa in the lateral orientation.

  The chamfered portion 52a is formed in a range slightly longer than the length dimension X of the component Pa on the other end side in the transport width direction of the transport path 42a below the guide portion 51a. The chamfer 52a narrows the conveyance width of the conveyance path 42a, so that only the component Pa in the basic posture (see the component Pa2 in FIG. 5A) with the lead 73a facing the inside of the bowl 31a out of the component Pa in the lateral orientation. Let it pass. Of the parts Pa in the horizontal orientation, the parts Pa in the reverse orientation with the lead 73a facing the outer wall portion 45a are dropped from the transport path 42a and returned to the bowl 31a because the center of gravity approaches the chamfered portion 52a. It is. In this way, the chamfered portion 52a passes only the component Pa in the basic posture among the components Pa in the lateral orientation.

  Of the components Pa in the lateral orientation, the component Pa with the lead 73a facing the conveyance direction has a sufficiently large length dimension X with respect to the conveyance width of the conveyance path 33a. It drops from 33a and is returned to the bowl 31. With such a configuration, the postures of the parts Pa passing through the sorting unit 43a are uniformly aligned and transported toward the transport rail 4a. Further, the sending unit 41 is formed with a dropping unit 44a that changes the posture of the component Pa in the basic posture to a posture that can be sucked by the mounting head 3 and sends the component Pa to the transport rail 4a.

  The drop-in portion 44a is formed so that the component Pa conveyed along the outer wall portion 45 rolls over in the conveyance width direction by its own weight by a recess 54a provided so as to narrow the conveyance width of the conveyance path 42a. At this time, the component Pa in the basic posture is dropped into the recess 54a from the lead 73a facing the inside of the bowl 31a, and the posture is changed to a vertical posture with the lead 73a facing downward (see FIG. 7). The component Pa whose posture has been changed is transported to the mounting apparatus 1 toward the transport rail 4a. The posture of the component Pa at this time is an appropriate posture with respect to the mounting head 3 to which the component Pa is attached from above with respect to the substrate W.

  As shown in FIG. 4B, the component supply device 2b is only provided with a metal supply portion 55b (second guide portion) that guides the small component Pb toward the chamfered portion 52b. Is different. Therefore, description of the configuration similar to that of the component supply device 2a will be omitted as much as possible, and only the guide portion 55b will be described in detail. In this component supply device 2b, since the length dimension X of the component Pb is not sufficiently large with respect to the conveyance width of the spiral conveyance path 33b, the component Pb in which the lead 73b is directed in the conveyance direction among the components Pb in the lateral orientation. (Refer to the part Pb5 in FIG. 5B) also enters the delivery part 41b without dropping off.

  Since the component Pb transported in this direction is transported in a lateral orientation, it passes under the strip-shaped guide portion 51b. Even on the conveyance path 42b narrowed by the chamfered portion 52b, the center of gravity of the component Pb is located on the conveyance path 42b, so that the component Pb is not easily dropped from the chamfered portion 52b. Therefore, the delivery unit 41b guides the component Pb toward the chamfered portion 52b by the guide portion 55b, so that the component Pb in which the lead 73b is directed in the conveyance direction is removed from the conveyance path 33b among the components in the lateral orientation. I have to.

  The guide portion 55b is attached to a guard 56b fixed to the outer wall portion 45b, and is formed in an arch shape in sectional view. The guide portion 55b is installed so as to straddle the conveyance path 42b from the outer wall portion 45b side toward the inside of the bowl 31b, and a tip portion facing the inside of the bowl 31b is located above the chamfered portion 52b. The leading end of the guide portion 51b is formed in a wedge shape so that the component Pb can be guided toward the chamfered portion 52b. In this case, the leading end of the guide portion 51b avoids the lead 73b facing the inside of the bowl 31b for the component Pb conveyed in the basic posture, and the component main body for the component Pb conveyed in other than the basic posture. It is formed so as to abut against 71b (see FIG. 6). In this way, the parts Pb passing through the sorting unit 43b are transported toward the transport rail 4b in a uniform posture.

  With reference to FIG. 5, how the parts are distributed by the distribution unit will be described. FIG. 5 is a diagram showing how parts are distributed by the distribution unit according to the present embodiment. Note that FIG. 5A shows a state in which large components are distributed, and FIG. 5B shows a state in which small components are distributed.

  As shown in FIG. 5A, in the component supply apparatus 2a, the large component Pa is conveyed in various postures from the spiral conveyance path 33a of the bowl 31a. Here, the first component Pa1 is conveyed in a vertical posture, the second component Pa2 is a horizontal basic posture, the third component Pa3 is a reverse posture of the basic posture, and the fourth component Pa4 is conveyed in a standing posture. When the vertically oriented part Pa1 enters the delivery part 41a, the lead 73a of the vertically oriented part Pa1 is guided by the strip-shaped guide part 51a and returned to the bowl 31a. Next, when the component Pa2 in the basic posture enters the delivery portion 41a, the lead 73a that has been laid down horizontally and the component main body 71a in which the width dimension Y is in the vertical direction pass below the strip-shaped guide portion 51a. At this time, the lead 73a of the component Pa2 faces the inside of the bowl 31a, and the center of gravity of the component Pa2 is closer to the outer wall portion 45a, so that the component Pa2 falls into the bowl 31a through the chamfered portion 52a. There is no.

  Next, when the component Pa3 in the reverse orientation enters the delivery part 41a, the lead 73a that has been laid sideways and the component main body 71a having the width dimension Y in the vertical direction pass below the strip-shaped guide part 51a. At this time, the lead 73a of the component Pa3 faces the outer wall 45a side, and the center of gravity of the component Pa3 is close to the chamfered portion 52a. Therefore, the component Pa3 drops off from the transport path 42a and is returned to the bowl 31a. . Next, when the component Pa4 in the standing posture enters the delivery portion 41a, the component main body 71a whose length dimension X is vertically raised is guided by the strip plate-shaped guide portion 51a and returned into the bowl 31a. Thus, only the component Pa2 in the basic posture is transported toward the drop-in portion 44a.

  As shown in FIG. 5B, in the component supply device 2b, the small component Pb is conveyed in various postures from the spiral conveyance path 33b of the bowl 31b. Here, the first component Pb1 is in the vertical orientation, the second component Pb2 is in the horizontal basic orientation, the third component Pb3 is in the reverse orientation of the basic orientation, the fourth component Pb4 is in the standing posture, and the fifth component Pb5 Are conveyed in orthogonal postures rotated 90 degrees horizontally with respect to the basic posture. When the vertically oriented component Pb1 enters the delivery portion 41b, the lead 73b of the vertically oriented component Pb1 is guided by the strip-shaped guide portion 51b and returned into the bowl 31b.

  Next, when the component Pb2 in the basic posture enters the delivery portion 41b, the lead 73b that has been laid down and the component main body 71b in which the width dimension Y is in the vertical direction pass below the strip-shaped guide portion 51b. At this time, the lead 73b of the component Pb2 faces the inside of the bowl 31b, the center of gravity of the component Pb2 approaches the outer wall 45b side, and the component Pb2 does not contact the arched guide portion 55b. It does not fall into the bowl 31b via the part 52b (see FIGS. 6A and 6B). Next, when the component Pb3 in the reverse orientation enters the delivery portion 41b, the lead 73b that has been laid down and the component main body 71b in which the width dimension Y is in the vertical direction pass below the strip-shaped guide portion 51b. At this time, the component Pb3 is guided toward the chamfered portion 52b by the tip of the arch-shaped guide portion 55b, falls off the conveying path 42b, and is returned into the bowl 31b.

  Next, when the component Pb4 in the standing posture enters the delivery portion 41b, the component main body 71b whose length dimension X is vertically raised is guided by the guide portion 51b and returned into the bowl 31b. Next, when the component Pb5 in the orthogonal posture enters the delivery portion 41b, the lead 73b that has been laid down and the component main body 71b in which the width dimension Y is in the vertical direction pass below the guide portion 51b. At this time, the component Pb5 is guided toward the chamfered portion 52b by the tip portion of the arched guide portion 55b, falls off the conveying path 42b, and returns to the bowl 31b (see FIGS. 6C and 6D). Thus, even when the small component Pb is transported, only the component Pb2 in the basic posture is transported toward the dropping portion 44b.

  With reference to FIG. 6, a state where a small component is guided by the arch-shaped guide portion will be described. FIG. 6 is a diagram illustrating a state in which components are guided by the arch-shaped guide portion according to the present embodiment. 6A and 6B show the case where the parts in the basic posture are conveyed, and FIGS. 6C and 6D show the cases where the parts in the orthogonal posture are conveyed.

  As shown in FIGS. 6A and 6B, the component Pb conveyed in the basic posture has the lead 73b facing the inside of the bowl 31b, and a space is formed in the vicinity of the root of the lead 73b to escape the tip of the guide portion 55b. ing. Therefore, even if the component Pb in the basic posture is conveyed on the conveyance path 42b, the guide portion 55b does not come into contact with the component Pb. On the other hand, as shown in FIGS. 6C and 6D, the component Pb transported in the orthogonal posture has the lead 73b facing forward in the transport direction, and no space is formed to escape the tip of the guide portion 55b. Accordingly, when the component Pb in the orthogonal posture is transported on the transport path 42b, the component Pb is guided toward the chamfered portion 52b by the tip portion of the guide portion 55b and drops into the bowl 31b. With such a configuration, the arch-shaped guide portion 55b can pass only the component Pb in the basic posture.

  With reference to FIG. 7, how the posture of the component is changed by the dropping unit will be described. FIG. 7 is a diagram illustrating a state in which the posture of the component is changed by the dropping unit according to the present embodiment. 7A shows a state in which the posture of a large-sized component is changed, FIG. 7B shows a state in which the posture of a large-sized component is changed in the dropping portion of the comparative example, and FIG.

  As shown in FIG. 7A, the drop-in portion 44a is formed by narrowing the conveyance path 42a by a recess 54a. The recess 54a is formed narrower toward the lower side by a pair of inclined surfaces 61a and 63a facing in the conveyance width direction. When the part Pa is transported on the transport path 42a narrowed by the recess 54a, the part Pa rolls over in the direction of the arrow with the corner portion 62a between the transport path 42a and the slope 61a as a fulcrum. At this time, the slope 63a functions as a guide surface that guides the tip of the lead 73a to the bottom surface 64a, and the component Pa can be smoothly rolled over. With this configuration, the posture of the component Pa in the horizontal posture is changed to the vertical posture with the lead 73a facing downward.

  By the way, as shown in FIG. 7B, the drop-in portion 44c according to the comparative example is provided with a transport rail 4c immediately below. For this reason, the phenomenon that the tip of the lead 73a is caught at the boundary portion between the slope 63c and the transport rail 4c when the part Pa rolls over has occurred. Therefore, in the drop-in portion 44a according to the present embodiment, the tip of the lead 73a is guided by the inclined surface 63a when the component Pa rolls over, and is sent to the transport rail 4a after the posture change of the component Pa has been completed. . Thus, the component Pa is not clogged in the recess 54a, and the component Pa can be continuously sent out to the transport rail 4a.

  As shown in FIG. 7C, the lead 73b is formed in a horizontal row in the small component Pb, but the posture is changed in the same manner as the large component Pb. In the present embodiment, the guide surfaces for guiding the tips of the leads 73a and 73b are configured by the inclined surfaces 63a and 63b. However, the present invention is not limited to this configuration. The guide surface may be a curved surface as long as it can guide the tips of the leads 73a and 73b.

  With the configuration described above, the component P is transported from the component supply device 2 to the mounting device 1 in an appropriate posture. In this case, the component P is transported to the mounting apparatus 1 in the vertical orientation with the length dimension X in the transport direction and the lead 73 facing down, but is transported with the front and rear in the transport direction reversed. There is. Therefore, in the mounting apparatus 1, the direction of the component P is determined, and the component P conveyed by being reversed in the front-rear direction is returned to an appropriate direction and then mounted on the substrate W. Hereinafter, the direction determination process of the component P in the mounting apparatus 1 will be described.

  The mounting head 3 takes out the component P supplied from the component supply device 2 by the nozzle 21 and corrects the positional deviation amount by SWEEP measurement. SWEEP measurement is to irradiate the component main body 71 with laser light from the side while rotating the component P adsorbed by the nozzle 21. Then, by detecting the shadow of the component main body 71 by the CCD line sensor, a displacement amount (XYθ) of the position and orientation of the component P with respect to the nozzle 21 is calculated. The amount of deviation is corrected by the rotation of the θ motor of the nozzle 21 and the mounting head moving mechanism 12 in accordance with the amount of deviation.

  When the position of the mounting head 3 is corrected by SWEEP measurement, the laser beam irradiation height is adjusted to the lead 73 of the component P. The lead 73 of the component P is irradiated with laser light, and the front-rear direction of the component P is determined by ONCE measurement. The ONCE measurement is to irradiate the lead 73 of the component P sucked by the nozzle 21 with a laser beam and acquire the left inner coordinate (left end coordinate) and the right inner coordinate (right end coordinate) of the shadow of the lead 73. is there. The mounting head 3 determines the inversion state based on how the shadow created by the lead 73 becomes non-target with reference to the threshold value α set as the reference coordinate.

  Here, with reference to FIG. 8, the direction discrimination process using ONCE measurement will be described in detail. FIG. 8 is a diagram illustrating an example of ONCE measurement of a large component according to the present embodiment. FIG. 9 is a diagram illustrating an example of ONCE measurement of a small component according to the present embodiment. In the following description, it is assumed that the orientation of the component during normal supply is set to 90 degrees and the orientation of the component during reverse supply is set to 270 degrees with respect to the control unit of the mounting apparatus. 8 and 9, the coordinate axes are set so as to increase from the left side to the right side. In the following description, the direction determination process is performed using ONCE measurement, but the direction determination process may be performed using SWEEP measurement.

  As shown in FIG. 8A, the large component Pa has a plurality of leads 73a arranged in two rows along the length direction (X-axis direction). Therefore, even if the laser beam is irradiated from the direction in which the leads 73a are arranged, the shadow created by the lead 73a is the target with respect to the threshold value α serving as the reference coordinates, and has been normally transported in the 90 ° orientation, or the 270 ° orientation. It is not possible to determine whether the paper is reversed and conveyed. Therefore, for example, as shown in FIGS. 8B and 8C, by setting the direction determination angle to 45 degrees, shadows created by the lead 73a with the threshold value α as a reference in normal supply and reverse supply are excluded. Yes.

  As shown in FIGS. 8B and 8C, the left inner coordinates and the right inner coordinates of the shadow formed by the lead 73a are obtained by irradiating the lead 73a with laser light. Then, the center coordinates of the left inner coordinates and the right inner coordinates are calculated, and the orientation of the component Pa is determined depending on whether the center coordinates are on the left or right side with respect to the threshold value α. In the case of the orientation shown in FIG. 8B, the center coordinate Ac between the left inner coordinate Al and the right inner coordinate Ar of the shadow is located on the left side of the threshold value α, and the value of the central coordinate Ac is set lower than the threshold value α. . On the other hand, in the case of the orientation shown in FIG. 8C, the center coordinate Bc between the left inner coordinate Bl and the right inner coordinate Br is positioned on the right side of the threshold α, and the value of the center coordinate Bc is set higher than the threshold α. Is done. For example, when the orientation shown in FIG. 8B indicates normal supply, the component Pa shown in FIG. 8C is rotated 180 degrees and adjusted to an appropriate orientation.

  The threshold value α is a coordinate stored in the control unit 18 in advance, and satisfies the requirement of α = (Ac + Bc) / 2, for example. In the present embodiment, it is determined whether the lead 73a is properly arranged with respect to the component main body 71a in addition to the above-described direction determination processing. For example, when the center coordinates Ac and Bc are within a predetermined error range centered on the threshold value α, the part Pa is determined to be defective and discarded. Thereby, for example, a defective product in which the lead 73a is bent can be removed from the production line. Note that the error range is threshold α ± error determination value β, and satisfies the requirement of error determination value β = (Ac−α) / 2, for example.

  As shown in FIG. 9, the small component Pb has a plurality of leads 73b arranged in a line along the length direction (X-axis direction). In this case, when the laser beam is irradiated from the direction in which the leads 73b are arranged, the shadow created by the lead 73b becomes non-target with reference to the threshold value α at the time of normal supply and at the time of reverse supply, and based on this, the direction is 90 degrees. It is possible to determine whether the sheet has been normally conveyed or reversed and conveyed in the direction of 270 degrees. Therefore, the direction discrimination angle is set to 0 degree. In the case of the orientation shown in FIG. 9A, the center coordinate Ac of the left inner coordinate Al and the right inner coordinate Ar of the shadow is located on the left side of the threshold value α, and the value of the central coordinate Ac is set lower than the threshold value α. . On the other hand, in the case of the orientation shown in FIG. 9B, the center coordinate Bc between the left inner coordinate Bl and the right inner coordinate Br is positioned on the right side of the threshold α, and the value of the center coordinate Bc is set higher than the threshold α. Is done. For example, when the orientation shown in FIG. 9A indicates normal supply, the component Pb shown in FIG. 9B is rotated 180 degrees and adjusted to an appropriate orientation.

  The threshold value α is a coordinate stored in advance in the control unit 18 as in the direction determination process for the large component Pa, and satisfies the requirement of α = (Ac + Bc) / 2, for example. Further, when the lead 73b is a row of parts Pb, it is possible to determine the direction using only the left inner coordinate or the right inner coordinate without calculating the center coordinate of the shadow of the lead 73b. Further, in the present embodiment, it is determined whether or not the lead 73b is appropriately arranged with respect to the component main body 71b in addition to the above-described direction determination processing. For example, when the center coordinates Ac and Bc are within a predetermined error range centered on the threshold value α, the part Pb is determined to be defective and discarded. Thereby, the defective product in which the lead 73b is bent can be removed from the production line. Note that the error range is threshold α ± error determination value β, and satisfies the requirement of error determination value β = (Ac−α) / 2, for example.

  The direction determination process shown in this embodiment is merely an example, and the present invention is not limited to this configuration. The direction determination process may be any configuration that determines the inversion of the component using the shadow coordinates of the lead, and the threshold α, the method of the direction determination process, the irradiation position of the laser beam, and the like may be changed as appropriate. The error determination process may be configured to determine whether or not the lead is appropriately arranged with respect to the component body using the lead shadow coordinates, and the error range, the method of the error determination process, and the like are appropriately determined. It may be changed.

  With reference to FIG. 10, the flow of direction determination processing will be described. FIG. 10 is a flowchart of direction determination processing according to the present embodiment. Although the flow of direction determination processing for a large component will be described here, the flow of direction determination processing for a small component is the same. It is assumed that the presence / absence of direction determination, the determination method, the threshold value, the error determination value, the direction determination height, and the direction determination angle are set in advance in the control unit of the mounting apparatus.

  As shown in FIG. 10, when the component Pa is sent to the component supply device 2a, the component Pa is taken out from the transport rail 4 by the nozzle 21 of the mounting head 3, and the component Pa is transported toward the mounting position on the substrate W. . Each process from ST101 to ST109 is performed during the conveyance of the component Pa. First, at the start of conveyance of the component Pa, SWEEP processing is performed on the component Pa (ST101). In the SWEEP process, the laser light source and the CCD line sensor are aligned with the height position of the component main body 71a, and the component main body 71a is irradiated with laser light while the component main body 71a is rotated. Then, a deviation amount of the position and orientation of the component Pa with respect to the nozzle 21 is calculated from the shadow of the component main body 71a, and the deviation amount is corrected.

  Next, the laser light source and the CCD line sensor are matched to the direction discrimination height, that is, the height of the lead 73a of the component Pa (ST102). Next, ONCE processing is performed on the component Pa in which the lead 73a is positioned at the direction discrimination height (ST103). In the ONCE process, the orientation of the component Pa is adjusted to the direction determination angle, and the lead 73a of the component Pa adjusted to the direction determination angle is irradiated with laser light. The left inner coordinates and right inner coordinates of the shadow of the lead 73a are acquired, and the center coordinates of the shadow of the lead 73a are calculated. When the left inner coordinates and right inner coordinates of the shadow of the lead 73a are acquired, the orientation of the component Pa is returned from the direction determination angle to the original angle.

  Next, it is determined whether or not the center coordinates are within an error range defined by the error determination value (ST104). When the center coordinates are within the error range (ST104: Yes), the part Pa is discarded because the lead 73a is bent (ST105). On the other hand, when the center coordinates are outside the error range (ST104: No), the center coordinates are compared with the value of the threshold α to determine whether the orientation of the component Pa is 90 degrees or 270 degrees.

  In ST106, when the orientation of the component Pa during normal supply to the control unit 18 is set to 90 degrees, it is determined whether or not the center coordinate is smaller than the threshold value α (ST107). When it is determined that the center coordinate is smaller than the threshold value α (ST107: Yes), it is assumed that the component Pa is supplied from the component supply device 2a to the mounting device 1 in a normal direction (90 degrees). The operation is performed (ST110). On the other hand, when it is determined that the center coordinate is equal to or larger than the threshold value α (ST107: No), it is assumed that the component Pa is supplied to the mounting device 1 from the component supply device 2a in an inverted direction (270 degrees). Is inverted and adjusted to a normal orientation (ST109). The component Pa that is aligned in the normal direction is inserted into the substrate W (ST110).

  In ST106, when the orientation of the component Pa at the time of normal supply to the control unit 18 is set to 270 degrees, it is determined whether or not the center coordinate is larger than the threshold value α (ST108). When it is determined that the center coordinate is larger than the threshold value α (ST108: Yes), it is assumed that the component Pa is supplied from the component supply device 2a to the mounting device 1 in a normal direction (270 degrees), and is inserted into the substrate W. The operation is performed (ST110). On the other hand, when it is determined that the center coordinate is equal to or less than the threshold value α (ST108: No), it is assumed that the component Pa is supplied from the component supply device 2a to the mounting device 1 in an inverted direction (90 degrees). Is inverted and adjusted to a normal orientation (ST109). The component Pa that is aligned in the normal direction is inserted into the substrate W (ST110).

  Thus, not only the posture of conveying the component Pa from the component supply device 2a but also the front and rear direction of the component Pa in the conveyance direction can be adjusted to the normal direction, thereby preventing erroneous mounting of the component Pa on the substrate W. it can. Further, the component Pa can be efficiently mounted on the substrate W by rotationally correcting the front-rear direction of the component Pa during the conveyance of the component Pa by the mounting head 3. In ST106, for example, the normal supply direction may be set to 90 degrees for the large component Pa, and the normal supply direction may be set to 270 degrees for the small component Pb.

  In this embodiment, the direction discrimination process is performed on the component with the lead. However, the direction discrimination process can be performed on the component without the lead. With reference to FIG. 11, a direction determination process using ONCE measurement will be described for a component without a lead. FIG. 11 is a diagram illustrating an example of ONCE measurement for a leadless component according to the present embodiment. In the following description, it is assumed that the orientation of the component during normal supply is set to 90 degrees and the orientation of the component during reverse supply is set to 270 degrees with respect to the control unit of the mounting apparatus. In FIG. 11, the coordinate axis is set so as to increase from the left side to the right side.

  As shown in FIG. 11A, the component Pc has a slope 77c inclined at about 45 degrees by cutting out one corner of a rectangle when viewed from above. Therefore, by rotating the component Pc by 45 degrees and irradiating the laser beam parallel to the inclined surface 77c, the shadow created by the component Pc with the threshold value α at the normal supply and the reverse supply is untargeted. . As shown in FIGS. 11B and 11C, the left inner coordinates and the right inner coordinates of the shadow formed by the component Pc are acquired by laser light irradiation. Then, the center coordinates of the left inner coordinates and the right inner coordinates are calculated, and the orientation of the component Pc is determined depending on whether the center coordinates are on the left or right with respect to the threshold value α.

  In the case of the orientation shown in FIG. 11B, the center coordinate Ac of the left inner coordinate Al and the right inner coordinate Ar of the shadow is positioned on the right side of the threshold value α, and the value of the central coordinate Ac is set higher than the threshold value α. . On the other hand, in the case of the orientation shown in FIG. 11C, the center coordinate Bc between the left inner coordinate Bl and the right inner coordinate Br of the shadow is positioned on the left side of the threshold α, and the value of the central coordinate Bc is set lower than the threshold α. Is done. For example, when the orientation shown in FIG. 11B indicates normal supply, the component P shown in FIG. 11C is rotated 180 degrees and adjusted to an appropriate orientation.

  The threshold value α is a coordinate stored in the control unit 18 in advance, and satisfies the requirement of α = (Ac + Bc) / 2, for example. Further, in the present embodiment, it is determined whether or not the dimensional error of the component Pc is within an appropriate range in addition to the above-described direction determination process. For example, when the center coordinates Ac and Bc are within a predetermined error range centered on the threshold value α, the part Pc is determined to be defective and discarded. Thereby, a defective product with a large dimensional error can be removed from the production line. Note that the error range is threshold α ± error determination value β, and satisfies the requirement of error determination value β = (Ac−α) / 2, for example.

  In the case of this component P, the direction determination process is performed in a flow substantially similar to that of the component with leads, but the process of adjusting the direction determination height (ST102) is omitted in the flowchart shown in FIG. As described above, in the mounting apparatus 1 according to the present embodiment, even if there is a lead-free component Pc, if there is a difference in the shadow formed by the component Pc between the normal supply and the reverse supply in the ONCE measurement, Direction discrimination processing can be performed.

  As described above, according to the component supply device 2 according to the present embodiment, even if the component P is an electronic component such as a deformed component or a connector, only the component P in a predetermined posture is selected by the distribution unit 43. The dropping unit 44 converts the mounting head 3 into a posture in which the mounting head 3 can be taken out. Therefore, since the component P is supplied to the mounting apparatus 1 with the lead 73 facing downward, it is not necessary to change the posture of the component P on the mounting apparatus 1 side, and the component P is placed on the horizontally mounted substrate W. The component P can be supplied in an appropriate posture to the mounting apparatus 1 to be mounted.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above-described embodiment, the configuration is such that the parts are distributed by the strip-shaped guide portion and the chamfered portion, but the present invention is not limited to this configuration. The distribution unit may be configured to pass only parts in a predetermined posture. In addition, the distribution unit is configured to pass only the components in the horizontal orientation, but may be configured to pass only the components in the vertical orientation.

  Further, in the above-described embodiment, the component is supplied to the mounting apparatus in the vertical orientation in which the lead is directed downward by the distributing unit and the dropping unit. However, the present invention is not limited to this configuration. If the mounting nozzle corresponds to a horizontally oriented component with the leads facing sideways, the component may be supplied to the mounting device in a horizontally oriented state.

  In the above-described embodiment, the component supply device supplies the leaded component to the mounting device. However, the present invention is not limited to this configuration. The component supply device can also supply components without leads to an appropriate posture and supply them to the mounting device by the sorting unit and dropping unit.

  Further, in the above-described embodiment, the belt-shaped plate material is extended as the first guide portion so as to cross over the conveying path, but the present invention is not limited to this configuration. The first guide unit may be configured in any way as long as it allows only a part in a predetermined posture to pass through.

  Further, in the above-described embodiment, the arch-shaped plate material is arranged as the second guide portion so as to straddle the conveyance path, but is not limited to this configuration. The 2nd guide part should just be the structure contact | abutted to components other than a basic attitude | position, and dropping from a conveyance path.

  In the above-described embodiment, the conveyance width of the conveyance path is narrowed by the chamfering portion as the width reducing portion, but the present invention is not limited to this configuration. The width reduction unit may be configured to reduce the conveyance width of the conveyance path. For example, the conveyance width may be reduced by a notch.

  In the above-described embodiment, the electronic component is mounted on the substrate. However, the present invention is not limited to this configuration. The electronic component may be configured to be mounted on a base material other than the substrate.

  In the above-described embodiment, the bowl feed is exemplified as the component supply device, but the present invention is not limited to this configuration. For example, a sorting unit, a dropping unit, a direction determination process, and the like can be applied to a bulk feeder or the like.

  In the above-described embodiment, the direction determination process is performed using ONCE measurement. However, the present invention is not limited to this configuration. What is necessary is just to be able to discriminate the reverse in the front and back in the conveying direction of the component. For example, it is possible to perform the direction discriminating process using SWEEP measurement.

  As described above, the present invention has an effect that parts such as odd-shaped parts and connectors with leads can be supplied to the mounting apparatus in a desired posture. This is useful for a component supply device that supplies radial components with leads to a mounting device for mounting components.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 2 Component supply apparatus 3 Mounting head 4 Conveying rail 18 Control part (discriminating part)
21 Nozzle 22 Laser unit 31 Bowl (container)
41 Sending section 42 Conveying path 43 Sorting section 44 Dropping section 51 Guide section (first guide section)
52 Chamfered part (width reduction part)
55 Guide part (second guide part)
63 Slope (guide surface)
71 Component body 72 Mounting surface 73 Lead P Component

Claims (10)

A component supply device for aligning and supplying the component by vibration to a mounting device for mounting the component on a substrate,
On the conveyance path of the component, a distribution unit that passes the component in a predetermined posture with the mounting surface with respect to the base material directed in one direction, and removes the component other than the predetermined posture from the conveyance path;
A dropping unit that changes the posture of the parts aligned in the sorting unit to a posture that is taken out by the mounting device by a recess provided in the conveyance path ;
The sorting unit allows a component having the mounting surface directed to one side to pass,
The drop feeding unit changes the posture of the component that has passed through the sorting unit by the depression so that the mounting surface faces downward . A storage container for storing the component on the upstream side of the transport path;
The component supply apparatus according to claim 1 , wherein a component removed from the conveyance path in the sorting unit is returned to the storage container. In the component, the lead protrudes outward from the mounting surface of the rectangular parallelepiped component body,
The height of the component is lower in the horizontal posture in which the component body is tilted so that the lead faces sideways than in the vertical posture in which the component body is raised so that the lead faces vertically. The component supply apparatus according to claim 1 or 2 . The distribution unit crosses the upper part of the horizontal position in the transport path, claim 3, wherein the components of the vertical orientation having a first guide portion for guiding towards outside the conveying path The component supply apparatus described in 1. The conveyance path is open on one side in the conveyance width direction,
The sorting unit has a width reduction unit that narrows the conveyance width of the conveyance path,
The conveyance path narrowed by the width reducing unit allows the parts in the basic posture with the leads facing the open side of the conveyance path among the parts in the lateral orientation to pass the parts other than the basic attitude in the conveyance direction. The component supply device according to claim 3 or 4 , wherein the component supply device is dropped from one side of the road. The sorting part has a second guide part that contacts a part other than the basic posture on one side of the narrow part of the transport path and guides the part toward the width reducing part,
The component supply apparatus according to claim 5 , wherein the second guide portion does not contact the component in the basic posture. The depression of the drop part is formed so as to narrow the conveyance width of the conveyance path and roll the component in the lateral orientation by its own weight,
Parts of the horizontal position, by being incorporated dropped into the recess, according to claims 3, characterized in that the position change in the vertical position toward the lead downwardly to claim 6 Parts supply device. 8. The guide according to claim 7 , wherein a guide surface for guiding the tip of the lead is formed in the recess so that the lead in the lateral orientation faces downward when the posture of the component in the lateral orientation is changed. Parts supply device. 9. A mounting apparatus comprising: a determination unit configured to determine whether or not the component conveyed by the component supply device according to claim 1 is reversed in the conveyance direction. The determination unit is provided in a mounting head that takes out the component from the component supply device and mounts the component on the substrate.
The mounting apparatus according to claim 9 , wherein the determination unit determines whether the component is reversed in the front-rear direction between the time when the mounting head is taken out and the time when the component is mounted.

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