JP5727977B2 - Optical semiconductor device - Google Patents

Description

  The present invention relates to a thermosetting light reflecting resin composition used in an optical semiconductor device in which an optical semiconductor element and a wavelength conversion means such as a phosphor are combined, an optical semiconductor element mounting substrate using the resin composition, and The present invention relates to a manufacturing method and an optical semiconductor device.

As an optical semiconductor device using an optical semiconductor element, an SMD (Surface Mounted Device) type LED (Light Emitting Diode) configured as shown in FIG. 5 is known. In this LED, a light emitting element is usually arranged in a cup-shaped part (concave part) formed on a mount substrate reflector, and a transparent sealing resin containing a phosphor is filled in the cup-shaped part in which the light emitting element is arranged. ing. The reflector is used for the purpose of increasing the on-axis strength by diffusing and reflecting the light emitted from the light-emitting element to the side and distributing it in the axial direction.
In recent years, an optical semiconductor device such as an LED has advantages such as high energy efficiency and long life, and therefore, the demand for outdoor displays, portable liquid crystal backlights, in-vehicle applications, and the like is expanding. As a result, the brightness of LED devices has increased, and there has been a problem of heat resistance degradation and light resistance degradation of materials due to an increase in junction temperature due to an increase in the amount of heat generated by the element or a direct increase in light energy. Patent Document 1 discloses a substrate for mounting an optical semiconductor element formed by molding a thermosetting light reflecting resin composition having excellent light reflection characteristics after a heat resistance test.

JP 2006-140207 A

When molding a thermosetting light reflecting resin composition, for example, the resin composition is press-molded into a cylindrical tablet using a mortar mold and a saddle mold mold, and then the tablet is molded. Molded into a desired shape by transfer molding. However, the conventional thermosetting light reflecting resin composition has a problem that it easily adheres to the surface of a mortar type or a bowl type used at the time of tablet molding, so that the tablet is easily broken. FIG. 1 is a schematic diagram illustrating adhesion of a resin composition to a mold when a tablet made of a thermosetting resin is molded using the mold. In the figure, reference numeral 1 is a mortar type, 2 is an upper punch type, 3 is a lower punch type, 4 is a resin composition (tablet), 5 is a resin composition attached to the punch, and in the figure the resin composition is gold It shows a state where the tablet is attached to the mold surface and destroyed. Moreover, the tablet which consists of the conventional thermosetting light reflection resin composition has the problem that the mechanical strength with respect to external force is low, and the crack etc. after tablet completion are easy to produce.
In view of the above, the present invention is a thermosetting light capable of obtaining a tablet-molded body having excellent mechanical strength without adhering to the surface of a mold or mortar of a molding die during tablet molding. It is an object of the present invention to provide a reflective resin composition, a substrate for mounting an optical semiconductor element using the resin composition, a manufacturing method thereof, and an optical semiconductor device.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors, as an inorganic filler of a thermosetting light reflecting resin composition for an optical semiconductor, in addition to conventionally used inorganic fillers The inventors have found that the above object can be achieved by using an inorganic filler having a large number of fine pores (hereinafter referred to as a porous filler) or an oil-absorbing compound, and the present invention has been completed based on this finding. It came to do.

  That is, the present invention is characterized by the following items (1) to (14).

(1) In a resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, and (F) a coupling agent, D) A thermosetting light-reflecting resin composition comprising a porous filler or an oil-absorbing compound as at least one component of the inorganic filler and the (E) white pigment.

(2) The porous filler or the compound having an oil-absorbing property is at least one selected from the group consisting of a spherical shape, a crushed shape, a disc shape, a rod shape, and a fiber shape. The thermosetting light reflecting resin composition according to (1).

(3) The above porous filler or oil-absorbing compound is silica, alumina, magnesium oxide, antimony oxide, titanium oxide, zirconium oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, barium carbonate, zeolite. The thermosetting light reflecting resin composition as described in (1) or (2) above, wherein the resin composition is at least one member selected from the group consisting of norbornene rubber and acrylonitrile / butadiene / styrene copolymer resin .

(4) The thermosetting as described in any one of (1) to (3) above, wherein the surface of the porous filler or the oil-absorbing compound is hydrophobized or hydrophilized. A resin composition for light reflection.

(5) The thermosetting property as set forth above in any one of (1) to (4), wherein the apparent density of the porous filler or the oil-absorbing compound is 0.4 g / cm ³ or more. A resin composition for light reflection.

(6) Based on the total amount of the (D) inorganic filler and the (E) white pigment, the content of the porous filler or the oil-absorbing compound is 0.1% by volume to 20% by volume. The thermosetting light reflecting resin composition according to any one of the above (1) to (5), which is in a range.

(7) The (D) inorganic filler is at least one selected from the group consisting of silica, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, and barium carbonate having no porous structure or oil absorption. The thermosetting light reflecting resin composition according to any one of the above (1) to (6), comprising:

(8) The above (E), wherein the white pigment (E) is at least one selected from the group consisting of alumina, magnesium oxide, antimony oxide, titanium oxide, zirconium oxide, and inorganic hollow particles. The thermosetting light reflecting resin composition according to any one of to (7).

(9) The thermosetting light reflecting resin as described in any one of (1) to (8) above, wherein the average particle diameter of the white pigment (E) is in the range of 0.1 to 50 μm. Composition.

(10) The above (1), wherein the total content of the (D) inorganic filler and the (E) white pigment is in the range of 10% by volume to 85% by volume with respect to the entire resin composition. The thermosetting resin composition for light reflection according to any one of (9) to (9).

(11) An optical semiconductor element mounting substrate comprising the thermosetting light reflecting resin composition according to any one of (1) to (10).

(12) An optical semiconductor element mounting substrate in which one or more recesses to be an optical semiconductor element mounting region are formed, and at least an inner peripheral side surface of the recess is described in any one of (1) to (10). A substrate for mounting an optical semiconductor element, comprising: a thermosetting resin composition for light reflection.

(13) A method for manufacturing a substrate for mounting an optical semiconductor element in which one or more recesses serving as an optical semiconductor element mounting region are formed, wherein at least the recess is described in any one of (1) to (10) above. A method for producing a substrate for mounting an optical semiconductor, wherein the optical semiconductor mounting substrate is formed by transfer molding using a thermosetting resin composition for light reflection.

(14) The optical semiconductor element mounting substrate according to (12), the optical semiconductor element mounted on the bottom surface of the concave portion of the optical semiconductor element mounting substrate, and the optical semiconductor element formed in the concave portion so as to cover the optical semiconductor element. An optical semiconductor device comprising at least the phosphor-containing transparent sealing resin layer.

In the present invention, the “porous filler” means a filler having a specific surface area of 10 m ² / g or more, and the “compound having oil absorbency” means an oil absorption amount defined by JIS K5101 of 10 ml / g. It means a compound of 100 g or more.

  ADVANTAGE OF THE INVENTION According to this invention, for thermosetting light reflection which can obtain the tablet molding which has the outstanding mechanical strength, without adhering to the surface of the metal mold | die or mortar type | mold used at the time of tablet shaping | molding It becomes possible to provide a resin composition, a substrate for mounting an optical semiconductor element using the resin composition, a manufacturing method thereof, and an optical semiconductor device.

It is the schematic explaining adhesion of the resin composition with respect to a metal mold | die at the time of shape | molding the tablet which consists of thermosetting resins using a metal mold | die. It is a figure which shows one Embodiment of the board | substrate for optical semiconductor element mounting of this invention, (a) is a perspective view, (b) is side sectional drawing. It is the schematic explaining the manufacturing method of the board | substrate for optical semiconductor element mounting of this invention, (a)-(c) respond | corresponds to each process in the case of manufacturing a board | substrate by transfer molding. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the optical semiconductor device of this invention, (a) And (b) is side sectional drawing which shows the structure of an apparatus typically, respectively. It is side surface sectional drawing which shows a general SMD type LED (optical semiconductor device).

  The thermosetting light reflecting resin composition of the present invention comprises (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, and (F) a cup. A ring agent is included, and a porous filler or an oil-absorbing compound is included as at least one component of the (D) inorganic filler and the (E) white pigment. Of course, a compound having a porous structure and having an oil absorbing property may be used as at least one component of the (D) inorganic filler and the (E) white pigment.

  The porous filler or the oil-absorbing compound is not particularly limited, and examples thereof include silica, alumina, magnesium oxide, antimony oxide, titanium oxide, zirconium oxide, aluminum hydroxide, water having a porous structure or oil-absorbing property. Examples thereof include magnesium oxide, barium sulfate, magnesium carbonate, barium carbonate, zeolite, norbornene rubber, acrylonitrile / butadiene / styrene copolymer resin, and these may be used alone or in combination. Silica, alumina, or a mixture thereof is preferable from the viewpoint of thermal conductivity, light reflection characteristics, and moldability.

  In addition, the shape of the porous filler or the oil-absorbing compound is not particularly limited, and for example, a spherical shape, a crushed shape, a disk shape, a rod shape, a fiber shape, or the like can be used. Considering the fluidity in the mold at the time of transfer molding, a spherical shape and a crushed shape are preferable, and a true spherical shape is more preferable.

  Further, the surface of the porous filler or the compound having oil absorbency may be subjected to a physical or chemical hydrophilization treatment or a hydrophobization treatment. Preferably, the surface is subjected to a hydrophobic treatment, and the surface is more preferably subjected to a chemical hydrophobic treatment so that the oil absorption amount (a prescribed amount according to JIS K5101) is 50 ml / 100 g or more. By using a porous filler whose surface is hydrophobized or an oil-absorbing compound, the adhesiveness with the (A) epoxy resin or the (B) curing agent is increased, and as a result, a thermoset machine. Strength and fluidity during transfer molding are improved. Further, by using a porous filler or an oil-absorbing compound whose surface has been subjected to a hydrophobic treatment so that the oil absorption amount is 50 ml / 100 g or more, the adhesiveness with the above-mentioned (A) epoxy resin is improved and mixed. The pot life reduction of the resin composition after tempering can be suppressed, and coloring can also be suppressed at the time of thermosetting. Examples of the porous filler subjected to such a hydrophobization treatment include Silo Hovic 702 sold by Fuji Silysia Chemical Co., Ltd.

Further, the apparent density of the porous filler or a compound having an oil absorbency is not particularly limited, it is preferably 0.4 g / cm ³ or more, to be 0.4 to 2.0 g / cm ³ More preferred. The apparent density is a density in consideration of the density occupied by the raw material of the porous filler or the oil-absorbing compound and the space occupied by the fine pores (that is, the pore volume). When this apparent density is less than 0.4 g / cm ³ , the mechanical strength of the filler particles is small, and the particles may be destroyed at the time of melt-kneading that generates shearing force such as a mixing roll mill. is there. On the other hand, when the apparent density exceeds 2.0 g / cm ³ , the resin composition tends to easily adhere to the surface of the mortar mold and bowl mold during tablet molding.

  The average particle diameter of the porous filler or the oil-absorbing compound is preferably 0.1 to 100 μm, and more preferably in the range of 1 to 10 μm in view of packing efficiency with a white pigment. . If the average particle size is larger than 100 μm or smaller than 0.1 μm, the fluidity of the resin composition tends to be poor at the time of melting during transfer molding.

The specific surface area of the porous filler or a compound having an oil absorbency is preferably 100~1000m ² / g, more preferably 300~700m ² / g. When the specific surface area is smaller than 100 m ² / g, the oil absorption amount of the resin by the filler is decreased, and the resin tends to adhere to the bowl at the time of tablet molding, and when the specific surface area is larger than 1000 m ² / g, The fluidity of the resin composition tends to deteriorate during melting during transfer molding.

  Further, the content of the porous filler or the oil-absorbing compound is not particularly limited, but is 0.1 volume% to 20 volume based on the total amount of (D) inorganic filler and (E) white pigment. % Is preferable. Considering the moldability of the resin composition at the time of melting, it is more preferably 1% by volume to 5% by volume. When this content is less than 0.1% by volume, a part of the resin composition tends to adhere to the surfaces of the mortar mold and bowl mold, and when it is greater than 20% by volume, transfer molding is performed. At the time of melting, the fluidity of the resin composition tends to decrease. For example, when the silophobic 702 is used as the porous filler, the content may be 5% by volume or less from the viewpoint of fluidity when the resin composition is melted and strength of the resin cured product. preferable.

  The epoxy resin (A) contained in the resin composition of the present invention is particularly limited as long as it is usually blended as a conventional thermosetting light reflecting resin composition or epoxy resin molding material. Can be used. For example, phenol novolac type epoxy resin, orthocresol novolak type epoxy resin and other phenols and aldehyde novolak resins epoxidized, bisphenol A, bisphenol F, bisphenol S, alkyl-substituted bisphenol, etc. Diglycidyl ether, diaminodiphenylmethane, isocyanuric acid and other polyamines obtained by the reaction of epichlorohydrin with glycidylamine type epoxy resins, linear aliphatic epoxy resins obtained by oxidizing olefinic bonds with peracids such as peracetic acid, alicyclics An epoxy resin etc. are mentioned, These may be individual or may be used together 2 or more types. Among these epoxy resins, those having relatively little color are preferable, and examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, diglycidyl isocyanurate, and triglycidyl isocyanurate. it can.

  As said (B) hardening | curing agent, if it reacts with an epoxy resin, it can use without being restrict | limited especially, However, The thing without a coloring is preferable. For example, an acid anhydride curing agent, an isocyanuric acid derivative, a phenolic curing agent, and the like can be given. Examples of the acid anhydride curing agent include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, glutaric anhydride. Acid, dimethylglutaric anhydride, diethylglutaric anhydride, succinic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride and the like. Examples of isocyanuric acid derivatives include 1,3,5-tris (1-carboxyl Methyl) isocyanurate, 1,3,5-tris (2-carboxyethyl) isocyanurate, 1,3,5-tris (3-carboxypropyl) isocyanurate, 1,3-bis (2-carboxyethyl) isocyanurate Etc. Among these curing agents, phthalic anhydride, trimellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, glutaric anhydride, dimethylglutaric anhydride, anhydrous Diethyl glutaric acid and 1,3,5-tris (3-carboxypropyl) isocyanurate are preferably used. The curing agent preferably has a molecular weight of about 100 to 400, and is preferably colorless or light yellow.

  Moreover, the compounding ratio of (A) epoxy resin and (B) hardening | curing agent is the active group (B) hardening | curing agent (B) which can react with the said epoxy group with respect to 1 equivalent of epoxy groups in (A) epoxy resin. The ratio is such that the acid anhydride group or hydroxyl group is 0.5 to 1.2 equivalents, and more preferably 0.6 to 0.8 equivalents. When the said active group is less than 0.5 equivalent, while the cure rate of an epoxy resin composition becomes slow, the glass transition temperature of the hardened | cured material obtained becomes low, and sufficient elastic modulus may not be obtained. On the other hand, when the active group exceeds 1.2 equivalents, the strength after curing may decrease.

  The (C) curing catalyst (curing accelerator) is not particularly limited, and for example, 1,8-diaza-bicyclo (5,4,0) undecene-7, triethylenediamine, tri-2,4. Tertiary amines such as 1,6-dimethylaminomethylphenol, imidazoles such as 2-ethyl-4methylimidazole and 2-methylimidazole, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, tetra-n-butylphosphonium-o , O-diethyl phosphorodithioate, tetra-n-butylphosphonium-tetrafluoroborate, phosphorus compounds such as tetra-n-butylphosphonium-tetraphenylborate, quaternary ammonium salts, organometallic salts, and derivatives thereof Can be mentioned. These may be used alone or in combination. Among these (C) curing catalysts, tertiary amines, imidazoles, and phosphorus compounds are preferably used.

  The content of the (C) curing catalyst is preferably 0.01 to 8.0% by weight, more preferably 0.1 to 3.0% by weight with respect to the (A) epoxy resin. is there. (C) When the content of the curing catalyst is less than 0.01% by weight, the curing acceleration effect may not be sufficiently obtained. When the content exceeds 8.0% by weight, discoloration is observed in the resulting molded product. There is.

  The (D) inorganic filler other than the porous filler or the oil-absorbing compound is not particularly limited. For example, silica, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, barium carbonate, etc. having no porous structure or oil absorption can be used, and these may be used alone or in combination of two or more. . Silica, aluminum hydroxide, magnesium hydroxide, or a mixture thereof is preferable from the viewpoint of thermal conductivity, light reflection characteristics, and moldability. Moreover, the average particle diameter of the (D) inorganic filler is not particularly limited, but it is preferable to use an inorganic filler having a range of 1 to 100 μm so that the packing with the white pigment is efficient.

The white pigment (E) is not particularly limited. For example, alumina, magnesium oxide, antimony oxide, titanium oxide, zirconium oxide, inorganic hollow particles, and the like can be used, and these can be used alone or in combination of two or more. It doesn't matter. Examples of the inorganic hollow particles include sodium silicate glass, aluminum silicate glass, borosilicate soda glass, and shirasu. Moreover, it is preferable that the average particle diameter of the said (E) white pigment exists in the range of 0.1-50 micrometers. If the thickness is less than 0.1 μm, the particles tend to aggregate and the dispersibility tends to deteriorate, and if it exceeds 50 μm, the reflective properties of the cured product tend to be insufficient.
Moreover, it is preferable that the total content of the (D) inorganic filler and the (E) white pigment is in the range of 10% by volume to 85% by volume with respect to the entire resin composition. If the total content is less than 10% by volume, the light reflection characteristics of the cured product tend not to be sufficiently obtained. If the total content exceeds 85% by volume, the moldability of the resin composition tends to be poor, and it becomes difficult to produce a substrate. It is in.

  Although it does not specifically limit as said (F) coupling agent, For example, a silane coupling agent and a titanate coupling agent can be used. As the silane coupling agent, generally, epoxy silane, amino silane, cationic silane, vinyl silane, acryl silane, mercapto silane, and composites thereof can be used at an arbitrary ratio. Moreover, although the kind and process conditions of said (F) coupling agent are not specifically limited, It is preferable that the compounding quantity shall be 5 weight% or less with respect to the whole resin composition.

  In addition to the above components (A) to (F), the resin composition of the present invention may contain additives such as known antioxidants, mold release agents, and ion supplementing agents as necessary. Good.

  The thermosetting light reflecting resin composition of the present invention containing the components as described above is preferably capable of being pressure-molded (tablet molding) at room temperature (0 to 30 ° C.) before thermosetting. It is desirable that the light reflectance at a wavelength of 350 nm to 800 nm after thermosetting is 80% or more. If the light reflectance is less than 80%, there is a tendency that the light semiconductor device cannot sufficiently contribute to the improvement of the luminance of the optical semiconductor device. A more preferable light reflectance is 90% or more. In addition, the said press molding should just be able to perform shaping | molding on the conditions of 5-50 MPa and about 1-5 second at room temperature, for example. The mold used for pressure molding (tablet molding) is not particularly limited. For example, a pair of a mortar mold and a bowl mold made of a ceramic material, a fluorine resin material, or the like, or an upper mold having a recess and a lower mold are used. It is preferable to use what is comprised of a pair with a mold. Moreover, it is preferable to use the metal mold | die consisting of a white material which does not have a fear of tablet coloring.

  Further, the thermosetting light reflecting resin composition of the present invention can be obtained by uniformly dispersing and mixing the various components described above, and means and conditions thereof are not particularly limited. Examples include a method in which components of a predetermined blending amount are sufficiently uniformly stirred and mixed by a mixer or the like, then (melted) kneaded by a mixing roll, an extruder, a kneader, a roll, an extruder, etc., and further cooled and pulverized. . The conditions for (melting) kneading may be appropriately determined depending on the type and blending amount of the components, and are not particularly limited, but are preferably (melting) kneading in the range of 15 to 100 ° C for 5 to 40 minutes, and 20 to 100 ° C. It is more preferable to perform kneading (melting) for 10 to 30 minutes within the above range. When the (melting) kneading temperature is less than 15 ° C., it is difficult to (melt) kneading each component, and the dispersibility tends to decrease. When the temperature is higher than 100 ° C., the resin composition has a high temperature. There is a possibility that the molecular weight proceeds and the resin composition is cured.

  The substrate for mounting an optical semiconductor element of the present invention is formed using the thermosetting light reflecting resin composition of the present invention, and, for example, one or more recesses to be an optical semiconductor element mounting region are formed, At least the inner peripheral side surface of the recess is made of the thermosetting light reflecting resin composition of the present invention. 2A and 2B show an embodiment of a substrate for mounting an optical semiconductor element of the present invention, wherein FIG. 2A is a perspective view and FIG. 2B is a side sectional view. The optical semiconductor element mounting substrate 110 of the present invention shown in FIG. 2 is an optical semiconductor element mounting region in which the reflector 103 and the wiring pattern (lead frame) including the Ni / Ag plating 104 and the metal wiring 105 are integrated. It has the structure where the recessed part 200 was formed, and the inner peripheral side surface of the reflector which forms the side wall of the recessed part 200 is comprised from the thermosetting light reflecting resin composition of this invention, It is characterized by the above-mentioned.

  Although the manufacturing method of the optical semiconductor element mounting substrate of this invention is not specifically limited, For example, it is preferable to manufacture the thermosetting light reflection resin composition of this invention by transfer molding. FIG. 3 is a schematic view for explaining a method for manufacturing a substrate for mounting an optical semiconductor element according to the present invention, and FIGS. 3A to 3C correspond to respective steps in manufacturing a substrate by transfer molding. More specifically, as shown in FIG. 3A, the substrate for mounting an optical semiconductor element is formed with a metal wiring 105 by a known method such as punching or etching from a metal foil. The thermosetting light reflecting resin composition of the present invention is injected from the resin injection port 300 of the mold 301 by placing it in the shaped mold 301 (FIG. 3B). Subsequently, the injected resin composition is preferably cured at a mold temperature of 170 to 190 ° C. and a molding pressure of 2 to 8 MPa for 60 to 120 seconds, then the mold 301 is removed, and the after cure temperature is 120 to 180 ° C. Heat cure for ~ 3 hours. Next, Ni / is deposited by electroplating on a predetermined position of the optical semiconductor element mounting region (recessed portion) (reference numeral 200 in FIG. 2) surrounded by the reflector 103 made of the cured thermosetting light reflecting resin composition. It can manufacture by giving silver plating 104 (FIG.3 (c)).

  An optical semiconductor device using the optical semiconductor element mounting substrate of the present invention includes, for example, an optical semiconductor element mounting substrate of the present invention, an optical semiconductor element mounted on the bottom surface of the recess of the optical semiconductor element mounting substrate, And a phosphor-containing transparent sealing resin layer formed in the recess so as to cover the optical semiconductor element. FIG. 4A and FIG. 4B are side cross-sectional views showing an embodiment of the optical semiconductor device of the present invention. More specifically, in the optical semiconductor device shown in FIG. 4, the optical semiconductor element 100 is mounted at a predetermined position of the bottom (concave portion) in the optical semiconductor element mounting region of the optical semiconductor element mounting substrate 110 of the present invention. The optical semiconductor element 100 and the metal wiring 105 are electrically connected through a Ni / silver plating 104 by a known method such as a bonding wire 102 or a solder bump 107, and the optical semiconductor element 100 includes a known phosphor 106. Covered with a transparent sealing resin 101.

  EXAMPLES Hereinafter, although an Example explains in full detail this invention, this invention is not limited to the following description.

(Examples 1-5, Comparative Examples 1-3)
1. Preparation of Thermosetting Light Reflecting Resin Composition After blending each component according to the blending table shown in Table 1, sufficiently kneading with a mixer, melt-kneading under a predetermined condition with a mixing roll, cooling and grinding, Examples Thermosetting light reflecting resin compositions of 1 to 5 and Comparative Examples 1 to 3 were prepared. In addition, the unit of the compounding quantity of each component in a table | surface is a weight part, and a blank represents no compounding.

2. Evaluation of Thermosetting Light Reflective Resin Composition The resin composition of each Example and each Comparative Example was evaluated for the light reflectivity and tablet moldability of the cured product by the following test methods. The results are shown in Table 1.

(Light reflectivity test)
The resin composition of each example and each comparative example was formed by transfer molding under the conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 90 seconds, and then post-cured at 150 ° C. for 2 hours to obtain a thickness of 1 A test piece of 0.0 mm was produced. Next, the light reflectance at a wavelength of 400 nm was measured with an integrating sphere type spectrophotometer V-750 type (manufactured by JASCO Corporation), and the light reflectivity of each test piece was evaluated according to the following evaluation criteria.
・ Evaluation criteria ○: Light reflectance of 80% or more at a light wavelength of 400 nm
Δ: Light reflectance of 70% or more and less than 80% at a light wavelength of 400 nm
×: Light reflectance of less than 70% at a light wavelength of 400 nm

(Tablet molding test)
Using a molding die composed of a pair of a saddle type and a mortar type whose material is alumina and whose contact surface with the resin is a cemented carbide (see FIG. 1), the resin compositions of the examples and comparative examples are used. , Under pressure, at room temperature (25 ° C.), under a molding pressure of 5 MPa, 10 MPa, 30 MPa, and 3 seconds to produce a tablet.
Thereafter, the resin composition was adhered to the wrinkle surface and the tablet was broken, and cracks of the obtained tablet were evaluated according to the following evaluation criteria.
・ Evaluation criteria for resin composition sticking and tablet breakage ○: Sticking by visual observation, tablet breakage cannot be confirmed.
X: Sticking by visual observation, destruction of the tablet is observed.
-Evaluation criteria for tablet cracks ○: Tablet cracks cannot be confirmed visually.
X: The crack of a tablet is recognized visually.

(Note)
Details of each component in Table 1 are as follows.

(1) Triglycidyl isocyanurate: epoxy equivalent 100, manufactured by Nissan Chemical Industries, Ltd., trade name “TEPIC-S”
(2) Hexahydrophthalic anhydride: manufactured by Wako Pure Chemical Industries, Ltd., active group equivalent 154 capable of reacting with an epoxy group
(3) Tetra-n-butylphosphonium-o, o-diethyl phosphorodithioate: Nippon Chemical Industry Co., Ltd., trade name “PX-4ET”
(4) Trimethoxyepoxysilane: Toray Dow Corning Co., Ltd., trade name “A-187”
(5) Fatty acid ester (manufactured by Clariant Co., Ltd., trade name “Hoechst Wax E”)
(6) Aliphatic ether (trade name “Unitox 420” manufactured by Toyo Petrolite Co., Ltd.)
(7) Fused spherical silica 1 (trade name “FB-950”, manufactured by Denki Kagaku Kogyo Co., Ltd.)
(8) Fused spherical silica 2 (manufactured by Denki Kagaku Kogyo Co., Ltd., trade name “FB-301”)
(9) Crushed silica (manufactured by Denki Kagaku Kogyo Co., Ltd., trade name “FS30”)
(10) Hollow particles (manufactured by Sumitomo 3M Co., Ltd., trade name “S60-HS”, borosilicate glass)
(11) Alumina (manufactured by Admatechs Co., Ltd., trade name “AO-25R”)
(12) Porous spherical silica (manufactured by Fuji Silysia Chemical Co., Ltd., trade name “Syrosphere C-1504”, average particle size 3 μm, apparent density 0.58 g / ml, specific surface area 300 m ² / g)
(13) Porous amorphous silica (manufactured by Fuji Silysia Chemical Ltd., trade name “Silo Hovic 702”, average particle diameter 4 μm, apparent density 0.48 g / ml, specific surface area 300 m ² / g)
(14) Porous amorphous silica (manufactured by Fuji Silysia Chemical Ltd., trade name “Silysia 435”, average particle size 4 μm, apparent density 0.48 g / ml, specific surface area 300 m ² / g)

  As shown in Table 1, the thermosetting light reflecting resin compositions according to the present invention of Examples 1 to 5 are excellent in light reflecting properties of the cured product, and do not adhere to the pestle and die during tableting. It can be seen that the tablet obtained has excellent mechanical strength. In the case of performing transfer molding, in the future, it is assumed that an apparatus such as a robot arm is used to perform molding automation and continuous molding, but by using the thermosetting light reflecting resin composition of the present invention, Automatic continuous molding can be performed without causing problems such as destruction of the tablet when the arm grips the tablet. As a result, in the manufacturing process of the optical semiconductor element mounting substrate and the optical semiconductor device, the yield is greatly improved, which is very advantageous in terms of productivity such as cost and manufacturing time.

1 mortar type 2 upper mold type 3 lower mold type 4 tablet (resin composition)
5 Resin composition attached to bowl-shaped 100 Photonic semiconductor element (LED element)
DESCRIPTION OF SYMBOLS 101 Transparent sealing resin 102 Bonding wire 103 Reflector 104 Ni / Ag plating 105 Metal wiring 106 Phosphor 107 Solder bump 110 Optical semiconductor element mounting substrate 200 Optical semiconductor element mounting area (recessed part) )
300 Resin injection port 301 Transfer mold 400 LED element 401 Bonding wire 402 Transparent sealing resin 403 Reflector 404 Lead 405 Phosphor 406 Die bond material

Claims (10)

One or more recesses to be an optical semiconductor element mounting region is formed, and at least an inner peripheral side surface of the recess is an optical semiconductor element mounting substrate made of a light-reflective thermosetting resin composition;
An optical semiconductor element mounted on the bottom of the recess of the optical semiconductor element mounting substrate;
A phosphor-containing transparent sealing resin layer formed in the recess so as to cover the optical semiconductor element;
An optical semiconductor device comprising at least
The light-reflective thermosetting resin composition includes an epoxy resin, a curing agent, an inorganic filler, and a white pigment, and at least one component of the inorganic filler and the white pigment is a porous filler or an oil-absorbing property. look-containing compounds having the porous filler or a compound having an oil absorbing silica optical semiconductor device according to claim containing Mukoto a having a porous structure or oil absorbing. The shape of the porous filler or the compound having oil absorbency is at least one selected from the group consisting of a spherical shape, a crushed shape, a disc shape, a rod shape, and a fiber shape. An optical semiconductor device according to 1. 3. The optical semiconductor device according to claim 1, wherein a surface of the porous filler or the oil-absorbing compound is subjected to a hydrophobic treatment or a hydrophilic treatment. 4. The apparent density of the porous filler or a compound having an oil absorption property, an optical semiconductor device according to any one of claims 1 to 3, characterized in that 0.4 g / cm ³ or more. The content of the porous filler or an oil-absorbing compound is in the range of 0.1% by volume to 20% by volume based on the total amount of the inorganic filler and the white pigment. the optical semiconductor device according to any one of clauses 1-4. The inorganic filler contains at least one selected from the group consisting of silica, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, and barium carbonate, which has no porous structure or oil absorption. the optical semiconductor device according to any one of claims 1 to 5, wherein. The white pigment, alumina, magnesium oxide, antimony oxide, titanium oxide, any one of the claims 1-6, characterized in that it comprises at least one selected from the group consisting of zirconium oxide and inorganic hollow particles, An optical semiconductor device according to item . The average particle size of the white pigment, the optical semiconductor device according to any one of claims 1 to 7, characterized in that in the range of 0.1 to 50 [mu] m. The total content of the inorganic filler and the white pigment, relative to the entire resin composition, according to any one of claims 1 to 8, characterized in that in the range of 10 vol% to 85 vol% Optical semiconductor device. The optical semiconductor device according to any one of claims 1 to 9, characterized in that at least the recess is formed by transfer molding using a light reflecting thermosetting resin composition.

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