JP5724638B2 - Ｐｂフリーはんだ及びはんだ被覆導体並びにそれを用いた電気部品 - Google Patents

Ｐｂフリーはんだ及びはんだ被覆導体並びにそれを用いた電気部品 Download PDF

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Publication number
JP5724638B2
JP5724638B2 JP2011120299A JP2011120299A JP5724638B2 JP 5724638 B2 JP5724638 B2 JP 5724638B2 JP 2011120299 A JP2011120299 A JP 2011120299A JP 2011120299 A JP2011120299 A JP 2011120299A JP 5724638 B2 JP5724638 B2 JP 5724638B2
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Prior art keywords
solder
conductor
free solder
layer
mass
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JP2011120299A
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Japanese (ja)
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JP2012245554A (ja
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壮平 内田
壮平 内田
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Hitachi Metals Ltd
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Hitachi Metals Ltd
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Priority to JP2011120299A priority Critical patent/JP5724638B2/ja
Priority to CN201210071751.3A priority patent/CN102806429B/zh
Publication of JP2012245554A publication Critical patent/JP2012245554A/ja
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JP2011120299A 2011-05-30 2011-05-30 Ｐｂフリーはんだ及びはんだ被覆導体並びにそれを用いた電気部品 Expired - Fee Related JP5724638B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011120299A JP5724638B2 (ja) 2011-05-30 2011-05-30 Ｐｂフリーはんだ及びはんだ被覆導体並びにそれを用いた電気部品
CN201210071751.3A CN102806429B (zh) 2011-05-30 2012-03-16 无Pb焊料、焊料被覆导体以及使用该无Pb焊料的电气部件

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JP2011120299A JP5724638B2 (ja) 2011-05-30 2011-05-30 Ｐｂフリーはんだ及びはんだ被覆導体並びにそれを用いた電気部品

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JP2012245554A JP2012245554A (ja) 2012-12-13
JP5724638B2 true JP5724638B2 (ja) 2015-05-27

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ID=47230392

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JP2011120299A Expired - Fee Related JP5724638B2 (ja) 2011-05-30 2011-05-30 Ｐｂフリーはんだ及びはんだ被覆導体並びにそれを用いた電気部品

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JP (1) JP5724638B2 (zh)
CN (1) CN102806429B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014142153A1 (ja) * 2013-03-13 2017-02-16 株式会社日本スペリア社 はんだ接合物及びはんだ接合方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10193170A (ja) * 1996-12-27 1998-07-28 Murata Mfg Co Ltd 半田付け物品
JP4979944B2 (ja) * 2003-08-26 2012-07-18 株式会社トクヤマ 素子接合用基板、素子接合基板及びその製造方法
CN1905985B (zh) * 2004-07-29 2010-12-08 千住金属工业株式会社 无铅焊锡合金
JP4344707B2 (ja) * 2005-02-24 2009-10-14 株式会社ルネサステクノロジ 半導体装置およびその製造方法
US7628871B2 (en) * 2005-08-12 2009-12-08 Intel Corporation Bulk metallic glass solder material
JP2008098315A (ja) * 2006-10-11 2008-04-24 Hitachi Cable Ltd 太陽電池用はんだめっき線およびその製造方法
TW200927357A (en) * 2007-10-17 2009-07-01 Ishikawa Metal Co Ltd Lead-free solder
EP2214213A2 (de) * 2009-01-29 2010-08-04 SCHOTT Solar AG Photovoltaisches Modul
JP2011156558A (ja) * 2010-01-30 2011-08-18 Nihon Superior Co Ltd 鉛フリーはんだ合金

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Publication number Publication date
CN102806429B (zh) 2016-01-20
CN102806429A (zh) 2012-12-05
JP2012245554A (ja) 2012-12-13

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