JP5717956B2 - Solder ball alignment supply device - Google Patents

Description

  The present invention relates to a solder ball alignment and supply device that supplies solder balls arranged in accordance with a solder ball mounting pattern of an object to be mounted.

  A conventional solder ball aligning and supplying apparatus is, for example, a space for accommodating solder balls as described in Patent Document 1 (Japanese Patent Laid-Open No. 8-8523) and Patent Document 2 (Japanese Patent Laid-Open No. 2001-244288). A squeegee having a container shape (frame shape) formed with a ball aligning plate in which a predetermined number of ball holes for receiving solder balls one by one are formed in accordance with a solder ball mounting pattern of an object to be mounted. The ball alignment plate or the squeegee is slid in a state where the lower end of the ball alignment plate is in close contact (contact) with or close to the upper surface of the ball alignment plate, so that the solder balls in the squeegee are placed in the ball holes of the ball alignment plate. The squeegeeing operation is performed.

JP-A-8-8523 JP 2001-244288 A

  In the solder ball alignment and supply apparatus described in Patent Documents 1 and 2, the squeegee operation is performed with the lower end of the container-shaped (frame-shaped) squeegee in close contact (contact) or close to the upper surface of the ball alignment plate. However, as shown in FIG. 11, the solder ball is caught between the upper edge of the ball hole and the squeegee with a part of the solder ball falling into the ball hole of the ball alignment plate during the squeezing operation. This may cause damage to the solder balls and lead to poor mounting quality and mounting defects.

  Therefore, the problem to be solved by the present invention is to provide a solder ball alignment and supply device capable of preventing the solder ball from being caught and damaged as much as possible between the upper edge of the ball hole of the ball alignment plate and the squeegee during the squeezing operation. Is to provide.

In order to solve the above-mentioned problems, the invention according to claim 1 is a solder-like object in which a container-shaped squeegee in which a space for accommodating solder balls is formed and a predetermined number of ball holes each for accommodating one solder ball are mounted. A ball alignment plate formed in accordance with a ball mounting pattern, and the ball alignment plate or the squeegee are reciprocated in the forward and reverse directions with the lower end of the squeegee in close contact with or close to the upper surface of the ball alignment plate. In the solder ball alignment supply device, the squeezing operation is performed so that the solder ball in the squeegee enters the respective ball holes of the ball alignment plate by reciprocating in the forward direction and the reverse direction. A squeegee at the lower end of the squeegee is sometimes used for scooping up the extra solder balls on the ball alignment plate. That from both sides of the forward and reverse operation are provided so as to protrude in the solder ball receiving space side with the first aspect, further, the ball scoop means, the cross-sectional right-angled triangle projecting from the lower end of the squeegee A wedge-shaped portion formed in a wedge shape, and an elastically deformable portion formed of an elastically deformable material and having a height smaller than the radius of the solder ball. The first feature is that the tip of the elastically deforming portion is bonded and protrudes in the squeezing operation direction from the tip of the wedge-shaped portion. Thus, if the ball scooping means is provided at the lower end of the squeegee so as to protrude toward the solder ball housing space, a part of the solder ball will drop into the ball hole of the ball alignment plate during the squeegeeing operation. Even so, the solder ball can be scooped up by the ball scooping means to escape from the ball hole. Thereby, it is possible to prevent the solder ball from being caught and damaged as much as possible between the upper edge of the ball hole of the ball alignment plate and the squeegee during the squeezing operation.
In addition, the ball scooping means is formed with a wedge-shaped portion that is formed in a wedge shape with a right-angled triangle cross-section protruding from the lower end of the squeegee and a height dimension (thickness dimension) smaller than the radius of the solder ball by an elastically deformable material. The elastic deformation portion is joined to the lower surface of the wedge-shaped portion, and the tip of the elastic deformation portion is protruded from the tip of the wedge-shaped portion in the squeezing operation direction. As a result, the solder ball that has fallen into the ball hole can be more reliably picked up by the synergistic effect of the elastically deforming portion and the wedge-shaped portion.
According to a second aspect of the present invention, it is preferable that the elastic deformation portion is formed of a soft resin material having a small friction coefficient, and the wedge-shaped portion is formed of a material having a mechanical strength stronger than that of the elastic deformation portion.

Further, as in claim 3 , an opening / closing means for opening and closing an opening of the solder ball housing space in the squeegee, and an antioxidant gas supply means for supplying a solder ball oxidation preventing gas to the solder ball housing space in the squeegee And after the solder ball is accommodated in the solder ball accommodation space in the squeegee, the opening of the solder ball accommodation space in the squeegee is closed by the opening and closing means, and the solder ball accommodation space is closed. The anti-oxidation gas supply means may be configured to supply a solder ball anti-oxidation gas to the solder ball housing space. In this way, even if the solder ball accommodated in the squeegee stays in the squeegee for a long time, the solder ball supplied to the squeegee is prevented from being oxidized by the oxygen in the atmosphere. This can be prevented by the gas.
According to a fourth aspect of the present invention, a camera that images the array region of the ball holes of the ball alignment plate, and an image captured by the camera after the squeezing operation is processed, and solder balls are placed in all the ball holes of the ball alignment plate. It is good also as a structure provided with the image processing means to judge whether or not. In this way, after the squeezing operation, if it is found that there is a ball hole without a solder ball based on the image recognition result of the camera, the squeezing operation is performed again to recognize the image of the camera. What is necessary is just to repeat the process which judges whether the solder ball has entered into all the ball holes based on the result.

1 is a perspective view of an apparatus for aligning and supplying solder balls, showing Embodiment 1 of the present invention. FIG. 2 is a perspective view of a feeder mounting base of the component mounting machine. FIG. 3 is a perspective view showing a state where the solder ball alignment / supply device is mounted on the feeder mounting base of the component mounting machine. FIG. 4 is a side view showing a state where the solder ball alignment / supply device is mounted on the feeder mounting base of the component mounting machine. FIG. 5 is an enlarged longitudinal sectional view for explaining a structure for adsorbing the solder balls in the ball holes of the ball alignment plate by the ball adsorbing nozzle. FIG. 6 is an enlarged longitudinal sectional view for explaining the operation of storing the solder balls in the ball holes of the ball alignment plate with the squeegee. FIG. 7 is a cutaway perspective view showing the shape of the squeegee. FIG. 8 is an external perspective view of the squeegee. FIGS. 9A to 9C are enlarged vertical sectional views for explaining the operation of adsorbing the solder balls in the ball holes of the ball alignment plate by the ball adsorbing nozzle. FIG. 10 is a diagram schematically showing the configuration of the component mounter. FIG. 11 is an enlarged longitudinal sectional view for explaining a problem that a solder ball is caught and damaged between the upper edge of the ball hole of the ball alignment plate and the squeegee during a conventional squeezing operation.

Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described.
First, the configuration of the solder ball alignment supply device 11 will be described.
The solder ball alignment and supply device 11 is mounted on a feeder mounting base 14 (see FIGS. 2, 3, and 10) of the component mounting machine 13 so as to be replaceable with a tape feeder (not shown). The width dimension of the solder ball alignment and supply device 11 is almost several times the width dimension of the tape feeder, and as shown in FIG. 3, the solder ball alignment and supply is provided in the space corresponding to several tape feeders on the feeder mounting base 14. The device 11 is detachably mounted.

  As shown in FIG. 1, the main body base 12 of the solder ball alignment supply device 11 is formed in a box shape that extends long in the front-rear direction, which is a direction in which the component mounter 13 is attached to or detached from the feeder mounting base 14. A guide rail 15 is provided on the main body base 12 so as to extend in the front-rear direction, and a ball alignment plate 17 is supported on the guide rail 15 via a slide base 16 so as to be slidable in the front-rear direction. Further, the main body base 12 is provided with a motor 18 serving as a driving means for slidingly moving the ball alignment plate 17 in the front-rear direction.

  A predetermined number of ball holes 21 (see FIG. 5) for accommodating the solder balls one by one are formed in the front end portion of the ball alignment plate 17 in accordance with the solder ball mounting pattern of the mounting object such as a circuit board. Each ball hole 21 is formed as a through hole having a circular cross section having an inner diameter that is larger than the diameter of the solder ball by a clearance (play) for inserting and removing the solder ball, and the depth of each ball hole 21. The (thickness dimension of the ball alignment plate 17) is the same as or slightly larger than the diameter of the solder balls.

  Further, in this embodiment, the bottom surface side of each ball hole 21 of the ball alignment plate 17 is configured to communicate with the atmosphere. In this case, each ball hole 21 of the ball alignment plate 17 may be configured so that the bottom surface side of each ball hole 21 communicates with the atmosphere by forming a stepped through hole with a lower diameter on the lower side. In order to accurately form a minute stepped through-hole for accommodating a minute solder ball, processing with a considerably high degree of difficulty is required, which increases the processing cost.

  Therefore, in this embodiment, as shown in FIG. 5, the air-permeable porous plate 22 is superimposed on the lower surface side of the ball alignment plate 17, so that the bottom surface of each ball hole 21 has air permeability. The bottom surface of each ball hole 21 is configured to communicate (open) with the atmosphere. The ball alignment plate 17 and the porous plate 22 are integrated by bonding, screws, or the like, and attached to the slide base 16 by screws or the like. A concave portion 23 is formed in the slide base 16 directly below the arrangement region of the ball holes 21, and the space of the concave portion 23 is opened to the atmosphere through the atmosphere opening 24.

  As shown in FIG. 1, a mounting frame 25 is provided at a substantially intermediate portion of the main body base 12 in a bridge shape extending upward, and a container-shaped squeegee in which a space for accommodating solder balls is formed in the mounting frame 25. 26 (see FIGS. 6 to 8) is attached, and when the arrangement region of the ball holes 21 of the ball alignment plate 17 slides directly below the squeegee 26, the lower end of the squeegee 26 is in close contact with the upper surface of the ball alignment plate 17 The height position of the squeegee 26 is adjusted so as to (contact) or approach.

Further, as shown in FIGS. 6 and 7, ball scooping means 51 for scooping off excess solder balls on the ball alignment plate 17 during the squeezing operation is provided at the lower end of the squeegee 26. In this embodiment, as shown in FIG. 7, the ball scooping means 51 has a wedge shape (triangular right-angled triangle) protruding from both sides of the lower end of the squeegee 26 in the forward and reverse directions of the squeegee operation toward the solder ball receiving space. ) Formed on the lower surface of the wedge-shaped portion 29, and a wedge-shaped portion 29 formed by an elastically deformable material and having a height dimension (thickness dimension) smaller than the radius of the solder ball. The elastic deformation portion 30 is joined by bonding or the like so that the distal end portion of the elastic deformation portion 30 protrudes from the distal end portion of the wedge-shaped portion 29 in the squeezing operation direction (solder ball accommodating space side). Here, the protruding dimension of the elastically deformable portion 30 from the tip of the wedge-shaped portion 29 is smaller than the diameter of the solder ball, and more preferably set within a range of 1/3 to 2/3 of the diameter of the solder ball. Has been.

  On the other hand, the elastically deforming portion 30 is formed of a soft resin material (for example, a fluororesin tape) having a small friction coefficient, and the frictional force against the ball alignment plate 17 and the solder balls during the squeezing operation is small. The squeegee 26 and the wedge-shaped portion 29 are integrally formed of a material (for example, metal, hard resin, etc.) having a mechanical strength stronger than that of the elastic deformation portion 30.

  As shown in FIG. 8, a lid 52 is provided on the upper surface of the squeegee 26 so as to be openable and closable as an opening and closing means for opening and closing the opening of the solder ball housing space. In this embodiment, the lid 52 is formed of a transparent material (for example, transparent glass, transparent resin, etc.), and the solder in the squeegee 26 passes through the transparent lid 52 even when the upper surface opening of the squeegee 26 is closed by the lid 52. The remaining amount of the ball can be visually confirmed. In this embodiment, the lid 52 is fixed by tightening the fixing screw 53 in a state of covering the upper surface of the squeegee 26. When refilling the solder balls into the squeegee 26, the fixing screw 53 is loosened and the fixing screw 53 is used as a fulcrum. The lid 52 is rotated to open the upper surface opening of the squeegee 26.

  The opening / closing structure of the lid 52 is not limited to the above configuration, and the lid 52 may be detached from the squeegee 26, and the fixing means for fixing the lid 52 in the closed position is not limited to screwing. For example, a clamp mechanism, an engaging means, etc. may be sufficient. Alternatively, the lid may be formed in a cap shape so that the upper end of the squeegee 26 can be detachably covered by press fitting. In this case, a seal such as an O-ring is provided on the fitting portion between the lid and the squeegee 26. You may make it improve the sealing performance of a fitting part by mounting | wearing a member.

  Further, the squeegee 26 has a pipe joint 54 for supplying an antioxidant gas as an antioxidant gas supply means for supplying a solder ball oxidation preventing gas (for example, inert gas, reducing gas, etc.) to the solder ball housing space. A gas supply pipe of an antioxidant gas supply source (such as a gas cylinder) is connected to the pipe joint 54.

  After the solder balls are accommodated in the squeegee 26, the lid 52 is put on the upper surface opening of the squeegee 26 to close the solder ball accommodating space in the squeegee 26, and then the solder balls are brought into the squeegee 26 from the antioxidant gas supply source. An antioxidation gas is supplied to fill the solder ball housing space in the squeegee 26 with the solder ball oxidation preventing gas to prevent the solder ball from being oxidized. Since the solder ball oxidation prevention gas supplied into the squeegee 26 leaks little by little from the opening on the lower surface of the squeegee 26, the solder ball oxidation prevention gas is replenished little by little in the squeegee 26 to compensate for the leakage. Like to do.

  As shown in FIG. 1, a camera 27 such as a CCD camera that images an array region of the ball holes 21 of the ball aligning plate 17 is mounted downward on the upper portion of the mounting frame 25. A rectangular frame-shaped illumination light source 28 for illuminating the array region of the ball holes 21 to be imaged at 27 is attached.

  As shown in FIG. 4, a signal line and a power line of the solder ball alignment / supply device 11 are attached to a feeder of the component mounter 13 on the front end surface (end surface on the mounting direction side) of the main body base 12 of the solder ball alignment / supply device 11. A connector 32 for connecting to a connector 31 (see FIG. 2) of the base 14 and two positioning pins 33 and 34 are provided, and the two positioning pins 33 and 34 are connected to the feeder mounting base 14 of the component mounting machine 13. By inserting into the positioning holes 35 and 36 (see FIG. 2), the mounting position of the solder ball alignment / supply device 11 is positioned on the feeder mounting base 14 and the connector 32 of the solder ball alignment / supply apparatus 11 is connected to the feeder mounting base 14. The connector 31 is inserted and connected.

  The component mounter 13 for mounting the solder ball alignment supply device 11 configured as described above is provided with a mounting head 37 (see FIG. 10) driven in the XYZ directions. A component suction nozzle (not shown) for holding and a ball suction nozzle 38 (see FIG. 5) for sucking the solder balls in the respective ball holes 21 of the ball alignment plate 17 are held so as to be replaceable. . The component mounter 13 is provided with a nozzle station (not shown) for storing the component suction nozzle and the ball suction nozzle 38. The component suction nozzle or the ball suction nozzle 38 held by the mounting head 37 is used as the nozzle station. The stored ball suction nozzle 38 or the component suction nozzle can be automatically replaced.

  As shown in FIG. 10, the component mounting machine 13 includes a conveyor 42 that conveys the circuit board 41, a mark camera 43 that captures the reference position mark of the circuit board 41 from above, and a component that is adsorbed by the component adsorption nozzle. And a parts camera 44 for imaging the camera from below. In this embodiment, a plurality of (for example, two) reference position marks 45 (for example, two) provided in a predetermined positional relationship with the ball holes 21 on both sides of the arrangement region of the ball holes 21 on the upper surface of the ball alignment plate 17 (FIGS. 1 and 3) is imaged by the mark camera 43, and the positions of the arrangement regions of the ball holes 21 of the ball alignment plate 17 in the XY direction and the θ direction are recognized. In addition, a plurality of (for example, two) reference position marks (not shown) provided in a predetermined positional relationship with the suction holes 39 on both sides of the arrangement area of the suction holes 39 on the lower surface of the ball suction nozzle 38 are part cameras 44. The positions of the arrangement region of the suction holes 39 on the lower surface of the ball suction nozzle 38 in the XY direction and the θ direction are recognized.

  Then, when the solder balls in the ball holes 21 of the ball alignment plate 17 are sucked by the suction holes 39 of the ball suction nozzle 38, based on the image recognition results of the two cameras 43 and 44 of the component mounter 13, The mounting head 37 is moved in the XY direction so that the positions in the XY direction and θ direction of the array area of the suction holes 39 of the ball suction nozzle 38 coincide with the positions in the XY direction and θ direction of the array area of the ball holes 21 of the ball alignment plate 17. And a holder mechanism (not shown) that holds the ball suction nozzle 38 is driven in the θ direction.

Next, a process of mounting the solder ball alignment and supply device 11 having the above-described configuration on the feeder mounting base 14 of the component mounting machine 13 to align and supply the solder balls will be described.
First, as shown in FIGS. 3 and 4, the lid 52 placed on the upper surface of the squeegee 26 of the solder ball alignment / supply device 11 mounted on the feeder mounting base 14 of the component mounter 13 is opened, and the squeegee 26 is opened. Accommodates solder balls. Alternatively, an automatic solder ball throwing device (not shown) may be provided in the mounting frame 25 so that the solder balls are automatically thrown into the squeegee 26 from the automatic solder ball throwing device. Further, an automatic opening / closing mechanism for automatically opening and closing the lid 52 may be provided so that the lid 52 is automatically opened and closed.

  After the solder ball is received, the upper surface opening of the squeegee 26 is closed with a lid 52, and a gas for preventing solder ball oxidation is supplied into the squeegee 26 from the antioxidant gas supply source. Fill the space with solder ball oxidation prevention gas to prevent solder ball oxidation. Since the solder ball oxidation preventing gas supplied into the squeegee 26 leaks little by little from the opening on the lower surface of the squeegee 26, the solder ball oxidation preventing gas is gradually replenished into the squeegee 26 to compensate for the leakage. .

  Thereafter, the motor 18 is operated, the ball alignment plate 17 is slid along the guide rail 15, and the arrangement area of the ball holes 21 of the ball alignment plate 17 is passed under the squeegee 26 to perform forward squeezing. After the operation, the squeezing operation in the reverse direction is performed by reversing the sliding direction of the ball alignment plate 17. At this time, as shown in FIG. 6, the ball alignment plate 17 is slid and moved while the lower end surface of the squeegee 26 is in close contact with or close to the arrangement region of the ball holes 21 of the ball alignment plate 17. One solder ball is sequentially inserted into each ball hole 21.

  As shown in FIG. 11, the conventional structure described above has a solder ball between the upper edge of the ball hole and the squeegee with a part of the solder ball falling into the ball hole of the ball alignment plate during the squeezing operation. May be bitten and damaged, which causes a decrease in solder ball mounting quality and mounting failure.

  On the other hand, in this embodiment, ball scooping means 51 (wedge-shaped portion 29 and elastic deformation portion 30) for scooping off excess solder balls on the ball alignment plate 17 during the squeezing operation is provided at the lower end portion of the squeegee 26. Since it is configured, even if a part of the solder ball is dropped into the ball hole 21 of the ball alignment plate 17 during the squeezing operation, the solder ball is scooped up by the ball scooping means 51 and escapes from the ball hole 21. Can be made. Thereby, it is possible to prevent the solder ball from being caught and damaged as much as possible between the upper edge of the ball hole 21 of the ball alignment plate 17 and the squeegee 26 during the squeezing operation.

  In addition, in this embodiment, the ball scooping means 51 is formed with a wedge-shaped portion 29 protruding from the lower end portion of the squeegee 26 in the squeezing operation direction and a height dimension smaller than the radius of the solder ball by an elastically deformable material. And the elastic deformation portion 30 is joined to the lower surface of the wedge-shaped portion 29 so that the distal end portion of the elastic deformation portion 30 protrudes from the distal end portion of the wedge-shaped portion 29 in the squeezing operation direction. Therefore, when scooping up the solder ball that has fallen into the ball hole 21 during the squeezing operation by the elastic deformation portion 30, the tip of the elastic deformation portion 30 is located below the solder ball that has fallen into the ball hole 21. The solder ball is elastically deformed so as to be submerged, and by the elastic deformation of the elastic deformation portion 30, the solder ball that has fallen into the ball hole 21 is smoothly picked up. Door can be.

  After performing the one-way reciprocating squeezing operation in the forward direction and the reverse direction as described above, when the arrangement area of the ball holes 21 reaches the illumination light source 28 having the square frame shape, the ball alignment plate 17 is slid. Once stopped, the camera 27 images the array area of the ball holes 21.

Thereafter, the image signal of the camera 27 is taken into the control device (control means) of the component mounting machine 13 and image recognition is performed to determine whether or not all the ball holes 21 contain solder balls, and the solder balls If there is a ball hole 21 that does not contain a mark, a reciprocating squeezing operation is performed again to determine whether or not all the ball holes 21 contain solder balls based on the image recognition result of the camera 27. Repeat the process. In the present embodiment, the control device of the component mounter 13 functions as an image processing means in the claims.

  As a result, even if the number of reciprocations of the squeezing operation reaches a predetermined number, if the ball hole 21 containing no solder balls remains, it is determined as an error and the operation of the solder ball alignment supply device 11 is stopped. An error is displayed on a display device (not shown) or a warning sound is generated to warn the operator. Thus, the operator confirms the cause of the error (for example, the shortage of the remaining amount of solder balls in the squeegee 26, etc.) and performs a recovery work according to the cause.

  On the other hand, if it is confirmed that solder balls are contained in all the ball holes 21 based on the image recognition result of the camera 27, the ball aligning plate 17 is moved to the solder ball suction position (positions in FIGS. 3 and 4). Slide to stop.

  Thereafter, based on the image recognition results of the two cameras 43 and 44 of the component mounting machine 13, the positions in the XY direction and the θ direction of the arrangement region of the suction holes 39 of the ball suction nozzle 38 are set to the ball holes 21 of the ball alignment plate 17. The mounting head 37 is driven in the XY direction and the holder mechanism (not shown) that holds the ball suction nozzle 38 is driven in the θ direction so as to coincide with the positions in the XY direction and the θ direction of the arrangement region. As a result, when the positions of the suction holes 39 of the ball suction nozzle 38 coincide with the positions of the ball holes 21 of the ball alignment plate 17, the driving in the XY direction and the θ direction is stopped, and FIG. As shown in FIG. 9, the mounting head 37 holding the ball suction nozzle 38 is lowered, and the lower end surface of the ball suction nozzle 38 is placed in the arrangement region of the ball holes 21 of the ball alignment plate 17 as shown in FIG. Stop in contact or in close proximity.

  In this state, negative pressure is supplied to the inside of the ball suction nozzle 38 via the air passage in the mounting head 37 (air in the ball suction nozzle 38 is sucked), and each suction hole 39 of the ball suction nozzle 38 is sucked. The solder balls in the respective ball holes 21 of the ball alignment plate 17 are sucked together. At this time, since each suction hole 39 is formed in a tapered surface, the suction position of the solder ball is positioned so that the center of the solder ball coincides with the center of the suction hole 39 by the tapered surface.

  Thereafter, as shown in FIG. 9 (c), the mounting head 37 holding the ball suction nozzle 38 that sucks the solder ball is raised and moved to a position just above the solder ball mounting area of the circuit board 41 and lowered. Then, solder balls are mounted on the solder ball mounting region of the circuit board 41.

  In the present embodiment described above, the ball scooping means 51 (the wedge-shaped portion 29 and the elastic deformation portion 30) is provided at the lower end portion of the squeegee 26. Even if a part of the solder ball is about to fall, the solder ball can be scooped up by the ball scooping means 51 and escaped from the ball hole 21, and the ball hole 21 of the ball alignment plate 17 can be removed during the squeezing operation. It is possible to prevent the solder ball from being caught between the upper edge and the squeegee 26 as much as possible.

  Moreover, in this embodiment, the ball scooping means 51 includes a wedge-shaped portion 29 protruding from the lower end portion of the squeegee 26 in the squeezing operation direction, and a height dimension (thickness dimension) smaller than the radius of the solder ball by an elastically deformable material. And the elastic deformation portion 30 is joined to the lower surface of the wedge-shaped portion 29 so that the tip of the elastic deformation portion 30 is squeezed from the tip of the wedge-shaped portion 29. Therefore, the solder ball that has fallen into the ball hole 21 during the squeezing operation can be more reliably picked up by the synergistic effect of the elastic deformation portion 30 and the wedge-shaped portion 29.

As a reference example related to the present invention , it is conceivable to form the ball scooping means only by the elastic deformation portion 30 without the wedge-shaped portion 29 . Even in this case, if the elastic deformation portion 30 having a height (thickness) smaller than the radius of the solder ball is provided so as to protrude from the lower end of the squeegee 26 in the squeezing operation direction, The elastic deformation part 30 comes to be elastically deformed so that the tip of the elastic deformation part 30 is under the solder ball that has fallen, and the elastic deformation of the elastic deformation part 30 smoothly picks up the solder ball that has fallen into the ball hole 21. be able to.

Further, as a reference example related to the present invention, it is conceivable to constitute the ball scooping means only by the wedge-shaped portion 29 without the elastic deformation portion 30 . Even in this case, if the wedge-shaped portion 29 is formed so as to protrude from the lower end portion of the squeegee 26 in the squeezing operation direction, the tip of the wedge-shaped portion 29 against the solder ball that has fallen into the ball hole 21 during the squeezing operation. A slanting upward force can be applied by the inclined surface of the portion, and the solder ball that has fallen into the ball hole 21 can be smoothly picked up by the wedge-shaped portion 29.

  Further, in this embodiment, the solder ball oxidation preventing gas is supplied from the antioxidant gas supply source to the solder ball accommodating space in the squeegee 26, so that the solder balls accommodated in the squeegee 26 are contained in the squeegee 26. Even if the staying time becomes long, the solder ball accommodated in the squeegee 26 can be prevented from being oxidized by oxygen or the like in the atmosphere by the solder ball oxidation preventing gas supplied in the squeegee 26.

  In this embodiment, the squeegee 26 is fixed and the ball alignment plate 17 is slid and moved during the squeezing operation. On the contrary, the ball alignment plate 17 is fixed and the squeegee 26 is slid. You may make it move.

  In addition, according to the present invention, the squeegee 26 may be formed integrally with the wedge-shaped portion 29 and / or the elastic deformable portion 30 by using the same material as that of the elastic deformable portion 30. Various modifications can be made without departing from the spirit of the invention, such as a configuration in which the antioxidant gas supply means for supplying the gas for use is omitted.

  DESCRIPTION OF SYMBOLS 11 ... Solder ball alignment supply apparatus, 12 ... Main body base, 13 ... Component mounting machine, 14 ... Feeder mounting base, 15 ... Guide rail, 16 ... Slide base, 17 ... Ball alignment board, 18 ... Motor (drive means), 21 DESCRIPTION OF SYMBOLS ... Ball hole, 22 ... Porous board, 24 ... Air release port, 26 ... Squeegee, 27 ... Camera, 28 ... Illumination light source, 29 ... Wedge shape part, 30 ... Elastic deformation part, 37 ... Mounting head, 38 ... Ball adsorption Nozzle 39 ... Suction hole 41 ... Circuit board (mounting object) 43 ... Mark camera 44 ... Parts camera 45 ... Reference position mark 51 ... Bowl scooping means 52 ... Lid (opening / closing means) 53 ... Fixed Screw, 54 ... Piping joint for antioxidant gas supply

Claims (4)

A container-like squeegee in which a space for accommodating solder balls is formed, a ball alignment plate in which a predetermined number of ball holes for accommodating solder balls one by one are formed in accordance with a solder ball mounting pattern of an object to be mounted, and the squeegee The ball alignment plate or the squeegee is slid so as to reciprocate in the forward and reverse directions while the lower end of the ball alignment plate is in close contact with or close to the upper surface of the ball alignment plate. In the solder ball alignment and supply device that executes the squeezing operation to enter the ball holes of the plate so as to reciprocate in the forward direction and the reverse direction,
Ball scooping means for scooping up the extra solder balls on the ball alignment plate during squeezing operation is provided so as to protrude from both sides of the squeegee at the lower end of the squeegee in the forward and reverse directions toward the solder ball receiving space. ,
The ball scooping means includes a wedge-shaped portion having a right-angled triangular cross-section protruding from the lower end of the squeegee, and an elastic deformation formed by an elastically deformable material with a height smaller than the radius of the solder ball. The elastic deformation portion is joined to the lower surface of the wedge-shaped portion, and the distal end portion of the elastic deformation portion protrudes in the squeezing operation direction from the distal end portion of the wedge-shaped portion. Solder ball alignment supply device. The elastic deformation portion is formed of a soft resin material having a small friction coefficient,
2. The solder ball alignment supply device according to claim 1, wherein the wedge-shaped portion is formed of a material having a mechanical strength stronger than that of the elastic deformation portion . An opening / closing means for opening and closing an opening of the solder ball accommodation space in the squeegee; and an antioxidant gas supply means for supplying a solder ball oxidation preventing gas to the solder ball accommodation space in the squeegee; After the solder ball is accommodated in the solder ball accommodating space, the opening / closing means closes the opening of the solder ball accommodating space in the squeegee to close the solder ball accommodating space, and then the antioxidant gas supply means 3. The solder ball alignment supply device according to claim 1, wherein the solder ball oxidation prevention gas is supplied to the solder ball housing space. A camera that images the array region of the ball holes of the ball alignment plate;
The image processing means for processing the image captured by the camera after the squeezing operation and determining whether or not the solder balls are in all the ball holes of the ball alignment plate. The solder ball alignment supply device according to any one of 1 to 3 .

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