JP2024058849A - Substrate-related processing machine and maintenance method thereof - Google Patents

Abstract

[Problem] To provide a technology for easily and safely performing maintenance work on a substrate-related work machine without changing the device configuration. [Solution] The substrate-related work machine includes a work performing device, a camera, a control device, and a light diffusion member attachment unit. The work performing device performs a predetermined substrate-related work on a substrate. The camera has an imaging unit and an LED illumination unit. The imaging unit performs an imaging operation with at least one of the substrate, a component mounted on the substrate, and the work performing device as the imaging target. The LED illumination unit is turned on when the imaging unit performs the imaging operation, and irradiates the imaging target with illumination light. The control device controls the operation of the work performing device and the camera. The camera is capable of being attached with a light diffusion member for diffusing the illumination light, and is configured to be able to turn on the LED illumination unit when the work performing device is stopped. [Selected Figure] Figure 2

Description

The technology disclosed in this specification relates to a substrate-related processing machine and a maintenance method thereof.

Various types of substrate-related work machines are known in the art. These types of substrate-related work machines are equipped with a work execution device and other components in a housing that perform specific work on substrates. However, if the inside of the substrate-related work machine is dark when performing maintenance on the machine, it is difficult to see what is in front of the worker's hands. This can make maintenance work difficult. Therefore, the conventional technology disclosed in Patent Document 1 provides mirrors and television cameras so that the inside of the machine can be seen from outside, and lighting fixtures are provided to illuminate the inside of the housing.

Japanese Patent Application Laid-Open No. 7-321454

In the above-mentioned conventional substrate-related processing machines, mirrors, television cameras, and lighting fixtures must be added to make maintenance work easier and safer, which necessitates changes to the device configuration. This leads to problems such as higher manufacturing costs for the device.

This specification therefore provides technology for easily and safely performing maintenance work on substrate-related processing machines without changing the device configuration.

This specification discloses a substrate-related work machine that includes a work performing device, a camera, and a control device. The work performing device performs a predetermined substrate-related work on a substrate. The camera has an imaging unit and an LED lighting unit. The imaging unit performs an imaging operation with at least one of the substrate, the components mounted on the substrate, and the work performing device as the imaging target. The LED lighting unit is turned on when the imaging unit performs the imaging operation and irradiates the imaging target with illumination light. The control device controls the operation of the work performing device and the camera. The camera is configured so that a light diffusion member for diffusing the illumination light can be attached and so that the LED lighting unit can be turned on when the work performing device is stopped. According to the above-mentioned configuration, a light diffusion member can be attached to the camera and the illumination light irradiated from the LED lighting unit of the camera can be used to perform maintenance work. This makes it possible to easily and safely perform maintenance work on the substrate-related work machine without significantly changing the device configuration.

This specification also discloses a method of performing maintenance on a substrate-related work machine that includes a work performing device, a camera, and a control device. The work performing device performs a predetermined substrate-related work on a substrate. The camera has an imaging unit and an LED lighting unit. The imaging unit performs an imaging operation with at least one of the substrate, the components mounted on the substrate, and the work performing device as the imaging target. The LED lighting unit is turned on when the imaging unit performs the imaging operation and irradiates the imaging target with illumination light. The control device controls the operation of the work performing device and the camera. The camera is capable of being fitted with a light diffusion member for diffusing the illumination light. The method of performing maintenance includes a step of attaching a light diffusion member to the camera when the operation of the work performing device is stopped, a step of turning on the LED lighting unit when the operation of the work performing device is stopped, and a step of performing maintenance work on the substrate-related work machine when the operation of the work performing device is stopped and the LED lighting unit is turned on. This method can also achieve the same effects as the substrate-related work machine described above.

1 is a schematic plan view showing a component mounter according to an embodiment of the present invention; FIG. 2 is a partial schematic front view showing the component mounter of the embodiment. FIG. 4 is a side view showing a state before a light diffusing member is attached to the mark camera in the embodiment. 1 is a plan view showing a light diffusing member used in a component mounter according to an embodiment of the present invention. FIG. 4 is a side view showing a state in which a light diffusing member is attached to the mark camera in the embodiment. FIG. 13 is a bottom view showing a state in which a light diffusing member is attached to the mark camera in the embodiment. FIG. 11 is a partial side view showing a state in which a light diffusing member is attached to a mark camera in another embodiment. FIG. 11 is a partial side view showing a state in which a light diffusing member is attached to a mark camera in another embodiment. FIG. 11 is a partial side view showing a state in which a light diffusing member is attached to a mark camera in another embodiment.

In the substrate-related operating machine disclosed in this specification, the light diffusion member may include a light diffusion lens that transmits and diffuses the illumination light. With this configuration, the illumination light from the LED illumination unit can be diffused in an optimal manner.

In the substrate-related operating machine disclosed in this specification, the light diffusion member may include a plate-shaped support, a light diffusion lens supported at the center of the support and transmitting and diffusing the illumination light, and a first mounting structure formed on the outer periphery of the support. A second mounting structure may be formed at a position corresponding to the first mounting structure on the front side of the camera. The first mounting structure and the second mounting structure may be used to detachably attach the light diffusion member to the camera. With this configuration, the light diffusion member can be easily attached to and detached from the camera.

In the substrate-related operating machine disclosed in this specification, the first mounting structure may be a plurality of screw insertion holes, the second mounting structure may be a plurality of female screw holes, and a plurality of male screws may be capable of being screwed into the plurality of female screw holes, respectively, via the plurality of screw insertion holes.

In the substrate-related operation machine disclosed in this specification, the control device may have a function of detecting whether the light diffusion member has been left detached from the camera. With this configuration, it is possible to prevent substrate-related operation from being performed with the light diffusion member attached to the camera.

In the substrate-related processing machine disclosed in this specification, a light-opaque portion may be formed in the support body in the area surrounding the light diffusion lens. The control device may detect whether the light diffusion member has been left unremoved by determining the width of the area illuminated by the illumination light based on an image captured by the camera. With this configuration, it is possible to detect whether the light diffusion member has been left unremoved without adding any configuration for detecting whether the light diffusion member has been left unremoved.

In the substrate-related operation machine disclosed in this specification, the control device may perform control to keep devices other than the camera stopped when it detects that the light diffusion member has been left unattached. This configuration can reliably prevent substrate-related operation from being performed with the light diffusion member attached to the camera.

The substrate-related operation machine disclosed in this specification may be a component mounter that mounts components picked up by a movable head onto a substrate. The camera may be a mark camera that is mounted on the head and captures an image of a mark affixed to the substrate from above the substrate.

In the substrate-related processing machine disclosed in this specification, the component mounter may have a table with an opening on the top surface and various devices arranged on the bottom surface, and a wafer expander installed in the opening.

Example 1
An embodiment of a component mounter 11 (one example of a substrate-related operating machine) according to the present invention will be described below with reference to the drawings. Fig. 1 is a schematic plan view of the component mounter 11 of the first embodiment, and Fig. 2 is a schematic partial front view of the component mounter 11. Note that Figs. 1 and 2 show a simplified depiction of the component mounter 11. XYZ coordinates are also defined in the drawings. Fig. 3 is a side view showing a state before a light diffusion member 71 is attached to the mark camera 36.

The component mounter 11 shown in FIG. 1 is a type of substrate-related processing machine, and is a device for mounting multiple types of components 2 (dies 2b and SMDs 2a) onto a substrate 1.

The component mounter 11 is equipped with a conveyor 21, an XY robot 26, a head unit 31, a mark camera 36, a parts camera 41, a nozzle station 42, a component feeder 46, a die supply device 51, a control device 61, etc.

The conveyor 21 is a device (an example of a work performing device) for carrying out the work of carrying the board 1 into a work position within the device and carrying out the board 1 from the work position after components are mounted. The conveyor 21 is equipped with a support device (not shown) that supports the board 1 from below, and a drive device (not shown) for driving the conveyor. The conveyor 21 transports the board 1 from the negative to the positive direction of the X-axis (from the left to the right in FIG. 1).

The XY robot 26 is a movement mechanism that moves the head unit 31 in the X and Y directions to move the component mounting head 32 between above the component feeder 46 and die supply device 51 and above the substrate 1. The XY robot 26 is equipped with a Y-axis slider 27 that slides the head unit 31 in the Y direction, and an X-axis slider 28 that slides the head unit 31 in the X direction. The head unit 31 is supported by the X-axis slider 28. The XY robot 26 is housed inside a housing (not shown) and is positioned above the substrate 1.

The head unit 31 is a movable unit (task execution device) that performs the task of mounting the component 2 picked up by the component mounting head 32 onto the board 1. The head unit 31 includes a component mounting head 32 and a mark camera 36. The component mounting head 32 is attached to the underside of the head unit 31 via a holder (not shown). The component mounting head 32 includes multiple suction nozzles 33. The multiple suction nozzles 33 are detachably supported by the component mounting head 32. The multiple suction nozzles 33 are raised and lowered in the vertical direction (Z direction in the drawing) by an actuator (not shown) housed in the component mounting head 32, and are configured to be able to pick up the component 2 at their tips.

The mark camera 36 is mounted on the head unit 31 and is configured to be movable together with the component mounting head 32. The mark camera 36 is arranged near the component mounting head 32, and moves above the board 1 brought into the work position by the conveyor 21 to capture an image of the mark attached to the board 1 as the image capture target. As shown in Figures 2 and 3, the mark camera 36 has a camera body 37, an image capture unit 38, and an LED illumination unit 39. The image capture unit 38 is installed in the center of the upper surface of the rectangular box-shaped camera body 37. The image capture unit 38 is configured using an image capture element such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The LED illumination unit 39 is arranged at multiple locations inside the camera body 37, and is turned on when the image capture unit 38 performs an image capture operation to irradiate the image capture target with illumination light L1. The camera body 37 has a flange portion 37b having a circular outer shape on the lower surface side. An opening 37a that connects the inside and outside of the camera body 37 is formed in the center of the flange portion 37b. The illumination light L1 emitted by the LED illumination unit 39 is emitted outward from the mark camera 36 through the opening 37a.

The part camera 41 is mounted facing upward on the table 22, which is a support stand arranged beside the conveyor 21. The part camera 41 is mounted below the moving path of the component mounting head 32, and captures images of the component 2 picked up by the component mounting head 32 from below. The part camera 41 also has a camera body, an imaging unit, an LED lighting unit, etc. (all not shown). The imaging unit 38 of the part camera 41 is also configured using an imaging element such as a CCD or CMOS.

The nozzle station 42 is provided on the table 22 immediately next to the part camera 41. The nozzle station 42 stores a plurality of suction nozzles 33. The suction nozzles 33 held by the component mounting head 32 are automatically replaced with the suction nozzles 33 stored in the nozzle station 42.

Each component feeder 46 stores multiple components 2 (SMD 2a). The component feeder 46 is detachably attached to the feeder holder 47 and supplies the components 2 to the head unit 31. The specific configuration of the component feeder 46 is not limited. For example, it may be a tape feeder that stores multiple components 2 on a tape, a tray feeder that stores multiple components 2 on a tray, or a bulk feeder that stores multiple components 2 randomly in a container.

The die supply device 51 is a device for supplying dies 2b formed by dicing one wafer attached to a dicing sheet 3, and includes a wafer storage section 52, a moving mechanism 53, and a wafer expanding device 54. The die 2b supplied from the die supply device 51 is adsorbed by the component mounting head 32 and mounted on the substrate 1. The wafer storage section 52 stores multiple ring-shaped wafer frames 4 that hold the dicing sheet 3 to which the wafer 1 is attached. The dicing sheet 3 is a sheet formed of an expandable material, and multiple dies 2b are attached to its upper surface side. The wafer storage section 52 includes a magazine and a lifting mechanism (not shown), and supplies the wafer frame 4 stored in the magazine to the wafer expanding device 54. The moving mechanism 53 is provided above the wafer expanding device 54, and moves the wafer frame 4 between the wafer storage section 52 and the wafer expanding device 54. The moving mechanism 53 is configured to move on a pair of guide rails 55 while clamping the wafer frame 4.

As shown in FIG. 2, the table 22 has an opening 22a on the upper surface, and a circular wafer expander 54 is installed above the opening 22a. The wafer expander 54 is used to expand the dicing sheet 3 while the wafer frame 4 is fixed, and to increase the distance between the dies 2b. Various devices 57 are arranged on the lower surface side of the table 22. One example of such devices 57, a push-up mechanism 58, is arranged directly below the wafer expander 54. The push-up mechanism 58 is a mechanism for pushing up the wafer expanded by the wafer expander 54 from below. By pushing up the wafer by the wafer expander 54, the suction nozzle 33 can easily pick up the die 2b. Other devices 57, such as a pod changer and a nozzle changer, are arranged on the lower surface side of the table 22.

The control device 61 is a device that controls the operation of each part (i.e., the work execution device, the camera, etc.) in the component mounter 11, and is configured as a microprocessor centered on a CPU, for example. In addition to the CPU, the control device 61 is equipped with a ROM, a HDD, a RAM, an input/output interface, etc. These are connected to each other so that they can communicate with each other via a bus. The control device 61 is connected to the conveyor 21, the XY robot 26, the head unit 31, the mark camera 36, the parts camera 41, the nozzle station 42, the component feeder 46, the die supply device 51, etc. so that they can communicate with each other. The control device 61 controls each part to mount the parts 2 on the board 1, perform an imaging operation in which the board 1 and the parts 2 are the image targets, transport the board 1, display various information, etc. The control device 61 also performs image recognition processing based on image data obtained by the imaging operation.

As shown in Figure 3, the mark camera 36 of this embodiment has a configuration that allows temporary attachment of a structure to be used during maintenance of the device. Specifically, the mark camera 36 has a light diffusion member attachment portion 76 that allows attachment of a light diffusion member 71 (see Figures 3 and 4) for diffusing the illumination light L1 during maintenance.

As shown in FIG. 4, the light diffusion member 71 of this embodiment includes a support 72, a light diffusion lens 73, and a screw insertion hole 74. The support 72 is a rectangular plate-shaped member large enough to completely cover the opening 37a of the mark camera 36, and is formed using a material that does not transmit light. A circular lens mounting hole 75 is formed in the center of the support 72. A light diffusion lens 73 for transmitting and diffusing the illumination light L1 is supported in the lens mounting hole 75. As the light diffusion lens 73, a conventionally known commercially available product can be used. Note that, for the sake of convenience, hatching is used in FIGS. 4 and 6 to show that the area surrounding the light diffusion lens 73 in the support 72 is the light non-transmitting portion 72a. Screw insertion holes 74 (an example of a first mounting structure) are formed at four separate locations (i.e., four corner portions) on the outer periphery of the support 72. Each screw insertion hole 74 is formed along the thickness direction of the support 72 and penetrates the upper and lower surfaces of the support 72.

Meanwhile, female threaded holes 76 (an example of a second mounting structure) are formed as light diffusion member mounting parts at positions corresponding to the screw insertion holes 74 in the flange part 37b on the front side of the mark camera 36. That is, four female threaded holes 76 are formed at four spaced apart positions in the flange part 37b. A plurality of male screws 77 are screwed into the plurality of female threaded holes 76 via the plurality of screw insertion holes 74. This allows the light diffusion member 71 to be detachably mounted on the front side of the mark camera 36.

Here, the operation of the component mounter 11 during operation will be briefly described. The light diffusion member 71 is not yet attached when the component mounter 11 is in operation. The control device 61 first drives the conveyor 21 to bring the board 1 into the work position in the device. Next, the control device 61 moves the head unit 31 onto the board 1 and drives the mark camera 36 to capture the mark on the board 1. Then, the control device 61 executes image recognition processing based on the image data captured by the mark camera 36 to recognize the detailed position of the board 1 brought into the work position. The control device 61 drives the XY robot 26 to move the head unit 31 to the component suction position and causes the suction nozzle 33 of the head unit 31 to suction the component 2. Specifically, when suctioning the SMD 2a, the head unit 31 is moved to above the component feeder 46. When suctioning the die 2b, the head unit 31 is moved to above the wafer expander 54. The control device 61 then moves the head unit 31 to the board 1 while passing above the part camera 41, and during the movement, drives the part camera 41 to capture an image of the component 2 and check the condition of the component 2. When the head unit 31 has been moved to the component mounting position, the control device 61 lowers the suction nozzle 33 and releases the component 2 that was being sucked. This operation mounts the component 2 on the board 1. Once mounting of all the components 2 has been completed, the control device 61 drives the conveyor 21 to transport the board 1 out of the work position.

Next, the maintenance work performed when the component mounter 11 is not in operation will be described. The maintenance work is usually performed with part of the housing open. A signal is input to the control device 61 that detects that part of the housing has been opened, and this signal input triggers the control device 61 to control the devices other than the mark camera 36 to be kept stopped. On the other hand, since the mark camera 36 is kept in a powered state, the imaging unit 38 and the LED lighting unit 39 are kept in an operable state. The worker attaches the light diffusion member 71 to the mark camera 36 using multiple male screws 77. After the attachment is completed, the mark camera 36 is operated to irradiate the illumination light L1 from the LED lighting unit 39, and the maintenance work is performed in this state. The illumination light L1 is diffused by passing through the light diffusion lens 73 of the light diffusion member 71, and a relatively wide area inside the housing is brightly illuminated. For example, if the maintenance work is to be performed on the wafer expander 54 and the various devices 57 below it, the worker manually moves the head unit 31 to position the mark camera 36 directly above the wafer expander 54. The worker then operates the mark camera 36 and irradiates it with diffused illumination light L1, thereby performing maintenance work on the wafer expander 54 and the various devices 57 in a bright environment. Once the maintenance work is completed, the light diffusion member 71 is removed from the mark camera 36, the housing is closed, and the component mounting work is resumed.

It is possible that after the maintenance work is completed, the component mounting work will be resumed without noticing that the light diffusion member 71 has been left detached. In order to prevent such a situation from occurring, the control device 61 of the component mounter 11 has a function of detecting that the light diffusion member 71 has been left detached. Specifically, even when the component mounter 11 is not in operation, the mark camera 36 operates, and the mark camera 36 performs an imaging operation while shining the illumination light L1 on the imaging area below. For example, when the light diffusion member 71 is removed, the imaging area is bright overall. In contrast, when the light diffusion member 71 is left detached, the part where the light that has passed through the light diffusion lens 73 hits is round and bright, while the surrounding area is dark. The control device 61 performs image recognition processing based on the imaging data from the mark camera 36 and determines the width of the area where the illumination light L1 hits. By such a determination, it is possible to detect that the light diffusion member 71 has been left detached. Then, when it is detected that the light diffusion member 71 has been left detached, the control device 61 controls the devices other than the mark camera 36 to maintain their stopped state.

As described above, in the component mounter 11 of this embodiment, the light diffusion member 71 can be attached to the mark camera 36. Therefore, during maintenance work, the LED lighting unit 39 of the mark camera 36 can be used as a light source, and the illumination light L1 diffused through the light diffusion member 71 can brightly illuminate the operator's hands. Therefore, maintenance work on the component mounter 11 can be easily and safely performed. Also, unlike the conventional technology, there is no need to permanently install additional mirrors, television cameras, lighting fixtures, etc. inside the housing of the component mounter 11, and the manufacturing cost of the device can be suppressed from increasing. In addition, since the light diffusion member 71 is detachable, it can be removed from the mark camera 36 when maintenance work is not performed. Therefore, the original function of the mark camera 36 is not affected during operation.

The light diffusion member 71 used in the component mounter 11 of this embodiment is attached to the mark camera 36 using multiple male screws 77. This allows the light diffusion member 71 to be attached and detached from the mark camera 36 relatively easily. Furthermore, the light diffusion member 71 itself has a simple structure that does not include any electrical components and can be manufactured inexpensively, so that its use can prevent an increase in the manufacturing costs of the device.

In the component mounter 11 of this embodiment, the control device 61 has a function of detecting whether the light diffusion member 71 has been left unremoved. That is, the control device 61 detects whether the light diffusion member 71 has been left unremoved based on the image captured by the mark camera 36. Furthermore, when the control device 61 detects that the light diffusion member 71 has been left unremoved, it performs control to maintain the stopped state of the devices other than the mark camera 36. Therefore, it is possible to prevent the component mounting work from being resumed with the light diffusion member 71 still attached after the maintenance work is completed. Furthermore, by not resuming the component mounting work, it is possible to make the worker aware that the light diffusion member 71 has been left unremoved.

Although the first embodiment has been described above, the specific aspect is not limited to the first embodiment. In the first embodiment, a light diffusion lens 73 that transmits and diffuses the illumination light L1 is used, but the present invention is not limited to this configuration. For example, in other embodiments, a light diffusion member with a non-lens structure that transmits and diffuses the illumination light L1 may be used. Alternatively, in other embodiments, a light diffusion member that reflects and diffuses the illumination light L1 may be used.

In the above-mentioned first embodiment, the component mounter 11 is equipped with a component feeder 46 and a wafer expander 54 to supply two types of components 2 (SMD 2a and die 2b), but is not limited to this configuration. For example, in other embodiments, the component mounter 11 may be equipped with only one of the component feeder 46 and the wafer expander 54.

In the above embodiment 1, a plurality of screw insertion holes 74 as the first mounting structure 74 are formed on the light diffusion member 71 side, a plurality of female screw holes 76 as the second mounting structure 76 are formed on the mark camera 36 side, and the light diffusion member 71 is attached to the mark camera 36 by screwing using a plurality of male screws 77, but this configuration is not limited. For example, in another embodiment shown in FIG. 7, the light diffusion member 71A has a rotating member 81 having a substantially U-shape. The fixed end 81a of the rotating member 81 is rotatably supported on the outer edge of the lower surface side of the light diffusion member 71A. The free end 81b of the rotating member 81 can be engaged with the outer edge of the upper surface side of the light diffusion member 71A. According to this configuration, the light diffusion member 71A can be detachably attached to the mark camera 36 by rotating the rotating member 81. In addition, it can be attached and detached more easily and with one touch than the screw fastening method.

In another embodiment shown in FIG. 8, the light diffusion member 71B is provided with a locking piece 82. The locking piece 82 is integrally formed on the outer edge of the light diffusion member 71B. The locking piece 82 extends in the thickness direction of the light diffusion member 71B, and has a claw portion 82a at its tip. Meanwhile, a recess 83 is formed on the outer peripheral surface of the flange portion 37b of the mark camera 36, into which the claw portion 82a can be locked. With this configuration, the light diffusion member 71B can be detachably attached to the mark camera 36 by locking the claw portion 82a into the recess 83.

In another embodiment shown in FIG. 9, the light diffusion member 71C has a first permanent magnet piece 84, and the flange portion 37b of the mark camera 36 has a second permanent magnet piece 85 at a position corresponding to the first permanent magnet piece 84. A magnetic attraction force acts between the first permanent magnet piece 84 and the second permanent magnet piece 85. With this configuration, the light diffusion member 71C can be detachably attached to the mark camera 36 by magnetically attaching the first permanent magnet piece 84 to the second permanent magnet piece 85.

In the above-mentioned first embodiment, the light diffusion member 71 is attached to the mark camera 36 only during maintenance work performed when the device is not in operation, and the light diffusion member 71 is removed from the mark camera 36 when the device is in operation to perform component mounting work, but this configuration is not limited to this. For example, in another embodiment, the light diffusion member 71 may be configured to be always attached near the mark camera 36, moved to a use position only during maintenance work, and retreated to a retreat position where it does not get in the way at other times.

In the above-mentioned first embodiment, the existing mark camera 36 is used as a light source and a light diffusion member 71 is attached to the mark camera 36, but this configuration is not limited to this. For example, in other embodiments, the existing part camera 41 may be used as a light source and a light diffusion member 71 may be attached to the part camera 41. Alternatively, if there is an existing side camera, the side camera may be used as a light source and a light diffusion member 71 may be attached. Among these cameras, it is preferable to select a mark camera 36 that can irradiate illumination light L1 from above downward.

In the above embodiment 1, an example was shown in which the substrate-related work machine was a component mounter 11 that performs component mounting work, but this configuration is not limited to this. For example, in other embodiments, the substrate-related work machine may be a printer that performs printing work such as solder paste on the substrate 1 (another example of substrate-related work). Alternatively, the substrate-related work machine may be an inspection machine that performs mounting position inspection work of mounted components on the substrate 1 (another example of substrate-related work). Since both the printer and the inspection machine are usually equipped with a camera, the existing camera may be used as a light source and a light diffusing member 71 may be attached to the camera.

Although specific examples of the present invention have been described above in detail, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. The technical elements described in this specification or drawings exert technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings can achieve multiple objectives simultaneously, and achieving one of those objectives is itself technically useful.

This specification also discloses the technical idea of changing "the substrate-related operation machine according to claim 3" in claim 5 to "the substrate-related operation machine according to any one of claims 1 to 4", the technical idea of changing "the substrate-related operation machine according to claim 6" in claim 7 to "the substrate-related operation machine according to claim 5 or 6", and the technical idea of changing "the substrate-related operation machine according to claim 8" in claim 9 to "the substrate-related operation machine according to any one of claims 1 to 8".

1: Board 2: Component 2a: SMD
2b: Die 11: Component mounter 22 as substrate-related operating machine: Table 22a: Opening 31: Head unit 32 as operating device: Component mounting head 36 as head: Mark camera 38 as camera: Imaging section 39: LED illumination section 54: Wafer expander 57: Equipment 61: Control device 71, 71A, 71B, 71C: Light diffusion member 72: Support body 72a: Light non-transmitting section 73: Light diffusion lens 74: Screw insertion hole 76 as light diffusion member mounting section (first mounting structure): Female screw hole L1 as second mounting structure: Illumination light

Claims (10)

an operation execution device that executes a predetermined substrate-related operation on a substrate;
a camera having an imaging unit that performs an imaging operation with at least one of the board, a component mounted on the board, and the task execution device as an imaging target, and an LED illumination unit that is turned on when the imaging unit performs the imaging operation and irradiates the imaging target with illumination light;
A control device that controls the operation of the work execution device and the camera,
The camera is capable of being fitted with a light diffusion member for diffusing the illumination light, and is configured to be able to turn on the LED illumination unit when the work execution device is stopped. The substrate-related operating machine according to claim 1, wherein the light diffusion member includes a light diffusion lens that transmits and diffuses the illumination light. the light diffusing member includes a plate-shaped support, a light diffusing lens supported at a center portion of the support and transmitting and diffusing the illumination light, and a first mounting structure formed on an outer periphery of the support,
a second mounting structure is formed on the front side of the camera at a position corresponding to the first mounting structure,
The substrate-related operating machine according to claim 1 , wherein the light diffusing member is detachably attached to the camera by using the first mounting structure and the second mounting structure. The substrate-related operating machine according to claim 3, wherein the first mounting structure is a plurality of screw insertion holes, the second mounting structure is a plurality of female screw holes, and a plurality of male screws can be screwed into the plurality of female screw holes via the plurality of screw insertion holes. The substrate-related operation machine according to claim 3, wherein the control device has a function of detecting whether the light diffusion member has been left detached from the camera. a light-opaque portion is formed in the support member in a region surrounding the light diffusing lens,
6. The substrate-related operating machine according to claim 5, wherein the control device detects whether the light diffusing member has been left unremoved by determining the width of an area illuminated by the illumination light based on the image captured by the camera. The substrate-related operation machine according to claim 6, wherein the control device performs control to maintain the devices other than the camera in a stopped state when it detects that the light diffusion member has been left unattended. the substrate-related operation machine is a component mounter that performs an operation of mounting the component picked up by a movable head onto the substrate,
8. The substrate-related operating machine according to claim 1, wherein the camera is a mark camera that is mounted on the head and captures an image of a mark affixed to the substrate from above the substrate. The substrate-related operation machine according to claim 8, wherein the component mounter has a table with an opening on the top surface and various devices arranged on the bottom surface thereof, and a wafer expander installed in the opening. an operation execution device that executes a predetermined substrate-related operation on a substrate;
a camera having an imaging unit that performs an imaging operation with at least one of the board, a component mounted on the board, and the task execution device as an imaging target, and an LED illumination unit that is turned on when the imaging unit performs the imaging operation and irradiates the imaging target with illumination light;
A control device that controls the operation of the work execution device and the camera,
A method for performing maintenance on a substrate-related operation machine in which a light diffusion member for diffusing the illumination light can be attached to the camera, comprising:
attaching the light diffusing member to the camera while the operation of the task execution device is stopped;
turning on the LED illumination unit while the operation of the task execution device is stopped;
performing a maintenance operation on the substrate-related operation machine while the operation execution device is stopped and the LED illumination unit is turned on;
A maintenance method for a substrate-related operating machine comprising:

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