JP5717309B2 - 太陽電池用シリコンウエハー及びその製造方法 - Google Patents
太陽電池用シリコンウエハー及びその製造方法 Download PDFInfo
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- JP5717309B2 JP5717309B2 JP2014518725A JP2014518725A JP5717309B2 JP 5717309 B2 JP5717309 B2 JP 5717309B2 JP 2014518725 A JP2014518725 A JP 2014518725A JP 2014518725 A JP2014518725 A JP 2014518725A JP 5717309 B2 JP5717309 B2 JP 5717309B2
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- polycrystalline silicon
- weight
- silicon wafer
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title description 10
- 229910052710 silicon Inorganic materials 0.000 title description 10
- 239000010703 silicon Substances 0.000 title description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 32
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 30
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 28
- 235000012431 wafers Nutrition 0.000 claims description 26
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 20
- 229910017604 nitric acid Inorganic materials 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 230000003746 surface roughness Effects 0.000 claims description 14
- 238000005259 measurement Methods 0.000 claims description 10
- 238000001039 wet etching Methods 0.000 claims description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 2
- 229910001431 copper ion Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- -1 silver ions Chemical class 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 7
- 239000002253 acid Substances 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000010248 power generation Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Chemical compound O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 2
- HIFJUMGIHIZEPX-UHFFFAOYSA-N sulfuric acid;sulfur trioxide Chemical compound O=S(=O)=O.OS(O)(=O)=O HIFJUMGIHIZEPX-UHFFFAOYSA-N 0.000 description 2
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Weting (AREA)
Description
サイズ156mm×156mm±0.5mm、厚さ200μm±20μmのP型多結晶シリコンウエハーを表1に示したエッチング条件でエッチングを行った。そして、以下の評価を行った。エッチング条件および評価結果を表1及び表2に示す。なお、上記のシリコンウエハーは、多結晶シリコンインゴットを遊離砥粒ワイヤーソー方式でスライスして得られたものであり、前述の立体的表面粗さは1.9である。
レーザーマイクロスコープ:KEYENCH社製「VK−9700」を使用し、測定時倍率:3,000倍、観察視野:6,512μm2の条件下で、多結晶シリコンウエハーの凹凸表面の表面積を計測し、その値を観察視野で除し、立体的表面粗さ値を算出した。
シリコンウエハーの断面をSEMで撮影し、凹凸の大きさ(深さ)を10点計測し、その平均値を凹凸の大きさとした。
シリコンウエハーを適当な大きさ(約30mm×30mm)にカットした後に洗浄する。洗浄操作は、(i)アセトン、メタノール、純水による超音波洗浄、(ii)アンモニア水+過酸化水素水による煮沸洗浄(アンモニア水:過酸化水素水:純水=1:1:6)、(iii)純水による洗浄、(iv)希弗酸(弗酸:純水=1:50)による自然酸化膜の除去、(v)純水による洗浄を順次に行った。その後に乾燥し、積分球装着分光光度計:日立製「U−3000」を使用し、波長600nmでの反射率を測定した。
(i)太陽電池の作成は次ぎのように行った。すなわち、先ず、各例で得られた太陽電池用リコンウエハー基板を22mm×30mmにカットした後、前記の(i)〜(v)の操作による洗浄を行い、不純物(リン)を熱拡散させpn接合を作成した。拡散条件は940℃、40minとした。次いで、バッファード弗酸にて表面の自然酸化膜を除去し、表面電極を作成した。すなわち、表面にAlを蒸着させ、フォトリソグラフィーにてパターニングし、櫛状電極を形成した。そして、裏面の不要n層除去のため裏面エッチングを行い(この際、弗酸:硝酸:酢酸=2:3:6の混酸を使用)、裏面にAlを蒸着させ裏面電極を形成した。
Claims (2)
- 湿式エッチングによって形成された凹凸表面を有する多結晶シリコンウエハーから成り、以下に定義する凹凸表面の立体的表面粗さが2.0〜4.0であり、上記の凹凸表面は、凹凸の深さ:0.5〜4.0μm、幅:0.5〜5.0μm、長さ:0.5〜20μmの範囲であり、アスペクト比が2〜20の凹構造から成ること特徴とする太陽電池用基板。
上記の立体的表面粗さは、レーザーマイクロスコープ:KEYENCE社製「VK−9700」を使用し、測定時倍率:3,000倍、観察視野:6,512μm2の条件下で、多結晶シリコンウエハーの凹凸表面の表面積を計測し、その値を観察視野で除した値を意味する。 - 請求項1に記載の太陽電池用基板の製造方法であって、硫酸濃度が55〜85重量%、硝酸濃度が10〜35重量%、弗酸濃度が2〜10重量%、水分濃度が2〜18重量%(但し、これらの合計量は100重量%)であり、水/硫酸の重量比率は0.26以下であり、銀イオンまたは銅イオンを含有しないエッチャントを使用して多結晶シリコンウエハーの表面を湿式エッチングすることを特徴とする太陽電池用基板の製造方法。
Priority Applications (1)
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JP2014518725A JP5717309B2 (ja) | 2012-05-31 | 2013-05-30 | 太陽電池用シリコンウエハー及びその製造方法 |
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JP2012123943 | 2012-05-31 | ||
JP2012123943 | 2012-05-31 | ||
JP2014518725A JP5717309B2 (ja) | 2012-05-31 | 2013-05-30 | 太陽電池用シリコンウエハー及びその製造方法 |
PCT/JP2013/065050 WO2013180221A1 (ja) | 2012-05-31 | 2013-05-30 | 太陽電池用シリコンウエハー及びその製造方法 |
Publications (2)
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JP5717309B2 true JP5717309B2 (ja) | 2015-05-13 |
JPWO2013180221A1 JPWO2013180221A1 (ja) | 2016-01-21 |
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JP2014518725A Expired - Fee Related JP5717309B2 (ja) | 2012-05-31 | 2013-05-30 | 太陽電池用シリコンウエハー及びその製造方法 |
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JP (1) | JP5717309B2 (ja) |
CN (1) | CN104364913B (ja) |
WO (1) | WO2013180221A1 (ja) |
Families Citing this family (1)
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CN105671641A (zh) * | 2014-11-20 | 2016-06-15 | 日本化成株式会社 | 太阳能电池用硅晶片的制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030119332A1 (en) * | 1999-12-22 | 2003-06-26 | Armin Kuebelbeck | Method for raw etching silicon solar cells |
WO2005117138A1 (ja) * | 2004-05-28 | 2005-12-08 | Sharp Kabushiki Kaisha | 太陽電池用半導体基板とその製造方法および太陽電池 |
WO2011032880A1 (en) * | 2009-09-21 | 2011-03-24 | Basf Se | Aqueous acidic etching solution and method for texturing the surface of single crystal and polycrystal silicon substrates |
JP2011249671A (ja) * | 2010-05-28 | 2011-12-08 | Sharp Corp | シリコン基板の表面処理方法および太陽電池 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010027981A (ja) * | 2008-07-23 | 2010-02-04 | Ricoh Co Ltd | 光電変換素子 |
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- 2013-05-30 CN CN201380027688.6A patent/CN104364913B/zh not_active Expired - Fee Related
- 2013-05-30 JP JP2014518725A patent/JP5717309B2/ja not_active Expired - Fee Related
- 2013-05-30 WO PCT/JP2013/065050 patent/WO2013180221A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030119332A1 (en) * | 1999-12-22 | 2003-06-26 | Armin Kuebelbeck | Method for raw etching silicon solar cells |
WO2005117138A1 (ja) * | 2004-05-28 | 2005-12-08 | Sharp Kabushiki Kaisha | 太陽電池用半導体基板とその製造方法および太陽電池 |
WO2011032880A1 (en) * | 2009-09-21 | 2011-03-24 | Basf Se | Aqueous acidic etching solution and method for texturing the surface of single crystal and polycrystal silicon substrates |
JP2011249671A (ja) * | 2010-05-28 | 2011-12-08 | Sharp Corp | シリコン基板の表面処理方法および太陽電池 |
Also Published As
Publication number | Publication date |
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CN104364913A (zh) | 2015-02-18 |
CN104364913B (zh) | 2016-09-14 |
JPWO2013180221A1 (ja) | 2016-01-21 |
WO2013180221A1 (ja) | 2013-12-05 |
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