JP5711468B2 - 分散型及び一体型の噴流冷却機能を有する熱管理システム - Google Patents
分散型及び一体型の噴流冷却機能を有する熱管理システム Download PDFInfo
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- JP5711468B2 JP5711468B2 JP2010088256A JP2010088256A JP5711468B2 JP 5711468 B2 JP5711468 B2 JP 5711468B2 JP 2010088256 A JP2010088256 A JP 2010088256A JP 2010088256 A JP2010088256 A JP 2010088256A JP 5711468 B2 JP5711468 B2 JP 5711468B2
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- 229910052751 metal Inorganic materials 0.000 description 3
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (5)
- 分散型噴流冷却機能を有するヒートシンク(10)において、
少なくとも1つの被加熱体(20)に熱接続するベース(12)と、
前記ベースに熱結合する配列状のフィン(14)と、
前記配列状のフィンの第1の側部(15)及び該第1の側部と対向する第2の側部(16)に該フィンに組み込まれて設けられる一対の多オリフィス型シンセティックジェット(30)と
を備えるヒートシンク(10)。 - 前記多オリフィス型シンセティックジェットの各々は、
第1の可撓構造(32)と、
第2の可撓構造(34)と、
前記第1及び第2の可撓構造の少なくとも一方に結合する少なくとも1つの活物質(36)と、
前記第1及び第2の可撓構造間に配置されてチャンバを形成する弾性壁(38)であって、複数のオリフィス(39)を形成して、前記チャンバと前記フィンの周囲環境との間における流体連通を容易にする弾性壁(38)とを備える、請求項1に記載のヒートシンク(10)。 - 前記フィン(14)は、ピン型フィンからなる、請求項1または2に記載のヒートシンク(10)。
- 前記配列状のフィン(14)の上に設けられ、周囲流体を前記フィンに吹き付けるように構成されるファン(50)を更に備える、請求項1乃至3のいずれか1項に記載のヒートシンク(10)。
- 前記フィン(14)は板型フィンからなる、請求項1乃至4のいずれか1項に記載のヒートシンク(10)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/421,068 | 2009-04-09 | ||
US12/421,068 US8496049B2 (en) | 2009-04-09 | 2009-04-09 | Heat sinks with distributed and integrated jet cooling |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010245539A JP2010245539A (ja) | 2010-10-28 |
JP5711468B2 true JP5711468B2 (ja) | 2015-04-30 |
Family
ID=42272059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010088256A Expired - Fee Related JP5711468B2 (ja) | 2009-04-09 | 2010-04-07 | 分散型及び一体型の噴流冷却機能を有する熱管理システム |
Country Status (4)
Country | Link |
---|---|
US (1) | US8496049B2 (ja) |
EP (1) | EP2239775B1 (ja) |
JP (1) | JP5711468B2 (ja) |
CA (1) | CA2697870A1 (ja) |
Families Citing this family (27)
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EP2094972B1 (en) * | 2006-12-15 | 2015-10-21 | Koninklijke Philips N.V. | Pulsating fluid cooling with frequency control |
US8453715B2 (en) | 2008-10-30 | 2013-06-04 | General Electric Company | Synthetic jet embedded heat sink |
US9615482B2 (en) | 2009-12-11 | 2017-04-04 | General Electric Company | Shaped heat sinks to optimize flow |
US9478479B2 (en) * | 2010-10-26 | 2016-10-25 | General Electric Company | Thermal management system and method |
US10226991B2 (en) * | 2009-10-28 | 2019-03-12 | GM Global Technology Operations LLC | Air curtain using smart materials |
US8776871B2 (en) * | 2009-11-19 | 2014-07-15 | General Electric Company | Chassis with distributed jet cooling |
US8695686B2 (en) * | 2010-01-07 | 2014-04-15 | General Electric Company | Method and apparatus for removing heat from electronic devices using synthetic jets |
US8760164B2 (en) | 2010-01-29 | 2014-06-24 | General Electric Company | Magnetic resonant imaging gradient driver architecture |
US8506105B2 (en) | 2010-08-25 | 2013-08-13 | Generla Electric Company | Thermal management systems for solid state lighting and other electronic systems |
JP5860665B2 (ja) * | 2010-10-26 | 2016-02-16 | ゼネラル・エレクトリック・カンパニイ | 熱管理システム及び方法 |
US20120170216A1 (en) * | 2011-01-04 | 2012-07-05 | General Electric Company | Synthetic jet packaging |
WO2012131713A1 (en) * | 2011-03-31 | 2012-10-04 | Tejas Networks Limited | An improved heat sink |
US9417017B2 (en) | 2012-03-20 | 2016-08-16 | Thermal Corp. | Heat transfer apparatus and method |
US8976525B2 (en) * | 2012-07-31 | 2015-03-10 | General Electric Company | Systems and methods for dissipating heat in an enclosure |
US9247672B2 (en) | 2013-01-21 | 2016-01-26 | Parker-Hannifin Corporation | Passively controlled smart microjet cooling array |
US20140216696A1 (en) * | 2013-02-01 | 2014-08-07 | Alcatel Lucent | Cooling device and a cooling assembly comprising the cooling device |
JP6509189B2 (ja) | 2013-03-14 | 2019-05-08 | ゼネラル・エレクトリック・カンパニイ | 低共振音響シンセティックジェット構造 |
US9976762B2 (en) * | 2013-03-14 | 2018-05-22 | General Electric Company | Synthetic jet driven cooling device with increased volumetric flow |
US9415413B2 (en) | 2013-03-14 | 2016-08-16 | General Electric Company | Synthetic jet suspension structure |
US10085363B2 (en) * | 2014-05-22 | 2018-09-25 | General Electric Company | Integrated compact impingement on extended heat surface |
US9879661B2 (en) | 2014-08-29 | 2018-01-30 | General Electric Company | Vibrational fluid mover jet with active damping mechanism |
WO2017099677A1 (en) * | 2015-12-09 | 2017-06-15 | Ozyegin Universitesi | Heat sink cooling with preferred synthetic jet cooling devices |
CN108393199B (zh) * | 2018-04-27 | 2024-05-10 | 清华大学 | 合成射流器 |
KR20220117924A (ko) | 2019-12-29 | 2022-08-24 | 액타시스 인코포레이티드 | 능동 유동 제어 액츄에이터를 사용한 온도 제어 |
CN113365466B (zh) * | 2020-03-02 | 2022-09-16 | 杭州海康威视数字技术股份有限公司 | 一种电子设备 |
CN111970897B (zh) * | 2020-08-06 | 2022-06-21 | 中国电子科技集团公司第三十八研究所 | 一种半包围式岛型肋杆旁孔扰流强化换热散热器 |
US11570930B2 (en) * | 2021-02-17 | 2023-01-31 | Meta Platforms, Inc. | IC package with embedded fan-based cooling system |
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JPH05251883A (ja) * | 1992-03-05 | 1993-09-28 | Fujitsu Ltd | 電子装置の冷却機構 |
US5299090A (en) * | 1993-06-29 | 1994-03-29 | At&T Bell Laboratories | Pin-fin heat sink |
US6123145A (en) * | 1995-06-12 | 2000-09-26 | Georgia Tech Research Corporation | Synthetic jet actuators for cooling heated bodies and environments |
US6159764A (en) * | 1997-07-02 | 2000-12-12 | Micron Technology, Inc. | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages |
JP2001345585A (ja) * | 2000-06-01 | 2001-12-14 | Hitachi Kokusai Electric Inc | 放熱フィン |
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-
2009
- 2009-04-09 US US12/421,068 patent/US8496049B2/en not_active Expired - Fee Related
-
2010
- 2010-03-25 CA CA2697870A patent/CA2697870A1/en not_active Abandoned
- 2010-03-31 EP EP10158793.9A patent/EP2239775B1/en not_active Not-in-force
- 2010-04-07 JP JP2010088256A patent/JP5711468B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2239775A2 (en) | 2010-10-13 |
US20100258270A1 (en) | 2010-10-14 |
US8496049B2 (en) | 2013-07-30 |
EP2239775B1 (en) | 2016-06-01 |
EP2239775A3 (en) | 2012-09-26 |
CA2697870A1 (en) | 2010-10-09 |
JP2010245539A (ja) | 2010-10-28 |
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