JP5707785B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light-emitting device that can be used in a lighting source, a display, a backlight source of a liquid crystal display, and the like.

  Conventionally, a light emitting device having the following configuration has been proposed. For example, the light emitting device proposed in Patent Document 1 includes a resin package (embedded resin in the literature), a first lead protruding from one side of the resin package, and a second lead protruding from the other side of the resin package. A light emitting element mounted on a first lead exposed in a recess provided on the upper surface of the resin package, and a sealing resin for sealing the light emitting element in the recess, and emitting light from the first lead The back surface of the portion where the element is mounted is exposed without being covered with the resin package. In use, the light emitting device is electrically connected to the substrate by soldering the back surfaces of the first and second leads to conductor wiring provided on the substrate.

JP 2005-353914 A

  However, in the light emitting device proposed in Patent Document 1, when the light emitting element is sealed in the concave portion with the sealing resin, the sealing resin penetrates from the boundary between the resin package and the first and second leads. There arises a problem that the sealing resin that has come out and ooze out adheres to part of the back surfaces of the first and second leads. Such adhesion of the sealing resin to the first and second leads leads to a reduction in the mounting area when the light emitting device is mounted on the substrate, and there is a problem that the light emitting device cannot be stably mounted on the substrate. Even when the first lead on which the light emitting element is mounted functions as a heat radiator that dissipates heat generated by the light emitting element, the adhesion of the sealing resin to the first lead causes a decrease in heat dissipation. There is also a problem of becoming.

  Therefore, the present invention was created to solve such problems, and the problem is to provide a light-emitting device having excellent mountability that can be stably mounted on a substrate or excellent heat dissipation. It is in.

In order to solve the above-described problems, a light-emitting device according to the present invention includes a light-emitting element, a package having a recess that accommodates the light-emitting element, a support supported by the package, and exposed on a back side of the package. And the sealing resin filled in the recess, and the package is in contact with at least a part of the boundary between the back surface and the electrode. have a form electrode groove being so, the grooves for the two said electrodes, characterized in that the contact two of said electrodes respectively. In the light-emitting device according to the present invention, it is preferable that the two electrodes are flat plate-like electrodes and are supported on the back surface of the package. In the light-emitting device according to the present invention, it is preferable that the two electrodes have a form in which end portions of the electrodes protrude from the side surface of the package. Furthermore, in the light emitting device according to the present invention, it is preferable that the two electrodes have a configuration in which the end portions of the electrodes do not protrude from the side surface side of the package and are located at the same position as the back end portion.

  According to the said structure, the sealing resin which oozed out from the boundary part by having a groove part for electrodes formed so that a package may contact at least one part of the boundary part of the said back surface and an electrode on the back surface is an electrode. Since the sealing resin does not spread on the exposed surface of the electrode on the back surface of the package that is guided to the groove portion and becomes the mounting surface with the substrate, the sealing resin is prevented from adhering to a part of the electrode exposed surface. .

  The light-emitting device according to the present invention is a light-emitting device having an electrode groove, wherein the package is continuous with the electrode groove on the back surface and extends away from the electrode exposed on the back surface, or It is preferable to further have an auxiliary groove portion for an electrode extending at a position away from the electrode.

  According to the said structure, the sealing resin which oozes out from a boundary part can be guide | induced to the position away from the electrode because the package further has the electrode auxiliary groove part which continues with the electrode groove part. Therefore, even when the amount of the sealing resin that oozes out is overflowing from the auxiliary groove portion for the electrode, the sealing resin spreads at a position away from the electrode. Adhesion is further suppressed.

  The light emitting device according to the present invention is a light emitting device having a groove for an electrode, wherein the back surface includes a first back surface region divided into a center, and a second back surface region divided into right and left of the first back surface region. It is preferable that the electrode groove portion is formed in the second back surface region, the first back surface region is recessed from the second back surface region, and the electrode groove portion is continuous through the recess.

  According to the above-described configuration, the sealing resin that exudes from the boundary portion is formed by the electrode groove portion by providing the first back surface region that is recessed from the second back surface region where the electrode groove portion is formed and the electrode groove portion is continuous from the recess. Guided to the first back region. Since the sealing resin in the first back surface region that is recessed from the second back surface region is difficult to crawl up to the second back surface region, the sealing resin may adhere to a part of the electrode exposed surface in the second back surface region. It is further suppressed.

  The light emitting device according to the present invention is a light emitting device having a groove for an electrode, wherein the back surface includes a first back surface region divided into a center, and a second back surface region divided into right and left of the first back surface region. Preferably, the second back surface region is formed with the electrode groove portion and the electrode auxiliary groove portion, the first back surface region is recessed from the second back surface region, and the electrode auxiliary groove portion is continuous through the recess. .

  According to the said structure, it is recessed from the 2nd back surface area | region in which the groove part for electrodes and the auxiliary groove part for electrodes are formed, and the sealing which oozes out from a boundary part is provided by providing the 1st back surface area | region which the auxiliary groove part for electrodes continues in a recess The resin is guided to the first back surface region by the electrode auxiliary groove. Since the sealing resin in the first back surface region that is recessed from the second back surface region is difficult to crawl up to the second back surface region, the sealing resin may adhere to a part of the electrode exposed surface in the second back surface region. It is further suppressed.

In the light emitting device according to the present invention, in the light emitting device having an electrode groove, the recess is preferably formed by a step.

  According to the above configuration, the sealing resin guided to the first back surface region is unlikely to crawl up to the second back surface region due to a step, so that the sealing resin adheres to a part of the electrode exposed surface in the second back surface region. This is further suppressed.

  The light-emitting device according to the present invention further includes a radiator that is supported by the package and is exposed on the back side of the package, and on which the light-emitting element is mounted, in the light-emitting device having an electrode groove. It is preferable that the back surface further includes a radiator groove formed so as to be in contact with at least a part of the boundary between the back surface and the radiator.

  According to the said structure, in addition to the effect | action which suppresses that sealing resin adheres to a part of electrode exposed surface, it is further equipped with the heat radiator by which the light emitting element was mounted, and the said back surface and heat radiator on the back surface of a package. The heat sink has a groove for heat radiator formed so as to be in contact with at least a part of the boundary with the heat sink. Since the stop resin does not spread, it is possible to suppress the sealing resin from adhering to a part of the exposed surface of the radiator.

  The light-emitting device according to the present invention further includes a radiator that is supported by the package and is exposed on the back side of the package, and on which the light-emitting element is mounted, in the light-emitting device having an electrode groove. It further has a heat sink groove formed on the back surface so as to be in contact with at least a part of the boundary between the back surface and the heat sink, and the heat sink groove is formed in the first back surface region. Is preferred.

  According to the said structure, in addition to the effect | action which suppresses that sealing resin adheres to a part of electrode exposed surface, it is further equipped with the heat radiator by which the light emitting element was mounted, and the said back surface and heat radiator on the back surface of a package. Since the sealing resin that oozes out from the boundary portion is further guided to the groove portion for the radiator by further having the groove portion for the radiator formed so as to be in contact with at least a part of the boundary portion with the It is suppressed that sealing resin adheres to a part.

  Since the light emitting device according to the present invention has the electrode groove on the back surface of the package, it is possible to suppress the sealing resin from adhering to a part of the electrode exposed surface, so that the mounting property to the substrate is excellent. The light-emitting device according to the present invention further includes an electrode auxiliary groove portion that is continuous with the electrode groove portion on the back surface of the package, and further includes a first back surface region that is divided into a center by a step. Since the adhesion of the sealing resin to the exposed surface is further suppressed, the mounting property to the substrate is further improved.

  Furthermore, since the light emitting device according to the present invention has the electrode groove portion and the heat radiator groove portion, it is possible to prevent the sealing resin from adhering to a part of the electrode exposed surface and the heat radiator exposed surface. Excellent mountability and heat dissipation.

It is a perspective view which shows the structure of the light-emitting device based on this invention. It is a top view when the light-emitting device of FIG. 1 is seen from the back surface side of a package. It is sectional drawing along the AA line of FIG. 1, and the BB line of FIG. (A)-(c) is a top view when it sees from the back surface side of the package which shows arrangement | positioning of the groove part for electrodes, and the auxiliary | assistant groove part for electrodes. (A) The top view when it sees from the back surface side of the package which shows other embodiment of the light-emitting device based on this invention, (b) is sectional drawing along the EE line of (a). It is a top view when it sees from the back surface side of the package which shows other embodiment of the light-emitting device based on this invention. It is sectional drawing along CC line of FIG. It is a top view when it sees from the back surface side of the package which shows other embodiment of the light-emitting device based on this invention. It is a top view when it sees from the back surface side of the package which shows other embodiment of the light-emitting device based on this invention. It is sectional drawing along the DD line of FIG. It is a top view when it sees from the back surface side of the package which shows other embodiment of the light-emitting device based on this invention. It is a top view when it sees from the back surface side of the package which shows other embodiment of the light-emitting device based on this invention.

A first embodiment of a light emitting device according to the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 to 3, the light emitting device 1 </ b> A includes a light emitting element 2, a package 4, two electrodes 15, and a sealing resin 21, and the package 4 has an electrode groove 11. Features. Each configuration will be described below.

(Light emitting element)
The light emitting element 2 is accommodated in the recess 5 of the package 4 and outputs light of an arbitrary wavelength, and a semiconductor light emitting element is preferable. As the semiconductor light-emitting element, for example, ZnSe or a nitride-based semiconductor (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is used as a blue or green light-emitting element. Things can be used. As the red light emitting element, GaAs, InP, or the like can be used. Furthermore, a semiconductor light emitting element made of a material other than this can also be used. The composition, emission color, size, number, and the like of the light emitting element to be used can be appropriately selected according to the purpose.

  Further, a light-emitting element that outputs not only light in the visible light region but also ultraviolet rays and infrared rays can be obtained. Furthermore, together with the semiconductor light emitting element, the light receiving element, a protective element (for example, a Zener diode or a capacitor) that protects the semiconductor element from destruction due to overvoltage, or a combination thereof can be accommodated in the recess 5 of the package 4. it can.

  The light emitting element 2 is electrically connected to the electrode 15 by being connected to the electrode 15 via the conductive wire 3. Moreover, it is preferable that the light emitting element 2 is mounted on the electrode 15 through a die bond member (not shown).

The conductive wire 3 preferably has good ohmic properties, mechanical connectivity, electrical conductivity and thermal conductivity with the electrode 15. Preferably ^{0.01cal / (s) (cm 2} ) (℃ / cm) or higher as heat conductivity, and more preferably ^{0.5cal / (s) (cm 2} ) (℃ / cm) or more. In consideration of workability and the like, the diameter of the conductive wire 3 is preferably Φ10 μm or more and Φ45 μm or less. Examples of such a conductive wire 3 include a conductive wire 3 using a metal such as gold, copper, platinum, and aluminum and alloys thereof. For the connection of the conductive wire 3, a wire bonding device is used.

  As the die bond member, either a conductive die bond member or an insulating die bond member is selected depending on the light emitting element 2 to be placed. For example, in the case of an insulating light emitting element, an insulating die bond member or a conductive die bond member may be used. In the case of a conductive light emitting element, a conductive die bond member is used. Epoxy resin, silicone resin or the like is used as the insulating die bond member, and the conductive die bond member is a conductive paste such as silver, gold or palladium, solder such as Au—Sn eutectic, or low melting point metal. Use materials.

(package)
The package 4 has a recess 5 for accommodating the light emitting element 2 and supports the two electrodes 15. The package 4 protects the light emitting element 2 and is molded integrally with the electrode 15. The shape of the package 4 is preferably a quadrangle or a shape close to this in plan view, but is not particularly limited thereto, and may be a triangle, a polygon, or a shape close thereto. Moreover, it is preferable that the package 4 has the recessed part 5 in the surface (upper surface), and provides the level | step-difference part 6 lowered | hung one step in the corner | angular part spaced apart from the recessed part 5. FIG. The step portion 6 can be used as a pin pushing region when taking out from the forming die at the time of forming the package, and can also be used as a cathode mark indicating the polarity of the electrode 15 by changing the shape of each corner portion. be able to. Such stepped portions 6 can be provided at all four corners of the package 4 or at only one corner of the package 4. Furthermore, depending on the shape and size of the package 4, it can also be provided in any part such as a region other than the corners.

  As a material constituting the package 4, an insulating member is preferable, and a member that does not easily transmit light from the light emitting element 2 or external light is preferable. Further, it has a certain degree of strength and can be used as a thermosetting resin, a thermoplastic resin or the like. Specifically, phenol resin, glass epoxy resin, BT resin (bismaleimide triazine resin), PPA (polyphthalate) Acid amide resin) and the like. In particular, it is preferable to use a triazine derivative epoxy resin which is a thermosetting resin. In other thermosetting resins, it is preferable to use at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins. Further, the thermosetting resin and the thermoplastic resin can contain an acid anhydride, an antioxidant, a release material, a light reflecting member, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, a pigment, and the like. Titanium dioxide or silica can be used for the light reflecting member. As a material constituting the other package, ceramics such as aluminum oxide, aluminum nitride, and silicon carbide can be used.

  The recess 5 is formed so as to open on the surface (upper surface) of the package 4, and the electronic components such as the light emitting element 2 and the protection element are accommodated in the recess. And this recessed part 5 becomes a light emission part (light emission window) in a light-emitting device. As described above, the recess 5 in which various electronic components are housed has a bottom surface having an area necessary for placing them, and the electrode 15 exposed on the bottom surface of the recess is electrically connected to these electronic components. It is preferable that the size and shape be such that a bonding region such as the conductive wire 3 to be secured can be secured. Further, the depth of the recess 5 is preferably set to such a depth that the electronic component can be sealed by the sealing resin 21 filled in the recess.

  The shape of the recess 5 is preferably a substantially circular shape, but is not particularly limited to this, and depending on the shape of the package 4, particularly the shape of the upper surface of the package, further considering light distribution characteristics and the like. It can be selected appropriately. When the upper surface of the package 4 is substantially square (see FIG. 1), it is preferable to form the substantially circular recess 5. However, when further increasing the light emitting area, it may be substantially rectangular as with the upper surface of the package. In addition, although not shown, one large concave portion 5 is not provided, but two or more plural concave portions 5 may be provided.

  It is preferable that the two electrodes 15 are exposed at the bottom of the recess 5 and the light emitting element 2 is placed on at least one of the exposed electrodes 15. The two electrodes 15 are preferably exposed so as to be substantially on the same surface at the bottom of the recess, but may be exposed so as to be on different surfaces such as by providing a step. Moreover, it is preferable that a part of the package 4 is exposed as an insulating member from the bottom of the recess 5 so as to insulate the two electrodes 15 from each other.

  The inner wall of the recess 5 is preferably provided so that the inner wall of the recess 5 is inclined toward the bottom so that the light from the light emitting element 2 is reflected and light is efficiently emitted from the recess 5. In that case, the angle can be selected as desired, and the inner wall can be partially inclined without being inclined. Moreover, you may provide the part which protrudes toward inner side in an inner wall. Specifically, an inner protrusion 7 that protrudes inward is formed on the inner wall of the recess 5 (see FIG. 1). As described above, the strength of the package 4 can be improved without reducing the light emitting area by projecting a part thereof inward rather than projecting the entire inner wall of the recess 5. It is possible to suppress a decrease in the holding force of the electrode 15 supported on the substrate. Only one inner protrusion 7 may be provided, or two or more inner protrusions 7 may be provided according to the size and shape of the package 4. Moreover, when providing the inner side protrusion part 7 in a part of inner wall in this way, it is preferable to adjust the inclination | tilt angle of an inner wall so that each may become substantially equal.

(electrode)
The two electrodes 15 are for supplying a current from the outside to the electronic components such as the light emitting element 2 and the protective element housed in the recess 5 of the package 4, and are supported by the package 4, on the back side of the package 4. It is provided at a position where it is exposed and electrically connected to the light emitting element 2. Specifically, the two electrodes 15 are preferably disposed on the opposite side surfaces 8 of the package 4 as a position where the two electrodes 15 are electrically connected to the light emitting element 2 via the conductive wires 3 (see FIG. 1). . Further, it is preferable that the two electrodes 15 are arranged at a substantially constant interval at the bottom of the recess 5, and the light emitting element 2 is placed on one or both of the electrodes 15.

  Each of the electrodes 15 has an exposed region 16 exposed at the bottom of the recess 5 of the package 4 on one end side, protrudes from the side surface 8 of the package 4 on the other end side, exposed on the back side of the package 4, and an electrode exposed surface 20. It is preferable that the electrode 15 has a substantially rectangular plate shape in plan view supported by the package 4 so as to have the protruding region 18. Each of the electrodes 15 has two bent portions 17 that are bent at a predetermined angle (for example, 90 to 150 degrees) inside the package 4.

  The back surface (electrode exposed surface 20) of the protruding region 18 serves as a portion where the light emitting device 1A is bonded onto the substrate 30 using a conductive bonding member 31 such as solder. Therefore, it is preferable that the back surface of the protruding region 18 is provided so as to be flush with the back surface 9 of the package 4. For example, by bending the electrode 15 so as to reach the back surface 9 of the package 4 inside the package 4, the back surface of the protruding region 18 becomes flush with the back surface 9 of the package 4 (see FIG. 3). By doing in this way, mounting of the light emitting device 1A on the substrate 30 is easy and reliable. Although not shown, the protruding region 18 may be formed by bending after protruding from the side surface 8 of the package 4.

  Thus, when providing the bending part 17 in the electrode 15, it is preferable not to bend after shaping | molding of the package 4, but to be bent beforehand before shaping | molding. By forming the package 4 by integral molding using the bent electrode 15, a gap is hardly generated between the package 4 and the electrode 15.

  Each of the electrodes 15 is preferably arranged so that the back surface shape of the protruding region 18 is substantially rectangular in plan view, and the long sides of the protruding region 18 are parallel to each other. By disposing the electrode 15 in this way, it becomes easy to reduce the deviation at the time of mounting on the substrate 30.

  The electrode 15 preferably has a through hole 19 in a region in contact with the side surface 8 of the package 4. By providing the through hole 19 in the electrode 15, even the relatively thick electrode 15 is easily bent. The through hole 19 is preferably filled with the package 4. By filling the through hole 19 with the package 4, the adhesion between the package 4 and the electrode 15 can be improved.

  The material constituting the electrode 15 is preferably a material having a relatively large thermal conductivity, whereby the heat generated in the light emitting element 2 can be efficiently released to the outside. For example, those having a thermal conductivity of about 200 W / (m · K) or more are preferable. The electrode 15 is preferably composed of a material having a relatively large mechanical strength, and a material that can be easily punched or etched. Specific examples include metals such as copper, aluminum, gold, silver, tungsten, iron, and nickel, nickel alloys, and alloys such as phosphor bronze. In addition, the thickness, shape, and the like of the electrode 15 can be appropriately adjusted in consideration of the size, shape, and the like of the light-emitting device 1A to be obtained. When the electrode 15 is made of a material that easily absorbs light, it is preferable that the electrode 15 has a laminated structure, such as providing a member that easily reflects light on the surface. For example, it is preferable that the electrode 15 has a laminated structure in which silver is plated on a conductive member made of tungsten or copper.

(Electrode groove)
As shown in FIG. 2, the electrode groove 11 is formed on the back surface 9 of the package 4 so as to be in contact with at least a part of the boundary portion 10 </ b> A between the back surface 9 and the electrode 15. Then, the sealing resin 21 forms such an electrode groove 11, so that when the light emitting element 2 is sealed inside the recess 5 of the package 4, the electrode resin groove portion oozes out from the boundary portion 10 </ b> A. 11 to guide. Therefore, the sealing resin 21 does not spread on the electrode exposed surface 20 that becomes the mounting surface with the substrate 30 (see FIG. 3), that is, on the back surface of the protruding region 18 of the electrode 15. This prevents the sealing resin 21 from adhering to the portion. As a result, the light emitting device 1A can be stably mounted on the substrate 30 using the conductive bonding member 31 such as solder. As shown in FIG. 2, if the electrode groove 11 is formed in contact with the boundary portion 10A, the sealing resin 21 oozing out from the boundary portion 10A can be efficiently guided to the electrode groove portion 11.

  The groove shape of the electrode groove 11 is not particularly limited as long as the sealing resin 21 can be prevented from spreading to the back surface of the protruding region 18 of the electrode 15 and the strength of the package 4 can be secured, but is orthogonal to the longitudinal direction. It is preferable that the cross section to be formed is a quadrangle, a semicircle, a triangle, or the like. Similarly, the longitudinal dimension of the electrode groove 11 is not particularly limited, but the groove width is about 0.3 mm, the groove depth is about 0.5 mm, and the electrode 15 has a width direction length. It is preferable that the lengths are approximately equal. The electrode groove 11 is preferably formed at the same time as the package 4 is integrally formed.

(Sealing resin)
The sealing resin 21 fills the recess 5 of the package 4 and protects the light emitting element 2 and the conductive wire 3 accommodated in the recess 5 from dust, moisture, external force, etc. Those having a light-transmitting property capable of transmitting the above light are preferable. Specific examples of the material include silicone resin, epoxy resin, and urea resin. In addition to such materials, a colorant, a light diffusing agent, a filler, a fluorescent member, and the like can be contained as desired. The fluorescent member absorbs light from the light emitting element 2 and converts it into light of a different wavelength. For example, a rare earth aluminate phosphor mainly activated by a lanthanoid element such as Ce, Eu, Ce Examples thereof include nitride-based phosphors and oxynitride-based phosphors mainly activated by lanthanoid elements such as lanthanoid elements. Moreover, it is preferable to provide the sealing resin 21 so as to fill the entire recess, but it is also possible to fill up the middle of the recess depending on the purpose.

  The light emitting device 1A shown in FIGS. 1 to 3 may be configured to include the electrode groove 11 as shown in FIGS. 4A to 4C or the electrode groove 11 and the electrode auxiliary groove 12. Good.

  For example, as shown in FIG. 4A, the electrode groove 11 has a package 4 so that an end thereof is in contact with a part of the boundary portion 10A and away from the back surface of the boundary portion 10A, that is, the protruding region 18 of the electrode 15. It may extend toward the center of the back surface 9. Further, the extending direction of the electrode groove 11 may be either parallel or oblique to the side of the back surface 9. Furthermore, the depth of the electrode groove 11 may be increased as it goes to the center of the back surface 9.

Further, as shown in FIGS. 4B and 4C, the back surface 9 of the package 4 may further include an electrode auxiliary groove 12 together with the electrode groove 11.
(Auxiliary groove for electrode)
The electrode auxiliary groove 12 is continuous with the electrode groove 11 and extends away from the electrode 15 exposed on the back side of the package 4 or extends away from the electrode 15.
In FIG. 4B, the electrode auxiliary groove portion 12 is continuous with the electrode groove portion 11 and extends away from the back surface of the protruding region 18 which is the electrode exposed surface 20 of the electrode 15, for example, a package. 4 extends toward the center of the back surface 9. Further, the extending direction of the electrode auxiliary groove portion 12 may be either parallel or oblique to the side of the back surface 9. Furthermore, the depth of the electrode auxiliary groove portion 12 may be made deeper toward the center of the back surface 9. The shape and dimensions of the electrode auxiliary groove 12 are the same as those of the electrode groove 11 described above. The length in the longitudinal direction of the auxiliary electrode groove 12 is preferably about 補助 of the length of the back surface 9 of the package 4.

  By forming such an electrode auxiliary groove portion 12, the sealing resin 21 oozing out from the boundary portion 10 </ b> A can be guided from the electrode groove portion 11 to the electrode auxiliary groove portion 12. Thus, even when the sealing resin 21 oozes out and overflows from the electrode auxiliary groove 12, the sealing resin 21 spreads at a position away from the electrode 15, so that the back surface of the protruding region 18 of the electrode 15 is This further suppresses the sealing resin 21 from adhering to the portion, so that the light emitting device 1A can be more stably mounted on the substrate 30 using the conductive bonding member 31 such as solder.

  The electrode groove portion 11 formed so as to be in contact with the boundary portion 10A can easily guide the sealing resin 21 to the electrode groove portion 11, but when the amount of the sealing resin 21 that oozes out is large, the electrode groove portion 11 is used. It is easy to overflow and accumulate. However, as shown in FIG. 4B, if the electrode auxiliary groove 12 is formed, the sealing resin 21 can be guided to the electrode auxiliary groove 12, so that the electrode groove 11 extends along the boundary 10A. Even if the package 4 is formed in contact with the surface, it is possible to suppress the sealing resin 21 from adhering to a part of the back surface of the protruding region 18 of the electrode 15.

  In addition, as shown in FIG. 4C, when the electrode groove 11 extends away from the back surface of the protruding region 18 of the electrode 15, a part of the electrode auxiliary groove 12 is an electrode. The groove portion 11 is continuous and extends away from the electrode 15 (projecting region 18). For example, a boundary portion extends from a portion continuous with the electrode groove portion 11 toward the end of the back surface 9 of the package 4. It may extend along 10A. Further, the extending direction of the electrode auxiliary groove portion 12 may be either parallel or oblique to the boundary portion 10A. It is preferable that the electrode auxiliary groove portion 12 extends with substantially the same length as the length of the electrode 15 in the width direction.

  In the light emitting device 1A shown in FIGS. 1 to 3, the back surface 9 of the package 4 may be provided with a first back surface region 9A and a second back surface region 9C as shown in FIGS.

(First back area)
The first back surface region 9A is a region that is sandwiched by the second back surface region 9C and divided into the center of the back surface 9 on the back surface 9 of the package 4, and is recessed from the second back surface region 9C. When the first back surface region 9A is recessed from the second back surface region 9C in a bowl shape, the electrode groove 11 or the electrode auxiliary groove 12 formed continuously on the second back surface region 9C through the recesses. A region recessed from one end is the first back surface region 9A. Further, the first back surface region 9A and the second back surface region 9C may be divided by the step 9B. The electrode groove portion 11 or the electrode auxiliary groove portion 12 formed in the second back surface region 9C continues to the step 9B, whereby the electrode groove portion 11 or the electrode auxiliary groove portion 12 is connected to the first back surface region 9A. If the first back surface region 9A and the second back surface region 9C are separated by the step 9B, the sealing resin 21 guided into the first back surface region 9A is unlikely to crawl up to the second back surface region 9C. It is further suppressed that the sealing resin 21 adheres to a part of the electrode exposed surface 20 in the back surface region 9C. The size of the first back surface region 9A is not particularly limited, but is preferably formed with an area ratio of about 30% with respect to the area of the back surface 9 of the package 4. The depth of the recess in the first back surface region 9A, that is, the height of the step 9B is not particularly limited, but is preferably about 0.5 mm. The shape of the first back surface region 9A is not particularly limited, but is a rectangular shape in which the step 9B is formed in a straight line parallel to the boundary portion 10A, or a curved shape in which the step 9B is not parallel to the boundary portion 10A. It is preferable that the 2nd back surface area | region 9C side formed in this is a concave shape or a convex shape (not shown).

(Second back area)
The second back surface region 9C is a region of the back surface 9 of the package 4 that is divided into left and right sides of the first back surface region 9A by a recess, and the electrode groove 11 and the electrode auxiliary groove 12 are formed. The size and shape of the second back surface region 9C are in accordance with the first back surface region 9A. The second back surface region 9C is preferably divided into the left and right sides of the first back surface region 9A on the back surface 9 of the package 4 by a step 9B.

  By providing the first back surface region 9A and the second back surface region 9C as described above, the sealing resin 21 oozing out from the boundary portion 10A can be guided to the first back surface region 9A by the electrode groove portion 11 and the electrode auxiliary groove portion 12. Since the sealing resin 21 guided to the first back surface region 9A hardly spreads to the stepped second back surface region 9C, the sealing resin 21 adheres to a part of the back surface of the protruding region 18 that is the electrode exposed surface 20. Thus, the light emitting device 1A can be more stably mounted on the substrate 30 using the conductive bonding member 31 such as solder (see FIG. 5B).

  The electrode groove portion 11 formed so as to be in contact with the boundary portion 10A can easily guide the sealing resin 21 to the electrode groove portion 11, but when the amount of the sealing resin 21 that oozes out is large, the electrode groove portion 11 is used. It is easy to overflow and accumulate. However, as shown in FIGS. 5 (a) and 5 (b), if the electrode auxiliary groove 12 is formed in a recess, the sealing resin 21 can be guided to the first back surface region 9A. Even in the package 4 formed so as to be in contact with the boundary portion 10 </ b> A, it is possible to suppress the sealing resin 21 from adhering to a part of the back surface of the protruding region 18 of the electrode 15.

  When the electrode groove 11 is a groove (see FIG. 4A) extending away from the boundary 10A, the electrode groove without forming the electrode auxiliary groove 12 in the second back surface region 9C. 11 is formed, and the electrode groove portion 11 continues through the recess of the first back surface region 9A.

The light emitting device 1A shown in FIGS. 1 to 3 is not limited to the one provided with the electrode 15 having the bent portion 17 as shown in FIG.
For example, in the light emitting device 1A, as shown in FIGS. 6 and 7, the electrode 15 is composed of a flat plate-like electrode 15 that does not have the bent portion 17 (see FIG. 3), and the end of the electrode 15 is It may be supported on the back surface 9 of the package 4 so as to protrude from the side surface of the package 4. Further, such a light emitting device 1A may be one in which the through hole 19 is formed in the electrode 15 and the through hole 19 is filled with the package 4, thereby improving the adhesion between the package 4 and the electrode 15. Good. The shape and size of the through-hole 19 are not particularly limited, but within a range in which the strength of the electrode 15 does not decrease, the exposed area of the electrode 15 is reduced to a square shape or a circular shape including an ellipse in a plan view. The area ratio is preferably 20% or less.
The details of each configuration of the light emitting device 1A, that is, the details of the light emitting element 2, the package 4, the electrode 15, the sealing resin 21, and the electrode groove 11 are the same as described above, and thus the description thereof is omitted. Further, such a light emitting device 1A may include the electrode auxiliary groove portion 12 described above.

  As shown in FIG. 8, the electrode 15 of the light emitting device 1 </ b> A includes a flat plate-like electrode 15 that does not have the bent portion 17 (see FIG. 3), and an end portion of the electrode 15. May be supported by the back surface 9 of the package 4 so that it does not protrude from the side surface of the package 4 and is located at the same position as the end of the back surface. In addition, such a light emitting device 1 </ b> A may be one in which a notch portion 20 a is formed at the back end portion of the electrode 15 to improve the bonding strength with the substrate 30. If the notch 20 a is formed at the back end of the electrode 15, the fillet of the conductive bonding member 31 such as solder is formed not only on the back surface of the electrode 15 but also on the side surface when mounted on the substrate 30. The bonding strength between the light emitting device 1A and the substrate 30 is improved. The shape and size of the notch 20a are not particularly limited, but the electrode 15 is exposed in a square shape or a semicircular shape including an ellipse in plan view within a range in which the strength of the electrode 15 does not decrease. It is preferable to form 20% or less in terms of the area ratio with respect to the area.

  In such a light emitting device 1 </ b> A, as shown in FIGS. 6 to 8, the light emitting element 2 is mounted by supporting a flat plate-like electrode 15 having no bent portion on the back surface 9 of the package 4. The back surface of the electrode 15 in the formed region is exposed without being covered with the package 4. As a result, in such a light emitting device 1A, heat generated from the light emitting element 2 is efficiently released to the outside. Therefore, in the light emitting device 1 </ b> A of FIGS. 6 and 8, the electrode 15 has a function as a heat radiator in addition to a conduction function to the light emitting element 2.

Next, a second embodiment of the light emitting device according to the present invention will be described with reference to the drawings.
As shown in FIGS. 9 and 10, the light emitting device 1 </ b> B includes a light emitting element 2, a package 4, two electrodes 15, a radiator 22, and a sealing resin 21, and the package 4 is for a radiator. The groove portion 13 is provided.
Since the light emitting element 2, the package 4, the electrode 15, and the sealing resin 21 are the same as those in the first embodiment, description thereof will be omitted, and the radiator 22 and the radiator groove 13 will be described.

(Heat radiator)
The radiator 22 is supported by the package 4, is exposed on the back side of the package 4, and the light emitting element 2 is placed thereon. Specifically, the heat radiator 22 is a columnar body, preferably a prismatic body having an end surface exposed at the bottom of the recess 5 of the package 4 and an end surface exposed at the back surface 9 of the package 4. Thus, by exposing the heat radiating body 22 from the back surface 9 of the package 4, the heat generated from the light emitting element 2 placed on the heat radiating body 22 can be efficiently released to the outside.

  In order to efficiently release heat from the radiator 22 to the outside, when the end surface 23 of the radiator 22 exposed from the back surface 9 is mounted on the substrate 30 using the conductive bonding member 31 such as solder, the light emitting device 1B is mounted. The heat radiator 22 is preferably supported by the package 4 so as to be positioned substantially on the same plane as the back surface 9 of the protruding region 18 of the electrode 15. If the end surface 23 of the radiator 22 is supported on the back surface side of the package 4 so as to protrude beyond the back surface 9 of the protruding region 18 that becomes the mounting surface, the stability of the light emitting device 1B at the time of mounting deteriorates, and This is because the bonding property of the protruding region 18 for conducting and the substrate 30 by the conductive bonding member 31 such as solder is deteriorated and the conduction may be insufficient.

  Like the electrode 15, the radiator 22 is preferably made of a material having a relatively large thermal conductivity. Further, as shown in FIG. 10, the heat radiator 22 is formed by thickening a part of the exposed region 16 of the electrode 15 and is preferably integrated with the electrode 15. The heat radiator 22 may be a separate member (not shown) that is not integrated with the electrode 15. Further, in the heat radiating body 22, the shape of the end surface 23 exposed on the back surface 9 of the package 4 is preferably a polygonal shape, and more preferably a rectangular shape (see FIG. 9). Further, the size of the end face 23 of the radiator 22 is not particularly limited as long as heat dissipation and the strength of the package 4 can be ensured, but it is preferably 10 to 50% in terms of the area ratio with the area of the back surface 9 of the package 4.

(Heat radiator groove)
The heat radiating groove 13 is formed on the back surface 9 of the package 4 so as to be in contact with at least a part of the boundary portion 10 </ b> B between the back surface 9 and the heat radiating body 22. Specifically, the heat radiator groove 13 is formed along the boundary portion 10B. The shape and dimensions of the radiator groove 13 are the same as those of the electrode groove 11 described above. In addition, it is preferable that the length of the groove part 13 for heat radiator is substantially equal to the length of the boundary part 10B.

  Since the heat sink groove 13 is formed, the sealing resin 21 oozing out from the boundary portion 10B is guided to the heat sink groove 13, so that the heat sink exposed surface (end surface 23) is partially formed. The adhesion of the sealing resin is suppressed, and the heat generated in the light emitting element 2 placed on the radiator 22 can be efficiently released to the outside. Further, the heat radiating body 22 can be mounted on the substrate 30 with good stability using a conductive bonding member 31 such as solder. As a result, the heat dissipation of the light emitting device 1B is excellent.

  The heat sink groove 13 is formed along the boundary portion 10B in FIG. 9, but if the sealing resin 21 can be prevented from spreading to the end face 23 of the heat sink 22 and the strength of the package 4 can be ensured, However, the present invention is not limited to this form. For example, as shown in FIG. 11, the heat dissipating groove 13 extends so that the end thereof is in contact with a part of the boundary portion 10B and away from the boundary portion 10B (the end surface 23 of the heat dissipating member 22). The part 10 </ b> B may extend toward the end of the back surface 9 of the package 4. The length of the discharger groove 13 is preferably about ½ of the length of the boundary 10B.

  As for the light-emitting device 1B of 2nd Embodiment, as shown in FIG. 9, it is preferable that the package 4 further has the auxiliary | assistant groove part 14 for heat radiator in the back surface 9. As shown in FIG.

(Auxiliary groove for radiator)
The auxiliary groove 14 for the radiator is continuous with the groove 13 for the radiator and extends away from the end surface 23 of the radiator 22 exposed on the back side of the package 4, for example, from the groove 13 for the radiator. A circular shape extends toward the end of the back surface 9 of the package 4. Further, the auxiliary groove 14 for a radiator is partly continuous with the groove 13 for a radiator and extends to a position away from the radiator 22, for example, a package from a part continuous with the groove 13 for radiator. 4 may extend along the boundary 10 </ b> B toward the end of the back surface 9. The shape and size of the auxiliary radiator groove 14 are the same as those of the electrode groove 11 described above. In addition, when the shape of the end surface 23 of the heat radiating body 22 is a polygonal shape, the auxiliary groove portion 14 for the heat radiating body extends from the corner portion, and the length thereof is ½ of the long side length of the end surface 23. It is preferable that it is a grade.

  By forming such a heat sink auxiliary groove portion 14, even when the sealing resin 21 oozes out from the boundary portion 10 </ b> B and overflows from the heat radiator auxiliary groove portion 14, it is located at a position away from the heat radiator 22. Since the sealing resin 21 spreads, it is further suppressed that the sealing resin 21 adheres to a part of the end surface 23 of the heat radiating body 22, and the heat generated in the light emitting element 2 placed on the heat radiating body 22 is efficiently transmitted to the outside. Can release well. As a result, the heat dissipation of the light emitting device 1B is further improved.

Next, a third embodiment of the light emitting device according to the present invention will be described with reference to the drawings.
As shown in FIG. 12, in the light emitting device 1 </ b> C, the package 4 of the light emitting device 1 </ b> A according to the first embodiment described above further includes a radiator groove 13 similar to that of the second embodiment on the back surface 9. It is characterized by. That is, the light emitting device 1C is characterized in that the package 4 has both the electrode groove 11 and the radiator groove 13 on the back surface 9 thereof. Moreover, it is preferable that 1 C of light-emitting devices further have the electrode auxiliary groove part 12 and the heat sink auxiliary groove part 14 in the back surface 9 of the package 4 similarly to the light-emitting device 1A and the light-emitting device 1B.

  In addition, each structure of 1 C of light-emitting devices, ie, a light emitting element (not shown), the package 4, the electrode 15, sealing resin (not shown), the electrode groove part 11, the electrode auxiliary groove part 12, and the heat sink groove part 13 are shown. The details of the radiator auxiliary groove 14 are the same as those of the light-emitting device 1A of the first embodiment and the light-emitting device 1B of the second embodiment, and a description thereof will be omitted.

  The light emitting device 1 </ b> C has both the electrode groove 11 and the radiator groove 13 on the back surface 9 of the package 4, and further includes the electrode auxiliary groove 12 and the radiator auxiliary groove 14. Since it is suppressed that sealing resin adheres to the back surface of the protrusion area | region 18 and the end surface 23 of a heat radiator, it becomes the thing excellent in the mounting property to a board | substrate, and heat dissipation.

  The light emitting device 1 </ b> C preferably includes the first back surface region 9 </ b> A and the second back surface region 9 </ b> C on the back surface 9 of the package 4 similarly to the light emitting device 1 </ b> A of the first embodiment. In the light emitting device 1C, the electrode groove 11 and the electrode auxiliary groove 12 are preferably formed in the second back surface region 9C, and the radiator groove 13 is preferably formed in the first back surface region 9A. When the electrode groove 11 (see FIG. 4) extending away from the boundary portion 10A is used as the electrode groove 11, the electrode auxiliary groove 12 (see FIG. 4) is formed in the second back surface region 9C. ), Only the electrode groove 11 is formed (not shown). Further, in the light emitting device 1C, similarly to the light emitting device 1A of the first embodiment, it is preferable to form the radiator auxiliary groove portion 14 in the first back surface region 9A.

DESCRIPTION OF SYMBOLS 1A, 1B Light-emitting device 2 Light-emitting element 4 Package 5 Recess 9 Back surface 9A 1st back surface area 9C 2nd back surface area 10A, 10B Boundary part 11 Electrode groove part 12 Electrode auxiliary groove part 13 Radiator groove part 14 Radiator auxiliary groove part 15 Electrode 21 Sealing resin 22 Heat radiator 23 End face

Claims (10)

A light emitting element;
A package having a recess for accommodating the light emitting element;
Two electrodes supported by the package, exposed on the back side of the package, and provided at a position to be electrically connected to the light emitting element;
A sealing resin filled in the recess,
The package, have a electrode groove portion which is formed in contact with at least a portion of the boundary portion between the electrode and the rear surface on the back surface,
The two electrode groove portions are in contact with the two electrodes, respectively .   The package further includes an electrode auxiliary groove that is continuous with the electrode groove on the back surface and extends away from the electrode exposed on the back surface, or extends to a position away from the electrode. The light-emitting device according to claim 1. The back surface includes a first back surface region divided into a center, and a second back surface region divided into the left and right of the first back surface region,
The second back region is formed with the electrode groove,
2. The light emitting device according to claim 1, wherein the first back surface region is recessed from the second back surface region, and the electrode groove portion is continuous through the recess. The back surface includes a first back surface region divided into a center, and a second back surface region divided into the left and right of the first back surface region,
The second back surface region is formed with the electrode groove and the electrode auxiliary groove,
3. The light emitting device according to claim 2, wherein the first back surface region is recessed from the second back surface region, and the electrode auxiliary groove portion is continuous through the recess.   The light-emitting device according to claim 3, wherein the recess is formed by a step. 3. The light emitting device according to claim 1, wherein the two electrodes are flat plate-like electrodes and are supported on a back surface of the package. The light emitting device according to claim 6, wherein the two electrodes have a form in which end portions of the electrodes protrude toward a side surface of the package. The light emitting device according to claim 6, wherein the two electrodes have a form in which an end portion of the electrode does not protrude from a side surface side of the package and is located at the same position as a back end portion. A heat sink supported by the package, exposed on the back side of the package, and mounted with the light emitting element;
The said package further has the groove part for heat radiator formed in the back surface so that at least one part of the boundary part of the said back surface and the said heat sink may be contact | connected. Light emitting device. A heat sink supported by the package, exposed on the back side of the package, and mounted with the light emitting element;
The package further includes a radiator groove portion formed on the back surface thereof so as to be in contact with at least a part of a boundary portion between the back surface and the radiator.
The light emitting device according to claim 3, wherein the heat radiating groove is formed in the first back surface region.

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