JP5703621B2 - 回路部材接続用接着剤、回路部材接続用接着剤シート、半導体装置及び半導体装置の製造方法 - Google Patents

回路部材接続用接着剤、回路部材接続用接着剤シート、半導体装置及び半導体装置の製造方法 Download PDF

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Publication number
JP5703621B2
JP5703621B2 JP2010178935A JP2010178935A JP5703621B2 JP 5703621 B2 JP5703621 B2 JP 5703621B2 JP 2010178935 A JP2010178935 A JP 2010178935A JP 2010178935 A JP2010178935 A JP 2010178935A JP 5703621 B2 JP5703621 B2 JP 5703621B2
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Japan
Prior art keywords
adhesive
circuit member
circuit
heating
resin
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JP2010178935A
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English (en)
Japanese (ja)
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JP2012038975A (ja
JP2012038975A5 (https=
Inventor
永井　朗
朗 永井
榎本　哲也
哲也 榎本
大久保　恵介
恵介 大久保
一尊 本田
一尊 本田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2010178935A priority Critical patent/JP5703621B2/ja
Publication of JP2012038975A publication Critical patent/JP2012038975A/ja
Publication of JP2012038975A5 publication Critical patent/JP2012038975A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2010178935A 2010-08-09 2010-08-09 回路部材接続用接着剤、回路部材接続用接着剤シート、半導体装置及び半導体装置の製造方法 Active JP5703621B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010178935A JP5703621B2 (ja) 2010-08-09 2010-08-09 回路部材接続用接着剤、回路部材接続用接着剤シート、半導体装置及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010178935A JP5703621B2 (ja) 2010-08-09 2010-08-09 回路部材接続用接着剤、回路部材接続用接着剤シート、半導体装置及び半導体装置の製造方法

Publications (3)

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JP2012038975A JP2012038975A (ja) 2012-02-23
JP2012038975A5 JP2012038975A5 (https=) 2013-08-29
JP5703621B2 true JP5703621B2 (ja) 2015-04-22

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JP2010178935A Active JP5703621B2 (ja) 2010-08-09 2010-08-09 回路部材接続用接着剤、回路部材接続用接着剤シート、半導体装置及び半導体装置の製造方法

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5838903B2 (ja) * 2012-04-17 2016-01-06 住友ベークライト株式会社 積層体の製造方法
WO2014010258A1 (ja) * 2012-07-13 2014-01-16 パナソニック株式会社 半導体封止用アクリル樹脂組成物とそれを用いた半導体装置およびその製造方法
JP6094884B2 (ja) * 2013-06-13 2017-03-15 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法とそれに使用される半導体封止用アクリル樹脂組成物
JP6094886B2 (ja) * 2013-07-12 2017-03-15 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法とそれに使用される半導体封止用アクリル樹脂組成物
JP7647092B2 (ja) * 2020-09-16 2025-03-18 株式会社レゾナック 半導体用接着剤、並びに、半導体装置及びその製造方法
KR20250067086A (ko) * 2022-09-05 2025-05-14 가부시끼가이샤 레조낙 적층 필름 및 반도체 장치의 제조 방법
WO2026069655A1 (ja) * 2024-09-30 2026-04-02 Ｒａｐｉｄｕｓ株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4815648B2 (ja) * 1999-09-01 2011-11-16 日立化成工業株式会社 回路接続用フィルム状接着剤
CN102942881B (zh) * 2006-05-09 2015-03-18 日立化成株式会社 粘接片、使用其的电路构件的连接结构及半导体器件
JP2009188063A (ja) * 2008-02-04 2009-08-20 Fujikura Kasei Co Ltd 端子間の接続方法、および半導体素子の実装方法
JP5417729B2 (ja) * 2008-03-28 2014-02-19 住友ベークライト株式会社 半導体用フィルム、半導体装置の製造方法および半導体装置
JP5837272B2 (ja) * 2008-05-21 2015-12-24 日立化成株式会社 半導体製造装置の製造方法

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JP2012038975A (ja) 2012-02-23

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