JP5690871B2 - 発光装置およびその製造方法 - Google Patents
発光装置およびその製造方法 Download PDFInfo
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- JP5690871B2 JP5690871B2 JP2013119158A JP2013119158A JP5690871B2 JP 5690871 B2 JP5690871 B2 JP 5690871B2 JP 2013119158 A JP2013119158 A JP 2013119158A JP 2013119158 A JP2013119158 A JP 2013119158A JP 5690871 B2 JP5690871 B2 JP 5690871B2
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- 239000002184 metal Substances 0.000 claims description 59
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- 238000009833 condensation Methods 0.000 description 3
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- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Led Device Packages (AREA)
Description
基板と、
上記基板の表面に形成された金属部と、
上記基板に支持されたLEDチップと、
上記LEDチップを封止する封止樹脂部と、
上記金属部と上記封止樹脂部との間に設けられた樹脂製のプライマーと
を備え、
上記LEDチップの少なくとも上面が上記プライマーの外側に露出しており、かつ、
上記LEDチップと上記基板との間には、上記プライマーが存在しないことを特徴としている。
上記プライマーは上記金属反射膜上に形成され、
上記配線パターンは上記プライマー上に形成されている。
上記プライマーは、上記基板の凹部底面を覆い、
上記封止樹脂は、上記プライマーの表面に密着していると共に上記LEDチップを封止しており、
さらに、上記プライマーは、露出していない。
上記LEDチップと上記樹脂製プライマーの少なくとも一部を封止樹脂で覆い、上記封止樹脂を硬化させて封止樹脂部を形成し、
上記プライマーは上記封止樹脂部よりもガス遮断性が高い樹脂で作製されている。
図1は、この発明の第1実施形態に係る発光装置の要部構成例を示す縦断面図である。
次に、図3Aを参照して、この発明の第2実施形態に係る発光装置21を説明する。図3Aは、上記発光装置21の要部構成を示す縦断面図である。
図4Aは、この発明の第3実施形態に係る発光装置の要部構成例を示す縦断面図である。
次に、図5Aを参照して、この発明の第4実施形態に係る発光装置を説明する。図5Aは、この第4実施形態に係る発光装置の要部構成を示す縦断面図である。
次に、図6を参照して、この発明の第5実施形態に係る発光装置を説明する。図6は、この第5実施形態に係る発光装置の要部構成例を示す縦断面図である。
2,62,82 基板
3,23,43,63,79,83 封止樹脂部
3a 液状シリコーン樹脂
5A,5B,25A,65A〜65D,75A〜75D 配線パターン
6,26,46,66〜68,86 LEDチップ
7,27,47,76A,76B,77A,77B ボンディングワイヤ
8A,8B 外部接続電極
31,32,51,52 外部接続端子
9A,9B 貫通導電層
10,30,35,55,70,78,90,94 プライマー
11 ダムシート
12 金型
22,42 樹脂部
22A,42A 基部
22B,42B 壁部
25,45 リードフレーム
25A,45A 第1の部分
25B,45B 第2の部分
33,44,73 金属反射膜
81 発光ユニット
93 リフレクタ部材
93A 反射面
Claims (2)
- 基板と、
上記基板の表面に形成された金属部と、
上記基板に支持されたLEDチップと、
上記LEDチップを封止する封止樹脂部と、
上記金属部と上記封止樹脂部との間に設けられた樹脂製のプライマーと
を備え、
上記LEDチップの少なくとも上面が上記プライマーの外側に露出しており、かつ、
上記LEDチップと上記基板との間には、上記プライマーが存在しない
ことを特徴とする発光装置。 - 請求項1に記載の発光装置において、
上記基板から突出する壁部と、
上記壁部の内壁面に形成された金属反射膜と
を備え、
上記金属反射膜は上記封止樹脂部で覆われ、
上記金属反射膜と上記封止樹脂部との間に、上記プライマーが設けられている
ことを特徴とする発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013119158A JP5690871B2 (ja) | 2013-06-05 | 2013-06-05 | 発光装置およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013119158A JP5690871B2 (ja) | 2013-06-05 | 2013-06-05 | 発光装置およびその製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008165897A Division JP5289835B2 (ja) | 2008-06-25 | 2008-06-25 | 発光装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013214760A JP2013214760A (ja) | 2013-10-17 |
JP5690871B2 true JP5690871B2 (ja) | 2015-03-25 |
Family
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JP2013119158A Active JP5690871B2 (ja) | 2013-06-05 | 2013-06-05 | 発光装置およびその製造方法 |
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JP (1) | JP5690871B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102136373B1 (ko) * | 2013-10-31 | 2020-07-21 | 해성디에스 주식회사 | 발광소자 패키지용 리드 프레임, 리드 프레임의 제조 방법 및 발광소자 패키지의 제조 방법 |
WO2015087970A1 (ja) * | 2013-12-11 | 2015-06-18 | 日立化成株式会社 | 光半導体装置及びその製造方法、並びに銀用表面処理剤及び発光装置 |
JP6308020B2 (ja) * | 2014-05-22 | 2018-04-11 | 日立化成株式会社 | 光半導体装置及びその製造方法 |
JP6269007B2 (ja) * | 2013-12-11 | 2018-01-31 | 日立化成株式会社 | 光半導体装置 |
JP6269284B2 (ja) * | 2014-04-18 | 2018-01-31 | 日立化成株式会社 | 銀用表面処理剤及び発光装置 |
KR102145207B1 (ko) * | 2014-04-17 | 2020-08-19 | 삼성전자주식회사 | 발광장치, 백라이트 유닛 및 디스플레이 장치 |
KR102188500B1 (ko) * | 2014-07-28 | 2020-12-09 | 삼성전자주식회사 | 발광다이오드 패키지 및 이를 이용한 조명장치 |
JP6459880B2 (ja) * | 2015-09-30 | 2019-01-30 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
Family Cites Families (1)
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JP5233087B2 (ja) * | 2006-06-28 | 2013-07-10 | 日亜化学工業株式会社 | 発光装置およびその製造方法、パッケージ、発光素子実装用の基板 |
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2013
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