JP5690348B2 - 光吸収性基板の表面の微細構造化 - Google Patents
光吸収性基板の表面の微細構造化 Download PDFInfo
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- JP5690348B2 JP5690348B2 JP2012538866A JP2012538866A JP5690348B2 JP 5690348 B2 JP5690348 B2 JP 5690348B2 JP 2012538866 A JP2012538866 A JP 2012538866A JP 2012538866 A JP2012538866 A JP 2012538866A JP 5690348 B2 JP5690348 B2 JP 5690348B2
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- 239000000758 substrate Substances 0.000 title claims description 124
- 239000002245 particle Substances 0.000 claims description 175
- 238000000034 method Methods 0.000 claims description 67
- 238000002844 melting Methods 0.000 claims description 26
- 230000008018 melting Effects 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000001020 plasma etching Methods 0.000 claims description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 230000001788 irregular Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 description 43
- 238000005530 etching Methods 0.000 description 42
- 239000010410 layer Substances 0.000 description 33
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- 238000001878 scanning electron micrograph Methods 0.000 description 13
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- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 9
- 239000006185 dispersion Substances 0.000 description 7
- 238000001039 wet etching Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- -1 aliphatic alcohols Chemical class 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000002310 reflectometry Methods 0.000 description 5
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- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000006117 anti-reflective coating Substances 0.000 description 3
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- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229910017855 NH 4 F Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
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- UREZNYTWGJKWBI-UHFFFAOYSA-M benzethonium chloride Chemical compound [Cl-].C1=CC(C(C)(C)CC(C)(C)C)=CC=C1OCCOCC[N+](C)(C)CC1=CC=CC=C1 UREZNYTWGJKWBI-UHFFFAOYSA-M 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000011236 particulate material Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 2
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- 238000001228 spectrum Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- ALSTYHKOOCGGFT-KTKRTIGZSA-N (9Z)-octadecen-1-ol Chemical compound CCCCCCCC\C=C/CCCCCCCCO ALSTYHKOOCGGFT-KTKRTIGZSA-N 0.000 description 1
- YFSUTJLHUFNCNZ-UHFFFAOYSA-M 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-heptadecafluorooctane-1-sulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F YFSUTJLHUFNCNZ-UHFFFAOYSA-M 0.000 description 1
- SNGREZUHAYWORS-UHFFFAOYSA-M 2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-pentadecafluorooctanoate Chemical compound [O-]C(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F SNGREZUHAYWORS-UHFFFAOYSA-M 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- 206010001513 AIDS related complex Diseases 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229920001213 Polysorbate 20 Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 210000002945 adventitial reticular cell Anatomy 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000008051 alkyl sulfates Chemical class 0.000 description 1
- 125000005211 alkyl trimethyl ammonium group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- BTBJBAZGXNKLQC-UHFFFAOYSA-N ammonium lauryl sulfate Chemical compound [NH4+].CCCCCCCCCCCCOS([O-])(=O)=O BTBJBAZGXNKLQC-UHFFFAOYSA-N 0.000 description 1
- 229940063953 ammonium lauryl sulfate Drugs 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 229960000686 benzalkonium chloride Drugs 0.000 description 1
- 229960001950 benzethonium chloride Drugs 0.000 description 1
- CADWTSSKOVRVJC-UHFFFAOYSA-N benzyl(dimethyl)azanium;chloride Chemical compound [Cl-].C[NH+](C)CC1=CC=CC=C1 CADWTSSKOVRVJC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229960000541 cetyl alcohol Drugs 0.000 description 1
- 229960001927 cetylpyridinium chloride Drugs 0.000 description 1
- YMKDRGPMQRFJGP-UHFFFAOYSA-M cetylpyridinium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 YMKDRGPMQRFJGP-UHFFFAOYSA-M 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- MRUAUOIMASANKQ-UHFFFAOYSA-N cocamidopropyl betaine Chemical compound CCCCCCCCCCCC(=O)NCCC[N+](C)(C)CC([O-])=O MRUAUOIMASANKQ-UHFFFAOYSA-N 0.000 description 1
- 229940073507 cocamidopropyl betaine Drugs 0.000 description 1
- 238000000803 convective self-assembly Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- WOQQAWHSKSSAGF-WXFJLFHKSA-N decyl beta-D-maltopyranoside Chemical compound O[C@@H]1[C@@H](O)[C@H](OCCCCCCCCCC)O[C@H](CO)[C@H]1O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 WOQQAWHSKSSAGF-WXFJLFHKSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- SMVRDGHCVNAOIN-UHFFFAOYSA-L disodium;1-dodecoxydodecane;sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O.CCCCCCCCCCCCOCCCCCCCCCCCC SMVRDGHCVNAOIN-UHFFFAOYSA-L 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000000025 interference lithography Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940050176 methyl chloride Drugs 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- YWFWDNVOPHGWMX-UHFFFAOYSA-N n,n-dimethyldodecan-1-amine Chemical compound CCCCCCCCCCCCN(C)C YWFWDNVOPHGWMX-UHFFFAOYSA-N 0.000 description 1
- DVEKCXOJTLDBFE-UHFFFAOYSA-N n-dodecyl-n,n-dimethylglycinate Chemical compound CCCCCCCCCCCC[N+](C)(C)CC([O-])=O DVEKCXOJTLDBFE-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- HEGSGKPQLMEBJL-RKQHYHRCSA-N octyl beta-D-glucopyranoside Chemical compound CCCCCCCCO[C@@H]1O[C@H](CO)[C@@H](O)[C@H](O)[C@H]1O HEGSGKPQLMEBJL-RKQHYHRCSA-N 0.000 description 1
- 229940055577 oleyl alcohol Drugs 0.000 description 1
- XMLQWXUVTXCDDL-UHFFFAOYSA-N oleyl alcohol Natural products CCCCCCC=CCCCCCCCCCCO XMLQWXUVTXCDDL-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- WFRLANWAASSSFV-FPLPWBNLSA-N palmitoleoyl ethanolamide Chemical compound CCCCCC\C=C/CCCCCCCC(=O)NCCO WFRLANWAASSSFV-FPLPWBNLSA-N 0.000 description 1
- YFSUTJLHUFNCNZ-UHFFFAOYSA-N perfluorooctane-1-sulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F YFSUTJLHUFNCNZ-UHFFFAOYSA-N 0.000 description 1
- SNGREZUHAYWORS-UHFFFAOYSA-N perfluorooctanoic acid Chemical compound OC(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F SNGREZUHAYWORS-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920001983 poloxamer Polymers 0.000 description 1
- 229920001987 poloxamine Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 1
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 1
- 235000010482 polyoxyethylene sorbitan monooleate Nutrition 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 229920000053 polysorbate 80 Polymers 0.000 description 1
- 229940068965 polysorbates Drugs 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229940057950 sodium laureth sulfate Drugs 0.000 description 1
- SXHLENDCVBIJFO-UHFFFAOYSA-M sodium;2-[2-(2-dodecoxyethoxy)ethoxy]ethyl sulfate Chemical compound [Na+].CCCCCCCCCCCCOCCOCCOCCOS([O-])(=O)=O SXHLENDCVBIJFO-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Surface Treatment Of Glass (AREA)
- Weting (AREA)
- Drying Of Semiconductors (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Description
呼び径が0.8μmの球形のポリメチル(メタクリレート)(PMMA)粒子の粉末(Soken Chemical & Engineering Co.,Ltdから入手)を水に分散させ、固体含量が12重量%の懸濁液を生成した。分散を補助するため、0.01%のTomadol 25−9非イオン性界面活性剤(Air Product and Chemicals,Inc.から入手)を溶液に添加した。粒子溶液を、ディップコーティングにより65mm/分のコーティング速度で(100配向)シリコンウェーハ基板上にコーティングした。その後、コーティングした基板をホットプレート上で130℃で1分間加熱し、粒子をリフローさせた。図5は、増加した接触面積を示す、Si上にコーティングされた融解粒子のSEM画像を提供する。
多数の異なる試料をHNO3:12H2O:NH4F(25:4:1)のウェットエッチング液に異なる時間浸漬したこと以外は、実施例1と同様のプロセスを使用した。更に、ウェットエッチングの後、残ったPMMA粒子を除去するために、試料をイソプロパノール溶液中で5分間超音波処理した。図7A〜Dは、エッチング時間が5分間(図7A)、8分間(図7B)、10分間(図7C)、及び13分間(図7D)の結果を示す。ウェットエッチング液の等方性にもかかわらず、角錘構造が得られた。したがって、等方性エッチング液の使用は、非対称構造をもたらすことができ、本明細書に記載のプロセスが単結晶シリコンに限定されず、無定形シリコン、多結晶シリコン、及び他の潜在的な太陽電池にも適用可能なことを示す。
Claims (3)
- 基板を微細構造化する方法であって、
a)前記基板の上面に粒子の層をコーティングする工程と、
b)前記粒子を融解して不規則な大きさで分布する融解粒子を形成する工程を含む、前記粒子を変性させる工程と、
c)エッチマスクとして前記変性粒子を使用して、前記基板をエッチングして、不規則な形状の構造を形成する工程と、を含み、
前記工程cの後に、前記粒子は、前記基板の上面上に残り、粒子層を形成する、方法。 - 前記粒子を変性させる工程が、反応性イオンエッチング又は酸素プラズマエッチングによって前記粒子を収縮することを含む、請求項1に記載の方法。
- 前記粒子を変性させる工程が、まず前記粒子を収縮すること、及び、その後に前記粒子を融解することを含む、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26187509P | 2009-11-17 | 2009-11-17 | |
US61/261,875 | 2009-11-17 | ||
PCT/US2010/055772 WO2011062791A2 (en) | 2009-11-17 | 2010-11-08 | Texturing surface of light-absorbing substrate |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013511151A JP2013511151A (ja) | 2013-03-28 |
JP2013511151A5 JP2013511151A5 (ja) | 2013-12-26 |
JP5690348B2 true JP5690348B2 (ja) | 2015-03-25 |
Family
ID=43901496
Family Applications (1)
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Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8729798B2 (en) | 2008-03-21 | 2014-05-20 | Alliance For Sustainable Energy, Llc | Anti-reflective nanoporous silicon for efficient hydrogen production |
US8815104B2 (en) * | 2008-03-21 | 2014-08-26 | Alliance For Sustainable Energy, Llc | Copper-assisted, anti-reflection etching of silicon surfaces |
EP2697820B1 (en) | 2009-11-11 | 2018-04-04 | Alliance for Sustainable Energy, LLC | Wet-chemical method for producing a black silicon substrate |
JP5690348B2 (ja) * | 2009-11-17 | 2015-03-25 | スリーエム イノベイティブ プロパティズ カンパニー | 光吸収性基板の表面の微細構造化 |
US9017566B2 (en) | 2010-04-30 | 2015-04-28 | Corning Incorporated | Anti-glare surface treatment method and articles thereof |
US8828765B2 (en) | 2010-06-09 | 2014-09-09 | Alliance For Sustainable Energy, Llc | Forming high efficiency silicon solar cells using density-graded anti-reflection surfaces |
JP2014512673A (ja) | 2011-03-08 | 2014-05-22 | アライアンス フォー サステイナブル エナジー リミテッド ライアビリティ カンパニー | 向上された青色感度を有する効率的なブラックシリコン光起電装置 |
TWI435360B (zh) * | 2011-10-17 | 2014-04-21 | Au Optronics Corp | 場發射顯示器及其顯示陣列基板的製造方法 |
CN104684858B (zh) * | 2012-05-29 | 2017-10-24 | 康宁股份有限公司 | 对玻璃表面进行织构化的方法 |
CN104584243B (zh) * | 2012-08-21 | 2018-12-25 | 王子控股株式会社 | 半导体发光元件用基板及半导体发光元件以及该等之制造方法 |
WO2014031772A1 (en) * | 2012-08-21 | 2014-02-27 | Regents Of The University Of Minnesota | Embedded mask patterning process for fabricating magnetic media and other structures |
US9831361B2 (en) * | 2012-12-14 | 2017-11-28 | Robert Bosch Gmbh | Method of fabricating nanocone texture on glass and transparent conductors |
US9082925B2 (en) | 2013-03-13 | 2015-07-14 | Sunpower Corporation | Methods for wet chemistry polishing for improved low viscosity printing in solar cell fabrication |
US10333008B2 (en) | 2013-10-31 | 2019-06-25 | University Of Florida Research Foundation, Inc. | Substrates having an antireflection layer and methods of forming an antireflection layer |
CN104195644B (zh) * | 2014-07-27 | 2016-08-24 | 北京工业大学 | 一种单晶硅衬底亚微米金字塔结构激光-化学制备方法 |
US10347467B2 (en) | 2015-08-21 | 2019-07-09 | Regents Of The University Of Minnesota | Embedded mask patterning process for fabricating magnetic media and other structures |
WO2017078164A1 (ja) * | 2015-11-04 | 2017-05-11 | 株式会社カネカ | 結晶シリコン系太陽電池の製造方法および結晶シリコン系太陽電池モジュールの製造方法 |
US10475940B2 (en) | 2016-01-26 | 2019-11-12 | King Abdullah University Of Science And Technology | Packaging glass with hierarchically nanostructured surface |
WO2018035091A1 (en) | 2016-08-15 | 2018-02-22 | University Of Florida Research Foundation, Inc. | Methods and compositions relating to tunable nanoporous coatings |
US10120111B2 (en) * | 2016-12-14 | 2018-11-06 | Google Llc | Thin ceramic imaging screen for camera systems |
DE102017109386A1 (de) * | 2017-05-02 | 2018-11-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Strukturieren einer Substratoberfläche |
WO2018213570A2 (en) | 2017-05-17 | 2018-11-22 | University Of Florida Research Foundation | Methods and sensors for detection |
JP6908487B2 (ja) * | 2017-09-28 | 2021-07-28 | 積水化学工業株式会社 | 表面処理方法及び装置 |
WO2019126248A1 (en) | 2017-12-20 | 2019-06-27 | University Of Florida Research Foundation | Methods and sensors for detection |
WO2019126171A1 (en) | 2017-12-21 | 2019-06-27 | University Of Florida Research Foundation | Substrates having a broadband antireflection layer and methods of forming a broadband antireflection layer |
WO2019246370A1 (en) | 2018-06-20 | 2019-12-26 | University Of Florida Research Foundation | Intraocular pressure sensing material, devices, and uses thereof |
KR102272710B1 (ko) * | 2019-11-29 | 2021-07-05 | 한국과학기술연구원 | 중공 나노 기둥이 구비된 유리의 제조방법 및 이를 이용하여 제조된 중공 나노 기둥이 구비된 유리 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4407695A (en) * | 1981-12-31 | 1983-10-04 | Exxon Research And Engineering Co. | Natural lithographic fabrication of microstructures over large areas |
US5510156A (en) * | 1994-08-23 | 1996-04-23 | Analog Devices, Inc. | Micromechanical structure with textured surface and method for making same |
US5676853A (en) * | 1996-05-21 | 1997-10-14 | Micron Display Technology, Inc. | Mask for forming features on a semiconductor substrate and a method for forming the mask |
US6037104A (en) * | 1998-09-01 | 2000-03-14 | Micron Display Technology, Inc. | Methods of forming semiconductor devices and methods of forming field emission displays |
US6495296B1 (en) * | 1999-02-17 | 2002-12-17 | Micron Technology, Inc. | Method for limiting particle aggregation in a mask deposited by a colloidal suspension |
GB9919479D0 (en) * | 1999-08-17 | 1999-10-20 | Imperial College | Island arrays |
US6984842B1 (en) * | 1999-10-25 | 2006-01-10 | The Board Of Trustees Of The University Of Illinois | Silicon nanoparticle field effect transistor and transistor memory device |
WO2002003430A2 (en) * | 2000-06-29 | 2002-01-10 | California Institute Of Technology | Aerosol process for fabricating discontinuous floating gate microelectronic devices |
US6579463B1 (en) * | 2000-08-18 | 2003-06-17 | The Regents Of The University Of Colorado | Tunable nanomasks for pattern transfer and nanocluster array formation |
US6521541B2 (en) * | 2000-08-23 | 2003-02-18 | California Institute Of Technology | Surface preparation of substances for continuous convective assembly of fine particles |
WO2002041987A2 (en) * | 2000-10-25 | 2002-05-30 | Tufts University | Polymeric microspheres |
JP3861197B2 (ja) * | 2001-03-22 | 2006-12-20 | 株式会社東芝 | 記録媒体の製造方法 |
DE60328492D1 (de) * | 2002-05-28 | 2009-09-03 | Panasonic Corp | Verfahren zur erzeugung von nanoteilchen |
US20060151428A1 (en) * | 2002-12-30 | 2006-07-13 | Reiner Windisch | Method for roughening a surface of a body, and optoelectronic component |
US7045851B2 (en) * | 2003-06-20 | 2006-05-16 | International Business Machines Corporation | Nonvolatile memory device using semiconductor nanocrystals and method of forming same |
US7989290B2 (en) * | 2005-08-04 | 2011-08-02 | Micron Technology, Inc. | Methods for forming rhodium-based charge traps and apparatus including rhodium-based charge traps |
US7385231B2 (en) * | 2005-08-31 | 2008-06-10 | Fujifilmcorporation | Porous thin-film-deposition substrate, electron emitting element, methods of producing them, and switching element and display element |
US7482619B2 (en) * | 2005-09-07 | 2009-01-27 | Samsung Electronics Co., Ltd. | Charge trap memory device comprising composite of nanoparticles and method of fabricating the charge trap memory device |
JP2007273746A (ja) | 2006-03-31 | 2007-10-18 | Sumitomo Chemical Co Ltd | 固体表面の微細加工方法および発光素子 |
KR100742720B1 (ko) * | 2006-06-07 | 2007-07-25 | 한양대학교 산학협력단 | 화학적 큐어링에 의한 나노입자의 제조방법 |
US8202582B2 (en) | 2006-06-30 | 2012-06-19 | Oji Paper Co., Ltd. | Single particle film etching mask and production method of single particle film etching mask, production method of micro structure with use of single particle film etching mask and micro structure produced by micro structure production method |
SG140481A1 (en) | 2006-08-22 | 2008-03-28 | Agency Science Tech & Res | A method for fabricating micro and nano structures |
EP2064364B1 (en) * | 2006-09-21 | 2014-02-12 | Fujirebio Inc. | Method and apparatus for producing small structures |
US7790560B2 (en) * | 2007-03-12 | 2010-09-07 | Board Of Regents Of The Nevada System Of Higher Education | Construction of flash memory chips and circuits from ordered nanoparticles |
KR101038487B1 (ko) * | 2008-02-13 | 2011-06-02 | 엘지전자 주식회사 | 금속 촉매를 이용한 태양전지의 습식 텍스처링 방법 |
US20100175749A1 (en) * | 2008-03-24 | 2010-07-15 | Tsutsumi Eishi | Solar cell and method for manufacturing metal electrode layer to be used in the solar cell |
US8445188B2 (en) * | 2008-09-17 | 2013-05-21 | National Science Foundation | Process for formation of highly uniform arrays of nano-holes and nano-pillars |
US8323744B2 (en) * | 2009-01-09 | 2012-12-04 | The Board Of Trustees Of The Leland Stanford Junior University | Systems, methods, devices and arrangements for nanowire meshes |
KR101155108B1 (ko) * | 2009-04-30 | 2012-06-11 | 국민대학교산학협력단 | 전하저장층 및 그의 형성 방법, 이를 이용한 비휘발성 메모리 장치 및 그의 제조 방법 |
JP5690348B2 (ja) * | 2009-11-17 | 2015-03-25 | スリーエム イノベイティブ プロパティズ カンパニー | 光吸収性基板の表面の微細構造化 |
US8039292B2 (en) * | 2009-11-18 | 2011-10-18 | International Business Machines Corporation | Holey electrode grids for photovoltaic cells with subwavelength and superwavelength feature sizes |
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- 2010-11-08 EP EP10779383.8A patent/EP2502279B1/en not_active Not-in-force
- 2010-11-08 CN CN201080052042.XA patent/CN102754217B/zh not_active Expired - Fee Related
- 2010-11-08 WO PCT/US2010/055772 patent/WO2011062791A2/en active Application Filing
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EP2502279A2 (en) | 2012-09-26 |
WO2011062791A3 (en) | 2012-07-19 |
WO2011062791A2 (en) | 2011-05-26 |
CN102754217B (zh) | 2016-07-06 |
US20120225517A1 (en) | 2012-09-06 |
EP2502279B1 (en) | 2016-04-20 |
JP2013511151A (ja) | 2013-03-28 |
CN102754217A (zh) | 2012-10-24 |
US9034684B2 (en) | 2015-05-19 |
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