JP5689136B2 - 複数の発光体を含む固体発光体パッケージ - Google Patents
複数の発光体を含む固体発光体パッケージ Download PDFInfo
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L2924/11—Device type
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- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
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Description
本出願は、2009年11月9日に出願された米国特許出願第12/614553号の優先権を主張するものである。このような関連出願の開示は、参照によりその全体が本明細書に組み込まれる。
Claims (16)
- 固体発光体パッケージであって、
複数の固体発光体と、
前記複数の固体発光体と電気的に連通している、複数の導電リードと、
前記固体発光体パッケージ内の及び/又は前記固体発光体パッケージ上の少なくとも1つの導電経路と電気的に連通している、空間的に離隔している少なくとも2つの導電リードであって、前記少なくとも1つの導電経路は前記複数の固体発光体のうちのどの固体発光体とも導電連通していない、導電リードと、を備え、
前記固体発光体パッケージ内の及び/又は前記固体発光体パッケージ上の前記少なくとも1つの導電経路は、加速度計、湿度センサ、化学センサ、歪みゲージ、電流センサ、電圧センサ、電流調整要素及び電圧調整要素のうちの少なくとも1つを備える、固体発光体パッケージと、
前記固体発光体パッケージから空間的に離隔しており、前記少なくとも1つの導電経路と作用的に結合された少なくとも1つの固体発光体と、を含む発光素子。 - 前記固体発光体パッケージは、
(a)前記複数の固体発光体に電流を供給するように構成された複数の導電リードを含む共通リードフレームと、
(b)前記複数の固体発光体を構造的に支持するように構成された共通基板と、
(c)前記複数の固体発光体の各固体発光体からの発光を反射するように構成された共通反射器と、の要素(a)〜(c)のうちの少なくとも1つを備える、請求項1に記載の発光素子。 - 前記固体発光体パッケージは、要素(a)、(b)、および(c)のうちの少なくとも2つを備える、請求項2に記載の発光素子。
- 前記複数の固体発光体の各固体発光体への電流を、前記複数の導電リードを用いて個別に制御することが可能である、請求項1に記載の発光素子。
- 前記複数の固体発光体は非白色固体発光体を含む、請求項1に記載の発光素子。
- 前記複数の固体発光体の各固体発光体は、前記複数の固体発光体のうちの少なくとも1つの隣接する固体発光体からの外側エッジ間隔が1.0mm未満であるように配列されている、請求項1に記載の発光素子。
- 前記複数の固体発光体のうちの少なくとも2つの固体発光体のピーク発光波長が、少なくとも50nm離れている、請求項1に記載の発光素子。
- 前記空間的に離隔している少なくとも2つの導電リードは、前記固体発光体パッケージの別々の側面に配置されている、請求項1に記載の発光素子。
- 前記固体発光体パッケージ内の及び/又は前記固体発光体パッケージ上の前記少なくとも1つの導電経路がジャンパを含む、請求項1〜8のいずれか一項に記載の発光素子。
- 加速度計、湿度センサ、化学センサ、歪みゲージ、電流センサ、電圧センサ、電流調整要素及び電圧調整要素のうちの少なくとも1つは、前記複数の固体発光体のうちの少なくとも1つの固体発光体の動作を制御する又は前記動作に影響を及ぼすように適合されている、請求項1〜8のいずれか一項に記載の発光素子。
- 加速度計、湿度センサ、化学センサ、歪みゲージ、電流センサ、電圧センサ、電流調整要素及び電圧調整要素のうちの少なくとも1つは、前記固体発光体パッケージから空間的に離隔した電気的に操作される少なくとも1つの要素の動作を制御する又は前記動作に影響を及ぼすように適合されている、請求項1〜8のいずれか一項に記載の発光素子。
- 加速度計、湿度センサ、化学センサ、歪みゲージ、電流センサ、電圧センサ、電流調整要素及び電圧調整要素のうちの少なくとも1つは電流調整要素又は電圧調整要素である、請求項1〜8、10及び11のいずれか一項に記載の発光素子。
- 加速度計、湿度センサ、化学センサ、歪みゲージ、電流センサ、電圧センサ、電流調整要素及び電圧調整要素のうちの少なくとも1つは加速度計又は歪みゲージである、請求項1〜8、10及び11のいずれか一項に記載の発光素子。
- 加速度計、湿度センサ、化学センサ、歪みゲージ、電流センサ、電圧センサ、電流調整要素及び電圧調整要素のうちの少なくとも1つは湿度センサ又は化学センサである、請求項1〜8、10及び11のいずれか一項に記載の発光素子。
- 加速度計、湿度センサ、化学センサ、歪みゲージ、電流センサ、電圧センサ、電流調整要素及び電圧調整要素のうちの少なくとも1つは電流センサ又は電圧センサである、請求項1〜8、10及び11のいずれか一項に記載の発光素子。
- 前記複数の固体発光体は、590nmから680nmの範囲のピーク発光波長を有する主色が赤の少なくとも1つの固体発光体と、400nmから480nmの範囲のピーク発光波長を有する主色が青の少なくとも1つの固体発光体と、576nm超から590nmの範囲のピーク発光波長を有する、電気的に活性化された少なくとも1つの補助固体発光体と、を含み、前記固体発光体パッケージは、510nmと575nmとの間の範囲のピーク発光波長を有する主色が緑の固体発光体を含まない、請求項1〜8のいずれか一項に記載の発光素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/614,553 US7893445B2 (en) | 2009-11-09 | 2009-11-09 | Solid state emitter package including red and blue emitters |
US12/614,553 | 2009-11-09 | ||
PCT/US2010/050612 WO2011056324A2 (en) | 2009-11-09 | 2010-09-29 | Solid state emitter package including multiple emitters |
Publications (2)
Publication Number | Publication Date |
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JP2013510439A JP2013510439A (ja) | 2013-03-21 |
JP5689136B2 true JP5689136B2 (ja) | 2015-03-25 |
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Application Number | Title | Priority Date | Filing Date |
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JP2012537884A Active JP5689136B2 (ja) | 2009-11-09 | 2010-09-29 | 複数の発光体を含む固体発光体パッケージ |
Country Status (7)
Country | Link |
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US (2) | US7893445B2 (ja) |
EP (1) | EP2499680A4 (ja) |
JP (1) | JP5689136B2 (ja) |
KR (1) | KR101345404B1 (ja) |
CN (1) | CN102687294B (ja) |
TW (1) | TW201133775A (ja) |
WO (1) | WO2011056324A2 (ja) |
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US9583678B2 (en) | 2009-09-18 | 2017-02-28 | Soraa, Inc. | High-performance LED fabrication |
US7893445B2 (en) * | 2009-11-09 | 2011-02-22 | Cree, Inc. | Solid state emitter package including red and blue emitters |
US10147850B1 (en) | 2010-02-03 | 2018-12-04 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
US20110186874A1 (en) * | 2010-02-03 | 2011-08-04 | Soraa, Inc. | White Light Apparatus and Method |
US9345095B2 (en) | 2010-04-08 | 2016-05-17 | Ledengin, Inc. | Tunable multi-LED emitter module |
US9450143B2 (en) | 2010-06-18 | 2016-09-20 | Soraa, Inc. | Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices |
US8523385B2 (en) * | 2010-08-20 | 2013-09-03 | DiCon Fibêroptics Inc. | Compact high brightness LED grow light apparatus, using an extended point source LED array with light emitting diodes |
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EP2499680A2 (en) | 2012-09-19 |
US20100140634A1 (en) | 2010-06-10 |
KR101345404B1 (ko) | 2013-12-30 |
CN102687294A (zh) | 2012-09-19 |
WO2011056324A2 (en) | 2011-05-12 |
US20110133223A1 (en) | 2011-06-09 |
CN102687294B (zh) | 2015-05-13 |
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WO2011056324A3 (en) | 2011-07-21 |
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