JP5683553B2 - 静電誘導吸着式電子部品検査テーブル - Google Patents
静電誘導吸着式電子部品検査テーブル Download PDFInfo
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- JP5683553B2 JP5683553B2 JP2012229627A JP2012229627A JP5683553B2 JP 5683553 B2 JP5683553 B2 JP 5683553B2 JP 2012229627 A JP2012229627 A JP 2012229627A JP 2012229627 A JP2012229627 A JP 2012229627A JP 5683553 B2 JP5683553 B2 JP 5683553B2
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- 238000007689 inspection Methods 0.000 title claims description 196
- 230000006698 induction Effects 0.000 title claims description 124
- 238000001179 sorption measurement Methods 0.000 title claims description 17
- 239000012780 transparent material Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 230000003068 static effect Effects 0.000 claims description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
120、120a:補助静電誘導層
130:回転モータ
140:電源供給装置
141:電圧発生装置
142:電圧調節器
143:電圧線
144:回転電源供給長針(スリップリング)
145:接触端子
150:支持部
151、151a:回転板
152、152a:上部固定板
153:連結ブロック
154:絶縁層
Claims (7)
- 投入された電子部品Cが載置され、透明な材質からなる検査板(110)と、
前記検査板(110)を回転させ、前記検査板(110)を帯電させることで、前記電子部品(C)を静電力によって前記検査板(110)の上に吸着固定させる回転板(151,151a)と、
前記回転板(151,151a)の中心側に連結され、前記検査板(110)を回転させる回転モータ(130)と、
前記回転板(151,151a)に静電誘導用電源を供給する電源供給装置(140)と、
を含み、
前記検査板(110)の下面にコーティングされており、前記回転板(151,151a)から静電誘導用電源の供給を受けて、前記検査板(110)の上に載置されて移動する電子部品(C)に静電力を加える補助静電誘導層(120,120a)を更に含むことを特徴とする
静電誘導吸着式電子部品検査テーブル。 - 前記補助静電誘導層(120)は、前記電子部品(C)が載置される検査板(110)の枠(B)の部分を含むようにコーティングされ、透明な材質からなる透明電極であることを特徴とする請求項1に記載の静電誘導吸着式電子部品検査テーブル。
- 前記補助静電誘導層(120a)は、前記電子部品(C)が載置される検査板(110)の枠(B)の部分を除いた部分にコーティングされ、透明または不透明の材質からなる伝導性電極であることを特徴とする請求項1に記載の静電誘導吸着式電子部品検査テーブル。
- 前記回転板(151,151a)の大きさは、前記補助静電誘導層(120,120a)を介して前記電子部品(C)に誘導される静電力の大きさによって調節されることを特徴とする請求項1ないし3のいずれか一項に記載の静電誘導吸着式電子部品検査テーブル。
- 前記検査板(110)の上面には、前記回転板(151,151a)と共に前記検査板(110)を固定する上部固定板(152,152a)が設置されていることを特徴とする請求項4に記載の静電誘導吸着式電子部品検査テーブル。
- 前記電源供給装置(140)は、静電誘導用電圧を供給する電圧発生装置(141)と、電源を伝送する電圧線(143)と、前記回転モータ(130)の中心側に設置された回転電源供給装置(144)と、回転板(151,151a)に接触して電源を供給する接触端子(145)と、を含むことを特徴とする請求項1ないし3のいずれか一項に記載の静電誘導吸着式電子部品検査テーブル。
- 前記電源供給装置(140)は、検査環境によって、前記補助静電誘導層(120,120a)に供給される静電誘導用電源の大きさを可変させる電圧調節器(142)を含むことを特徴とする請求項1又は2に記載の静電誘導吸着式電子部品検査テーブル。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120024177A KR101173578B1 (ko) | 2012-03-09 | 2012-03-09 | 정전 유도 흡착식 전자부품 검사 테이블 |
KR10-2012-0024177 | 2012-03-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013187535A JP2013187535A (ja) | 2013-09-19 |
JP5683553B2 true JP5683553B2 (ja) | 2015-03-11 |
Family
ID=46880390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012229627A Active JP5683553B2 (ja) | 2012-03-09 | 2012-10-17 | 静電誘導吸着式電子部品検査テーブル |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5683553B2 (ja) |
KR (1) | KR101173578B1 (ja) |
CN (1) | CN103308450B (ja) |
TW (1) | TWI472749B (ja) |
WO (1) | WO2013133492A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201617631A (zh) * | 2014-11-10 | 2016-05-16 | Tian Zheng Internat Prec Machinery Co Ltd | 自動化層測設備 |
CN106370666A (zh) * | 2015-07-23 | 2017-02-01 | 台达电子工业股份有限公司 | 电子元件外观检测装置及其检测方法 |
KR101919692B1 (ko) * | 2017-04-26 | 2018-11-16 | 윈텍 주식회사 | 정전기력을 이용한 흡착식 전자부품 검사 테이블 |
KR101938592B1 (ko) | 2018-06-15 | 2019-01-15 | 김기석 | Led 검사 장치 및 led 검사용 디스크 |
CN109807082A (zh) * | 2019-03-04 | 2019-05-28 | 肇庆市宏华电子科技有限公司 | 履带式检测设备及检测系统 |
JP7159942B2 (ja) * | 2019-03-28 | 2022-10-25 | 株式会社村田製作所 | 外観検査装置 |
JP7347386B2 (ja) * | 2020-09-25 | 2023-09-20 | 株式会社村田製作所 | 静電誘導吸着式搬送体および静電誘導吸着式搬送装置 |
KR102325078B1 (ko) | 2021-05-10 | 2021-11-11 | 주식회사 제이엔에스 | 적층 세라믹 커패시터용 칩 분류 장치 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3442224B2 (ja) | 1996-07-04 | 2003-09-02 | 松下電器産業株式会社 | フリップチップ実装設備のic廃棄装置 |
JP3855733B2 (ja) * | 2001-10-30 | 2006-12-13 | 株式会社村田製作所 | 電子部品の外観検査装置および外観検査方法 |
JP4430442B2 (ja) * | 2004-03-24 | 2010-03-10 | 株式会社チップトン | ワーククランプ装置 |
KR20050116414A (ko) * | 2004-06-07 | 2005-12-12 | 삼성전자주식회사 | 반도체 제조장치에 사용되는 정전척 |
JP4768699B2 (ja) * | 2006-11-30 | 2011-09-07 | キヤノンアネルバ株式会社 | 電力導入装置及び成膜方法 |
JP2008260594A (ja) * | 2007-04-10 | 2008-10-30 | Okano Denki Kk | 部品搬送装置 |
US9099513B2 (en) * | 2008-09-08 | 2015-08-04 | Shibaura Mechatronics Corporation | Substrate processing apparatus, and substrate processing method |
JP2010118480A (ja) | 2008-11-12 | 2010-05-27 | Olympus Corp | 基板吸着装置、及び、基板検査装置 |
US8902402B2 (en) * | 2008-12-19 | 2014-12-02 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
JP4875190B2 (ja) * | 2009-08-31 | 2012-02-15 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
CN102079448B (zh) * | 2009-11-27 | 2013-09-04 | 东京威尔斯股份有限公司 | 工件的外观检查装置以及工件的外观检查方法 |
JP5598912B2 (ja) * | 2009-11-27 | 2014-10-01 | 株式会社 東京ウエルズ | ワークの外観検査装置およびワークの外観検査方法 |
JP5510411B2 (ja) * | 2010-08-11 | 2014-06-04 | Toto株式会社 | 静電チャック及び静電チャックの製造方法 |
CN102623379A (zh) * | 2011-01-27 | 2012-08-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 静电夹持装置及半导体处理设备 |
-
2012
- 2012-03-09 KR KR1020120024177A patent/KR101173578B1/ko active IP Right Grant
- 2012-08-16 WO PCT/KR2012/006512 patent/WO2013133492A1/ko active Application Filing
- 2012-10-17 JP JP2012229627A patent/JP5683553B2/ja active Active
-
2013
- 2013-02-05 TW TW102104413A patent/TWI472749B/zh active
- 2013-02-20 CN CN201310054213.8A patent/CN103308450B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN103308450A (zh) | 2013-09-18 |
KR101173578B1 (ko) | 2012-08-13 |
WO2013133492A1 (ko) | 2013-09-12 |
TW201337242A (zh) | 2013-09-16 |
CN103308450B (zh) | 2015-09-09 |
TWI472749B (zh) | 2015-02-11 |
JP2013187535A (ja) | 2013-09-19 |
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