JP5682926B2 - 水性金属用接着剤 - Google Patents
水性金属用接着剤 Download PDFInfo
- Publication number
- JP5682926B2 JP5682926B2 JP2011185361A JP2011185361A JP5682926B2 JP 5682926 B2 JP5682926 B2 JP 5682926B2 JP 2011185361 A JP2011185361 A JP 2011185361A JP 2011185361 A JP2011185361 A JP 2011185361A JP 5682926 B2 JP5682926 B2 JP 5682926B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- bisphenol
- adhesive
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 title claims description 67
- 230000001070 adhesive effect Effects 0.000 title claims description 64
- 239000002184 metal Substances 0.000 title claims description 37
- 229910052751 metal Inorganic materials 0.000 title claims description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 27
- 229920000647 polyepoxide Polymers 0.000 claims description 150
- 239000003822 epoxy resin Substances 0.000 claims description 149
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 87
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 65
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 59
- 229920005989 resin Polymers 0.000 claims description 54
- 239000011347 resin Substances 0.000 claims description 54
- -1 phenol compound Chemical class 0.000 claims description 38
- 239000007787 solid Substances 0.000 claims description 36
- 229930185605 Bisphenol Natural products 0.000 claims description 34
- 229920000877 Melamine resin Polymers 0.000 claims description 32
- 150000001875 compounds Chemical class 0.000 claims description 31
- 239000004593 Epoxy Substances 0.000 claims description 30
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 28
- 229920000570 polyether Polymers 0.000 claims description 28
- 239000005056 polyisocyanate Substances 0.000 claims description 24
- 229920001228 polyisocyanate Polymers 0.000 claims description 24
- 239000004640 Melamine resin Substances 0.000 claims description 21
- 239000005011 phenolic resin Substances 0.000 claims description 21
- 125000003700 epoxy group Chemical group 0.000 claims description 18
- 229920003987 resole Polymers 0.000 claims description 17
- 239000002994 raw material Substances 0.000 claims description 11
- 239000003431 cross linking reagent Substances 0.000 claims description 9
- 238000006068 polycondensation reaction Methods 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 7
- 150000001555 benzenes Chemical class 0.000 claims description 4
- 230000009257 reactivity Effects 0.000 claims description 4
- 239000004971 Cross linker Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 43
- 238000000034 method Methods 0.000 description 40
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 30
- 239000000178 monomer Substances 0.000 description 30
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 25
- 238000006243 chemical reaction Methods 0.000 description 24
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 23
- 239000000243 solution Substances 0.000 description 23
- 239000003054 catalyst Substances 0.000 description 22
- 239000000203 mixture Substances 0.000 description 22
- 229920003270 Cymel® Polymers 0.000 description 21
- 239000003960 organic solvent Substances 0.000 description 18
- 238000000576 coating method Methods 0.000 description 17
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- 239000011248 coating agent Substances 0.000 description 16
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Natural products OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 230000000903 blocking effect Effects 0.000 description 13
- 239000000047 product Substances 0.000 description 13
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 12
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 12
- 230000032050 esterification Effects 0.000 description 12
- 238000005886 esterification reaction Methods 0.000 description 12
- 239000004925 Acrylic resin Substances 0.000 description 11
- 229920000178 Acrylic resin Polymers 0.000 description 11
- 150000003254 radicals Chemical class 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 10
- 239000002253 acid Substances 0.000 description 10
- 229920006243 acrylic copolymer Polymers 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 238000010992 reflux Methods 0.000 description 10
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 238000005304 joining Methods 0.000 description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 239000012736 aqueous medium Substances 0.000 description 8
- 238000001723 curing Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 239000010419 fine particle Substances 0.000 description 8
- 230000009477 glass transition Effects 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 7
- 239000003513 alkali Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 7
- 229910021641 deionized water Inorganic materials 0.000 description 7
- 150000002148 esters Chemical class 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000001993 wax Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 239000000839 emulsion Substances 0.000 description 6
- 235000019441 ethanol Nutrition 0.000 description 6
- 125000001841 imino group Chemical group [H]N=* 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 5
- 238000007259 addition reaction Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 150000007514 bases Chemical class 0.000 description 5
- 239000002981 blocking agent Substances 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 5
- 230000003472 neutralizing effect Effects 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 5
- 235000011121 sodium hydroxide Nutrition 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002736 nonionic surfactant Substances 0.000 description 4
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- 229920003275 CYMEL® 325 Polymers 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
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- 239000011134 resol-type phenolic resin Substances 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 2
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 2
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- 229940126062 Compound A Drugs 0.000 description 2
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- PFUKECZPRROVOD-UHFFFAOYSA-N 1,3,5-triisocyanato-2-methylbenzene Chemical compound CC1=C(N=C=O)C=C(N=C=O)C=C1N=C=O PFUKECZPRROVOD-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Adhesives Or Adhesive Processes (AREA)
Description
アクリル樹脂変性エポキシ樹脂は、エステル化法、変性エステル化法(直接重合法)、グラフト法等の変性方法によって合成することができる。
HOOC−(CH2)n−COOH ・・・(1)
(式中、nは1〜12の整数である。)で示される化合物を好適に使用することができる。具体的には、コハク酸、アジピン酸、ピメリン酸、アゼライン酸、セバシン酸、ドデカン二酸、ヘキサヒドロフタル酸等をあげることができる。
ビスフェノールF型エポキシ樹脂としては、例えば、上記市販のビスフェノールF型エポキシ樹脂、ビスフェノールFと低分子量のエポキシ化合物とを反応させて高分子量化したビスフェノールF型エポキシ樹脂を使用することができる。
本接着剤の(B)成分であるポリヒドロキシポリエーテル樹脂は、エポキシ樹脂の骨格を有する熱可塑性樹脂であり、通常、エポキシ樹脂製造のための原料と同様の原科から製造されるものであり、主として、本接着剤の密着性及び耐ブロッキング性に寄与するものである。なお、本接着剤において、ポリヒドロキシポリエーテル樹脂成分(B)とは、アクリル樹脂変性エポキシ樹脂成分(A)は除かれる概念である。
本接着剤の(C)成分である架橋剤は、レゾール型フェノール樹脂、メラミン樹脂及びブロックポリイソシアネート化合物から選ばれる少なくとも1種の架橋剤である。
レゾール型フェノール樹脂は、アクリル樹脂変性エポキシ樹脂成分(A)及びポリヒドロキシポリエーテル樹脂成分(B)の架橋剤として働くものであり、フェノールやビスフェノールA等のフェノール類とホルムアルデヒド等のアルデヒド類とを反応触媒の存在下で縮合反応させて、メチロール基を導入してなるフェノール樹脂、また導入されたメチロール基の一部を炭素原子数6以下のアルコールでアルキルエーテル化したものも包含される。レゾール型フェノール樹脂は、重量平均分子量が、好ましくは300〜4000、より好ましくは400〜3000の範囲内であり、かつベンゼン核1核当りのメチロール基の平均個数が0.3〜3.0個、好ましくは0.5〜3.0個、さらに好ましくは0.7〜3.0個の範囲内であることが好適である。上記レゾール型フェノール樹脂を使用することによって、接着剤としての接着性を向上させることができる。
メラミン樹脂は、メラミンとアルデヒドとの反応により得られる樹脂であり、部分メチロール化メラミン樹脂及び完全メチロール化メラミン樹脂の両者が包含される。また、本発明の接着剤に使用されるメラミン樹脂は、接着性及び硬化性等の観点から、一般に、200〜2000、好ましくは250〜1600、さらに好ましくは300〜1200の範囲内の重量平均分子量を有することが好ましい。
ブロックポリイソシアネート化合物は、ポリイソシアネート化合物のフリーのイソシアネート基をブロック化剤によってブロック化した化合物である。
上記ブロッキング防止剤としては、体質顔料(例えば、シリカ微粉末、硫酸バリウム、炭酸バリウム、炭酸カルシウム、タルク、マイカ、クレー、カオリン、シリカ、アルミナホワイト等)、有機微粒子(ナイロン微粒子、ポリオレフィン微粒子、アクリル樹脂微粒子、シリコーンゴム微粒子、ウレタン樹脂微粒子、フェノール樹脂微粒子、ポリ四弗化エチレン微粒子等)等を挙げることができる。
製造例1
ビスフェノールF及びビスフェノールA併用型エポキシ樹脂(a1)の製造
JER806(三菱化学社製、ビスフェノールF型エポキシ樹脂、エポキシ当量約170、分子量約320)579部、JER828EL(三菱化学社製、ビスフェノールA型エポキシ樹脂、エポキシ当量約187、分子量約350)165部 、ビスフェノールF 410部及びテトラブチルアンモニウムブロマイド0.6部を還流冷却管、温度計及び撹拌機を装着した四つ口フラスコに仕込み、窒素気流下160℃で反応を行った。反応はエポキシ当量で追跡し、約6時間反応させることにより数平均分子量約8000、エポキシ当量約6500g/eqのビスフェノールF及びビスフェノールA併用型エポキシ樹脂(a1)を得た。
ビスフェノールF型エポキシ樹脂(a2)の製造
JER806 800部、ビスフェノールF 448部及びテトラブチルアンモニウムブロマイド0.6部を還流冷却管、温度計及び撹拌機を装着した四つ口フラスコに仕込み、窒素気流下160℃で反応を行った。反応はエポキシ当量で追跡し、約6時間反応させることにより数平均分子量約8000、エポキシ当量約7000g/eqのビスフェノールF型エポキシ樹脂(a2)を得た。
ビスフェノールF及びビスフェノールA併用型エポキシ樹脂(a3)の製造
JER806 268部、JER828EL 546部、ビスフェノールA 456部及びテトラブチルアンモニウムブロマイド0.6部を還流冷却管、温度計及び撹拌機を装着した四つ口フラスコに仕込み、窒素気流下160℃で反応を行った。反応はエポキシ当量で追跡し、約6時間反応させることにより数平均分子量約7800、エポキシ当量約5600g/eqのビスフェノールF及びビスフェノールA併用型エポキシ樹脂(a3)を得た。
ビスフェノールA型エポキシ樹脂(b1)の製造
JER828EL 558部、ビスフェノールA 329部及びテトラブチルアンモニウムブロマイド0.6部を還流冷却管、温度計及び撹拌機を装着した四つ口フラスコに仕込み、窒素気流下160℃で反応を行った。反応はエポキシ当量で追跡し、約5時間反応させることにより数平均分子量約11000、エポキシ当量約8000g/eqのビスフェノールA型エポキシ樹脂(b1)を得た。
製造例5
カルボキシル基含有アクリル樹脂(c1)溶液の製造
還流冷却管、温度計、モノマー流量調整器及び撹拌機を装着した四つ口フラスコに、n−ブタノール1096部を仕込み、窒素気流下100℃に加熱した。次に、メタクリル酸210部、スチレン180部、アクリル酸エチル210部及びt−ブチルパーオキシ−2−エチルヘキサノエート(重合開始剤)18部の混合物を約3時間かけて滴下し、滴下終了後、さらに同温度で2時間撹拌を続け、室温まで冷却することにより、固形分約35質量%のアクリル樹脂(c1)溶液を得た。得られたアクリル樹脂(c1)の酸価は228mgKOH/g、重量平均分子量は約25000であった。
製造例6
アクリル樹脂変性エポキシ樹脂(A1−1)の製造
還流冷却管、温度計及び撹拌機を装着した四つ口フラスコに、製造例1で得たエポキシ樹脂(a1)60部、製造例4で得たエポキシ樹脂(b1)25部、製造例5で得たアクリル樹脂(c1)溶液42.9部(固形分15部)及びジエチレングリコールモノブチルエーテル55.6部を仕込み、100℃に加熱し溶解させた。次に、N,N−ジメチルアミノエタノール3.7部を加え、100℃に保持し約1.5時間反応させることにより、樹脂酸価25mgKOH/gのアクリル変性エポキシ樹脂(A1−1)溶液を得た。
アクリル樹脂変性エポキシ樹脂(A1−2)の製造
還流冷却管、温度計及び撹拌機を装着した四つ口フラスコに、製造例2で得たエポキシ樹脂(a2)60部、JER1256(三菱化学社製、数平均分子量約12000、エポキシ当量約8000のビスフェノールA型エポキシ樹脂溶液、固形分約40%)62.5部(固形分25部)、製造例5で得たアクリル樹脂(c1)溶液42.9部 (固形分15部)及びジエチレングリコールモノブチルエーテル18.1部を仕込み、85℃に加熱し溶解させた。次に、N,N−ジメチルアミノエタノール3.7部を加え、85℃に保持し約1.5時間反応させることにより、樹脂酸価25mgKOH/gのアクリル変性エポキシ樹脂(A1−2)溶液を得た。
アクリル樹脂変性エポキシ樹脂(A1−3)の製造
還流冷却管、温度計及び撹拌機を装着した四つ口フラスコに、製造例2で得たエポキシ樹脂(a2)85部 、製造例5で得たアクリル樹脂(c1)溶液42.9部(固形分15部)及びジエチレングリコールモノブチルエーテル55.6部を仕込み、100℃に加熱し溶解させた。次に、N,N−ジメチルアミノエタノール3.7部を加え、100℃に保持し約1.5時間反応させることにより、樹脂酸価25mgKOH/gのアクリル変性エポキシ樹脂(A1−3)溶液を得た。
アクリル樹脂変性エポキシ樹脂(A1−4)の製造
還流冷却管、温度計及び撹拌機を装着した四つ口フラスコに、製造例3で得たエポキシ樹脂(a3)85部、製造例5で得たアクリル樹脂(c1)溶液42.9部(固形分15部)及びジエチレングリコールモノブチルエーテル55.6部を仕込み、100℃に加熱し溶解させた。次に、N,N−ジメチルアミノエタノール3.7部を加え、100℃に保持し約1.5時間反応させることにより、樹脂酸価28mgKOH/gのアクリル変性エポキシ樹脂(A1−4)溶液を得た。
アクリル樹脂変性エポキシ樹脂(A2−1)の製造
還流冷却管、温度計及び撹拌機を装着した四つ口フラスコに、製造例4で得たエポキシ樹脂(b1)85部 、製造例5で得たアクリル樹脂(c1)溶液42.9部(固形分15部)及びジエチレングリコールモノブチルエーテル55.6部を仕込み、100℃に加熱し溶解させた。次に、N,N−ジメチルアミノエタノール3.7部を加え、100℃に保持し約1.5時間反応させることにより、樹脂酸価25mgKOH/gのアクリル変性エポキシ樹脂(A2−1)溶液を得た。
製造例11
レゾール型フェノール樹脂(C1)の製造
反応容器に、石炭酸94部、37%ホルムアルデヒド水溶液243部及び苛性ソーダ1部を加え、60℃で3時間反応させた後、減圧下、50℃で1時間脱水した。ついで、濾過して苛性ソーダを濾別し、固形分約50%のレゾール型フェノール樹脂(C1)溶液を得た。得られたレゾール型フェノール樹脂(C1)の重量平均分子量は約1100、ベンゼン核1核当りのメチロール基の平均個数は1.9個であった。
レゾール型フェノール樹脂(C2)の製造
反応容器に、ビスフェノールF 150部、37%ホルムアルデヒド水溶液243部及び苛性ソーダ1部を加え、60℃で3時間反応させた後、減圧下、50℃で1時間脱水した。ついで、濾過して苛性ソーダを濾別し、固形分約50%のレゾール型フェノール樹脂(C2)溶液を得た。得られたレゾール型フェノール樹脂(C2)は、ビスフェノールF骨格を有しており、重量平均分子量は約1800、ベンゼン核1核当りのメチロール基の平均個数は2.1個であった。
実施例1〜22及び比較例1〜5
後記表1及び表2に示す組成にて接着剤を作製し、各接着剤No.1〜27を得た。各接着剤は脱イオン水を用いて固形分濃度が30質量%となるように調整した。なお、接着剤No.23〜27は比較例用の接着剤である。
◎:40℃で1ヵ月貯蔵後の接着剤を塗装しても塗面異常(ブツ)が認められない。
○:40℃で2週間貯蔵後の接着剤を塗装しても塗面異常(ブツ)が認められない。
△:40℃で2週間貯蔵後の接着剤を塗装すると塗面異常(ブツ)が認められる。
×:40℃で1週間貯蔵後の接着剤を塗装すると塗面異常(ブツ)が認められる。
◎:抵抗なく剥すことができる。
○:塗膜の剥離は認められないが、剥す際、やや抵抗がある。
△:塗膜の剥離がわずかに認められ、剥す際、抵抗がある。
×:剥す際の抵抗が大きく、塗膜が剥離する。
◎:せん断剥離強度が、70kgf以上/1cm2。
○:せん断剥離強度が、40kgf以上/1cm2、かつ、70kgf未満/1cm2。
△:せん断剥離強度が、10kgf以上/1cm2、かつ、40kgf未満/1cm2。
×:せん断剥離強度が、10kgf未満/1cm2。
◎:Tピール剥離強度が、1.5kgf以上/1cm幅。
○:Tピール剥離強度が、1.0kgf以上/1cm幅、かつ、1.5kgf未満/1cm幅。
△:Tピール剥離強度が、0.5kgf以上/1cm幅、かつ、1.0kgf未満/1cm幅。
×:Tピール剥離強度が、0.5kgf未満/1cm幅。
◎:接着面積が、全体の90%以上。
○:接着面積が、全体の70%以上、かつ、90%未満。
△:接着面積が、全体の40%以上、かつ、70%未満。
×:接着面積が、全体の40%未満。
Claims (6)
- 重量平均分子量が20000〜400000の範囲内である、アクリル樹脂変性エポキシ樹脂成分(A)、重量平均分子量が20000未満、エポキシ当量が50000g/eq以上のポリヒドロキシポリエーテル樹脂成分(B)、ならびに、レゾール型フェノール樹脂、メラミン樹脂及びブロックポリイソシアネート化合物から選ばれる少なくとも1種の架橋剤成分(C)を含有することを特徴とする水性金属用接着剤。
- アクリル樹脂変性エポキシ樹脂成分(A)が、原料成分であるビスフェノール及びビスフェノール型エポキシ樹脂の総量を基準にして、ビスフェノールF及び/又はビスフェノールF型エポキシ樹脂を15質量%以上含有する原料成分を反応させることにより得られるエポキシ樹脂、を変性してなるアクリル樹脂変性エポキシ樹脂(A1)を含有することを特徴とする請求項1に記載の水性金属用接着剤。
- ポリヒドロキシポリエーテル樹脂成分(B)が、フェノール化合物とエピハロヒドリンとを重縮合させて得られる重合体(B1)を含有することを特徴とする請求項1又は2に記載の水性金属用接着剤。
- ポリヒドロキシポリエーテル樹脂成分(B)が、フェノール化合物とエピハロヒドリンとを重縮合させて得られる重合体(B1)と、該重合体(B1)中のエポキシ基と反応性を有する化合物とを反応させることにより得られる重合体(B2)を含有することを特徴とする請求項1〜3のいずれか一項に記載の水性金属用接着剤。
- 架橋剤成分(C)として、重量平均分子量が300〜4000で、かつベンゼン核1核当りのメチロール基の平均個数が0.3〜3.0個であるレゾール型フェノール樹脂を含有することを特徴とする請求項1〜4のいずれか一項に記載の水性金属用接着剤。
- アクリル樹脂変性エポキシ樹脂成分(A)及びポリヒドロキシポリエーテル樹脂成分(B)の割合(アクリル樹脂変性エポキシ樹脂成分(A)/ポリヒドロキシポリエーテル樹脂成分(B))が両者の固形分質量割合で、20/80〜80/20の範囲内である請求項1〜5のいずれか1項に記載の水性金属用接着剤。
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