JP5679290B2 - Flexible substrate laminate - Google Patents

Description

  The present invention relates to a flexible substrate laminate comprising a flexible substrate and a release film that is bonded to the flexible substrate via an adhesive layer and is detachable from the flexible substrate, and more particularly, a pattern formed on the flexible substrate. It is related with the flexible substrate laminated body which can improve the dimensional accuracy of this easily.

  In recent years, with the rapid spread of flat panel displays such as liquid crystal displays, organic EL displays, and electronic paper displays, the demand for display members constituting such displays has increased. Current flat panel displays are widely used not only for TVs and desktop monitors, but also for portable electronic devices such as portable notebook computers, mobile phones, portable game consoles, electronic readers, and electronic books. For this reason, further weight reduction, size reduction, and thickness reduction are required. For this reason, as a display member, weight reduction, size reduction, and thickness reduction are required.

  Under such circumstances, as a display member constituting a liquid crystal display, an organic EL display, an electronic paper display, etc., a display using a flexible flexible substrate instead of the glass substrate which has been mainly used so far. Members have been proposed. By using a flexible substrate instead of the glass substrate in the display member, the display can be a flexible display. Actually, as such a flexible display, for example, a transparent touch panel, a liquid crystal display, an organic EL display, and the like are known.

JP 2009-36859 A

  However, since the flexible substrate has a lower mechanical strength than a conventional glass substrate or the like, when manufacturing a display member using the flexible substrate, the flexible substrate is distorted, and the dimensional accuracy of the pattern formed on the flexible substrate is low. There was a problem of lowering. In particular, in a flexible substrate laminate including a release film that is bonded to a flexible substrate on which a pattern is formed via an adhesive layer and is peelable from the flexible substrate, the dimension of the pattern before and after peeling of the release film. There was a problem of slipping. In this case, it is difficult to align and join with another counter substrate. For example, in a color filter in which red pixels, green pixels, and blue pixels are arranged in a row at a resolution of 200 dpi, when a pattern having a distance of 200 mm changes by 40 μm (corresponding to a dimensional change of 200 ppm), one color A minute shift will occur, which becomes a serious defect. For this reason, it has been difficult to produce a color filter having a large area using a flexible substrate. In addition, it is difficult to form an active matrix switching element that requires a positioning accuracy of 3 to 5 μm in the patterning process on the flexible substrate.

  By the way, in order to suppress the dimensional change of a flexible substrate, the method of providing a stress relaxation hole in a flexible substrate is disclosed (for example, refer patent document 1). Here, the stress applied to the display area of the flexible substrate is relaxed by deforming the stress relaxation hole, thereby preventing the display area from being distorted. However, in such a method, there is a problem that a step of providing the stress relaxation hole as described above is required in the flexible substrate, and the step of manufacturing the display member becomes complicated.

  The present invention has been made in consideration of such points, and an object of the present invention is to provide a flexible substrate laminate that can easily improve the dimensional accuracy of a pattern formed on a flexible substrate.

  The present invention comprises: a flexible substrate; and a release film that is bonded to the flexible substrate via an adhesive layer and is detachable from the flexible substrate, wherein the flexible substrate has a pattern formed thereon, and the flexible substrate Provided is a flexible substrate laminate in which a strain generated by bonding the flexible substrate and the release film is within ± 0.01% in a portion of the substrate where the pattern is formed. To do.

  ADVANTAGE OF THE INVENTION According to this invention, the distortion produced by bonding a flexible substrate and a peeling film in the part in which the pattern was formed among flexible substrates can be reduced. Thereby, the difference between the dimension of the pattern before peeling the release film from the flexible substrate and the dimension of the pattern after peeling can be reduced. For this reason, it can suppress that the dimension of a pattern changes before and after peeling a peeling film, and can improve the dimensional accuracy of the pattern formed in the flexible substrate easily. In this case, it is possible to easily and accurately align the pattern with the counter substrate on which another pattern to be bonded in a later step is formed.

  In the flexible substrate laminate described above, a plurality of the patterns are formed on the flexible substrate, and the flexible substrate and the release film are attached to a portion of the flexible substrate where the one pattern is formed. You may make it the difference between the distortion | strain produced by having combined and the distortion | strain produced by the said bonding in the part in which the said other pattern was formed be less than +/- 0.01%. In this case, the distortion generated by bonding the flexible substrate and the release film in the portion where one pattern is formed in the flexible substrate, and the bonding generated in the portion where the other pattern is formed The difference from strain can be reduced. For this reason, it can suppress that the dimension of each pattern differs before and after peeling of a peeling film, and can improve the dimensional accuracy of each pattern formed in the flexible substrate easily. In this case, each pattern can be easily and accurately aligned with the counter substrate on which another pattern to be bonded in a later step is formed, and the highly accurate pattern can be mass-produced.

  In the flexible substrate laminate described above, the release film may be peelable from the adhesive layer.

  Moreover, the flexible substrate laminated body mentioned above WHEREIN: The said adhesion layer may be made to be able to peel with respect to the said flexible substrate.

  Moreover, the flexible substrate laminated body mentioned above WHEREIN: You may make it the said pattern be formed in the surface at the side of the said adhesion layer of the said flexible substrate.

  Moreover, the flexible substrate laminated body mentioned above WHEREIN: You may make it the said pattern be formed in the surface on the opposite side to the said adhesion layer of the said flexible substrate.

  In the flexible substrate laminate described above, a barrier layer may be provided on the flexible substrate.

  In the flexible substrate laminate described above, an antireflection layer may be provided on the flexible substrate.

  Moreover, in the flexible substrate laminate described above, a hard coat layer may be provided on the flexible substrate.

  In the flexible substrate laminate described above, the pattern may include a pixel pattern for a color filter.

  According to the present invention, it is possible to easily improve the dimensional accuracy of the pattern formed on the flexible substrate, the counter substrate on which another pattern to be joined in a later step is formed, and easily and accurately, Patterns can be aligned.

FIG. 1 is a diagram showing a configuration of a flexible substrate laminate in the first embodiment of the present invention. FIG. 2 is a plan view showing a flexible substrate in the first embodiment of the present invention. Drawing 3 is a figure showing the outline of the pasting device in a 1st embodiment of the present invention. Fig.4 (a) is a figure which shows the state before a flexible substrate and a peeling film are bonded together in the 1st Embodiment of this invention. FIG.4 (b) is a figure which shows the state by which the flexible substrate and the peeling film were bonded together. FIG.4 (c) is a figure which shows the state by which the peeling film was peeled. FIG. 4D is a diagram illustrating a state in which the counter substrate is bonded. Fig.5 (a) is a figure which shows the state before a flexible substrate and a peeling film are bonded together in the 1st Embodiment of this invention. FIG.5 (b) is a figure which shows the state by which the flexible substrate and the peeling film were bonded together. FIG.5 (c) is a figure which shows the state by which the peeling film was peeled. FIG. 5D is a diagram showing a state in which the counter substrate is bonded. Fig.6 (a) is a figure which shows the structure of the flexible substrate laminated body which has a barrier layer in the modification of the 1st Embodiment of this invention. FIG. 6B is a diagram showing a configuration of a flexible substrate laminate having an AG layer. FIG.6 (c) is a figure which shows the structure of the flexible substrate laminated body which has AR layer. FIG.6 (d) is a figure which shows the structure of the flexible substrate laminated body which has a hard-coat layer. FIG. 7A is a diagram showing a configuration of a flexible substrate laminate having a barrier layer and a hard coat layer in a modification of the first embodiment of the present invention. FIG.7 (b) is a figure which shows the structure of the flexible substrate laminated body which has a barrier layer and AG layer. FIG.7 (c) is a figure which shows the structure of the flexible substrate laminated body which has a barrier layer and AR layer. FIG. 8 is a diagram showing a configuration of a flexible printed circuit board laminate in the second embodiment of the present invention. Fig.9 (a) is a figure which shows the state before a flexible substrate and a peeling film are bonded together in the 2nd Embodiment of this invention. FIG.9 (b) is a figure which shows the state by which the flexible substrate and the peeling film were bonded together. FIG.9 (c) is a figure which shows the state by which the peeling film was peeled. FIG. 9D is a diagram illustrating a state in which the counter substrate is bonded. FIG. 10A is a diagram showing a state before the flexible substrate and the release film are bonded to each other in the modification of the second embodiment of the present invention. FIG.10 (b) is a figure which shows the state by which the flexible substrate and the peeling film were bonded together. FIG.10 (c) is a figure which shows the state by which the peeling film was peeled. FIG. 10D is a diagram illustrating a state where the counter substrate is bonded. Fig.11 (a) is a figure which shows the state before a flexible substrate and a peeling film are bonded together in the 3rd Embodiment of this invention. FIG.11 (b) is a figure which shows the state by which the flexible substrate and the peeling film were bonded together. FIG.11 (c) is a figure which shows the state by which the peeling film was peeled with the adhesion layer. FIG. 11D is a diagram illustrating a state in which the counter substrate is bonded. FIG. 12A is a diagram showing a state before the flexible substrate and the release film are bonded together in the fourth embodiment of the present invention. FIG. 12B is a diagram illustrating a state in which the flexible substrate and the release film are bonded to each other. FIG.12 (c) is a figure which shows the state by which the peeling film was peeled with the adhesion layer. FIG. 12D shows a state in which the counter substrate is bonded.

DESCRIPTION OF EXEMPLARY EMBODIMENTS First Embodiment Hereinafter, an embodiment of the invention will be described with reference to the drawings. Here, FIG. 1 thru | or FIG. 7 is a figure for demonstrating the flexible substrate laminated body in the 1st Embodiment of this invention.

  First, the flexible substrate laminate 10 according to the present embodiment will be described with reference to FIG. A flexible substrate laminate 10 shown in FIG. 1 is bonded to a strip-shaped flexible substrate 11 and a flexible substrate 11 via an adhesive layer 13 and is peelable from the flexible substrate 11 (for example, a release liner) 12. And. Among these, the surface of the release film 12 on the side of the adhesive layer 13 is subjected to release treatment by silicon treatment or the like, and the release film 12 is freely peelable from the adhesive layer 13.

  As shown in FIG. 1 and FIG. 2, a plurality of color filter patterns 14 are formed on the flexible substrate 11. Each pattern 14 includes a rectangular pixel pattern 15 for a color filter including a red pixel 15a, a green pixel 15b, and a blue pixel 15c (a black matrix (not shown) if necessary), and four corners of the pixel pattern 15. And cross-shaped marks 16 formed at corresponding positions. Such a pattern 14 is formed on the surface of the flexible substrate 11 on the adhesive layer 13 side, and the adhesive layer 13 is adhered to the pattern 14.

  In the portion of the flexible substrate 11 where each pattern 14 is formed, the distortion generated by bonding the flexible substrate 11 and the release film 12 is within ± 0.01%, preferably within ± 0.005%. It has become. That is, the deformation amount before and after bonding of the dimension of the portion of the flexible substrate 11 is ± 0.01% with respect to the dimension of the portion before bonding (for example, the deviation from the reference dimension of 100 mm is ± 10 μm). Within 0.005% (for example, the deviation from the 100 mm reference dimension is within ± 5 μm). In this case, the difference between the dimension of the pattern 14 before bonding the flexible substrate 11 and the release film 12 and the dimension of the pattern 14 after bonding the flexible substrate 11 and the release film 12 is within ± 0.01%, Preferably, it is within ± 0.005%.

  By the way, when the peeling film 12 is peeled from the adhesive layer 13, the influence of the stress due to the peeling film 12 is removed from the flexible substrate 11. Further, the adhesive layer 13 adhered to the flexible substrate 11 has flexibility. From this, the state of deformation of the flexible substrate 11 after the release film 12 is released returns to the state before the flexible substrate 11 and the release film 12 are bonded together. For this reason, with the dimension of the pattern 14 formed in the flexible substrate 11 in the state in which the flexible substrate 11 and the peeling film 12 are bonded together, and the dimension of the pattern 14 after peeling the peeling film 12 from the adhesive layer 13 The difference is within ± 0.01%, preferably within ± 0.005%. Thereby, the dimensional accuracy of each pattern 14 can be improved, and the accuracy of the display image as a color filter can be improved. Specifically, when the flexible substrate laminate 10 having the pixel pattern 15 for the color filter and the TFT array are bonded together, driving the liquid crystal element may be inconvenient if the dimensional deviation is within ± 10 μm. Can be prevented, the transmittance and color of the pixels can be maintained within a predetermined range, and the image display can be improved.

  Further, in the portion of the flexible substrate 11 where the pattern 14 is formed, the distortion caused by the bonding of the flexible substrate 11 and the release film 12 and the portion where the other pattern 14 is formed The difference from the strain generated by the combination is within ± 0.01%, preferably within ± 0.005%. In this case, the difference between the dimension of one pattern 14 and the dimension of the other pattern 14 is within ± 0.01%, preferably within ± 0.005%. Thereby, the dimensional accuracy of each pattern 14 can be improved, and a plurality of patterns 14 can be mass-produced with high accuracy.

  Next, the material of the flexible substrate 11 will be described. The flexible substrate 11 in the present embodiment is not particularly limited as long as the plastic substrate is not extremely high even when a tensile force is applied, and can be appropriately selected and used according to the display application. . As such a flexible substrate 11, for example, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyether sulfone (PES), polyimide (PI), polyether ether ketone (PEEK), polycarbonate (PC), Polyethylene (PE), polypropylene (PP), polyphenylene sulfide (PPS), polyetherimide (PEI), cellulose triacetate (CTA), cyclic polyolefin (COP), polymethyl methacrylate (PMMA), polysulfone (PSF), polyamideimide ( PAI), synthetic resins such as nobornene resins and allyl ester resins. Of these, PEN and PET are preferably used.

  The thickness of the flexible substrate 11 is in the range of 10 μm to 500 μm, preferably in the range of 20 μm to 300 μm. This is because if the thickness of the flexible substrate 11 is too thick than the above range, the flexibility is lost, the flexible substrate 11 is easily broken, and it is difficult to wind it into a roll. On the other hand, when it is thinner than the above range, there is no strain and handling in each step becomes difficult.

  Although it does not specifically limit as a width | variety of the flexible substrate 11, For example, it is preferable to exist in the range of 50 mm-2000 mm, Preferably it exists in the range of 100 mm-1500 mm.

  In addition, the flexible substrate 11 may have a configuration including a single layer, or may have a configuration in which a plurality of layers are stacked.

  As a material used for the release film 12, the same material as that of the flexible substrate 11 can be used. Further, the thickness and width of the release film 12 are also preferably the same as those of the flexible substrate 11. Furthermore, even if the peeling film 12 is a structure consisting of a single layer, it may have a structure in which a plurality of layers are laminated.

  The material of the pressure-sensitive adhesive layer 13 is not particularly limited as long as it has flexibility, and it is preferably made of a resin material such as acrylic or styrene. Moreover, as thickness of the adhesion layer 13, what is necessary is just a thickness of the grade which does not lose a softness | flexibility.

  Next, the bonding apparatus 20 which bonds the flexible substrate 11 and the peeling film 12 is demonstrated using FIG. The bonding apparatus 20 shown in FIG. 3 has the 1st delivery roll 21 which delivers the flexible substrate 11 in which the pattern 14 was formed, and the 2nd delivery roll 22 which delivers the peeling film 12 in which the adhesion layer 13 was provided. Yes.

  A laminating portion 23 is provided on the downstream side of the first feeding roll 21 and the second feeding roll 22 to laminate the flexible substrate 11 fed from the first feeding roll 21 and the release film 12 fed from the second feeding roll 22. It has been. In this laminate part 23, the flexible substrate 11 and the peeling film 12 are bonded together via the adhesive layer 13, and the flexible substrate laminated body 10 is produced. The laminating section 23 includes a pair of pressing rollers 23a, and the laminating pressure when laminating the flexible substrate 11 and the release film 12 can be adjusted by adjusting the pressure between the pair of pressing rollers 23a. It can be done.

  A take-up roll 24 that winds the flexible substrate laminate 10 into a roll is provided on the downstream side of the laminating unit 23. The take-up roll 24 has a function as a drive unit that conveys the flexible substrate laminate 10.

  Moreover, in the bonding apparatus 20 shown in FIG. 3, it is conveyed by applying a torque to the opposite side to a conveyance direction to the 1st delivery roll 21 and the 2nd delivery roll 22, and adjusting this torque. The tension applied to the flexible substrate 11 and the release film 12 can be adjusted.

  Next, the effect | action of this Embodiment which consists of such a structure, ie, the method (the manufacturing method of a flexible substrate laminated body) of bonding the flexible substrate and peeling film by this Embodiment is demonstrated.

  First, a plurality of patterns 14 (see FIGS. 1 and 2) having pixel patterns 15 and marks 16 are formed on the flexible substrate 11.

  Thereafter, the flexible substrate 11 is wound in a roll shape so that the pattern 14 is disposed on the outer side in the radial direction, and attached to the first feeding roll 21 (see FIG. 3).

  On the other hand, the adhesive layer 13 is provided on the surface of the release film 12 that has been subjected to the release treatment, and the release film 12 is wound in a roll shape so that the adhesive layer 13 is disposed on the outer side in the radial direction. 22 is attached.

  Next, the winding roll 24 is driven, the flexible substrate 11 and the release film 12 are bonded together (see FIG. 4A), and the flexible substrate laminate 10 is manufactured (see FIG. 4B).

  In this case, first, the flexible substrate 11 is fed from the first feeding roll 21, and the release film 12 is fed from the second feeding roll 22. Subsequently, the fed-out flexible substrate 11 and the release film 12 are bonded to each other via the adhesive layer 13 in the laminate portion 23. In the laminate part 23, the flexible substrate 11 and the release film 12 are arranged so that the pattern 14 formed on the flexible substrate 11 and the adhesive layer 13 provided on the release film 12 face each other (see FIG. 4A). Are pasted together.

While the flexible substrate 11 and the release film 12 are being transported, the tension per unit cross-sectional area loaded on the flexible substrate 11 and the tension per unit cross-sectional area loaded on the release film 12 are both small and comparable. It is preferable to be a value of. For example, the tension per unit cross-sectional area is preferably 0.026 N / mm ² or more and 4000 N / mm ² or less. Thereby, it is possible to prevent the flexible substrate 11 and the release film 12 from being wrinkled during bonding, and to suppress the deformation of the flexible substrate 11 and the release film 12. Here, the tension (stress) per unit cross-sectional area loaded on the flexible substrate 11 is obtained by dividing the tension loaded on the conveyed flexible substrate 11 by the cross-sectional area (width × thickness) of the flexible substrate. The required tension (stress) per unit cross-sectional area applied to the release film 12 is obtained by dividing the tension applied to the release film 12 being conveyed by the cross-sectional area (width × thickness) of the release film 12. Is required.

  The difference in tension per unit cross-sectional area is preferably within ± 0.01% when the pair of flexible substrates 11 and 12 have the same Young's modulus. As a result, the deformation amount of the flexible substrate 11 and the deformation amount of the release film 12 can be made comparable. When the material is different between the flexible substrate 11 and the release film 12, the strain due to the tension is calculated from the tension per unit cross-sectional area described above using the Young's modulus of each material, and the tension of the flexible substrate 11. The tension may be set so that the strain due to the tension and the strain due to the tension of the release film 12 are approximately the same (for example, the difference in strain due to the tension is within ± 0.01%).

  Further, during this time, the laminating pressure when laminating the flexible substrate 11 and the release film 12 is preferably low, for example, preferably 0 MPa or more and 1 MPa or less. Thus, the flexible substrate 11 and the release film 12 can be securely bonded together, and the deformation of the flexible substrate 11 and the release film 12 can be suppressed.

  Thus, the flexible substrate laminated body 10 with which the flexible substrate 11 and the peeling film 12 were bonded together by the adhesion layer 13 as shown in FIG. 1 is obtained. In the flexible substrate laminate 10, the distortion generated by bonding in the portion of the flexible substrate 11 where each pattern 14 is formed can be at least ± 0.01%, and one of the flexible substrates 11. The difference between the strain generated by the bonding in the portion where the pattern 14 is formed and the strain generated by the bonding in the portion where the other pattern 14 is formed can be at least ± 0.01%. . For this reason, the dimensional accuracy of the pattern 14 is facilitated by adjusting the tension per unit cross-sectional area loaded on the flexible substrate 11 and the release film 12 and the laminating pressure between the flexible substrate 11 and the release film 12. Can be improved.

  Thereafter, the flexible substrate laminate 10 is wound around the winding roll 24 and formed into a roll shape.

  In the flexible substrate laminate 10 thus obtained, the release film 12 is then peeled from the adhesive layer 13 (see FIG. 4C), and the pattern 14 formed on the flexible substrate 11 is replaced with another pattern 14. The counter substrate 30 with a mark on which a pattern (for example, TFT, image display element, etc.) is formed is bonded (see FIG. 4D).

  Here, in the flexible substrate 11, a method for confirming the strain generated by bonding the flexible substrate 11 and the release film 12 will be described. Such strain is obtained by measuring the dimension of the pattern 14 of the flexible substrate 11 before and after the flexible substrate 11 and the release film 12 are bonded together. When the dimension between the marks 16 is used as the dimension of the pattern 14, for example, the dimension A between the marks 16 in the width direction of the flexible substrate 11 and the dimension B between the marks 16 in the longitudinal direction may be measured. (See FIG. 2). Note that it is generally preferable to use a length measuring device for measuring the dimensions. In particular, a precise length measuring machine capable of measuring dimensions to the micrometer unit is more preferable. For example, an ultra-precision automatic two-dimensional coordinate measuring machine manufactured by SOKKIA or a CNC image measuring system manufactured by Nikon Instruments Company can be used.

  Using the A dimension and B dimension between the marks 16 of each pattern 14 before bonding and the A dimension and B dimension after bonding, the difference between the dimensions is obtained. It is possible to confirm the strain generated by the bonding of the formed portions. Moreover, by using the A dimension and B dimension between the marks 16 of each pattern 14 after bonding (before peeling the release film 12) and the A dimension and B dimension after peeling the release film 12, It is also possible to obtain a difference in dimension of the pattern 14 before and after peeling.

  The dimension of the pattern 14 is not limited to measuring the A dimension and the B dimension between the marks 16, and the dimension of the pixel pattern 15 may be measured. In this case, the width dimension and the longitudinal dimension of the pixel pattern 15 may be measured. Alternatively, the size of the aggregate of a predetermined number of red pixels 15a, green pixels 15b, and blue pixels 15c that are continuous in the width direction and the predetermined number of red pixels 15a, green pixels 15b, and blue pixels 15c that are continuous in the longitudinal direction. You may measure the dimension of an aggregate.

  Further, after the flexible substrate laminate 10 shown in FIG. 1 is manufactured (that is, after the flexible substrate 11 and the release film 12 are bonded), the dimensions before bonding of the pattern 14 on the flexible substrate 11 are obtained. A method will be described.

  In this case, first, the flexible substrate laminate 10 is sufficiently immersed in an organic solvent such as acetone. Subsequently, the release film 12 and the adhesive layer 13 are peeled from the flexible substrate 11 so that a large tension is not applied to the flexible substrate 11. Thus, the peeling film 12 can be peeled from the flexible substrate 11 while removing the influence of the stress of the peeling film 12 on the pattern 14 and preventing the flexible substrate 11 from being deformed.

  As another method for removing the influence of the stress caused by the release film 12, only the release film 12 may be half-cut into a lattice at intervals of 10 mm, for example, without peeling the release film 12 from the flexible substrate 11. .

  Next, the flexible substrate 11 is exposed to an atmosphere having the same temperature and humidity as the atmosphere when the dimension between the marks 16 is measured before the release film 12 is peeled, and the solvent evaporates from the flexible substrate 11 to be in an equilibrium state. Until left. Thereby, the temperature and water absorption rate of the peeled flexible substrate 11 can be made equal to the temperature and water absorption rate of the flexible substrate 11 before peeling. For this reason, the factor of the dimensional change by the change of the surrounding environment can be removed.

  Thereafter, the A dimension and the B dimension between the marks 16 of each pattern 14 on the flexible substrate 11 are measured. The A and B dimensions between the marks 16 thus obtained correspond to the A and B dimensions before the release film 12 is bonded. Thus, even after the flexible substrate 11 and the release film 12 are bonded together, the A dimension and B dimension before bonding can be obtained. For this reason, the difference between each dimension before and after the bonding is determined by the A and B dimensions between the marks 16 of the pattern 14 before bonding obtained in this way and the A and B dimensions after bonding. The distortion of the portion where the pattern 14 is formed in the flexible substrate 11 can be confirmed.

  As described above, according to the present embodiment, at the portion of the flexible substrate 11 where the pattern 14 is formed, the strain generated by bonding the flexible substrate 11 and the release film 12 is at least ± 0.01. It is within%. By this, the distortion by bonding of the part in which the pattern 14 of the flexible substrate 11 was formed can be reduced, the dimension of the pattern 14 before peeling the peeling film 12 from the adhesive layer 13, and the pattern after peeling. The difference with the dimension of 14 can be reduced. For this reason, it can suppress that the dimension of the pattern 14 changes before and after peeling the peeling film 12, and can improve the dimensional accuracy of the pattern 14 formed in the flexible substrate 11 easily. In this case, the pattern 14 can be easily and accurately aligned with the counter substrate 30 with a mark on which another pattern 14 to be bonded in a later step is formed.

  Moreover, according to this Embodiment, the distortion produced by bonding the flexible substrate 11 and the peeling film 12 in the part in which the one pattern 14 was formed among the flexible substrates 11, and the other pattern 14 are. In the formed portion, the difference from the strain generated by the bonding can be reduced. For this reason, it can suppress that the dimension of each pattern 14 differs before and after peeling of the peeling film 12, and can improve the dimensional accuracy of each pattern 14 formed in the flexible substrate 11 easily. In this case, each pattern 14 can be easily and accurately aligned with the counter substrate 30 on which another pattern to be bonded in a later step is formed, and the pattern 14 with high accuracy can be mass-produced. it can.

  Furthermore, according to the present embodiment, the adhesive layer 13 is provided on the release film 12 before bonding, so that, for example, a functional layer having a three-dimensional shape is formed on the flexible substrate 11 before bonding as described later. Even when laminated, or when a delicate barrier layer 40 (see FIGS. 6 and 7), antireflection layers 41 and 42, or a lens sheet (not shown) is laminated, these functional layers Good performance can be maintained.

  In addition, in this Embodiment, the adhesion layer 13 demonstrated the example provided in the peeling film 12 before bonding. However, the present invention is not limited to this, and the adhesive layer 13 may be provided on the pattern 14 formed on the flexible substrate 11 without being provided on the release film 12 before bonding.

  In this case, the 1st delivery roll 21 (refer FIG. 3) by which the flexible substrate 11 was wound by roll shape so that the adhesion layer 13 may be arrange | positioned on the radial direction outer side is prepared. Moreover, the 2nd delivery roll 22 with which the peeling film 12 was wound in roll shape is prepared. Except for this, the flexible substrate 11 and the release film 12 are bonded together via the adhesive layer 13 (see FIG. 5A) in the same manner as in the above-described embodiment, and the release film 12 is attached to the adhesive layer 13. The flexible board | substrate laminated body 10 shown in FIG. 1 attached so that peeling was possible can be produced (refer FIG.5 (b)). Thereafter, the release film 12 was peeled from the adhesive layer 13 (see FIG. 5C), and another pattern (for example, TFT, image display element, etc.) was formed on the pattern 14 formed on the flexible substrate 11. The counter substrate 30 with a mark is bonded (see FIG. 5D).

  Moreover, in this Embodiment, the example in which only the pattern 14 was provided in the flexible substrate 11 was demonstrated. However, the present invention is not limited to this, and various functional layers may be provided on the surface of the flexible substrate 11 opposite to the pattern 14 as shown in FIG.

  As such a flexible substrate laminated body 10, for example, as shown in FIG. 6A, the second adhesive layer 45, the second flexible substrate 46, and oxygen are prevented from permeating through the flexible substrate 11. The barrier layer 40 may be sequentially stacked. In this case, the order of bonding of the flexible substrate 11 and the release film 12 and bonding of the flexible substrate 11 and the second flexible substrate 46 are not limited. Alternatively, the flexible substrate 11 may be bonded to the second flexible substrate 46 provided with the barrier layer 40 in advance, and the flexible substrate 11 and the second flexible substrate 46 are bonded together by the second adhesive layer 45. After that, the barrier layer 40 may be provided, and the barrier layer 40 can be formed on the second flexible substrate 46 at an arbitrary timing. In this way, the flexible substrate laminate 10 shown in FIG. 6A can be produced. Thereby, even if it is the flexible substrate laminated body 10 which has the barrier layer 40, the dimensional accuracy of the pattern 14 can be improved easily.

  Further, for example, as shown in FIGS. 6B and 6C, the flexible substrate 11 has a second adhesive layer 45, a second flexible substrate 46, and an antireflection layer (AG (antiglare) that suppresses flickering of the screen. ) Layer 41 or AR (anti-reflection) layer 42) may be sequentially laminated. In this case, the order of bonding of the flexible substrate 11 and the release film 12 and bonding of the flexible substrate 11 and the second flexible substrate 46 are not limited. Further, the flexible substrate 11 may be bonded to the second flexible substrate 46 in which the antireflection layers 41 and 42 are provided in advance, and the flexible substrate 11 and the second flexible substrate 46 are the second adhesive layer 45. The antireflection layers 41 and 42 may be provided after being bonded together, and the antireflection layers 41 and 42 can be formed on the second flexible substrate 46 at an arbitrary timing. In this way, the flexible substrate laminate 10 shown in FIGS. 6B and 6C can be manufactured. Thereby, even if it is the flexible substrate laminated body 10 which has the antireflection layers 41 and 42, the dimensional accuracy of the pattern 14 can be improved easily.

  Furthermore, for example, as shown in FIG. 6D, the flexible substrate 11 is sequentially laminated with a second adhesive layer 45, a second flexible substrate 46, and a hard coat layer 43 that prevents the display from being damaged. May be. In this case, the order of bonding of the flexible substrate 11 and the release film 12 and bonding of the flexible substrate 11 and the second flexible substrate 46 are not limited. Alternatively, the flexible substrate 11 may be bonded to the second flexible substrate 46 provided with the hard coat layer 43 in advance, and the flexible substrate 11 and the second flexible substrate 46 are bonded to each other by the second adhesive layer 45. The hard coat layer 43 may be provided after being put together, and the hard coat layer 43 can be formed on the second flexible substrate 46 at an arbitrary timing. In this way, the flexible substrate laminate 10 shown in FIG. 6 (d) can be produced. Thereby, even if it is the flexible substrate laminated body 10 which has the hard-coat layer 43, the dimensional accuracy of the pattern 14 can be improved easily.

  Moreover, the flexible substrate laminated body 10 may have two functional layers as shown in FIG.

  As such a flexible substrate laminate 10, for example, as shown in FIG. 7A, the second adhesive layer 45, the second flexible substrate 46, the barrier layer 40, and the third adhesive are attached to the flexible substrate 11. The layer 47, the third flexible substrate 48, and the hard coat layer 43 may be sequentially stacked. In this case, the order of bonding of the flexible substrate 11 and the release film 12, bonding of the flexible substrate 11 and the second flexible substrate 46, and bonding of the second flexible substrate 46 and the third flexible substrate 48 is as follows. The barrier layer 40 and the hard coat layer 43 are not limited to the second flexible substrate 46 and the third flexible substrate 48 at any timing, as in the flexible substrate laminate 10 shown in FIG. Can be formed respectively. In this way, the flexible substrate laminate 10 shown in FIG. 7A can be produced. Thereby, even if it is the flexible substrate laminated body 10 which has the barrier layer 40 and the hard-coat layer 43, the dimensional accuracy of the pattern 14 can be improved easily.

  Further, for example, as shown in FIGS. 7B and 7C, the flexible substrate 11 has a second adhesive layer 45, a second flexible substrate 46, a barrier layer 40, a third adhesive layer 47, and a third adhesive layer. The flexible substrate 48 and the antireflection layer (AG layer 41 or AR layer 42) may be sequentially laminated. In this case, the order of bonding of the flexible substrate 11 and the release film 12, bonding of the flexible substrate 11 and the second flexible substrate 46, and bonding of the second flexible substrate 46 and the third flexible substrate 48 is as follows. The barrier layer 40 and the antireflection layers 41 and 42 are not limited, and the second flexible substrate 46 and the third flexible substrate 46 are formed at an arbitrary timing, as in the flexible substrate laminate 10 shown in FIG. Each can be formed on the substrate 48. In this way, the flexible substrate laminate 10 shown in FIGS. 7B and 7C can be manufactured. Thereby, even if it is the flexible substrate laminated body 10 which has the barrier layer 40 and the antireflection layers 41 and 42, the dimensional accuracy of the pattern 14 can be improved easily.

  In the example in which the various functional layers are provided, the example in which the pattern 14 and the adhesive layer 13 are configured to face each other has been described. However, the present invention is not limited to this, and the pattern 14 is flexible. Even when formed on the surface of the substrate 11 opposite to the adhesive layer 13 (see FIG. 8 described later), various functional layers as described above can be provided on the pattern 14 in the same manner.

Second Embodiment Next, a flexible substrate laminate in a second embodiment of the present invention will be described with reference to FIGS.

  The second embodiment shown in FIGS. 8 and 9 is mainly different in that the pattern is formed on the surface of the flexible substrate on the side opposite to the adhesive layer. This is substantially the same as the first embodiment shown in FIG. 8 and FIG. 9, the same parts as those of the first embodiment shown in FIG. 1 to FIG.

  In the flexible substrate laminate 50 shown in FIG. 8, the pattern 14 is formed on the surface of the flexible substrate 11 opposite to the adhesive layer 13. That is, the adhesive layer 13 is directly adhered to the flexible substrate 11.

  When producing such a flexible substrate laminated body 50, the flexible substrate 11 prepares the 1st delivery roll 21 (refer FIG. 3) wound in roll shape so that the pattern 14 may be arrange | positioned inside radial direction. Except for this, as in the first embodiment, the flexible substrate 11 and the release film 12 are bonded together via the adhesive layer 13 (see FIG. 9A), and the flexible substrate laminate shown in FIG. A body 50 is produced (see FIG. 9B).

  In the manufactured flexible substrate laminate 50, thereafter, the release film 12 is released from the adhesive layer 13 (see FIG. 9C), and another pattern is formed on the surface of the flexible substrate 11 opposite to the pattern 14. A counter substrate 30 with a mark on which (for example, a TFT, an image display element, etc.) is formed is bonded (see FIG. 9D).

  As described above, according to the present embodiment, at the portion of the flexible substrate 11 where the pattern 14 is formed, the strain generated by bonding the flexible substrate 11 and the release film 12 is at least ± 0.01. It is within%. By this, the distortion by bonding of the part in which the pattern 14 of the flexible substrate 11 was formed can be reduced, the dimension of the pattern 14 before peeling the peeling film 12 from the adhesive layer 13, and the pattern after peeling. The difference with the dimension of 14 can be reduced. For this reason, it can suppress that the dimension of the pattern 14 changes before and after peeling the peeling film 12, and can improve the dimensional accuracy of the pattern 14 formed in the flexible substrate 11 easily. In this case, the pattern 14 can be easily and accurately aligned with the counter substrate 30 with a mark on which another pattern 14 to be bonded in a later step is formed.

  Moreover, according to this Embodiment, the distortion produced by bonding the flexible substrate 11 and the peeling film 12 in the part in which the one pattern 14 was formed among the flexible substrates 11, and the other pattern 14 are. In the formed portion, the difference from the strain generated by the bonding can be reduced. For this reason, it can suppress that the dimension of each pattern 14 differs before and after peeling of the peeling film 12, and can improve the dimensional accuracy of each pattern 14 formed in the flexible substrate 11 easily. In this case, each pattern 14 can be easily and accurately aligned with the counter substrate 30 on which another pattern to be bonded in a later step is formed, and the pattern 14 with high accuracy can be mass-produced. it can.

  Further, according to the present embodiment, since the color filter pixel pattern 15 is arranged on the outermost surface of the flexible substrate laminate 10, when assembling the LCD panel, the pixel pattern 15 can be brought close to the liquid crystal layer. And the problem of parallax can be avoided.

  Furthermore, according to the present embodiment, by providing the adhesive layer 13 on the release film 12 before bonding, for example, when a functional layer having a three-dimensional shape is laminated on the flexible substrate 11 before bonding, Or even when a delicate barrier layer 40 (see FIGS. 6 and 7), antireflection layers 41 and 42, or a lens sheet (not shown) is laminated, the performance of these functional layers is maintained well. can do.

  In addition, in this Embodiment, the adhesion layer 13 demonstrated the example provided in the peeling film 12 before bonding. However, the present invention is not limited to this, and the adhesive layer 13 may be provided on the surface opposite to the pattern 14 of the flexible substrate 11 without being provided on the release film 12 before bonding.

  In this case, the 1st delivery roll 21 (refer FIG. 3) by which the flexible substrate 11 was wound by roll shape so that the adhesion layer 13 may be arrange | positioned on the radial direction outer side is prepared. Moreover, the 2nd delivery roll 22 with which the peeling film 12 was wound in roll shape is prepared. Except for this, as in the first embodiment, the flexible substrate 11 and the release film 12 are bonded together via the adhesive layer 13 (see FIG. 10A), and the release film 12 is attached to the adhesive layer 13. The flexible substrate laminate 50 shown in FIG. 8 attached to the substrate in a peelable manner can be produced (see FIG. 10B). Thereafter, the release film 12 is peeled from the adhesive layer 13 (see FIG. 10C), and another pattern (for example, TFT, image display element, etc.) is formed on the surface of the flexible substrate 11 opposite to the pattern 14. The formed counter substrate 30 with a mark is bonded (see FIG. 10D).

Third Embodiment Next, a flexible substrate laminate in a third embodiment of the present invention will be described with reference to FIG.

  The third embodiment shown in FIG. 11 is mainly different from the first embodiment shown in FIGS. 1 to 7 in that the adhesive layer is detachable from the flexible substrate. The form is substantially the same. In FIG. 11, the same parts as those of the first embodiment shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 11B, in the flexible substrate laminate 60 in the present embodiment, the adhesive layer 13 is detachable from the flexible substrate 11. That is, the adhesive layer 13 is provided on the surface of the flexible substrate 11 on the pattern 14 side, is directly adhered to the pattern 14, and is detachable from the pattern 14. In this way, the release film 12 is configured to be peelable from the flexible substrate 11 together with the adhesive layer 13, and constitutes a protective film that protects the flexible substrate 11 on which the pattern 14 is formed.

  By the way, when the peeling film 12 is peeled from the flexible substrate 11 together with the adhesive layer 13, the influence of the stress due to the peeling film 12 is removed from the flexible substrate 11. From this, the state of deformation of the flexible substrate 11 after the release film 12 is released returns to the state before the flexible substrate 11 and the release film 12 are bonded together. Therefore, the dimension of the pattern 14 formed on the flexible substrate 11 in a state where the flexible substrate 11 and the release film 12 are bonded together, and the pattern 14 after the release film 12 is peeled from the flexible substrate 11 together with the adhesive layer 13. The difference from the dimension is within ± 0.01%, preferably within ± 0.005%. Thereby, the dimensional accuracy of each pattern 14 can be improved, and the accuracy of the display image as a color filter can be improved.

  Such a flexible substrate laminate 60 can be produced in the same manner as in the first embodiment. First, the 1st supply roll 21 (refer FIG. 3) by which the flexible substrate 11 was wound by roll shape so that the pattern 14 may be arrange | positioned on the radial direction outer side is prepared. Moreover, the 2nd delivery roll 22 with which the peeling film 12 was wound by roll shape so that the adhesion layer 13 may be arrange | positioned on the radial direction outer side is prepared.

  Next, the winding roll 24 is driven, the flexible substrate 11 and the release film 12 are bonded together (see FIG. 11A), and the flexible substrate laminate in which the adhesive layer 13 is detachably adhered to the flexible substrate 11. 60 is produced (see FIG. 11B).

  In the flexible substrate laminate 60 produced in this way, the release film 12 is peeled from the flexible substrate 11 together with the adhesive layer 13 (see FIG. 11C), and the pattern 14 formed on the flexible substrate 11 is formed. The counter substrate 30 with a mark on which another pattern (for example, TFT, image display element, etc.) is formed is bonded (see FIG. 11D).

  As described above, according to the present embodiment, at the portion of the flexible substrate 11 where the pattern 14 is formed, the strain generated by bonding the flexible substrate 11 and the release film 12 is at least ± 0.01. It is within%. By this, the distortion by bonding of the part in which the pattern 14 of the flexible substrate 11 was formed can be reduced, and the dimension of the pattern 14 before peeling the release film 12 together with the adhesive layer 13 from the flexible substrate 11; The difference with the dimension of the pattern 14 after peeling can be reduced. For this reason, it can suppress that the dimension of the pattern 14 changes before and after peeling the peeling film 12, and can improve the dimensional accuracy of the pattern 14 formed in the flexible substrate 11 easily. In this case, the pattern 14 can be easily and accurately aligned with the counter substrate 30 with a mark on which another pattern 14 to be bonded in a later step is formed.

  Moreover, according to this Embodiment, the distortion produced by bonding the flexible substrate 11 and the peeling film 12 in the part in which the one pattern 14 was formed among the flexible substrates 11, and the other pattern 14 are. In the formed portion, the difference from the strain generated by the bonding can be reduced. For this reason, it can suppress that the dimension of each pattern 14 differs before and after peeling of the peeling film 12, and can improve the dimensional accuracy of each pattern 14 formed in the flexible substrate 11 easily. In this case, each pattern 14 can be easily and accurately aligned with the counter substrate 30 on which another pattern to be bonded in a later step is formed, and the pattern 14 with high accuracy can be mass-produced. it can.

  Moreover, according to this Embodiment, the protective film which protects the flexible substrate 11 in which the pattern 14 was formed by the peeling film 12 and the adhesion layer 13 is comprised. For this reason, the flexible substrate 11 and the pattern 14 can be protected while suppressing the dimension of the pattern 14 from changing before and after the release film 12 is peeled off.

  Furthermore, according to the present embodiment, by providing the adhesive layer 13 on the release film 12 before bonding, for example, when a functional layer having a three-dimensional shape is laminated on the flexible substrate 11 before bonding, Or even when a delicate barrier layer 40 (see FIGS. 6 and 7), antireflection layers 41 and 42, or a lens sheet (not shown) is laminated, the performance of these functional layers is maintained well. can do.

Fourth Embodiment Next, a flexible substrate laminate according to a fourth embodiment of the present invention will be described with reference to FIG.

  The fourth embodiment shown in FIG. 12 is mainly different in that the adhesive layer is detachable from the flexible substrate and is provided on the surface opposite to the pattern of the flexible substrate. Other configurations are substantially the same as those of the first embodiment shown in FIGS. In FIG. 12, the same parts as those of the first embodiment shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 12B, in the flexible substrate laminate 70 in the present embodiment, the adhesive layer 13 is detachable from the flexible substrate 11. That is, the adhesive layer 13 is provided on the surface of the flexible substrate 11 opposite to the pattern 14, is directly adhered to the flexible substrate 11, and is detachable from the flexible substrate 11. In this way, the release film 12 is configured to be peelable from the flexible substrate 11 together with the adhesive layer 13, and constitutes a protective film that protects the flexible substrate 11 on which the pattern 14 is formed.

  By the way, when the peeling film 12 is peeled from the flexible substrate 11 together with the adhesive layer 13, the influence of the stress due to the peeling film 12 is removed from the flexible substrate 11. From this, the state of deformation of the flexible substrate 11 after the release film 12 is released returns to the state before the flexible substrate 11 and the release film 12 are bonded together. Therefore, the dimension of the pattern 14 formed on the flexible substrate 11 in a state where the flexible substrate 11 and the release film 12 are bonded together, and the pattern 14 after the release film 12 is peeled from the flexible substrate 11 together with the adhesive layer 13. The difference from the dimension is within ± 0.01%, preferably within ± 0.005%. Thereby, the dimensional accuracy of each pattern 14 can be improved, and the accuracy of the display image as a color filter can be improved.

  Such a flexible substrate laminate 70 can be manufactured in the same manner as in the first embodiment. First, a first feeding roll 21 (see FIG. 3) in which the flexible substrate 11 is wound on a roll is prepared so that the pattern 14 is arranged on the inner side in the radial direction. Moreover, the 2nd delivery roll 22 with which the peeling film 12 was wound by roll shape so that the adhesion layer 13 may be arrange | positioned on the radial direction outer side is prepared.

  Next, the winding roll 24 is driven, the flexible substrate 11 and the release film 12 are bonded together (see FIG. 12A), and the flexible substrate laminate in which the adhesive layer 13 is detachably adhered to the flexible substrate 11. 70 is produced (see FIG. 12B).

  In the flexible substrate laminate 70 thus manufactured, the release film 12 is peeled from the flexible substrate 11 together with the adhesive layer 13 (see FIG. 12C), and the pattern 14 formed on the flexible substrate 11 is formed. The counter substrate 30 with a mark on which another pattern (for example, TFT, image display element, etc.) is formed is bonded (see FIG. 12D).

  As described above, according to the present embodiment, at the portion of the flexible substrate 11 where the pattern 14 is formed, the strain generated by bonding the flexible substrate 11 and the release film 12 is at least ± 0.01. It is within%. By this, the distortion by bonding of the part in which the pattern 14 of the flexible substrate 11 was formed can be reduced, and the dimension of the pattern 14 before peeling the release film 12 together with the adhesive layer 13 from the flexible substrate 11; The difference with the dimension of the pattern 14 after peeling can be reduced. For this reason, it can suppress that the dimension of the pattern 14 changes before and after peeling the peeling film 12, and can improve the dimensional accuracy of the pattern 14 formed in the flexible substrate 11 easily. In this case, the pattern 14 can be easily and accurately aligned with the counter substrate 30 with a mark on which another pattern 14 to be bonded in a later step is formed.

  Moreover, according to this Embodiment, the distortion produced by bonding the flexible substrate 11 and the peeling film 12 in the part in which the one pattern 14 was formed among the flexible substrates 11, and the other pattern 14 are. In the formed portion, the difference from the strain generated by the bonding can be reduced. For this reason, it can suppress that the dimension of each pattern 14 differs before and after peeling of the peeling film 12, and can improve the dimensional accuracy of each pattern 14 formed in the flexible substrate 11 easily. In this case, each pattern 14 can be easily and accurately aligned with the counter substrate 30 on which another pattern to be bonded in a later step is formed, and the pattern 14 with high accuracy can be mass-produced. it can.

  Moreover, according to this Embodiment, the protective film which protects the flexible substrate 11 in which the pattern 14 was formed by the peeling film 12 and the adhesion layer 13 is comprised. For this reason, scratches or the like are formed on the surface (the lower surface in FIG. 12) of the flexible substrate 11 on the observer side of the color filter while suppressing the change of the dimension of the pattern 14 before and after the peeling of the release film 12. Can be prevented and the flexible substrate 11 can be protected.

  Furthermore, according to the present embodiment, by providing the adhesive layer 13 on the release film 12 before bonding, for example, when a functional layer having a three-dimensional shape is laminated on the flexible substrate 11 before bonding, Or even when a delicate barrier layer 40 (see FIGS. 6 and 7), antireflection layers 41 and 42, or a lens sheet (not shown) is laminated, the performance of these functional layers is maintained well. can do.

  As mentioned above, although embodiment by this invention has been described, naturally, within the scope of the gist of this invention, these embodiment can also be combined suitably partially. Further, in the present embodiment, various modifications other than the above-described modifications are possible within the scope of the present invention.

  In the flexible substrate laminate 30 of the present invention, the dimension of the pattern 14 before and after the release film 12 was peeled was measured.

  First, as a flexible substrate 11, a PET film (Cosmo Shine A4100 manufactured by Toyobo Co., Ltd., 300 mm wide × 0.125 mm thick and 10 m long) is prepared, and a release film 12 provided with an adhesive layer 13 is prepared. A double-sided adhesive film (CS9621T, manufactured by Nitto Denko Corporation) having a width of 270 mm, a thickness of 0.050 mm, and a length of 10 m was prepared. The release film 12 is made of PET.

  A plurality of pixel patterns 15 were formed on the PET film, and dimension measurement marks 16 were formed at positions corresponding to the four corners of each pixel pattern 15 (see FIG. 2). The distance between the marks 16 was 212 mm. Here, before bonding a PET film and the peeling film 12, the dimension between the marks 16 formed on the PET film was measured by the method described above.

  As the bonding apparatus 20, a bonding apparatus (product name: LM-203-SB) manufactured by DNK Co., Ltd. was used.

When the PET film and the release film 12 were bonded together, the conveyance speed was 0.6 m / min, and the laminating pressure (effective pressure) applied to the PET film and the release film 12 was set to 0.28 MPa. Further, in order to reduce the deformation amount in each film and make it the same level, the tension applied to each film is adjusted, the tension per unit cross-sectional area applied to the PET film is 1.33 N / mm ² , and the release film The tension per unit cross-sectional area of 12 was 1.48 N / mm ² .

  Under such conditions, the PET film and the release film 12 were bonded together to produce the flexible substrate laminate 10.

  Subsequently, the dimension between the marks 16 was measured by the method described above.

  Then, the peeling film 12 was peeled from the adhesive film, and the dimension between the marks 16 after peeling was measured.

  It was confirmed that the dimensional difference between the marks 16 before and after bonding thus obtained was within ± 0.003% (for example, the deviation from the reference dimension of 100 mm was ± 3 μm). That is, it was confirmed that the strain generated by bonding the PET film and the release film 12 in the portion of the PET film where the pattern 14 was formed was within ± 0.003%. Further, it was confirmed that the dimensional difference between the marks 16 before and after peeling was within ± 0.003% (for example, the deviation from the reference dimension of 100 mm was within ± 3 μm). Further, it was confirmed that the difference in dimension between the patterns 14 was within ± 0.003%. That is, in the portion where one pattern 14 is formed in the PET film, the strain caused by bonding the PET film and the release film 12 and the portion where the other pattern 14 is formed are bonded by this bonding. It was confirmed that the difference from the generated strain was within ± 0.003%.

  Furthermore, when each pattern 14 of the obtained flexible substrate laminate 10 was superimposed on another counter substrate 30 with marks, the marks could be easily and accurately aligned.

DESCRIPTION OF SYMBOLS 10 Flexible substrate laminated body 11 Flexible substrate 12 Peeling film 13 Adhesive layer 14 Pattern 15 Pixel pattern 15a Red pixel 15b Green pixel 15c Blue pixel 16 Mark 20 Pasting apparatus 21 1st delivery roll 22 2nd delivery roll 23 Laminating part 23a Pressure roller 24 winding roll 30 counter substrate 40 barrier layer 41 AG layer 42 AR layer 43 hard coat layer 45 second adhesive layer 46 second flexible substrate 47 third adhesive layer 48 third flexible substrate 50, 60, 70 flexible Board laminate

Claims (10)

A flexible substrate;
Affixed to the flexible substrate via an adhesive layer, and a release film that can be peeled off from the flexible substrate,
A pattern is partially formed on one surface of the flexible substrate,
The difference between the strain calculated from the tension applied to the flexible substrate and its Young's modulus and the strain calculated from the tension applied to the release film and its Young's modulus is within ± 0.01%. So that the flexible substrate and the release film are bonded together,
The flexible substrate laminate, wherein a strain generated by bonding the flexible substrate and the release film in a portion where the pattern is formed in the flexible substrate is within ± 0.01%. . A plurality of the patterns are formed partially on the one surface of the flexible substrate,
In the portion where the one pattern of the flexible substrate is formed, the strain caused by bonding the flexible substrate and the release film, and in the portion where the other pattern is formed, by the bonding The flexible substrate laminate according to claim 1, wherein a difference from the generated strain is within ± 0.01%.   The flexible substrate laminate according to claim 1, wherein the release film is detachable from the adhesive layer.   The flexible substrate laminate according to claim 1, wherein the adhesive layer is detachable from the flexible substrate.   The flexible substrate laminate according to any one of claims 1 to 4, wherein the pattern is formed on a surface of the flexible substrate on the adhesive layer side.   The flexible substrate laminate according to any one of claims 1 to 4, wherein the pattern is formed on a surface of the flexible substrate opposite to the adhesive layer.   The flexible substrate laminate according to claim 1, wherein a barrier layer is provided on the flexible substrate.   The flexible substrate laminate according to claim 1, wherein an antireflection layer is provided on the flexible substrate.   The flexible substrate laminate according to any one of claims 1 to 6, wherein a hard coat layer is provided on the flexible substrate.   The flexible substrate laminate according to claim 1, wherein the pattern has a pixel pattern for a color filter.

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