JP5679289B2 - Flexible substrate laminate - Google Patents

Description

  The present invention relates to a flexible substrate laminate including a pair of flexible substrates and an adhesive layer interposed between the pair of flexible substrates and bonded to the pair of flexible substrates, and in particular, formed on one flexible substrate. It is related with the flexible substrate laminated body which can improve the dimensional accuracy of the pattern made easily.

  In recent years, with the rapid spread of flat panel displays such as liquid crystal displays, organic EL displays, and electronic paper displays, the demand for display members constituting such displays has increased. Current flat panel displays are widely used not only for TVs and desktop monitors, but also for portable electronic devices such as portable notebook computers, mobile phones, portable game consoles, electronic readers, and electronic books. For this reason, further weight reduction, size reduction, and thickness reduction are required. For this reason, as a display member, weight reduction, size reduction, and thickness reduction are required.

  Under such circumstances, as a display member constituting a liquid crystal display, an organic EL display, an electronic paper display, etc., a display using a flexible flexible substrate instead of the glass substrate which has been mainly used so far. Members have been proposed. By using a flexible substrate instead of the glass substrate in the display member, the display can be a flexible display. Actually, as such a flexible display, for example, a transparent touch panel, a liquid crystal display, an organic EL display, and the like are known.

JP 2009-36859 A

  However, since a flexible substrate has a lower mechanical strength than a conventional glass substrate or the like, when manufacturing a display member using a flexible substrate, in particular, one flexible substrate on which a pattern is formed, and another flexible substrate. When the substrates are bonded together with the adhesive layer, there is a problem that the flexible substrate is distorted and the dimensional accuracy of the pattern formed on the flexible substrate is lowered. In this case, it becomes difficult to align and bond another counter substrate to the distorted flexible substrate. For example, in a color filter in which red pixels, green pixels, and blue pixels are arranged in a row at a resolution of 200 dpi, when a pattern having a distance of 200 mm changes by 40 μm (corresponding to a dimensional change of 200 ppm), one color A minute shift will occur, which becomes a serious defect. For this reason, it has been difficult to produce a color filter having a large area using a flexible substrate. In addition, it is difficult to form an active matrix switching element that requires a positioning accuracy of 3 to 5 μm in the patterning process on the flexible substrate.

  By the way, in order to suppress the dimensional change of a flexible substrate, the method of providing a stress relaxation hole in a flexible substrate is disclosed (for example, refer patent document 1). Here, the stress applied to the display area of the flexible substrate is relaxed by deforming the stress relaxation hole, thereby preventing the display area from being distorted. However, in such a method, there is a problem that a step of providing the stress relaxation hole as described above is required in the flexible substrate, and the step of manufacturing the display member becomes complicated.

  The present invention has been made in consideration of such points, and an object of the present invention is to provide a flexible substrate laminate that can easily improve the dimensional accuracy of a pattern formed on a flexible substrate.

  The present invention includes a pair of flexible substrates and an adhesive layer interposed between the pair of flexible substrates, wherein one of the pair of flexible substrates has a pattern formed thereon, The flexible substrate laminate is characterized in that, in the portion of the flexible substrate in which the pattern is formed, the strain generated by bonding the pair of flexible substrates is within ± 0.01%. .

  ADVANTAGE OF THE INVENTION According to this invention, the distortion produced by bonding a pair of flexible substrate in the part in which the pattern was formed among one flexible substrates can be reduced. Thereby, the difference between the dimension of the pattern before bonding the pair of flexible substrates and the dimension of the pattern after bonding can be reduced. For this reason, it can suppress that the dimension of a pattern changes before and after bonding, and can improve the dimensional accuracy of the pattern formed in the said one flexible substrate easily. In this case, it is possible to easily and accurately align the pattern with the counter substrate on which another pattern to be bonded in a later step is formed.

  In the flexible substrate laminate described above, a plurality of the patterns are formed on the one flexible substrate, and the pair of flexible substrates is formed at a portion of the one flexible substrate where the one pattern is formed. You may make it the difference of the distortion produced by bonding and the distortion produced by the said bonding in the part in which the said other pattern was formed be less than +/- 0.01%. In this case, the strain generated by bonding a pair of flexible substrates in a portion where one pattern is formed in one flexible substrate and the bonding generated in the portion where another pattern is formed The difference from strain can be reduced. For this reason, it can suppress that the dimension of each pattern differs before and after bonding, and can improve the dimensional accuracy of each pattern formed in the said one flexible substrate easily. In this case, each pattern can be easily and accurately aligned with the counter substrate on which another pattern to be bonded in a later step is formed, and the highly accurate pattern can be mass-produced.

  In the flexible substrate laminate described above, the pattern may be formed on a surface of the one flexible substrate on the adhesive layer side.

  Moreover, the flexible substrate laminated body mentioned above WHEREIN: You may make it the said pattern be formed in the surface on the opposite side to the said adhesion layer of said one flexible substrate.

  In the above-described flexible substrate laminate, a barrier layer may be provided on the other flexible substrate of the pair of flexible substrates.

  Moreover, in the flexible substrate laminate described above, an antireflection layer may be provided on the other flexible substrate of the pair of flexible substrates.

  In the flexible substrate laminate described above, a hard coat layer may be provided on the other flexible substrate of the pair of flexible substrates.

  In the flexible substrate laminate described above, the pattern may include a pixel pattern for a color filter.

  According to the present invention, it is possible to easily improve the dimensional accuracy of a pattern formed on one flexible substrate of a pair of flexible substrates, and an opposing substrate on which another pattern to be joined in a later step is formed. The pattern can be aligned easily and accurately.

FIG. 1 is a diagram showing a configuration of a flexible substrate laminate in the first embodiment of the present invention. FIG. 2 is a plan view showing a first flexible substrate in the first embodiment of the present invention. Drawing 3 is a figure showing the outline of the pasting device in a 1st embodiment of the present invention. FIG. 4A is a diagram showing a state before a pair of flexible substrates are bonded together in the first embodiment of the present invention. FIG. 4B is a diagram showing a state in which a pair of flexible substrates are bonded together. FIG. 4C shows a state where the counter substrate is bonded. Fig.5 (a) is a figure which shows the state before a pair of flexible substrate is bonded together in the modification of the 1st Embodiment of this invention. FIG.5 (b) is a figure which shows the state in which a pair of flexible substrate was bonded together. FIG.5 (c) is a figure which shows the state with which the opposing board | substrate was joined. Fig.6 (a) is a figure which shows the structure of the flexible substrate laminated body which has a barrier layer in the modification of the 1st Embodiment of this invention. FIG. 6B is a diagram showing a configuration of a flexible substrate laminate having an AG layer. FIG.6 (c) is a figure which shows the structure of the flexible substrate laminated body which has AR layer. FIG.6 (d) is a figure which shows the structure of the flexible substrate laminated body which has a hard-coat layer. FIG. 7A is a diagram showing a configuration of a flexible substrate laminate having a barrier layer and a hard coat layer in a modification of the first embodiment of the present invention. FIG.7 (b) is a figure which shows the structure of the flexible substrate laminated body which has a barrier layer and AG layer. FIG.7 (c) is a figure which shows the structure of the flexible substrate laminated body which has a barrier layer and AR layer. FIG. 8 is a diagram showing a configuration of a flexible printed circuit board laminate in the second embodiment of the present invention. FIG. 9A is a diagram showing a state before a pair of flexible substrates are bonded together in the second embodiment of the present invention. FIG. 9B is a diagram showing a state in which a pair of flexible substrates are bonded together. FIG. 9C shows a state in which the counter substrate is bonded. FIG. 10A is a diagram showing a state before a pair of flexible substrates are bonded together in a modification of the second embodiment of the present invention. FIG. 10B is a diagram showing a state in which a pair of flexible substrates are bonded together. FIG. 10C shows a state where the counter substrate is bonded.

DESCRIPTION OF EXEMPLARY EMBODIMENTS First Embodiment Hereinafter, an embodiment of the invention will be described with reference to the drawings. Here, FIG. 1 thru | or FIG. 7 is a figure for demonstrating the flexible substrate laminated body in the 1st Embodiment of this invention.

  First, the flexible substrate laminate 10 according to the present embodiment will be described with reference to FIG. A flexible substrate laminate 10 shown in FIG. 1 is interposed between a pair of strip-shaped flexible substrates (first flexible substrate 11 and second flexible substrate 12), and the first flexible substrate 11 and the second flexible substrate 12, And an adhesive layer 13 obtained by bonding the first flexible substrate 11 and the second flexible substrate 12 together.

  As shown in FIGS. 1 and 2, a plurality of color filter patterns 14 are formed on the first flexible substrate 11. Each pattern 14 includes a rectangular pixel pattern 15 for a color filter including a red pixel 15a, a green pixel 15b, and a blue pixel 15c (a black matrix (not shown) if necessary), and four corners of the pixel pattern 15. And cross-shaped marks 16 formed at corresponding positions. Such a pattern 14 is formed on the surface of the first flexible substrate 11 on the adhesive layer 13 side, and the adhesive layer 13 is adhered to the second flexible substrate 12 and the pattern 14.

  In the portion where each pattern 14 is formed in the first flexible substrate 11, the strain generated by bonding the pair of flexible substrates 11 and 12 is within ± 0.01%, preferably ± 0.005%. It is within. That is, the amount of deformation before and after the bonding of the dimension of the portion of the first flexible substrate 11 is ± 0.01% with respect to the dimension of the portion before bonding (for example, the deviation from the reference dimension of 100 mm is ± 10 μm) or less, preferably within ± 0.005% (for example, the deviation from the reference dimension of 100 mm is within ± 5 μm). In this case, the difference between the dimension of the pattern 14 before bonding the first flexible substrate 11 and the second flexible substrate 12 and the dimension of the pattern 14 after bonding the first flexible substrate 11 and the second flexible substrate 12 is as follows. , Within ± 0.01%, preferably within ± 0.005%. Thereby, the dimensional accuracy of each pattern 14 can be improved, and the accuracy of the display image as a color filter can be improved. Specifically, when the flexible substrate laminate 10 having the pixel pattern 15 for the color filter and the TFT array are bonded together, driving the liquid crystal element may be inconvenient if the dimensional deviation is within ± 10 μm. Can be prevented, the transmittance and color of the pixels can be maintained within a predetermined range, and the image display can be improved.

  Further, in the portion where the first pattern 14 is formed in the first flexible substrate 11, the distortion caused by bonding the pair of flexible substrates 11 and 12 and the portion where the other pattern 14 is formed The difference from the strain generated by the bonding is within ± 0.01%, preferably within ± 0.005%. In this case, the difference between the dimension of one pattern 14 and the dimension of the other pattern 14 is within ± 0.01%, preferably within ± 0.005%. Thereby, the dimensional accuracy of each pattern 14 can be improved, and a plurality of patterns 14 can be mass-produced with high accuracy.

  Next, materials for the flexible substrates 11 and 12 will be described. The flexible substrates 11 and 12 in the present embodiment are not particularly limited as long as they are not extremely high in plasticity even when a tensile force is applied, and are appropriately selected and used according to the display application. Can do. Examples of such flexible substrates include polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyethersulfone (PES), polyimide (PI), polyetheretherketone (PEEK), polycarbonate (PC), and polyethylene. (PE), polypropylene (PP), polyphenylene sulfide (PPS), polyetherimide (PEI), cellulose triacetate (CTA), cyclic polyolefin (COP), polymethyl methacrylate (PMMA), polysulfone (PSF), polyamideimide (PAI) ), Synthetic resins such as nobornene resins and allyl ester resins. Of these, PEN and PET are preferably used.

  The thickness of the flexible substrates 11 and 12 is preferably in the range of 10 μm to 500 μm, and preferably in the range of 20 μm to 300 μm. This is because if the thickness of the flexible substrates 11 and 12 is too thick than the above range, the flexibility is lost, the flexible substrates 11 and 12 are easily broken, and it is difficult to wind them in a roll shape. On the other hand, when it is thinner than the above range, there is no strain and handling in each step becomes difficult.

  Although it does not specifically limit as the width | variety of the flexible substrates 11 and 12, For example, it is preferable to exist in the range of 50 mm-2000 mm, Preferably it exists in the range of 100 mm-1500 mm.

  In addition, the flexible substrates 11 and 12 may have a configuration composed of a single layer, or may have a configuration in which a plurality of layers are stacked.

  The material of the adhesive layer 13 is not particularly limited as long as it is a flexible material, and is preferably made of a resin material such as acrylic or styrene. Moreover, as thickness of the adhesion layer 13, what is necessary is just a thickness of the grade which does not lose a softness | flexibility.

  Next, the bonding apparatus 20 which bonds the 1st flexible substrate 11 and the 2nd flexible substrate 12 is demonstrated using FIG. The bonding apparatus 20 shown in FIG. 3 includes a first feeding roll 21 that feeds out the first flexible substrate 11 on which the pattern 14 is formed, and a second feeding roll 22 that feeds out the second flexible substrate 12 on which the adhesive layer 13 is provided. have.

  Laminate for laminating the first flexible substrate 11 fed from the first feeding roll 21 and the second flexible substrate 12 fed from the second feeding roll 22 on the downstream side of the first feeding roll 21 and the second feeding roll 22. A portion 23 is provided. In this laminate part 23, the first flexible substrate 11 and the second flexible substrate 12 are bonded together via the adhesive layer 13, and the flexible substrate laminate 10 is produced. The laminating section 23 is composed of a pair of pressing rollers 23a. By adjusting the pressure between the pair of pressing rollers 23a, the laminating pressure when laminating the first flexible substrate 11 and the second flexible substrate 12 is adjusted. It can be adjusted.

  A take-up roll 24 that winds the flexible substrate laminate 10 into a roll is provided on the downstream side of the laminating unit 23. The take-up roll 24 has a function as a drive unit that conveys the flexible substrate laminate 10.

  Moreover, in the bonding apparatus 20 shown in FIG. 3, it is conveyed by applying a torque to the opposite side to a conveyance direction to the 1st delivery roll 21 and the 2nd delivery roll 22, and adjusting this torque. The tension applied to the first flexible substrate 11 and the second flexible substrate 12 can be adjusted.

  Next, the effect | action of this Embodiment which consists of such a structure, ie, the bonding method (manufacturing method of a flexible substrate laminated body) of a pair of flexible substrate by this Embodiment, is demonstrated.

  First, a plurality of patterns 14 (see FIGS. 1 and 2) having pixel patterns 15 and marks 16 are formed on the first flexible substrate 11.

  Then, the 1st flexible substrate 11 is wound in roll shape so that the pattern 14 may be arrange | positioned on the radial direction outer side, and is attached to the 1st delivery roll 21 (refer FIG. 3).

  On the other hand, the adhesive layer 13 is provided on the second flexible substrate 12, and the second flexible substrate 12 is wound in a roll shape so that the adhesive layer 13 is disposed on the outer side in the radial direction, and attached to the second feeding roll 22. .

  Next, the winding roll 24 is driven, the first flexible substrate 11 and the second flexible substrate 12 are bonded together (see FIG. 4A), and the flexible substrate laminate 10 is manufactured (FIG. 4B). reference).

  In this case, first, the first flexible substrate 11 is fed out from the first feeding roll 21 and the second flexible substrate 12 is fed out from the second feeding roll 22. Subsequently, the first flexible substrate 11 and the second flexible substrate 12 that have been fed out are bonded to each other via the adhesive layer 13 in the laminate portion 23. In the laminating part 23, the first flexible substrate 11 is formed such that the pattern 14 formed on the first flexible substrate 11 and the adhesive layer 13 provided on the second flexible substrate 12 face each other (see FIG. 4A). 11 and the second flexible substrate 12 are bonded together.

While the first flexible substrate 11 and the second flexible substrate 12 are being transported, the tension per unit sectional area loaded on the first flexible substrate 11 and the tension per unit sectional area loaded on the second flexible substrate 12 Are preferably small and comparable. For example, the tension per unit cross-sectional area is preferably 0.026 N / mm ² or more and 4000 N / mm ² or less. Accordingly, it is possible to prevent the first flexible substrate 11 and the second flexible substrate 12 from being wrinkled during bonding, and to suppress the deformation of the first flexible substrate 11 and the deformation of the second flexible substrate 12. Here, the tension (stress) per unit cross-sectional area loaded on the first flexible substrate 11 is the same as the tension loaded on the first flexible substrate 11 being conveyed. The tension (stress) per unit cross-sectional area applied to the second flexible substrate 12 is calculated by dividing the tension applied to the second flexible substrate 12 being conveyed by the second flexible substrate. It is obtained by dividing by 12 cross-sectional areas (width × thickness).

  Further, the difference in tension per unit cross-sectional area is preferably within ± 0.01% when the pair of flexible substrates 11 and 12 have the same Young's modulus. As a result, the deformation amount of the first flexible substrate 11 and the deformation amount of the second flexible substrate 12 can be made comparable. If the materials of the first flexible substrate 11 and the second flexible substrate 12 are different, the strain due to the tension is calculated from the tension per unit cross-sectional area described above using the Young's modulus of each material, The tension may be set so that the strain due to the tension of the first flexible substrate 11 and the strain due to the tension of the second flexible substrate 12 are approximately the same (for example, the difference in strain due to the tension is within ± 0.01%).

  During this time, the laminating pressure when laminating the first flexible substrate 11 and the second flexible substrate 12 is preferably low, for example, preferably 0 MPa or more and 1 MPa or less. Thus, the first flexible substrate 11 and the second flexible substrate 12 can be securely bonded together, and the deformation of the first flexible substrate 11 and the deformation of the second flexible substrate 12 can be suppressed.

  Thus, a flexible substrate laminate 10 in which the first flexible substrate 11 and the second flexible substrate 12 are bonded together by the adhesive layer 13 as shown in FIG. 1 is obtained. In the flexible substrate laminate 10, the distortion generated by bonding in the portion of the first flexible substrate 11 where each pattern 14 is formed can be at least ± 0.01%, and the first flexible substrate 11, the difference between the distortion caused by bonding in the portion where one pattern 14 is formed and the distortion generated by bonding in the portion where other pattern 14 is formed is at least ± 0.01% or less. can do. Therefore, by adjusting the tension per unit cross-sectional area loaded on each of the first flexible substrate 11 and the second flexible substrate 12 and the laminating pressure between the first flexible substrate 11 and the second flexible substrate 12 The dimensional accuracy of the pattern 14 can be easily improved.

  Thereafter, the flexible substrate laminate 10 is wound around the winding roll 24 and formed into a roll shape.

  As shown in FIG. 4C, the flexible substrate laminate 10 thus obtained is then applied to the counter substrate 30 with a mark on which another pattern (for example, TFT, image display element, etc.) is formed. Be joined.

  Here, a description will be given of a method of confirming the strain generated by bonding the first flexible substrate 11 and the second flexible substrate 12 in the first flexible substrate 11. Such a strain is obtained by measuring the dimension of the pattern 14 of the first flexible substrate 11 before and after the first flexible substrate 11 and the second flexible substrate 12 are bonded together. When the dimension between the marks 16 is used as the dimension of the pattern 14, for example, the dimension A between the marks 16 in the width direction of the first flexible substrate 11 and the dimension B between the marks 16 in the longitudinal direction are measured. Good (see FIG. 2). Note that it is generally preferable to use a length measuring device for measuring the dimensions. In particular, a precise length measuring machine capable of measuring dimensions to the micrometer unit is more preferable. For example, an ultra-precision automatic two-dimensional coordinate measuring machine manufactured by SOKKIA or a CNC image measuring system manufactured by Nikon Instruments Company can be used.

  Using the A dimension and B dimension between the marks 16 of each pattern 14 before bonding and the A dimension and B dimension after bonding, a difference in each dimension is obtained, and each pattern in the first flexible substrate 11 is determined. The distortion which arose by bonding of the part in which 14 was formed can be confirmed.

  The dimension of the pattern 14 is not limited to measuring the A dimension and the B dimension between the marks 16, and the dimension of the pixel pattern 15 may be measured. In this case, the width dimension and the longitudinal dimension of the pixel pattern 15 may be measured. Alternatively, the size of the aggregate of a predetermined number of red pixels 15a, green pixels 15b, and blue pixels 15c that are continuous in the width direction and the predetermined number of red pixels 15a, green pixels 15b, and blue pixels 15c that are continuous in the longitudinal direction. You may measure the dimension of an aggregate.

  Further, after the flexible substrate laminate 10 shown in FIG. 1 is manufactured (that is, after the first flexible substrate 11 and the second flexible substrate 12 are bonded), the pattern 14 on the first flexible substrate 11 is pasted. A method for obtaining the dimensions before alignment will be described.

  In this case, first, the flexible substrate laminate 10 is sufficiently immersed in an organic solvent such as acetone. Subsequently, the second flexible substrate 12 and the adhesive layer 13 are peeled from the first flexible substrate 11 so that a large tension is not applied to the first flexible substrate 11. Thus, the influence on the pattern 14 due to the stress of the second flexible substrate 12 is removed, and the second flexible substrate 12 is peeled from the first flexible substrate 11 while preventing the first flexible substrate 11 from being deformed. Can do.

  As another method for removing the influence of the stress caused by the second flexible substrate 12, only the second flexible substrate 12 is latticed at intervals of 10 mm, for example, without peeling the second flexible substrate 12 from the first flexible substrate 11. It may be half-cut into a shape.

  Next, the first flexible substrate 11 is exposed to an atmosphere having the same temperature and humidity as the atmosphere when the dimension between the marks 16 is measured before the second flexible substrate 12 is peeled off, and the solvent is evaporated from the first flexible substrate 11. And left to equilibrium. Thereby, the temperature and water absorption rate of the peeled first flexible substrate 11 can be made equal to the temperature and water absorption rate of the first flexible substrate 11 before peeling. For this reason, the factor of the dimensional change by the change of the surrounding environment can be removed.

  Thereafter, the A dimension and the B dimension between the marks 16 of each pattern 14 on the first flexible substrate 11 are measured. The A and B dimensions between the marks 16 thus obtained correspond to the A and B dimensions before the second flexible substrate 12 is bonded. Thus, even after the first flexible substrate 11 and the second flexible substrate 12 are bonded together, the A dimension and the B dimension before bonding can be obtained. For this reason, the difference between each dimension before and after the bonding is determined by the A and B dimensions between the marks 16 of the pattern 14 before bonding obtained in this way and the A and B dimensions after bonding. The distortion of the portion where the pattern 14 is formed in the first flexible substrate 11 can be confirmed.

  As described above, according to the present embodiment, in the portion of the first flexible substrate 11 where the one pattern 14 is formed, the distortion caused by bonding the pair of flexible substrates 11 and 12 is at least ± 0. Within .01%. As a result, distortion due to bonding of the portion of the first flexible substrate 11 where the pattern 14 is formed can be reduced, and the dimension of the pattern 14 before bonding and the dimension of the pattern 14 after bonding can be reduced. The difference can be reduced. For this reason, it can suppress that the dimension of the pattern 14 changes before and after bonding, and can improve the dimensional accuracy of the pattern 14 formed in the 1st flexible substrate 11 easily. In this case, the pattern 14 can be easily and accurately aligned with the counter substrate 30 with a mark on which another pattern 14 to be bonded in a later step is formed.

  Moreover, according to this Embodiment, in the part in which the one pattern 14 was formed among the 1st flexible substrates 11, the distortion produced by bonding a pair of flexible substrates 11 and 12, and the other pattern 14 In the portion where is formed, the difference from the strain caused by this bonding can be reduced. For this reason, it can suppress that the dimension of each pattern 14 differs before and after bonding, and can improve the dimensional accuracy of each pattern 14 formed in the 1st flexible substrate 11 easily. In this case, each pattern 14 can be easily and accurately aligned with the counter substrate 30 on which another pattern to be bonded in a later step is formed, and the pattern 14 with high accuracy can be mass-produced. it can.

  In the present embodiment, the example in which the adhesive layer 13 is provided on the second flexible substrate 12 before bonding has been described. However, the present invention is not limited to this, and the adhesive layer 13 may be provided on the pattern 14 formed on the first flexible substrate 11 without being provided on the second flexible substrate 12 before bonding.

  In this case, the 1st delivery roll 21 (refer FIG. 3) by which the 1st flexible substrate 11 was wound by roll shape so that the adhesion layer 13 may be arrange | positioned on the radial direction outer side is prepared. Moreover, the 2nd supply roll 22 with which the 2nd flexible substrate 12 was wound in roll shape is prepared. Except for this, the first flexible substrate 11 and the second flexible substrate 12 are bonded together via the adhesive layer 13 in the same manner as in the above-described embodiment (see FIG. 5A) and shown in FIG. The flexible substrate laminate 10 can be manufactured (see FIG. 5B). Thereafter, the flexible substrate laminate 10 is bonded to the counter substrate 30 with a mark on which another pattern (for example, TFT, image display element, etc.) is formed (see FIG. 5C). Thus, when the adhesive layer 13 is provided in the pattern 14 before bonding, for example, as described later, when a functional layer having a three-dimensional shape is laminated on the second flexible substrate 12 before bonding, Or even when a delicate barrier layer 40 (see FIGS. 6 and 7), antireflection layers 41 and 42, or a lens sheet (not shown) is laminated, the performance of these functional layers is maintained well. can do.

  Moreover, in this Embodiment, the example in which only the adhesion layer 13 was provided in the 2nd flexible substrate 12 was demonstrated. However, the present invention is not limited to this, and as shown in FIG. 6, various functional layers may be provided on the surface of the second flexible substrate 12 opposite to the adhesive layer 13.

  As such a flexible substrate laminate 10, for example, as shown in FIG. 6A, a barrier layer that suppresses permeation of oxygen to the surface of the second flexible substrate 12 opposite to the adhesive layer 13. 40 may be provided. In this case, the second flexible substrate 12 in which the adhesive layer 13 and the barrier layer 40 are provided in advance is bonded to the first flexible substrate 11 to produce the flexible substrate laminate 10 shown in FIG. Alternatively, after the second flexible substrate 12 provided with only the adhesive layer 13 is bonded to the first flexible substrate 11, a barrier is formed on the surface of the second flexible substrate 12 opposite to the adhesive layer 13. The layer 40 may be formed to produce the flexible substrate laminate 10 shown in FIG. Thereby, even if it is the flexible substrate laminated body 10 which has the barrier layer 40, the dimensional accuracy of the pattern 14 can be improved easily.

  Further, for example, as shown in FIGS. 6B and 6C, an antireflection layer (AG (antiglare) layer) that suppresses flickering of the screen on the surface of the second flexible substrate 12 opposite to the adhesive layer 13. 41 or an AR (anti-reflection) layer 42) may be provided. In this case, the second flexible substrate 12 in which the adhesive layer 13 and the antireflection layers 41 and 42 are provided in advance is bonded to the first flexible substrate 11, and the flexible substrate laminate shown in FIGS. The body 10 may be manufactured, or the second flexible substrate 12 provided with only the adhesive layer 13 is bonded to the first flexible substrate 11 and then the adhesive layer 13 of the second flexible substrate 12 is used. Antireflection layers 41 and 42 may be formed on the opposite surface to produce the flexible substrate laminate 10 shown in FIGS. 6B and 6C. Thereby, even if it is the flexible substrate laminated body 10 which has the antireflection layers 41 and 42, the dimensional accuracy of the pattern 14 can be improved easily.

  Furthermore, for example, as shown in FIG. 6D, even if a hard coat layer 43 for preventing the display from being scratched is provided on the surface of the second flexible substrate 12 opposite to the adhesive layer 13. good. In this case, the second flexible substrate 12 in which the adhesive layer 13 and the hard coat layer 43 are provided in advance is bonded to the first flexible substrate 11 so that the flexible substrate laminate 10 shown in FIG. Alternatively, after the second flexible substrate 12 provided with only the adhesive layer 13 is bonded to the first flexible substrate 11, the second flexible substrate 12 on the surface opposite to the adhesive layer 13, The hard coat layer 43 may be formed to produce the flexible substrate laminate 10 shown in FIG. Thereby, even if it is the flexible substrate laminated body 10 which has the hard-coat layer 43, the dimensional accuracy of the pattern 14 can be improved easily.

  Moreover, the flexible substrate laminated body 10 may have two functional layers as shown in FIG.

  As such a flexible substrate laminate 10, for example, as shown in FIG. 7A, a barrier layer 40, a second adhesive layer 45, a third flexible substrate 46, and a hard coat layer are provided on the second flexible substrate 12. 43 may be sequentially laminated. In this case, the order of bonding of the first flexible substrate 11 and the second flexible substrate 12 and the bonding of the second flexible substrate 12 and the third flexible substrate 46 is not limited, and is shown in FIG. As with the flexible substrate laminate 10, the barrier layer 40 and the hard coat layer 43 can be formed on the second flexible substrate 12 and the third flexible substrate 46, respectively, at any timing. In this way, the flexible substrate laminate 10 shown in FIG. 7A can be produced. Thereby, even if it is the flexible substrate laminated body 10 which has the barrier layer 40 and the hard-coat layer 43, the dimensional accuracy of the pattern 14 can be improved easily.

  Further, for example, as shown in FIGS. 7B and 7C, the second flexible substrate 12 is provided with a barrier layer 40, a second adhesive layer 45, a third flexible substrate 46, an antireflection layer (AG layer 41 or The AR layer 42) may be sequentially stacked. In this case, the order of bonding of the first flexible substrate 11 and the second flexible substrate 12 and the bonding of the second flexible substrate 12 and the third flexible substrate 46 is not limited, and is shown in FIG. Similar to the flexible substrate laminate 10, the barrier layer 40 and the antireflection layers 41 and 42 can be formed on the second flexible substrate 12 and the third flexible substrate 46, respectively, at an arbitrary timing. In this way, the flexible substrate laminate 10 shown in FIGS. 7B and 7C can be manufactured. Thereby, even if it is the flexible substrate laminated body 10 which has the barrier layer 40 and the antireflection layers 41 and 42, the dimensional accuracy of the pattern 14 can be improved easily.

  6 and FIG. 7, the example in which various functional layers are stacked above the second flexible substrate in FIG. 6 and FIG. 7 has been described. May be laminated below the first flexible substrate 11. Moreover, in the example in which the various functional layers described above are provided, the example in which the pattern 14 and the adhesive layer 13 are configured to face each other has been described, but the present invention is not limited to this, and the pattern 14 is In the case where the flexible substrate 11 is formed on the surface opposite to the adhesive layer 13 (see FIG. 8 described later), various functional layers as described above can be provided in the same manner.

Second Embodiment Next, a flexible substrate laminate in a second embodiment of the present invention will be described with reference to FIGS.

  The second embodiment shown in FIGS. 8 and 9 is mainly different in that the pattern is formed on the surface opposite to the adhesive layer of the first flexible substrate. Through substantially the same as the first embodiment shown in FIG. 8 and FIG. 9, the same parts as those of the first embodiment shown in FIG. 1 to FIG.

  In the flexible substrate laminate 50 shown in FIG. 8, the pattern 14 is formed on the surface of the first flexible substrate 11 opposite to the adhesive layer 13. That is, the adhesive layer 13 is directly adhered to the first flexible substrate 11 and the second flexible substrate 12.

  When producing such a flexible substrate laminated body 50, the 1st flexible substrate 11 prepares the 1st feeding roll 21 (refer FIG. 3) wound by roll shape so that the pattern 14 may be arrange | positioned inside radial direction. To do. Except for this, the first flexible substrate 11 and the second flexible substrate 12 are bonded together via the adhesive layer 13 in the same manner as in the first embodiment (see FIG. 9A). The flexible substrate laminate 50 shown is produced (see FIG. 9B).

  As shown in FIG. 9C, the manufactured flexible substrate laminate 50 is then bonded to the marked counter substrate 30 on which another pattern (for example, TFT, image display element, etc.) is formed.

  As described above, according to the present embodiment, in the portion of the first flexible substrate 11 where the one pattern 14 is formed, the distortion caused by bonding the pair of flexible substrates 11 and 12 is at least ± 0. Within .01%. As a result, distortion due to bonding of the portion of the first flexible substrate 11 where the pattern 14 is formed can be reduced, and the dimension of the pattern 14 before bonding and the dimension of the pattern 14 after bonding can be reduced. The difference can be reduced. For this reason, it can suppress that the dimension of the pattern 14 changes before and after bonding, and can improve the dimensional accuracy of the pattern 14 formed in the 1st flexible substrate 11 easily. In this case, the pattern 14 can be easily and accurately aligned with the counter substrate 30 with a mark on which another pattern 14 to be bonded in a later step is formed.

  Moreover, according to this Embodiment, in the part in which the one pattern 14 was formed among the 1st flexible substrates 11, the distortion produced by bonding a pair of flexible substrates 11 and 12, and the other pattern 14 In the portion where is formed, the difference from the strain caused by this bonding can be reduced. For this reason, it can suppress that the dimension of each pattern 14 differs before and after bonding, and can improve the dimensional accuracy of each pattern 14 formed in the 1st flexible substrate 11 easily. In this case, each pattern 14 can be easily and accurately aligned with the counter substrate 30 on which another pattern to be bonded in a later step is formed, and the pattern 14 with high accuracy can be mass-produced. it can.

  Further, according to the present embodiment, since the color filter pixel pattern 15 is arranged on the outermost surface of the flexible substrate laminate 10, when assembling the LCD panel, the pixel pattern 15 can be brought close to the liquid crystal layer. And the problem of parallax can be avoided.

  In the present embodiment, the example in which the adhesive layer 13 is provided on the second flexible substrate 12 before bonding has been described. However, the present invention is not limited to this, and the adhesive layer 13 may be provided on the surface opposite to the pattern 14 of the first flexible substrate 11 without being provided on the second flexible substrate 12 before bonding. .

  In this case, the 1st delivery roll 21 (refer FIG. 3) by which the 1st flexible substrate 11 was wound by roll shape so that the adhesion layer 13 may be arrange | positioned on the radial direction outer side is prepared. Moreover, the 2nd supply roll 22 with which the 2nd flexible substrate 12 was wound in roll shape is prepared. Except for this, as in the first embodiment, the first flexible substrate 11 and the second flexible substrate 12 are bonded together via the adhesive layer 13 (see FIG. 10A), and FIG. The flexible substrate laminate 50 shown can be manufactured (see FIG. 10B). Thereafter, the flexible substrate laminate 50 is bonded to the marked counter substrate 30 on which another pattern (for example, TFT, image display element, etc.) is formed (see FIG. 10C). Thus, by providing the adhesive layer 13 on the first flexible substrate 11 before bonding, for example, when a functional layer having a three-dimensional shape is laminated on the second flexible substrate 12 before bonding, or delicately Even when the barrier layer 40 (see FIGS. 6 and 7), the antireflection layers 41 and 42, or the lens sheet (not shown) is laminated, the performance of these functional layers should be maintained satisfactorily. Can do.

  As mentioned above, although embodiment by this invention has been described, naturally, within the scope of the gist of this invention, these embodiment can also be combined suitably partially. Further, in the present embodiment, various modifications other than the above-described modifications are possible within the scope of the present invention.

  In the flexible substrate laminate 30 of the present invention, the dimension of the pattern 14 before and after bonding was measured.

  First, a 300 mm width × 0.125 mm thickness, 10 m length PET film (manufactured by Toyobo Co., Ltd., Cosmo Shine A4100) is prepared as the first flexible substrate 11, and the second adhesive layer 13 is provided. As the flexible substrate 12, an adhesive film with a base material of 270 mm width × 0.050 mm thickness and 10 m length (Fuji Clear 50, manufactured by Lintec Corporation) was prepared. The base material (second flexible substrate 12) is made of PET.

  A plurality of pixel patterns 15 were formed on the PET film, and dimension measurement marks 16 were formed at positions corresponding to the four corners of each pixel pattern 15 (see FIG. 2). The distance between the marks 16 was 212 mm. Here, before bonding a PET film and an adhesive film, the dimension between the marks 16 formed on the PET film was measured by the method described above.

  As the bonding apparatus 20, a bonding apparatus (product name: LM-203-SB) manufactured by DNK Co., Ltd. was used.

When the PET film and the adhesive film were bonded together, the conveyance speed was 0.6 m / min, and the laminating pressure (effective pressure) applied to the PET film and the adhesive film was set to 0.28 MPA. Further, in order to reduce the deformation amount in each film and make it the same level, the tension applied to each film is adjusted, the tension per unit cross-sectional area applied to the PET film is 1.33 N / mm ² , and the adhesive film The tension per unit cross-sectional area of the base material was 1.48 N / mm ² .

  Under such conditions, a PET film and an adhesive film were bonded together to produce a flexible substrate laminate 10.

  Then, the dimension between the marks 16 measured before bonding was measured by the method described above.

  It was confirmed that the dimensional difference between the marks 16 before and after bonding thus obtained was within ± 0.003% (for example, the deviation from the reference dimension of 100 mm was within ± 3 μm). That is, it was confirmed that the strain generated by bonding the PET film and the adhesive film in the portion of the PET film where the pattern 14 was formed was within ± 0.003%. Further, it was confirmed that the difference in dimension between the patterns 14 was within ± 0.003%. That is, in the portion where one pattern 14 is formed in the PET film, the strain caused by bonding the PET film and the adhesive film, and in the portion where the other pattern 14 is formed, this bonding causes It was confirmed that the difference from the strain was within ± 0.003%.

  Furthermore, when each pattern 14 of the obtained flexible substrate laminate 10 was superimposed on another counter substrate 30 with marks, the marks could be easily and accurately aligned.

DESCRIPTION OF SYMBOLS 10 Flexible substrate laminated body 11 1st flexible substrate 12 2nd flexible substrate 13 Adhesive layer 14 Pattern 15 Pixel pattern 15a Red pixel 15b Green pixel 15c Blue pixel 16 Mark 20 Pasting apparatus 21 1st delivery roll 22 2nd delivery roll 23 Laminating Part 23a Pressure roller 24 Winding roll 30 Counter substrate 40 Barrier layer 41 AG layer 42 AR layer 43 Hard coat layer 45 Second adhesive layer 46 Third flexible substrate 50 Flexible substrate laminate

Claims (8)

A pair of flexible substrates;
An adhesive layer interposed between the pair of flexible substrates,
A pattern is partially formed on one surface of one of the pair of flexible substrates,
The difference between the strain calculated from the tension applied to the one flexible substrate and its Young's modulus and the strain calculated from the tension applied to the other flexible substrate and its Young's modulus is ± 0.01. %, The pair of flexible substrates are bonded to each other,
The flexible substrate laminate, wherein a strain generated by bonding the pair of flexible substrates in a portion where the pattern is formed in the one flexible substrate is within ± 0.01%. A plurality of the patterns are formed partially on the one surface of the one flexible substrate,
Strain generated by bonding the pair of flexible substrates in the portion where the one of the flexible substrates is formed, and the bonding in the portion where the other pattern is formed The flexible substrate laminate according to claim 1, wherein the difference from the strain is within ± 0.01%.   The flexible substrate laminate according to claim 1, wherein the pattern is formed on a surface of the one flexible substrate on the adhesive layer side.   The flexible substrate laminate according to claim 1, wherein the pattern is formed on a surface of the one flexible substrate opposite to the adhesive layer.   The flexible substrate laminate according to claim 1, wherein a barrier layer is provided on the other flexible substrate of the pair of flexible substrates.   The flexible substrate laminate according to any one of claims 1 to 4, wherein an antireflection layer is provided on the other flexible substrate of the pair of flexible substrates.   The flexible substrate laminate according to claim 1, wherein a hard coat layer is provided on the other flexible substrate of the pair of flexible substrates.   The flexible substrate laminate according to claim 1, wherein the pattern includes a pixel pattern for a color filter.

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