JP5676017B2 - オン抵抗が低減された半導体装置 - Google Patents
オン抵抗が低減された半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 26
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 12
- 229920005591 polysilicon Polymers 0.000 claims description 12
- 238000001465 metallisation Methods 0.000 claims description 11
- 238000009826 distribution Methods 0.000 claims description 10
- 230000005684 electric field Effects 0.000 claims description 7
- 229910021332 silicide Inorganic materials 0.000 claims description 5
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 17
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010703 silicon Substances 0.000 description 17
- 230000000903 blocking effect Effects 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 210000000746 body region Anatomy 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910005883 NiSi Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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- H01L29/7395—Vertical transistors, e.g. vertical IGBT
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- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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Description
電力用MOS電界効果トランジスタはかなり以前から、電力用エレクトロニクスにおける用途のための高速スイッチとして用いられている。プレーナ型の二重拡散構造(DMOS)のほかに、トレンチ構造を備えた電力用MOSFET(トレンチMOS)が使用されることも多くなってきている。
これに対し請求項1記載の特徴を備えた半導体装置の有する利点とは、簡単に実現可能であり、オン抵抗の低減とともに電圧範囲の拡張も可能となり、特別な手法で多数キャリア素子にも適することである。本発明による半導体装置は複数のフローティングショットキーコンタクトを有しており、これは半導体装置のエピ領域のところに設けられている。ここでフローティングショットキーコンタクトとは、ショットキー金属が他のコンタクトと直流電気的な接続を有していないショットキーコンタクトのことである。
Claims (10)
- 高濃度でドーピングされた第1の導電型(n+)の基板(1)上に設けられた第1の導電型(n)のエピ層(2)と、該エピ層(2)中に設けられた第2の導電型(p)の第1の層(6)と、該第2の導電型(p)の前記第1の層(6)の表面に設けられ高濃度でドーピングされた第2の導電型(p+)の第2の層(7)とを有する、
半導体装置において、
前記第2の導電型(p)の前記第1の層(6)と、前記高濃度でドーピングされた第1の導電型(n+)の基板(1)との間に、トレンチ(3)内に形成され前記高濃度でドーピングされた基板(1)の方向で互いに平行に配置されたフローティング状態の複数のショットキーメタル層(12)が設けられており、該ショットキーメタル層(12)はそれぞれ両側で、前記第1の導電型(n)のエピ層(2)とショットキーコンタクト(70)を形成していることを特徴とする、
半導体装置。 - 前記第2の導電型(p)の前記第1の層(6)の表面に、高濃度でドーピングされた第1の導電型(n+)の第3の層(8)と、高濃度でドーピングされた第2の導電型(p+)の前記第2の層(7)とがさらに設けられており、
前記エピ層(2)中に、少なくとも2つの前記トレンチ(3)が設けられており、該トレンチ(3)内にそれぞれ、誘電層(4,4a)により覆われ、ドーピングされたポリシリコン(5)により充填された領域が設けられており、該領域は、一番上の前記ショットキーメタル層(12)上面から前記第1の層(6)表面まで延在しており、
該領域底部における前記誘電層(4a)は、該領域側壁における誘電層(4)よりも厚く形成されており、
前記第2の導電型(p)の前記第1の層(6)と、高濃度でドーピングされた前記第1の導電型(n+)の基板(1)との間に、金属層もしくはシリサイド層(12)と別の誘電層(14)とが交互に続く積層体がそれぞれ設けられており、
前記金属層もしくはシリサイド層(12)は前記第1の導電型(n)の前記エピ層(2)と、それぞれ非オーミックなショットキーコンタクトを形成している(図2)、
請求項1記載の半導体装置。 - 前記高濃度でドーピングされた第1の導電型(n + )の基板(1)の最も近くの側に位置するショットキーメタル層(12)は、トレンチ底部をそれぞれ覆っており、該高濃度でドーピングされた第1の導電型(n+)の基板(1)に対し間隔D_epiを有している、請求項2記載の半導体装置。
- フローティング状態にある前記ショットキーメタル層(12)はそれぞれ幅D_skを有しており、該ショットキーメタル層(12)の間に設けられている前記誘電層(14)はそれぞれ幅D_gapを有している、請求項2または3記載の半導体装置。
- 半導体装置において隣り合うトレンチ(3)の間にそれぞれメサ領域が設けられており、該メサ領域において電界分布が間隔Dで周期的に繰り返され、ここで式
D=D_sk+D_gap
が成り立ち、
ただし、D_skはフローティング状態にあるショットキーメタル層(12)の幅であり、D_gapは別の誘電層(14)の幅である、
請求項2から4のいずれか1項に記載の半導体装置。 - メサ領域の電圧分布はそれぞれ線形である、請求項5記載の半導体装置。
- 前記エピ層(2)に、誘電層(14a)により充填された少なくとも2つのトレンチ(3)が設けられており、
該誘電層(14a)と前記高濃度でドーピングされた第1の導電型(n+)の基板(1)との間隔は、前記第2の導電型(p)の前記第1の層(6)と前記高濃度でドーピングされた第1の導電型(n+)の基板(1)との間隔よりも小さく、
前記高濃度でドーピングされた第1の導電型(n+)の基板(1)の側に位置する、前記誘電層(14a)の端部と、前記高濃度でドーピングされた第1の導電型(n+)の基板(1)との間に、金属層もしくはシリサイド層(12)と別の誘電層(14)とが交互に続く積層体がそれぞれ設けられており、
該金属層もしくはシリサイド層(12)は前記第1の導電型(n)のエピ層と、それぞれ非オーミックなショットキーコンタクトを形成している(図7)、
請求項1記載の半導体装置。 - 前記互いに平行に配置されたショットキーメタル層(12)は、DMOSトランジスタのボディダイオードの下方またはIGBTのボディダイオードの下方に設けられている、請求項1から7のいずれか1項に記載の半導体装置。
- はんだ付け可能な前面金属化部(9)とはんだ付け可能な背面金属化部(11)が設けられている、請求項1から8のいずれか1項に記載の半導体装置。
- 自動車ジェネレータの整流器に備えられた、請求項1から9のいずれか1項に記載の半導体装置。
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DE102011003456A DE102011003456A1 (de) | 2011-02-01 | 2011-02-01 | Halbleiteranordnung mit reduziertem Einschaltwiderstand |
DE102011003456.0 | 2011-02-01 | ||
PCT/EP2011/071590 WO2012103968A1 (de) | 2011-02-01 | 2011-12-02 | Halbleiteranordnung mit reduziertem einschaltwiderstand |
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JP2014508406A JP2014508406A (ja) | 2014-04-03 |
JP5676017B2 true JP5676017B2 (ja) | 2015-02-25 |
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US (1) | US9306044B2 (ja) |
EP (1) | EP2671253B1 (ja) |
JP (1) | JP5676017B2 (ja) |
CN (1) | CN103339730B (ja) |
DE (1) | DE102011003456A1 (ja) |
WO (1) | WO2012103968A1 (ja) |
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JP7059555B2 (ja) * | 2017-10-05 | 2022-04-26 | 富士電機株式会社 | 半導体装置 |
EP3881360B1 (en) * | 2019-11-08 | 2022-05-04 | Hitachi Energy Switzerland AG | Insulated gate bipolar transistor |
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US9021A (en) * | 1852-06-15 | Preparing cotton yarn for the manufacture of duck and other coarse | ||
US5016A (en) * | 1847-03-13 | Improvement in clevises for plows | ||
NL191683C (nl) * | 1977-02-21 | 1996-02-05 | Zaidan Hojin Handotai Kenkyu | Halfgeleidergeheugenschakeling. |
JP3392665B2 (ja) * | 1995-11-06 | 2003-03-31 | 株式会社東芝 | 半導体装置 |
US6037632A (en) | 1995-11-06 | 2000-03-14 | Kabushiki Kaisha Toshiba | Semiconductor device |
US6621121B2 (en) | 1998-10-26 | 2003-09-16 | Silicon Semiconductor Corporation | Vertical MOSFETs having trench-based gate electrodes within deeper trench-based source electrodes |
DE19958694A1 (de) * | 1999-12-06 | 2001-06-13 | Infineon Technologies Ag | Steuerbares Halbleiterschaltelement |
JP2002100772A (ja) * | 2000-07-17 | 2002-04-05 | Toshiba Corp | 電力用半導体装置及びその製造方法 |
US7126169B2 (en) * | 2000-10-23 | 2006-10-24 | Matsushita Electric Industrial Co., Ltd. | Semiconductor element |
US7345342B2 (en) * | 2001-01-30 | 2008-03-18 | Fairchild Semiconductor Corporation | Power semiconductor devices and methods of manufacture |
US6998678B2 (en) * | 2001-05-17 | 2006-02-14 | Infineon Technologies Ag | Semiconductor arrangement with a MOS-transistor and a parallel Schottky-diode |
JP4865166B2 (ja) * | 2001-08-30 | 2012-02-01 | 新電元工業株式会社 | トランジスタの製造方法、ダイオードの製造方法 |
US7638841B2 (en) * | 2003-05-20 | 2009-12-29 | Fairchild Semiconductor Corporation | Power semiconductor devices and methods of manufacture |
JP4903055B2 (ja) * | 2003-12-30 | 2012-03-21 | フェアチャイルド・セミコンダクター・コーポレーション | パワー半導体デバイスおよびその製造方法 |
US7714365B2 (en) * | 2008-02-21 | 2010-05-11 | Infineon Technologies Austria Ag | Semiconductor component with Schottky zones in a drift zone |
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- 2011-02-01 DE DE102011003456A patent/DE102011003456A1/de not_active Withdrawn
- 2011-12-02 EP EP11804970.9A patent/EP2671253B1/de active Active
- 2011-12-02 JP JP2013552119A patent/JP5676017B2/ja active Active
- 2011-12-02 US US13/982,430 patent/US9306044B2/en active Active
- 2011-12-02 CN CN201180066235.5A patent/CN103339730B/zh active Active
- 2011-12-02 WO PCT/EP2011/071590 patent/WO2012103968A1/de active Application Filing
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Publication number | Publication date |
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EP2671253B1 (de) | 2020-02-19 |
WO2012103968A1 (de) | 2012-08-09 |
EP2671253A1 (de) | 2013-12-11 |
JP2014508406A (ja) | 2014-04-03 |
CN103339730A (zh) | 2013-10-02 |
US20140021509A1 (en) | 2014-01-23 |
DE102011003456A1 (de) | 2012-08-02 |
US9306044B2 (en) | 2016-04-05 |
CN103339730B (zh) | 2016-06-15 |
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