JP5667467B2 - 合金材料、回路基板、電子デバイス及びその製造方法 - Google Patents
合金材料、回路基板、電子デバイス及びその製造方法 Download PDFInfo
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- JP5667467B2 JP5667467B2 JP2011033496A JP2011033496A JP5667467B2 JP 5667467 B2 JP5667467 B2 JP 5667467B2 JP 2011033496 A JP2011033496 A JP 2011033496A JP 2011033496 A JP2011033496 A JP 2011033496A JP 5667467 B2 JP5667467 B2 JP 5667467B2
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- 239000000956 alloy Substances 0.000 title claims description 36
- 238000004519 manufacturing process Methods 0.000 title description 3
- 229910052718 tin Inorganic materials 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 20
- 229910052709 silver Inorganic materials 0.000 claims description 20
- 229910052797 bismuth Inorganic materials 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 15
- 229910002059 quaternary alloy Inorganic materials 0.000 claims 1
- 230000008018 melting Effects 0.000 description 42
- 238000002844 melting Methods 0.000 description 42
- 230000008014 freezing Effects 0.000 description 37
- 238000007710 freezing Methods 0.000 description 37
- 238000000034 method Methods 0.000 description 34
- 239000002184 metal Substances 0.000 description 26
- 229910052751 metal Inorganic materials 0.000 description 26
- 239000004065 semiconductor Substances 0.000 description 24
- 239000000203 mixture Substances 0.000 description 19
- 229910001338 liquidmetal Inorganic materials 0.000 description 17
- 238000007711 solidification Methods 0.000 description 13
- 230000008023 solidification Effects 0.000 description 13
- 229910052733 gallium Inorganic materials 0.000 description 10
- 229910020836 Sn-Ag Inorganic materials 0.000 description 7
- 229910020988 Sn—Ag Inorganic materials 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011033496A JP5667467B2 (ja) | 2011-02-18 | 2011-02-18 | 合金材料、回路基板、電子デバイス及びその製造方法 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011033496A JP5667467B2 (ja) | 2011-02-18 | 2011-02-18 | 合金材料、回路基板、電子デバイス及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012172178A JP2012172178A (ja) | 2012-09-10 |
| JP2012172178A5 JP2012172178A5 (enrdf_load_stackoverflow) | 2014-03-06 |
| JP5667467B2 true JP5667467B2 (ja) | 2015-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011033496A Active JP5667467B2 (ja) | 2011-02-18 | 2011-02-18 | 合金材料、回路基板、電子デバイス及びその製造方法 |
Country Status (1)
| Country | Link |
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| JP (1) | JP5667467B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016157971A1 (ja) * | 2015-03-31 | 2016-10-06 | 住友金属鉱山株式会社 | はんだペースト |
| WO2017065236A1 (ja) * | 2015-10-15 | 2017-04-20 | 住友精密工業株式会社 | 充填方法および充填装置 |
| CN106001982A (zh) * | 2016-07-08 | 2016-10-12 | 重庆科技学院 | 一种高熔点无铅铋银锡钎料及其制备方法 |
| JP7487471B2 (ja) * | 2019-12-13 | 2024-05-21 | 株式会社レゾナック | 金属ペースト、導電体、並びに、貫通電極を有する基体及びその製造方法 |
| JP7417696B1 (ja) | 2022-08-01 | 2024-01-18 | 千住金属工業株式会社 | 金属及び電子装置 |
| JP7534693B1 (ja) | 2023-12-14 | 2024-08-15 | 千住金属工業株式会社 | 金属及び電子装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3671815B2 (ja) * | 2000-06-12 | 2005-07-13 | 株式会社村田製作所 | はんだ組成物およびはんだ付け物品 |
| JP2004533327A (ja) * | 2001-05-28 | 2004-11-04 | ハネウエル・インターナシヨナル・インコーポレーテツド | 高温鉛フリーハンダ用組成物、方法およびデバイス |
| EP1952934B1 (en) * | 2005-11-11 | 2015-03-18 | Senju Metal Industry Co., Ltd. | Soldering paste and solder joints |
| US20080118761A1 (en) * | 2006-09-13 | 2008-05-22 | Weiser Martin W | Modified solder alloys for electrical interconnects, methods of production and uses thereof |
| JP4444995B2 (ja) * | 2007-08-10 | 2010-03-31 | 有限会社ナプラ | 基板配線用導電性組成物、回路基板及び電子デバイス |
| JP5194326B2 (ja) * | 2008-12-27 | 2013-05-08 | 千住金属工業株式会社 | Ｂｉ−Ｓｎ系リール巻きはんだ線およびはんだ線の製造方法 |
| US9205513B2 (en) * | 2010-06-30 | 2015-12-08 | Senju Metal Industry Co., Ltd. | Bi—Sn based high-temperature solder alloy |
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- 2011-02-18 JP JP2011033496A patent/JP5667467B2/ja active Active
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| Publication number | Publication date |
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| JP2012172178A (ja) | 2012-09-10 |
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