JP5659396B2 - 接合部検査装置 - Google Patents
接合部検査装置 Download PDFInfo
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- JP5659396B2 JP5659396B2 JP2013066133A JP2013066133A JP5659396B2 JP 5659396 B2 JP5659396 B2 JP 5659396B2 JP 2013066133 A JP2013066133 A JP 2013066133A JP 2013066133 A JP2013066133 A JP 2013066133A JP 5659396 B2 JP5659396 B2 JP 5659396B2
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- 238000007689 inspection Methods 0.000 title claims description 49
- 238000005259 measurement Methods 0.000 claims description 43
- 230000009916 joint effect Effects 0.000 claims description 17
- 238000004891 communication Methods 0.000 claims description 5
- 238000005286 illumination Methods 0.000 description 43
- 238000012546 transfer Methods 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000002950 deficient Effects 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2518—Projection by scanning of the object
- G01B11/2527—Projection by scanning of the object with phase change by in-plane movement of the patern
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/50—Depth or shape recovery
- G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0817—Monitoring of soldering processes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10141—Special mode during image acquisition
- G06T2207/10152—Varying illumination
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder
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- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
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- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
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- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Quality & Reliability (AREA)
- Optics & Photonics (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Description
10 3次元形状測定装置
20 分類装置
30 ユーザインターフェース装置
100 測定ステージ部
110 ステージ
120 ステージ移送ユニット
200 映像撮影部
210 カメラ
220 結像レンズ
230 フィルタ
240 円形ランプ
300 第1照明部
310 第1照明モジュール
311 第1照明ユニット
312 第1格子ユニット
313 第1格子移送ユニット
314 第1レンズユニット
320 第2照明モジュール
321 第2照明ユニット
322 第2格子ユニット
323 第2格子移送ユニット
324 第2レンズユニット
400 第2照明部
410 第1光源モジュール
420 第2光源モジュール
430 第3光源モジュール
500 映像取得部
600 モジュール制御部
610 照明コントローラ
620 格子コントローラ
630 ステージコントローラ
700 中央制御部
710 インターフェースボード
720 イメージ処理ボード
730 制御ボード
800 判断規則格納部
900 判断部
1000 通信部
1100 接合部特性値格納部
1200 接合部状態格納部
1300 ディスプレイ部
1400 入力部
1500 接合部
1510 端子
1520 パッド
1530 半田
1540 検査領域
1541 近検査領域
1542 遠検査領域
1550 傾斜領域
1560 飽和領域
Claims (8)
- 接合部特性値を測定する3次元形状測定装置(10)と、
前記3次元形状測定装置(10)から受信した少なくとも二つ以上の接合部特性値によって接合部の状態を判断する分類装置(20)と、
前記接合部の状態を表示するユーザインターフェース装置(30)と、を含む、接合部検査装置であって、
前記接合部の状態は、接合部特性値空間グラフに表示され、
前記接合部特性値空間グラフは、第1接合部特性値空間グラフの分割された領域に第2接合部特性値空間グラフが含まれることを特徴とする、
接合部検査装置。 - 前記3次元形状測定装置(10)は、測定対象物(1)の3次元接合部特性値および2次元接合部特性値を測定することを特徴とする、請求項1に記載の接合部検査装置。
- 前記二つ以上の接合部特性値は、3次元接合部特性値と、2次元接合部特性値と、を含むことを特徴とする、請求項2に記載の接合部検査装置。
- 前記3次元接合部特性値は接合部の高さまたはパッドの高さであり、前記2次元接合部特性値は傾斜率または非平坦率であることを特徴とする、請求項3に記載の接合部検査装置。
- 第1接合部特性値空間または第2接合部特性値空間を形成する接合部特性値は、3次元接合部特性値および2次元接合部特性値の組み合わせからなることを特徴とする、請求項1に記載の接合部検査装置。
- 前記分類装置(20)は、
前記3次元形状測定装置(10)で測定された接合部特性値によって接合部の状態を判断する判断規則が格納された判断規則格納部(800)と、
前記3次元形状測定装置(10)で測定された接合部特性値と判断規則格納部(800)に格納された判断規則とを比較して接合部の状態を判断する判断部(900)と、
前記分類装置(20)と、前記3次元形状測定装置(10)および前記ユーザインターフェース装置(30)との間のデータを送受信する通信部(1000)と、を含むことを特徴とする、請求項1に記載の接合部検査装置。 - 前記分類装置(20)は、
前記3次元形状測定装置(10)で測定された接合部特性値を格納する接合部特性値格納部1100と、
接合部の状態を格納する接合部状態格納部(1200)と、をさらに含むことを特徴とする、請求項6に記載の接合部検査装置。 - 前記ユーザインターフェース装置(30)は、
接合部特性値空間グラフおよび前記接合部特性値空間グラフ内の接合部を表示するディスプレイ部(1300)と、
前記ディスプレイ部(1300)に表示される画面で接合部特性値空間、接合部特性値別境界値、接合部状態データを設定または変更できる入力部(1400)と、を含むことを特徴とする、請求項1に記載の接合部検査装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120032152A KR101614061B1 (ko) | 2012-03-29 | 2012-03-29 | 조인트 검사 장치 |
KR10-2012-0032152 | 2012-03-29 |
Publications (2)
Publication Number | Publication Date |
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JP2013231713A JP2013231713A (ja) | 2013-11-14 |
JP5659396B2 true JP5659396B2 (ja) | 2015-01-28 |
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JP2013066133A Active JP5659396B2 (ja) | 2012-03-29 | 2013-03-27 | 接合部検査装置 |
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US (1) | US9091668B2 (ja) |
JP (1) | JP5659396B2 (ja) |
KR (1) | KR101614061B1 (ja) |
CN (2) | CN103364398A (ja) |
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- 2013-03-27 JP JP2013066133A patent/JP5659396B2/ja active Active
- 2013-03-28 CN CN2013101033385A patent/CN103364398A/zh active Pending
- 2013-03-28 CN CN201610825033.9A patent/CN106908443B/zh active Active
- 2013-03-28 US US13/852,133 patent/US9091668B2/en active Active
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Publication number | Publication date |
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CN106908443A (zh) | 2017-06-30 |
US20130259359A1 (en) | 2013-10-03 |
US9091668B2 (en) | 2015-07-28 |
JP2013231713A (ja) | 2013-11-14 |
KR20130110308A (ko) | 2013-10-10 |
CN106908443B (zh) | 2020-12-08 |
KR101614061B1 (ko) | 2016-04-20 |
CN103364398A (zh) | 2013-10-23 |
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