JP5657953B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP5657953B2
JP5657953B2 JP2010191196A JP2010191196A JP5657953B2 JP 5657953 B2 JP5657953 B2 JP 5657953B2 JP 2010191196 A JP2010191196 A JP 2010191196A JP 2010191196 A JP2010191196 A JP 2010191196A JP 5657953 B2 JP5657953 B2 JP 5657953B2
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plasma processing
processing apparatus
dielectric window
temperature
waveguide
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Japanese (ja)
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JP2012049393A (ja
JP2012049393A5 (enExample
Inventor
雅敏 川上
雅敏 川上
角屋　誠浩
誠浩 角屋
田村　仁
仁 田村
茂 白米
茂 白米
基裕 田中
基裕 田中
靖 園田
靖 園田
智司 渡邉
智司 渡邉
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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  • Drying Of Semiconductors (AREA)
JP2010191196A 2010-08-27 2010-08-27 プラズマ処理装置 Active JP5657953B2 (ja)

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JP2010191196A JP5657953B2 (ja) 2010-08-27 2010-08-27 プラズマ処理装置

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JP2010191196A JP5657953B2 (ja) 2010-08-27 2010-08-27 プラズマ処理装置

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JP2012049393A JP2012049393A (ja) 2012-03-08
JP2012049393A5 JP2012049393A5 (enExample) 2013-09-05
JP5657953B2 true JP5657953B2 (ja) 2015-01-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11037760B2 (en) 2018-06-18 2021-06-15 Samsung Electronics Co., Ltd. Temperature controller, temperature measurer, and plasma processing apparatus including the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5800757B2 (ja) * 2012-05-28 2015-10-28 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6286215B2 (ja) * 2014-01-28 2018-02-28 株式会社日立ハイテクノロジーズ プラズマ処理装置
KR101559024B1 (ko) 2014-03-27 2015-10-13 세메스 주식회사 기판 처리 장치
KR102171460B1 (ko) * 2018-01-30 2020-10-29 (주)아이씨디 윈도우 히팅 시스템을 갖는 기판 처리 장치
JP6715894B2 (ja) * 2018-08-07 2020-07-01 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム
CN110875208B (zh) * 2018-08-29 2022-11-25 北京北方华创微电子装备有限公司 工艺腔室用控温装置及方法、工艺腔室
CN120513508A (zh) * 2023-03-23 2025-08-19 株式会社国际电气 基板处理装置、基板处理方法、半导体装置的制造方法以及程序

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07142444A (ja) * 1993-11-12 1995-06-02 Hitachi Ltd マイクロ波プラズマ処理装置および処理方法
JP3193575B2 (ja) * 1994-11-09 2001-07-30 株式会社日立製作所 マイクロ波プラズマ処理装置
JPH1081982A (ja) * 1996-09-02 1998-03-31 C Bui Res:Kk プラズマ処理装置
JPH11186222A (ja) * 1997-12-24 1999-07-09 Sony Corp Ｅｃｒエッチング装置
JP5121684B2 (ja) * 2008-12-11 2013-01-16 株式会社日立ハイテクノロジーズ プラズマ処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11037760B2 (en) 2018-06-18 2021-06-15 Samsung Electronics Co., Ltd. Temperature controller, temperature measurer, and plasma processing apparatus including the same

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