JP5653610B2 - 電子回路モジュールおよび同軸ケーブルの接続方法 - Google Patents
電子回路モジュールおよび同軸ケーブルの接続方法 Download PDFInfo
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- JP5653610B2 JP5653610B2 JP2009274863A JP2009274863A JP5653610B2 JP 5653610 B2 JP5653610 B2 JP 5653610B2 JP 2009274863 A JP2009274863 A JP 2009274863A JP 2009274863 A JP2009274863 A JP 2009274863A JP 5653610 B2 JP5653610 B2 JP 5653610B2
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- exposed
- coaxial cable
- anode
- electronic component
- cathode
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- 238000000034 method Methods 0.000 title claims description 22
- 239000012212 insulator Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
- H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
- H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Endoscopes (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Description
図1は、本実施の形態の電子回路モジュール1の構成例を模式的に示す斜視図である。また、図2は、電子回路モジュール1の平面図である。図1に示すように、本実施の形態の電子回路モジュール1は、電子回路基板11と、電子部品13と、同軸ケーブル15とを備える。
11,11b電子回路基板
111,113電子部品用電極
13電子部品
131陽極
133陰極
15同軸ケーブル
151芯線
152内部絶縁体
153シールド線
154外部絶縁体
171,173導電性材料
171a,173aフィレット
Claims (4)
- 電子回路基板に実装され、対向面を形成する陽極および陰極を備えた電子部品と、
芯線およびシールド線が段階的に露出した同軸ケーブルと、
を備え、
前記同軸ケーブルの芯線およびシールド線は、前記電子部品の陽極および陰極のケーブル接続面の長手方向の幅と同等の長さに合わせて段階的に露出されるとともに、
前記同軸ケーブルは、側面が前記電子部品のケーブル接続面の長手方向に対向するように配置され、前記電子部品の所定のケーブル接続面に露出した前記陽極および前記陰極に対し、前記同軸ケーブルの露出した前記芯線の側面および露出した前記シールド線の側面が直接接続されたことを特徴とする電子回路モジュール。 - 電子回路基板に実装され、対向面を形成する陽極および陰極を備えた電子部品と、
芯線およびシールド線が段階的に露出した同軸ケーブルと、
を備え、
前記同軸ケーブルの芯線およびシールド線は、前記電子部品の陽極および陰極のケーブル接続面の長手方向の幅以上の長さに段階的に露出されるとともに、
前記同軸ケーブルは、側面が前記電子部品のケーブル接続面の長手方向に対向するように配置され、前記電子部品の所定のケーブル接続面に露出した前記陽極および前記陰極に対し、前記同軸ケーブルの露出した前記芯線の側面および露出した前記シールド線の側面が直接接続されたことを特徴とする電子回路モジュール。 - 前記陽極および前記陰極は、前記同軸ケーブルの露出した前記芯線の側面および露出した前記シールド線の側面が接続されていない面で、前記電子回路基板の上面に配置された電子部品用電極に接続されることを特徴とする請求項1または2に記載の電子回路モジュール。
- 対向面を形成する陽極および陰極を備えた電子部品に対して同軸ケーブルを接続する同軸ケーブルの接続方法であって、
前記電子部品の所定のケーブル接続面の幅に合わせて前記同軸ケーブルのシールド線を露出させるシールド線露出工程と、
前記同軸ケーブルの露出させた前記シールド線を前記ケーブル接続面に露出した前記陰極の長手方向の幅と同等の長さに合わせて残し、前記同軸ケーブルの内部絶縁体を露出させる内部絶縁体露出工程と、
前記ケーブル接続面に露出した前記陽極の長手方向の幅と同等の長さに合わせて前記同軸ケーブルの芯線を露出させる芯線露出工程と、
前記同軸ケーブルは、側面が前記電子部品のケーブル接続面の長手方向に対向するように配置され、露出させた前記芯線の側面および露出させた前記シールド線の側面を前記ケーブル接続面に露出した前記陽極および前記陰極に接続する接続工程と、
を含むことを特徴とする同軸ケーブルの接続方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009274863A JP5653610B2 (ja) | 2009-12-02 | 2009-12-02 | 電子回路モジュールおよび同軸ケーブルの接続方法 |
US12/957,962 US8513536B2 (en) | 2009-12-02 | 2010-12-01 | Electronic circuit module and method of connecting coaxial cable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009274863A JP5653610B2 (ja) | 2009-12-02 | 2009-12-02 | 電子回路モジュールおよび同軸ケーブルの接続方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011119409A JP2011119409A (ja) | 2011-06-16 |
JP5653610B2 true JP5653610B2 (ja) | 2015-01-14 |
Family
ID=44067990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009274863A Active JP5653610B2 (ja) | 2009-12-02 | 2009-12-02 | 電子回路モジュールおよび同軸ケーブルの接続方法 |
Country Status (2)
Country | Link |
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US (1) | US8513536B2 (ja) |
JP (1) | JP5653610B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6289288B2 (ja) * | 2014-07-02 | 2018-03-07 | オリンパス株式会社 | 実装用ケーブル、および集合ケーブル |
EP3276749A1 (en) * | 2015-03-24 | 2018-01-31 | Olympus Corporation | Electronic circuit module |
KR101972864B1 (ko) * | 2019-02-08 | 2019-04-26 | 태양쓰리시 주식회사 | 동축 케이블의 접속 구조 및 방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0474001A (ja) * | 1990-07-13 | 1992-03-09 | Nec Corp | 半導体集積回路装置用パッケージ |
US5402088A (en) * | 1992-12-03 | 1995-03-28 | Ail Systems, Inc. | Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits |
JP2000051150A (ja) * | 1999-07-12 | 2000-02-22 | Olympus Optical Co Ltd | 撮像装置 |
US6911733B2 (en) * | 2002-02-28 | 2005-06-28 | Hitachi, Ltd. | Semiconductor device and electronic device |
JP2003338693A (ja) * | 2002-05-20 | 2003-11-28 | Tdk Corp | 同軸ケーブルの接続方法及び多層プリント基板 |
DE102005002707B4 (de) * | 2005-01-19 | 2007-07-26 | Infineon Technologies Ag | Verfahren zur Herstellung elektrischer Verbindungen in einem Halbleiterbauteil mittels koaxialer Mikroverbindungselemente |
US7405582B2 (en) * | 2006-06-01 | 2008-07-29 | Advantest Corporation | Measurement board for electronic device test apparatus |
US7803017B2 (en) * | 2006-09-15 | 2010-09-28 | Nokia Corporation | Simultaneous bidirectional cable interface |
JP2008124590A (ja) * | 2006-11-09 | 2008-05-29 | Nissei Electric Co Ltd | 同軸ケーブル端末加工品 |
-
2009
- 2009-12-02 JP JP2009274863A patent/JP5653610B2/ja active Active
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2010
- 2010-12-01 US US12/957,962 patent/US8513536B2/en active Active
Also Published As
Publication number | Publication date |
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US20110127079A1 (en) | 2011-06-02 |
US8513536B2 (en) | 2013-08-20 |
JP2011119409A (ja) | 2011-06-16 |
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