JP5642776B2 - マイクロトラスを使用する構造絶縁層のための方法と装置 - Google Patents

マイクロトラスを使用する構造絶縁層のための方法と装置 Download PDF

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JP5642776B2
JP5642776B2 JP2012513090A JP2012513090A JP5642776B2 JP 5642776 B2 JP5642776 B2 JP 5642776B2 JP 2012513090 A JP2012513090 A JP 2012513090A JP 2012513090 A JP2012513090 A JP 2012513090A JP 5642776 B2 JP5642776 B2 JP 5642776B2
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micro
truss structure
fluid flow
outer plate
heat source
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Japanese (ja)
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JP2012529159A (ja
JP2012529159A5 (enExample
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アラン， ジョン ジェイコブセン，
アラン， ジョン ジェイコブセン，
スティーヴン， エドワード レーマン，
スティーヴン， エドワード レーマン，
ジェフリー， ピー． マクナイト，
ジェフリー， ピー． マクナイト，
ウィリアム， バーナード カーター，
ウィリアム， バーナード カーター，
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Boeing Co
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Boeing Co
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Building Environments (AREA)
JP2012513090A 2009-06-01 2010-05-05 マイクロトラスを使用する構造絶縁層のための方法と装置 Active JP5642776B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/476,003 2009-06-01
US12/476,003 US8800641B2 (en) 2009-06-01 2009-06-01 Methods and apparatus for a micro-truss based structural insulation layer
PCT/US2010/033725 WO2010141176A2 (en) 2009-06-01 2010-05-05 Methods and apparatus for a micro-truss based structural insulation layer

Publications (3)

Publication Number Publication Date
JP2012529159A JP2012529159A (ja) 2012-11-15
JP2012529159A5 JP2012529159A5 (enExample) 2013-04-11
JP5642776B2 true JP5642776B2 (ja) 2014-12-17

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JP2012513090A Active JP5642776B2 (ja) 2009-06-01 2010-05-05 マイクロトラスを使用する構造絶縁層のための方法と装置

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Country Link
US (1) US8800641B2 (enExample)
EP (1) EP2437933B1 (enExample)
JP (1) JP5642776B2 (enExample)
CN (1) CN102427936B (enExample)
AU (1) AU2010257071B2 (enExample)
CA (1) CA2757905C (enExample)
WO (1) WO2010141176A2 (enExample)

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US10895015B1 (en) 2014-12-16 2021-01-19 Hrl Laboratories, Llc Thin-walled high temperature alloy structures via multi-material additive manufacturing
CN105000166A (zh) * 2015-04-29 2015-10-28 中国航空工业集团公司北京航空材料研究院 一种用于高马赫飞行器的隔热结构
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US11747094B2 (en) * 2017-05-12 2023-09-05 The Boeing Company Hollow lattice thermal energy storage heat exchanger
US10203169B2 (en) * 2017-06-12 2019-02-12 Microsoft Technology Licensing, Llc Thermal management devices, systems and methods
US10493693B1 (en) * 2017-07-25 2019-12-03 National Technology & Engineering Solutions Of Sandia, Llc 3D-printed apparatus for efficient fluid-solid contact
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CN109018298A (zh) * 2018-07-19 2018-12-18 中国航空工业集团公司沈阳飞机设计研究所 一种带内部流道的飞机防火墙隔热板结构
US11946702B2 (en) * 2021-03-23 2024-04-02 Terrapower, Llc Heat exchanger configuration with porous layer
US12013190B2 (en) * 2021-06-23 2024-06-18 Hamilton Sundstrand Corporation Wavy adjacent passage heat exchanger core and manifold
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CN119704797A (zh) * 2024-12-20 2025-03-28 华中科技大学 一种主被动协同的高效隔热结构及成型方法

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Also Published As

Publication number Publication date
AU2010257071A1 (en) 2011-12-08
US20100300669A1 (en) 2010-12-02
CN102427936A (zh) 2012-04-25
AU2010257071B2 (en) 2015-02-12
JP2012529159A (ja) 2012-11-15
WO2010141176A3 (en) 2011-01-27
WO2010141176A2 (en) 2010-12-09
CN102427936B (zh) 2014-10-29
US8800641B2 (en) 2014-08-12
CA2757905C (en) 2015-02-24
EP2437933B1 (en) 2014-07-09
CA2757905A1 (en) 2010-12-09
EP2437933A2 (en) 2012-04-11

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