JP5620330B2 - 並列光トランシーバ・モジュールと共に使用する、浮遊物体からこのモジュールの部品を保護するための保護ソケット - Google Patents
並列光トランシーバ・モジュールと共に使用する、浮遊物体からこのモジュールの部品を保護するための保護ソケット Download PDFInfo
- Publication number
- JP5620330B2 JP5620330B2 JP2011097042A JP2011097042A JP5620330B2 JP 5620330 B2 JP5620330 B2 JP 5620330B2 JP 2011097042 A JP2011097042 A JP 2011097042A JP 2011097042 A JP2011097042 A JP 2011097042A JP 5620330 B2 JP5620330 B2 JP 5620330B2
- Authority
- JP
- Japan
- Prior art keywords
- transceiver module
- optical transceiver
- side wall
- optical
- protective socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims description 189
- 230000001681 protective effect Effects 0.000 title claims description 92
- 238000007667 floating Methods 0.000 title description 15
- 238000004891 communication Methods 0.000 claims description 32
- 239000013307 optical fiber Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 239000002991 molded plastic Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims 6
- 230000000717 retained effect Effects 0.000 claims 1
- 239000000428 dust Substances 0.000 description 21
- 230000017525 heat dissipation Effects 0.000 description 13
- 239000007789 gas Substances 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
- G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/772,462 US8414309B2 (en) | 2010-05-03 | 2010-05-03 | Receptacle for an optical transceiver module for protecting the module from airborne particles |
| US12/772,462 | 2010-05-03 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011253180A JP2011253180A (ja) | 2011-12-15 |
| JP2011253180A5 JP2011253180A5 (https=) | 2013-08-01 |
| JP5620330B2 true JP5620330B2 (ja) | 2014-11-05 |
Family
ID=44786673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011097042A Expired - Fee Related JP5620330B2 (ja) | 2010-05-03 | 2011-04-25 | 並列光トランシーバ・モジュールと共に使用する、浮遊物体からこのモジュールの部品を保護するための保護ソケット |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8414309B2 (https=) |
| JP (1) | JP5620330B2 (https=) |
| DE (1) | DE102011075106A1 (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8463098B2 (en) * | 2010-08-20 | 2013-06-11 | Calix, Inc. | Optical transceiver assembly |
| US8849085B2 (en) * | 2011-11-22 | 2014-09-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Flexible dust cover for use with a parallel optical communications module to prevent airborne matter from entering the module, and a method |
| CN104412142A (zh) * | 2012-06-12 | 2015-03-11 | 富加宜(亚洲)私人有限公司 | 用于收发器的可释放连接器 |
| US9146368B2 (en) * | 2012-08-31 | 2015-09-29 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Methods and systems for dissipating heat in optical communications modules |
| US9389373B2 (en) * | 2012-09-24 | 2016-07-12 | The Boeing Company | Optical connector |
| US9106027B2 (en) * | 2012-12-21 | 2015-08-11 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Methods, apparatuses and systems for mid-plane mounting parallel optical communications modules on circuit boards |
| US9235015B2 (en) * | 2013-02-26 | 2016-01-12 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Heat dissipation device and method for use in an optical communications module |
| US9048585B2 (en) | 2013-11-06 | 2015-06-02 | Foxconn Interconnect Technology Limited | Electrical connector having a rotatable buckle |
| WO2015123399A1 (en) | 2014-02-17 | 2015-08-20 | Corning Optical Communications LLC | Optical bodies having a total internal reflection surface and a short optical path length |
| CN106461885A (zh) | 2014-04-04 | 2017-02-22 | 康宁光电通信有限责任公司 | 衬底安装的光学插座 |
| US20160226591A1 (en) | 2015-02-04 | 2016-08-04 | International Business Machines Corporation | Integrated parallel optical transceiver |
| US9739961B2 (en) * | 2015-03-31 | 2017-08-22 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Pluggable optical communications module and system with aligned ESA axis |
| US10331182B2 (en) | 2015-07-31 | 2019-06-25 | Hewlett Packard Enterprise Development Lp | Heat exchangers |
| US9733441B2 (en) | 2015-10-29 | 2017-08-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Heat dissipation clamp and methods, devices and systems for facilitating heat dissipation in optical communications modules |
| US10330872B2 (en) | 2015-11-24 | 2019-06-25 | Hewlett Packard Enterprise Development Lp | Interfacing a ferrule with a socket |
| EP3394937B1 (en) | 2015-12-22 | 2020-10-14 | Hewlett-Packard Enterprise Development LP | System comprising a socket connector with a horizontal and vertical alignment feature |
| WO2017146722A1 (en) * | 2016-02-26 | 2017-08-31 | Hewlett Packard Enterprise Development Lp | Optical connector assembly |
| US10678006B2 (en) * | 2016-09-30 | 2020-06-09 | Hewlett Packard Enterprise Development Lp | Optical interfaces with solder that passively aligns optical socket |
| US10795091B2 (en) * | 2017-07-14 | 2020-10-06 | Hewlett Packard Enterprise Development Lp | Adaptor for optical component of optical connector |
| KR101994201B1 (ko) * | 2018-01-09 | 2019-09-30 | (주)옵토마인드 | 광송수신용 조립체 및 그를 이용한 광송수신기 |
| US10690868B1 (en) * | 2018-05-29 | 2020-06-23 | Cisco Technology, Inc. | Thermal protection for modular components in a network device |
| US11360276B1 (en) * | 2020-12-17 | 2022-06-14 | TE Connectivity Services Gmbh | Optoelectronic assembly for a communication system |
| JPWO2024203634A1 (https=) * | 2023-03-31 | 2024-10-03 |
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| US4421383A (en) | 1980-01-17 | 1983-12-20 | Gte Laboratories Incorporated | Optical fiber connectors |
| US4506938A (en) * | 1982-07-06 | 1985-03-26 | At&T Bell Laboratories | Integrated circuit chip carrier mounting arrangement |
| AU4160096A (en) * | 1994-11-15 | 1996-06-06 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
| US5743785A (en) | 1996-04-04 | 1998-04-28 | Us Conec Ltd. | Polishing method and apparatus for preferentially etching a ferrule assembly and ferrule assembly produced thereby |
| US6005991A (en) | 1997-11-26 | 1999-12-21 | Us Conec Ltd | Printed circuit board assembly having a flexible optical circuit and associated fabrication method |
| US6085003A (en) | 1998-07-28 | 2000-07-04 | Us Conec Ltd | Multifiber connector having a free floating ferrule |
| US7208725B2 (en) | 1998-11-25 | 2007-04-24 | Rohm And Haas Electronic Materials Llc | Optoelectronic component with encapsulant |
| US6652158B2 (en) * | 2000-09-05 | 2003-11-25 | Optical Zonu Corporation | Optical networking unit employing optimized optical packaging |
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| US6533470B2 (en) * | 2001-03-16 | 2003-03-18 | Infineon Technologies North America Corp. | Single-piece cage for pluggable fiber optic transceiver |
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| US8035973B2 (en) * | 2009-08-31 | 2011-10-11 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Cage having a heat sink device secured thereto in a floating arrangement that ensures that continuous contact is maintained between the heat sink device and a parallel optical communications device secured to the cage |
| US8870468B2 (en) | 2010-02-22 | 2014-10-28 | US Conec, Ltd | Multi-port shielded adapter |
| US8047856B2 (en) * | 2010-02-24 | 2011-11-01 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Array connector for optical transceiver module |
| US8852716B2 (en) | 2010-03-18 | 2014-10-07 | Us Conec, Ltd. | Insert-molded transceiver body with heat sink and method therefor |
-
2010
- 2010-05-03 US US12/772,462 patent/US8414309B2/en not_active Expired - Fee Related
-
2011
- 2011-04-25 JP JP2011097042A patent/JP5620330B2/ja not_active Expired - Fee Related
- 2011-05-02 DE DE102011075106A patent/DE102011075106A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US8414309B2 (en) | 2013-04-09 |
| DE102011075106A1 (de) | 2011-11-03 |
| US20110268397A1 (en) | 2011-11-03 |
| JP2011253180A (ja) | 2011-12-15 |
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