JP5604062B2 - 排スラリー中の有用固形成分の回収方法 - Google Patents

排スラリー中の有用固形成分の回収方法 Download PDF

Info

Publication number
JP5604062B2
JP5604062B2 JP2009157214A JP2009157214A JP5604062B2 JP 5604062 B2 JP5604062 B2 JP 5604062B2 JP 2009157214 A JP2009157214 A JP 2009157214A JP 2009157214 A JP2009157214 A JP 2009157214A JP 5604062 B2 JP5604062 B2 JP 5604062B2
Authority
JP
Japan
Prior art keywords
concentration
waste slurry
titanium
component
slurry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009157214A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011011289A5 (https=
JP2011011289A (ja
Inventor
泉里 小島
嗣 阿部
慶一郎 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nomura Micro Science Co Ltd
Original Assignee
Nomura Micro Science Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nomura Micro Science Co Ltd filed Critical Nomura Micro Science Co Ltd
Priority to JP2009157214A priority Critical patent/JP5604062B2/ja
Publication of JP2011011289A publication Critical patent/JP2011011289A/ja
Publication of JP2011011289A5 publication Critical patent/JP2011011289A5/ja
Application granted granted Critical
Publication of JP5604062B2 publication Critical patent/JP5604062B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Treatment Of Water By Ion Exchange (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2009157214A 2009-07-01 2009-07-01 排スラリー中の有用固形成分の回収方法 Expired - Fee Related JP5604062B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009157214A JP5604062B2 (ja) 2009-07-01 2009-07-01 排スラリー中の有用固形成分の回収方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009157214A JP5604062B2 (ja) 2009-07-01 2009-07-01 排スラリー中の有用固形成分の回収方法

Publications (3)

Publication Number Publication Date
JP2011011289A JP2011011289A (ja) 2011-01-20
JP2011011289A5 JP2011011289A5 (https=) 2012-08-02
JP5604062B2 true JP5604062B2 (ja) 2014-10-08

Family

ID=43590652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009157214A Expired - Fee Related JP5604062B2 (ja) 2009-07-01 2009-07-01 排スラリー中の有用固形成分の回収方法

Country Status (1)

Country Link
JP (1) JP5604062B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102423871A (zh) * 2011-07-01 2012-04-25 上海华力微电子有限公司 一种抛光液的循环再利用方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796447B2 (ja) * 1986-06-13 1995-10-18 モ−ゼス レイク インダストリ−ズ インコ−ポレイテツド 高純度シリカの製造方法
JPH1128338A (ja) * 1997-07-11 1999-02-02 Matsushita Seiko Eng Kk 半導体用スラリー状研磨液の分離方法およびその装置
JP3641956B2 (ja) * 1998-11-30 2005-04-27 三菱住友シリコン株式会社 研磨スラリーの再生システム
JP2002173317A (ja) * 2000-11-30 2002-06-21 Watanabe Shoko:Kk 高純度コロイダルシリカおよび高純度合成石英粉の製造方法
JP2008124213A (ja) * 2006-11-10 2008-05-29 Nippon Valqua Ind Ltd 使用済みｃｍｐスラリの再生方法
JP4353991B2 (ja) * 2007-07-22 2009-10-28 株式会社キーファー・テック スラリー廃液の再生方法及び装置

Also Published As

Publication number Publication date
JP2011011289A (ja) 2011-01-20

Similar Documents

Publication Publication Date Title
TWI843026B (zh) 含有次氯酸離子的半導體晶圓處理液
DE60028962T2 (de) Zusammensetzungen zum reinigen von substraten von organischen und plasmaätz-rückständen bei halbleiter-vorrichtungen
KR102055154B1 (ko) 처리액 및 기판 세정 방법
TWI439424B (zh) Ultra-pure water manufacturing method and apparatus, and method and apparatus for cleaning electronic component parts
JP4480061B2 (ja) 超純水製造装置及び該装置における超純水製造供給システムの洗浄方法
ATE429480T1 (de) Verbesserte saure chemie für säuberung nach cmp
KR20030036009A (ko) 반도체 제조에 이용하는 세정수 또는 침지수
CN1432531A (zh) 溶氢水制造设备
TW200522189A (en) Method for cleaning semiconductor wafers
CA2617270C (en) System and method of slurry treatment
KR101643124B1 (ko) 웨이퍼용 세정수 및 웨이퍼의 세정 방법
JP5604062B2 (ja) 排スラリー中の有用固形成分の回収方法
JP5320723B2 (ja) 超純水製造方法及び装置並びに電子部品部材類の洗浄方法及び装置
JP5678436B2 (ja) 超純水製造方法及び装置
JP5358266B2 (ja) 排スラリー中の有用固形成分の回収方法
JP2009112944A (ja) 超純水製造方法及び装置並びに電子部品部材類の洗浄方法及び装置
JP2008124213A (ja) 使用済みｃｍｐスラリの再生方法
JP5965213B2 (ja) 銅含有酸性廃液からの酸化銅の回収方法及び装置
JP3507590B2 (ja) ウエット処理方法及び処理装置
WO2008027034A1 (en) System and method of slurry treatment
JP2011045844A (ja) 水酸化テトラアルキルアンモニウム含有現像廃液の精製方法
KR20130062928A (ko) 기판의 처리를 위한 방법 및 상기 방법을 위한 처리 조성물
TW202432478A (zh) 減少經唑處理之廢水中之二價鐵
JP2011011289A5 (https=)
JP5633838B2 (ja) 半導体基板の処理方法および半導体装置の製造方法。

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120618

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120618

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130919

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130924

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131010

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140225

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140410

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140819

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140825

R150 Certificate of patent or registration of utility model

Ref document number: 5604062

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees