JP5599561B2 - 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 - Google Patents

熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 Download PDF

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JP5599561B2
JP5599561B2 JP2008320024A JP2008320024A JP5599561B2 JP 5599561 B2 JP5599561 B2 JP 5599561B2 JP 2008320024 A JP2008320024 A JP 2008320024A JP 2008320024 A JP2008320024 A JP 2008320024A JP 5599561 B2 JP5599561 B2 JP 5599561B2
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optical semiconductor
resin composition
thermosetting resin
semiconductor element
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JP2010047741A (ja
JP2010047741A5 (enExample
Inventor
勇人 小谷
直之 浦崎
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008320024A 2008-07-22 2008-12-16 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 Active JP5599561B2 (ja)

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JP2008320024A JP5599561B2 (ja) 2008-07-22 2008-12-16 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置

Applications Claiming Priority (3)

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JP2008188406 2008-07-22
JP2008188406 2008-07-22
JP2008320024A JP5599561B2 (ja) 2008-07-22 2008-12-16 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置

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JP2010047741A JP2010047741A (ja) 2010-03-04
JP2010047741A5 JP2010047741A5 (enExample) 2011-12-01
JP5599561B2 true JP5599561B2 (ja) 2014-10-01

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5711209B2 (ja) 2010-03-04 2015-04-30 高砂香料工業株式会社 均一系不斉水素化触媒
JP6045774B2 (ja) * 2010-03-16 2016-12-14 日立化成株式会社 半導体封止充てん用エポキシ樹脂組成物、半導体装置、及びその製造方法
JP5533203B2 (ja) * 2010-04-30 2014-06-25 日亜化学工業株式会社 発光装置および発光装置の製造方法
CN103408930B (zh) 2011-01-28 2016-06-29 可乐丽股份有限公司 反射板用聚酰胺组合物、反射板、具备该反射板的发光装置、以及具备该发光装置的照明装置和图像显示装置
JP5838790B2 (ja) * 2011-12-22 2016-01-06 日本ゼオン株式会社 光反射部材用樹脂組成物、光反射部材及び発光素子
EP2980836A1 (en) * 2013-03-28 2016-02-03 Nitto Denko Corporation Method for manufacturing optical semiconductor device, system, manufacturing conditions determination device, and manufacturing management device
KR101627019B1 (ko) * 2013-10-10 2016-06-03 제일모직주식회사 반도체 소자 밀봉용 에폭시수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
JP2017501577A (ja) * 2014-01-07 2017-01-12 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 発光デバイスパッケージ
JP6451579B2 (ja) * 2015-09-30 2019-01-16 日亜化学工業株式会社 発光装置
JP6917707B2 (ja) * 2016-12-27 2021-08-11 サンアプロ株式会社 エポキシ樹脂硬化促進剤
JP7659329B2 (ja) * 2020-07-30 2025-04-09 日東化成株式会社 重合体の硬化に用いる硬化触媒及びその製造方法、湿気硬化型組成物、硬化物の製造方法

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Publication number Priority date Publication date Assignee Title
JP4475771B2 (ja) * 2000-08-08 2010-06-09 日本化学工業株式会社 光半導体封止用エポキシ樹脂組成物
JP2005054060A (ja) * 2003-08-04 2005-03-03 Hokko Chem Ind Co Ltd 熱硬化性エポキシ樹脂用硬化促進剤および高温熱硬化用潜在型エポキシ樹脂組成物
CN101268559B (zh) * 2005-08-04 2010-11-17 日亚化学工业株式会社 发光装置及其制造方法以及成形体及密封构件
JP4802667B2 (ja) * 2005-11-08 2011-10-26 住友金属鉱山株式会社 エポキシ樹脂接着組成物及びそれを用いた光半導体用接着剤
JP2007256545A (ja) * 2006-03-23 2007-10-04 Konica Minolta Holdings Inc 表示素子
JP5298468B2 (ja) * 2006-09-26 2013-09-25 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
EP2465887A4 (en) * 2009-08-10 2015-12-23 Mitsubishi Gas Chemical Co THERMOSETTING RESIN COMPOSITION FOR SURFACE PROTECTION LAYERS

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