JP5588015B2 - 矩形ワーク搬送装置及び矩形ワーク処理装置 - Google Patents
矩形ワーク搬送装置及び矩形ワーク処理装置 Download PDFInfo
- Publication number
- JP5588015B2 JP5588015B2 JP2012540765A JP2012540765A JP5588015B2 JP 5588015 B2 JP5588015 B2 JP 5588015B2 JP 2012540765 A JP2012540765 A JP 2012540765A JP 2012540765 A JP2012540765 A JP 2012540765A JP 5588015 B2 JP5588015 B2 JP 5588015B2
- Authority
- JP
- Japan
- Prior art keywords
- rectangular workpiece
- conveying
- rectangular
- pair
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H9/00—Registering, e.g. orientating, articles; Devices therefor
- B65H9/16—Inclined tape, roller, or like article-forwarding side registers
- B65H9/163—Tape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2404/00—Parts for transporting or guiding the handled material
- B65H2404/20—Belts
- B65H2404/22—Cross section profile
- B65H2404/221—Round belt
- B65H2404/2211—Multiplicity of round belts spaced out each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2404/00—Parts for transporting or guiding the handled material
- B65H2404/20—Belts
- B65H2404/26—Particular arrangement of belt, or belts
- B65H2404/269—Particular arrangement of belt, or belts other arrangements
- B65H2404/2691—Arrangement of successive belts forming a transport path
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Attitude Control For Articles On Conveyors (AREA)
- Registering Or Overturning Sheets (AREA)
- Framework For Endless Conveyors (AREA)
Description
2−ガイド
3−補助搬送部材
10−矩形ワーク搬送装置
21−当接面
31−無端ベルト(補助搬送部材)
100−矩形ワーク
200−矩形ワーク処理装置
220A,220B−撮像装置(処理部)
Claims (3)
- 矩形ワークの搬送方向に平行にして配置され、同一平面内に位置するそれぞれの上面に矩形ワークが載置される一対の搬送部材と、
前記同一平面内で前記搬送方向に直交する直交方向における前記一対の搬送部材の一方の外側の位置に配置され、前記搬送方向に沿う当接面を有するガイドと、
前記搬送方向における前記ガイドの当接面が位置する範囲で、前記一対の搬送部材の上面に載置された矩形ワークを前記搬送方向に直交する面内で前記ガイド側が下方となるように徐々に傾斜させる補助搬送部材と、を備え、
前記補助搬送部材は、前記一対の搬送部材の上面に載置された矩形ワークの底面に当接する傾斜面を備え、
前記傾斜面は、前記直交方向について少なくとも搬送方向の上流側の一部を前記一対の搬送部材の間における中央部よりも前記ガイドの配置側の反対側に配置され、前記搬送方向の下流側が、前記ガイドに近接するように前記搬送方向に対して傾斜し、かつ前記同一平面よりも上方に位置するように傾斜して配置された矩形ワーク搬送装置。 - 前記補助搬送部材は、少なくとも一対のローラに張架された無端ベルトであって外周面が前記傾斜面を構成する無端ベルトである請求項1に記載の矩形ワーク搬送装置。
- 請求項1又は2に記載の矩形ワーク搬送装置と、
前記矩形ワークの搬送方向における前記補助搬送部材の下流側で、前記矩形ワーク搬送装置によって搬送される矩形ワークに所定の処理を実行する処理部と、
を備えた矩形ワーク処理装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012540765A JP5588015B2 (ja) | 2010-10-28 | 2011-10-13 | 矩形ワーク搬送装置及び矩形ワーク処理装置 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010241747 | 2010-10-28 | ||
| JP2010241747 | 2010-10-28 | ||
| PCT/JP2011/073511 WO2012056892A1 (ja) | 2010-10-28 | 2011-10-13 | 矩形ワーク搬送装置及び矩形ワーク処理装置 |
| JP2012540765A JP5588015B2 (ja) | 2010-10-28 | 2011-10-13 | 矩形ワーク搬送装置及び矩形ワーク処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2012056892A1 JPWO2012056892A1 (ja) | 2014-03-20 |
| JP5588015B2 true JP5588015B2 (ja) | 2014-09-10 |
Family
ID=45993617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012540765A Expired - Fee Related JP5588015B2 (ja) | 2010-10-28 | 2011-10-13 | 矩形ワーク搬送装置及び矩形ワーク処理装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5588015B2 (ja) |
| TW (1) | TWI443060B (ja) |
| WO (1) | WO2012056892A1 (ja) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100447U (ja) * | 1979-12-28 | 1981-08-07 | ||
| JPS59158728A (ja) * | 1983-02-26 | 1984-09-08 | Katayama Seisakusho:Kk | タイル等の方形ワ−クの整列搬送装置 |
| JPH06183556A (ja) * | 1992-12-21 | 1994-07-05 | Central Glass Co Ltd | ガラス板の位置決め装置 |
| JPH0738037U (ja) * | 1993-12-21 | 1995-07-14 | 日本板硝子株式会社 | 板状部材のアライメント装置 |
-
2011
- 2011-10-13 JP JP2012540765A patent/JP5588015B2/ja not_active Expired - Fee Related
- 2011-10-13 WO PCT/JP2011/073511 patent/WO2012056892A1/ja not_active Ceased
- 2011-10-19 TW TW100137847A patent/TWI443060B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100447U (ja) * | 1979-12-28 | 1981-08-07 | ||
| JPS59158728A (ja) * | 1983-02-26 | 1984-09-08 | Katayama Seisakusho:Kk | タイル等の方形ワ−クの整列搬送装置 |
| JPH06183556A (ja) * | 1992-12-21 | 1994-07-05 | Central Glass Co Ltd | ガラス板の位置決め装置 |
| JPH0738037U (ja) * | 1993-12-21 | 1995-07-14 | 日本板硝子株式会社 | 板状部材のアライメント装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2012056892A1 (ja) | 2014-03-20 |
| TW201242874A (en) | 2012-11-01 |
| TWI443060B (zh) | 2014-07-01 |
| WO2012056892A1 (ja) | 2012-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100504422C (zh) | 太阳能电池的测试系统 | |
| US8961094B2 (en) | Method and device for aligning substrates | |
| TWI383936B (zh) | 基板交換裝置、基板處理裝置及基板檢查裝置 | |
| KR101454823B1 (ko) | 외관 검사 장치 | |
| KR101967375B1 (ko) | 검사 장치, 및 그 장치를 이용한 검사 방법 | |
| TWI511629B (zh) | 用於對準電子電路板之對準裝置及方法,及用於處理基板之設備 | |
| US20120210839A1 (en) | Cutting apparatus | |
| KR101954416B1 (ko) | 검사 장치 | |
| KR20180063904A (ko) | 기판 반송 장치 | |
| JP2012094770A (ja) | 検査装置および基板の位置決め方法 | |
| KR101967372B1 (ko) | 검사 장치, 및 그 장치를 이용한 검사 방법 | |
| KR101730039B1 (ko) | 평판디스플레이 패널 에지 검사장치 및 방법 | |
| JP5588015B2 (ja) | 矩形ワーク搬送装置及び矩形ワーク処理装置 | |
| US20110127139A1 (en) | Wafer conveying and detecting system and wafer detecting method used in wafer conveying and detecting system | |
| TW201832313A (zh) | 對準裝置 | |
| KR20120003328U (ko) | 표면실장기판 검사장치 | |
| CN207624385U (zh) | 工作台装置、输送装置和半导体制造装置 | |
| KR101669992B1 (ko) | 기판의 양면 검사장치 | |
| KR101111272B1 (ko) | 향상된 정확도를 갖는 전자기기 케이스의 외관 검사장치 | |
| JP6150392B2 (ja) | ウエハ側面検査装置 | |
| JP6893357B2 (ja) | 位置決め装置 | |
| KR101543875B1 (ko) | 기판 이송 장치 및 이를 포함하는 기판 검사 장치 | |
| JP2019038023A5 (ja) | ||
| CN113003178A (zh) | 输送设备、真空输送设备及光学检测设备和光学检测方法 | |
| TWI758383B (zh) | 攝影裝置、凸塊檢查裝置以及攝影方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140325 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140428 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140715 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140724 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5588015 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |