JP5577557B2 - 成形用ダイ - Google Patents

成形用ダイ Download PDF

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Publication number
JP5577557B2
JP5577557B2 JP2010291404A JP2010291404A JP5577557B2 JP 5577557 B2 JP5577557 B2 JP 5577557B2 JP 2010291404 A JP2010291404 A JP 2010291404A JP 2010291404 A JP2010291404 A JP 2010291404A JP 5577557 B2 JP5577557 B2 JP 5577557B2
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Japan
Prior art keywords
die
groove
molding
lower die
punch
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Japanese (ja)
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JP2012136760A5 (cg-RX-API-DMAC7.html
JP2012136760A (ja
Inventor
優 秋山
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Sumitomo Electric Sintered Alloy Ltd
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Sumitomo Electric Sintered Alloy Ltd
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Priority to JP2010291404A priority Critical patent/JP5577557B2/ja
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Publication of JP2012136760A5 publication Critical patent/JP2012136760A5/ja
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JP2010291404A 2010-12-28 2010-12-28 成形用ダイ Active JP5577557B2 (ja)

Priority Applications (1)

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JP2010291404A JP5577557B2 (ja) 2010-12-28 2010-12-28 成形用ダイ

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JP2010291404A JP5577557B2 (ja) 2010-12-28 2010-12-28 成形用ダイ

Publications (3)

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JP2012136760A JP2012136760A (ja) 2012-07-19
JP2012136760A5 JP2012136760A5 (cg-RX-API-DMAC7.html) 2013-09-05
JP5577557B2 true JP5577557B2 (ja) 2014-08-27

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ID=46674404

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JP2010291404A Active JP5577557B2 (ja) 2010-12-28 2010-12-28 成形用ダイ

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JP (1) JP5577557B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5804397B2 (ja) 2014-03-25 2015-11-04 住友電工焼結合金株式会社 段付きダイ
DE102016125406A1 (de) * 2016-12-22 2018-06-28 Gkn Sinter Metals Engineering Gmbh Matrize für eine Presse

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58116999A (ja) * 1981-12-29 1983-07-12 Hitachi Powdered Metals Co Ltd 粉末成形における充填方法およびその装置
JPH02114196U (cg-RX-API-DMAC7.html) * 1989-02-23 1990-09-12
JP2006326648A (ja) * 2005-05-26 2006-12-07 Aisin Seiki Co Ltd 粉末成形金型及び粉末成形方法

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JP2012136760A (ja) 2012-07-19

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