JP5577040B2 - Probe card - Google Patents

Description

  The present invention relates to a probe card used for measuring electrical characteristics of a semiconductor device.

  This type of probe card includes a printed circuit board, a reinforcing plate attached to the upper surface of the printed circuit board, upper and lower probes, and a fixing resin for attaching the probe to the lower surface of the printed circuit board. (See Patent Document 1).

JP 2008-205282 A (refer in particular to paragraph 0009 and FIGS. 1 to 3 of the specification)

  The probe card is required to be miniaturized and arranged at a narrow pitch with the recent high integration of semiconductor devices.

  However, it is very difficult to arrange the miniaturized probes at narrow pitch intervals.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a probe card in which probes can be easily arranged at narrow pitch intervals.

In order to solve the above-described problems, a probe card of the present invention includes a rear end portion that extends linearly, an intermediate portion that is connected to the rear end portion and is bent in an approximately L shape, and the intermediate portion. A plurality of first probes having a front end portion connected to each other and bent in a substantially L shape so that the front end faces the opposite side of the rear end portion, a rear end portion extending linearly, and the rear end portion An intermediate portion connected to the intermediate portion and bent into a substantially L shape, and a front end portion connected to the intermediate portion and bent into a substantially L shape so that the front end faces the opposite side of the rear end portion. A plurality of second probes, each having a length from the tip of the front tip to the bent portion shorter than the length from the tip of the first probe to the bent portion; A plurality of first through holes into which a rear end portion of one probe is inserted; Substrate having a plurality of second through holes rear end of the substantially parallel to provided in which and the second probe is inserted into the aligned through holes, the arrangement of the said substrate first through hole A first positioning member fixed substantially in parallel and provided with a plurality of recesses for holding the intermediate portion of the first probe in a row substantially parallel to the first through hole; and the substrate A second positioning member that is fixed between the first and second through holes of the surface to which the first positioning member is fixed and that is taller than the first positioning member. . The end of the second positioning member is provided with a plurality of recesses substantially in parallel with the second through hole. The concave portion of the second positioning member holds the intermediate portion of the second probe so that the tip of the second probe is substantially flush with the tip of the first probe.

In the case of such a probe card , the first probe is positioned and held on the substrate by the concave portion of the first positioning member fixed to the substrate. That is, the first probes can be easily arranged on the substrate at a narrow pitch by simply holding the first probes in the recesses of the first positioning member fixed on the substrate.

Further, the first and second probes are positioned and held on the substrate by the concave portions of the first and second positioning members fixed to the substrate. In other words, the first and second probes can be easily held on the substrate at a narrow pitch by simply holding the first and second probes in the recesses of the first and second positioning members fixed on the substrate. Can be arranged.

The substrate, the first, the first surface of the second positioning member is fixed, the first hole portion that communicates with the second through hole, and is filled in the hole, the first, A structure having a resin portion in which the second probe is fixed to the substrate can be employed.

  The substrate is provided substantially parallel to the first through hole on the first surface, and the first positioning groove into which the first positioning member is fitted, and the first surface of the first surface. Between the first and second through holes, it is possible to have a second positioning groove which is provided substantially in parallel with the first and second through holes and into which the second positioning member is fitted. It is.

It is a schematic sectional drawing of the probe card which concerns on embodiment of this invention. It is an enlarged view of the X part of FIG. 1 of the probe card. It is the schematic perspective view of the 1st, 2nd probe and positioning plate of the probe card, (a) is the perspective view seen from the front upper part, (b) is the perspective view seen from the back lower part. It is the schematic of the 1st, 2nd positioning plate of the probe card, (a) is a perspective view, (b) is a front view. It is a schematic diagram which shows the manufacturing process of the probe card, Comprising: (a) is the bottom view and sectional drawing which show the guide board | substrate of the state before attaching a 1st, 2nd probe and a 1st, 2nd positioning plate. (B) is a bottom view and sectional view showing a state where the first positioning plate is attached to the guide substrate, and (c) is a view showing a state where the first probe is attached to the first positioning plate. . FIG. 6 is a schematic diagram illustrating a manufacturing process subsequent to FIG. 5 of the card of the probe, where (a) is a diagram illustrating a state in which the first probe and the first positioning plate are resin-fixed to the lower surface of the guide substrate; FIG. 4B is a diagram showing a state where the second positioning plate is attached to the guide substrate, and FIG. 5C is a diagram showing a state where the second probe is attached to the second positioning plate. FIG. 7 is a schematic diagram illustrating a manufacturing process subsequent to FIG. 6 of the card of the probe, in which (a) is a diagram in which the first and second probes and the first and second positioning plates are resin-fixed to the lower surface of the guide substrate. The figure which shows a state, (b) is a figure which shows the state by which the 1st, 2nd probe was resin-fixed on the upper surface of a guide board, (c) is the state in which the 1st, 2nd probe was connected to the main board | substrate. FIG. It is a schematic sectional view showing a design change example of a probe card, and is a view showing an example in which first, second, third, and fourth probes and a positioning plate are provided. It is a schematic sectional view showing another design change example of the probe card, and shows an example in which the second, third and fourth positioning plates are positioned by the first, second and third probes. . It is a schematic sectional drawing which shows another example of a design change of the probe card | curd, Comprising: It is a figure which shows the example by which a 1st, 2nd, 3rd, 4th probe is connected to a guide board | substrate. It is the schematic which shows another example of a design change of the probe card, Comprising: (a) is sectional drawing of the probe card provided with the 1st, 2nd probe by which the intermediate part is not bent, (b) is 2nd. It is a perspective view of this positioning plate. It is a schematic perspective view which shows the example of a design change of the positioning plate of the probe card.

  A probe card according to an embodiment of the present invention will be described below with reference to FIGS. 1 is a schematic cross-sectional view of a probe card according to an embodiment of the present invention, FIG. 2 is an enlarged view of a portion X of FIG. 1 of the probe card, and FIG. 3 is a diagram illustrating first and second probes of the probe card. It is the schematic of a positioning plate, (a) is the perspective view seen from front upper direction, (b) is the perspective view seen from back lower surface, FIG. 4 is the outline of the 1st, 2nd positioning plate of the probe card. FIG. 3A is a perspective view, FIG. 3A is a perspective view, and FIG.

The probe card shown in FIG. 1 includes a main board 100, a reinforcing plate 200, a holding member 300, a guide board 400 ( a board in claims) , a plurality of first and second probes 500a and 500b, and two fixing resins. 600 and two first and second positioning plates 700a and 700b (positioning members) are provided. Hereinafter, each part of the probe card will be described in detail.

  The probe card is used for measuring various electrical characteristics of the semiconductor device 10 in which the plurality of electrodes 11 are arranged in two rows.

  As shown in FIGS. 2 and 3, each first probe 500a is formed by bending a cylindrical metal needle such as tungsten. The first probe 500a includes a tip portion 510a bent downward in a substantially L shape, an intermediate portion 520a bent upward in a substantially L shape, and a linear rear end portion 530a. Have

  As shown in FIGS. 2 and 3, each second probe 500b is formed by bending a cylindrical metal needle such as tungsten. The second probe 500b includes a tip portion 510b bent downward in a substantially L shape, an intermediate portion 520b bent upward in a substantially L shape, and a linear rear end portion 530b. Have

  The first and second probes 500a and 500b are different in the following points. The length from the tip of the tip portion 510b to the bent portion 511b is shorter than the length from the tip of the tip portion 510a to the bent portion 511a (substantially half in this embodiment). The length from the bent portion 511b of the tip portion 510b to the bent portion 521b of the intermediate portion 520b is longer than the length from the bent portion 511a of the tip portion 510a to the bent portion 521a of the intermediate portion 520a. The length from the bent portion 521b of the intermediate portion 520b to the end of the rear end portion 530b is longer than the length from the bent portion 521a of the intermediate portion 520a to the end of the rear end portion 530a.

  In the present embodiment, the intermediate portions 520a and 520b and the rear end portions 530a and 530b have a diameter of 0.09 mm. The tip portions 510 a and 510 b are tapered, and the tips can contact the electrode 11 of the semiconductor device 10.

  The guide substrate 400 is a plate-like body made of ceramic. As shown in FIG. 1, a substantially rectangular hole 410 is provided at the center of the guide substrate 400.

  On the lower surface (first surface) of both edge portions of the hole portion 410 of the guide substrate 400, as shown in FIG. 2 and FIG. 5A to be described later, first and second positioning grooves 420a and 420b which are long grooves. Are arranged substantially parallel to each other. In addition, a plurality of first and second through holes 430a and 430b are respectively disposed substantially parallel to the first and second positioning grooves 420a and 420b at both edge portions of the guide substrate 400. As shown in FIG. 5, the first through holes 430a and the second through holes 430b are staggered in a plane position. The outer diameters of the first and second through holes 430a and 430b are slightly larger than the diameters of the intermediate portions 520a and 520b of the first and second probes 500a and 500b. That is, the upper portions of the bent portions 521a and 521b of the intermediate portions 520a and 520b of the first and second probes 500a and 500b are inserted into the first and second through holes 430a and 430b, respectively.

  The pitch interval between the first and second through holes 430a and 430b is 5 mm. Further, as shown in FIG. 2, the distance D1 between the first through-hole 430a and the second through-hole 430b is such that the bent portion of the intermediate portion 520a is bent from the bent portion 511a of the tip portion 510a of the first probe 500a. It is set to be the same as the difference between the length up to 521a and the length from the bent portion 511b of the distal end portion 510b of the second probe 500b to the bent portion 521b of the intermediate portion 520b. Therefore, when the upper portions of the intermediate portions 520a and 520b of the first and second probes 500a and 500b are respectively inserted into the first and second through holes 430a and 430b, the distal ends of the probes 500a and 500b are inserted. 510a and 510b are alternately arranged in a line.

  Holes 440 are provided in the upper surface (second surface) of both edge portions of the guide substrate 400. The hole 440 is a long hole extending in the same direction as the first and second positioning grooves 420a and 420b, and communicates with the first and second through holes 430a and 430b. Further, the hole portion 440 is filled with the resin 450, and the upper portions of the intermediate portions 520a and 520b of the first and second probes 500a and 500b inserted into the first and second through holes 430a and 430b are the resin 450. Thus, the guide substrate 400 is fixed. As the resin 450, a resin that is an insulating resin is used.

  As shown in FIGS. 2 to 4, the first positioning plate 700 a is a plate-like body made of a material having substantially the same thermal expansion coefficient as that of the guide substrate 400 and the semiconductor device 10. In this embodiment, an LCP (liquid crystal polymer) film is used as the first positioning plate 700a. In the present embodiment, the first positioning plate 700a has a height position of about 0.1 mm and a thickness dimension of 0.5 to 0.1 mm.

  The upper end portion of the first positioning plate 700 a is fitted into the first positioning groove 420 a of the guide substrate 400. At the lower end of the first positioning plate 700a, a plurality of substantially U-shaped recesses 710a are arranged in a row at the same pitch interval as the first through holes 430a.

  The width dimension of the recessed part 710a is substantially the same as the diameter of the intermediate part 500a of the first probe 500a. That is, the intermediate portion 500a of the first probe 500a is fitted into the recess 710a. In the present embodiment, the width dimension of the recess 710a is 0.09 mm.

  As shown in FIGS. 2 to 4, the second positioning plate 700 b is a plate-like body made of a material having substantially the same thermal expansion coefficient as that of the guide substrate 400 or the semiconductor device 10. In the present embodiment, the second positioning plate 700b also uses an LCP (liquid crystal polymer) film. The height dimension of the second positioning plate 700b is larger than the height dimension of the first positioning plate 700a. In the present embodiment, the second positioning plate 700b has a height position of about 0.2 to 0.5 mm and a thickness dimension of 0.5 to 0.1 mm.

  The upper end portion of the second positioning plate 700 b is fitted in the second positioning groove 420 b of the guide substrate 400. A plurality of recesses 710b are arranged in a row at the same pitch interval as the second through holes 430b at the lower end of the second positioning plate 700b.

  The width dimension of the recess 710b is substantially the same as the diameter of the intermediate part 500b of the second probe 500b. That is, the intermediate portion 500b of the second probe 500b is fitted into the recess 710b. In the present embodiment, the width dimension of the recess 710b is 0.09 mm.

  As shown in FIG. 4B, the upper end portions of the first and second positioning plates 700a and 700b are fitted into the first and second positioning grooves 420a and 420b of the guide substrate 400 (fitted state). In addition, the recesses 710a and 710b are staggered in front of each other. For this reason, the intermediate portions 520a and 520b of the first and second probes 500a and 500b fitted in the recesses 710a and 710b are also staggered in the same front position.

  Further, in the fitted state, as shown in FIG. 2, the distance D2 from the height position of the bottom portion of the recess 710a to the height position of the bottom portion of the recess 710b is the first and first fitted to the recesses 710a and 710b. The heights of the tips of the tip portions 510a and 510b of the second probes 500a and 500b are set to a distance that aligns downward.

  The fixing resin 600 is intermediate between the first and second probes 500a and 500b fitted in the first and second positioning plates 700a and 700b and the recesses 710a and 710b of the first and second positioning plates 700a and 700b. This is an insulating resin that fixes the bent portions 521 a and 521 b of the portions 520 a and 520 b to the edge portion of the hole portion 410 of the guide substrate 400. In the present embodiment, a resin is used as the fixing resin 600. The fixing resin 600 is obtained by integrating first and second fixing resins 601 and 602, as shown in FIG.

  The main board 100 is a well-known printed board. As shown in FIG. 1, a substantially rectangular hole 110 is provided at the center of the main substrate 100. As shown in FIG. 2, a plurality of first and second through holes 120a and 120b (first and second electrodes) are spaced substantially in parallel at both edges of the hole 110 of the main substrate 100. Are arranged. The outer diameters of the first and second through holes 120a and 120b are the same as the outer diameters of the first and second through holes 430a and 430b, and the same pitch interval as the first and second through holes 120a and 120b. Are arranged concentrically. That is, the first through hole 120a and the second through hole 120b are staggered in plan view. Rear end portions 530a and 530b of the first and second probes 500a and 500b are inserted into the first and second through holes 120a and 120b, respectively, and are soldered.

  A plurality of external electrodes 130 are arranged in a row on both outer edge portions of the main substrate 100. The first and second through holes 120 a and 120 b and the external electrode 130 are electrically connected to each other by an external wiring or an internal wiring on the surface of the main substrate 100.

  The reinforcing plate 200 is attached to the upper surface of the main board 100 as shown in FIG. As the reinforcing plate 200, a plate-like body made of a material harder than the main substrate 100 (for example, stainless steel) is used. The flatness of the main board 100 is maintained by the reinforcing plate 200.

  In addition, a substantially rectangular hole 210 communicating with the hole 110 is provided at the center of the reinforcing plate 200. The outer shape of the hole 210 is smaller than the outer shape of the hole 110. For this reason, the both edge portions of the main substrate 100 are exposed upward from the hole portion 210.

  The holding member 300 is attached to the lower surface of the main board 100 as shown in FIG. The holding member 300 is made of a stainless steel plate.

  A substantially rectangular hole 310 that communicates with the hole 110 is provided at the center of the holding member 300. The outer shape of the hole 310 is larger than the outer shapes of the hole 110 and the hole 410. Therefore, as shown in FIG. 1, both edge portions of the hole portion 410 of the guide substrate 400 face each other edge portion of the hole portion 110 of the main substrate 100 through the hole portion 310. The rear end portions 530a and 530b of the first and second probes 500a and 500b inserted into the first and second through holes 430a and 430b of the guide substrate 400 pass through the hole 310 and the first end of the main substrate 100. The second through holes 120a and 120b are inserted.

  In addition, an attachment recess 320 into which the guide substrate 400 is fitted is provided at the center of the lower surface of the holding member 300. The mounting recess 320 communicates with the hole 310.

  Hereinafter, a method for manufacturing the probe card described above will be described with reference to FIGS. FIG. 5 is a schematic view showing a manufacturing process of the probe card according to the embodiment of the present invention, where (a) is a state before the first and second probes and the first and second positioning plates are attached. (B) is a bottom view and a cross-sectional view showing a state where the first positioning plate is attached to the guide board, and (c) is a first positioning plate for the first probe. FIG. 6 is a schematic view showing a manufacturing process subsequent to FIG. 5 of the card of the probe, and FIG. 6A is a diagram showing the first probe and the first positioning plate of the guide substrate. The figure which shows the state by which resin was fixed to the lower surface, (b) is the figure which shows the state in which the 2nd positioning plate was attached to the guide board, (c) was the 2nd probe to which the 2nd positioning plate was attached. Indicate state FIG. 7 is a schematic view showing a manufacturing process subsequent to FIG. 6 of the card of the probe, wherein FIG. 7A shows the first and second probes and the first and second positioning plates on the lower surface of the guide substrate. The figure which shows the state by which resin was fixed, (b) is the figure which shows the state which the 1st, 2nd probe was resin-fixed on the upper surface of a guide board, (c) is the 1st, 2nd probe on a main board | substrate. It is a figure which shows the state connected.

  First, as shown in FIG. 5B, the first positioning plate 700a is fitted into the first positioning groove 420a on the lower surface of the guide substrate 400 shown in FIG.

  Thereafter, as illustrated in FIG. 5C, the rear end portion 530 a of the first probe 500 a is inserted into the first through hole 430 a of the guide substrate 400. Then, the rear end portion 530a of the first probe 500a is moved straight in the insertion direction. Then, the upper portion of the intermediate portion 520a of the first probe 500a is inserted into the first through hole 430a of the guide substrate 400, and the bent portion 521a of the intermediate portion 520a of the first probe 500a is the first positioning plate. It fits into the recess 710a of 700a.

  After that, as shown in FIG. 6A, the first fixing resin 601 is applied to the bent portion 521a of the intermediate portion 520a and the first positioning plate 700a of the first probe 500a, and the first fixing resin 601 is applied. The bent portion 521a of the intermediate portion 520a of the first probe 500a and the first positioning plate 700a are fixed to the lower surface of the guide substrate 400 by the resin 601.

  After that, as shown in FIG. 6B, the second positioning plate 700b is fitted into the second positioning groove 420b on the lower surface of the guide substrate 400.

  Thereafter, as shown in FIG. 6C, the rear end portion 530 b of the second probe 500 b is inserted into the second through-hole 430 b of the guide substrate 400. Then, the rear end portion 530b of the second probe 500b is moved straight in the insertion direction. Then, the upper portion of the intermediate portion 520b of the second probe 500b is inserted into the first through hole 430b of the guide substrate 400, and the bent portion 521b of the intermediate portion 520b of the second probe 500b is the second positioning plate. It fits into the recess 710b of 700b.

  Thereafter, as shown in FIG. 7A, a second fixing resin 602 is applied to the bent portion 521b of the intermediate portion 520b and the second positioning plate 700b of the second probe 500b, and the second fixing resin 602 is applied. The bent portion 521b of the intermediate portion 520b of the second probe 500b and the second positioning plate 700b are fixed to the lower surface of the guide substrate 400 by the resin 602. At this time, the second fixing resin 602 is integrated with the first fixing resin 601 and becomes the fixing resin 600.

  Thereafter, as shown in FIG. 7B, the guide substrate 400 is turned over. Then, the hole 440 of the guide substrate 400 is filled with the resin 450, and the first and second probes 500a and 500b are fixed to the upper surface of the guide substrate 400.

  After that, as shown in FIG. 7C, the reinforcing plate 200 is attached to the upper surface of the main substrate 100, the holding member 300 is attached to the lower surface of the main substrate 100, and the first, The guide substrate 400 to which the second probes 500a and 500b and the first and second positioning plates 700a and 700b are fixed is fitted.

  At this time, the rear end portions 530a and 530b of the first and second probes 500a and 500b are inserted into the hole portions 310 of the holding member 300, and are inserted into the first and second through holes 120a and 120b of the main board 100, respectively. Is done.

  Thereafter, the rear end portions 530a and 530b of the first and second probes 500a and 500b are solder-connected to the first and second through holes 120a of the main substrate 100, respectively.

  In the case of the probe card manufactured in this way, the upper portion of the intermediate portion 520a of the first probe 500a is inserted into the first through hole 430a of the guide substrate 400, and the first positioning groove 420a of the guide substrate 400 is inserted. The bent portions 521a of the intermediate portion 520a of the first probe 500a are respectively fitted into the recesses 710a of the first positioning member 700a fitted to the first positioning member 700a, and then the second probe is inserted into the second through hole 430b of the guide substrate 400. The upper portion of the intermediate portion 520b of 500b is inserted, and the bent portion of the intermediate portion 520b of the second probe 500b is inserted into the concave portion 710b of the second positioning member 700b fitted into the second positioning groove 420b of the guide substrate 400. The first and second probes 500 can be formed on the lower surface of the guide substrate 400 simply by fitting the respective 521a. It can be arranged at a narrow pitch interval 500b easily alternately.

  Moreover, the bent portions 521a and 521b of the intermediate portions 520a and 520b of the first and second probes 500a and 500b are held by the first and second positioning plates 700a and 700b, and the first and second probes 500a. , 500b, the upper portions of the intermediate portions 520a and 520b are inserted and held in the first and second through holes 430a and 430b of the guide substrate 400, respectively. That is, the first and second probes 500a and 500b are held at two points, the first and second positioning plates 700a and 700b and the first and second through holes 430a and 430b of the guide substrate 400. It is possible to prevent the first and second probes 500a and 500b from rotating in the circumferential direction while being inserted into the first and second through holes 430a and 430b of the guide substrate 400. In addition, since thin LCP (liquid crystal polymer) films are used as the first and second positioning plates 700a and 700b, the recesses 710a and 710b can be easily opened at narrow pitch intervals, and the cost of lowering can be reduced. There is also an advantage of being able to.

  Further, LCP films having the same thermal expansion coefficient as the guide substrate 400 and the semiconductor device 10 are used as the first and second positioning plates 700a and 700b. For this reason, even if this probe card is used to measure the electrical characteristics of the semiconductor device 10 in a high temperature environment, the first and second positioning plates 700a and 700b are connected to the guide substrate 400 and the semiconductor device 10. Similarly, the first and second positioning plates 700a and 700b and the guide substrate 400 and the semiconductor device 10 are attached to the first and second positioning plates 700a and 700b by performing different thermal expansion. Further, it is possible to prevent the tip positions of the tip portions 510a and 510b of the first and second probes 500a and 500b from being shifted to a position where they do not contact the electrode 11 of the semiconductor device 10.

  The probe card described above is not limited to the above embodiment, and can be arbitrarily changed in design within the scope of the claims. Details will be described below. FIG. 8 is a schematic cross-sectional view showing a design change example of the probe card according to the embodiment of the present invention, and shows an example in which first, second, third, and fourth probes and a positioning plate are provided. FIG. 9 is a schematic cross-sectional view showing another example of design change of the probe card, in which the second, third, and fourth positioning plates are positioned by the first, second, and third probes. FIG. 10 is a schematic cross-sectional view showing another design change example of the probe card, and shows an example in which the first, second, third, and fourth probes are connected to the guide substrate. FIG. 11 is a schematic view showing another design change example of the probe card, in which (a) is a cross-sectional view of the probe card including the first and second probes in which the intermediate portion is not bent; ) Is a perspective view of the second positioning plate, and FIG. 12 is the probe card. It is a schematic perspective view illustrating a design modification of the positioning plate.

  The probe card includes the first and second probes 500a and 500b. However, the probe card may include three or more types of probes having different lengths from the distal end to the bent portion. For example, as shown in FIG. 8, it is possible to change the design so that the probe card includes first, second, third, and fourth probes 500a, 500b, 500c, and 500d. In this case, the first, second, third, and fourth positioning plates 700a according to the number of types of the first, second, third, and fourth probes 500a, 500b, 500c, and 500d (here, 4). , 700b, 700c, and 700d. The height dimensions of the first, second, third, and fourth positioning plates 700a, 700b, 700c, and 700d are the tip portions of the first, second, third, and fourth probes 500a, 500b, 500c, and 500d. What is necessary is just to select and set suitably according to the length from the front-end | tip of 510a, 510b, 510c, 510d to bending part 511a, 511b, 511c, 511d.

  In the above embodiment, the first and second positioning plates 700a and 700b are fitted in the first and second positioning grooves 420a and 420b, and then the first and second positioning plates 700a and 700b are moved to the first. Although the second probes 500a and 500b are attached, the first and second positioning plates 700a and 700b are attached to the first and second positioning plates 700a and 700b. The plates 700a and 700b may be fitted into the first and second positioning grooves 420a and 420b. In this case, all the first and second probes 500a and 500b can be inserted into the first and second through holes 430a and 430b of the guide substrate 400 at a time.

  In the above embodiment, the first and second positioning grooves 420a and 420b into which the first and second positioning plates 700a and 700b are fitted are provided on the guide substrate 400. However, the present invention is not limited to this. Is not to be done. For example, as shown in FIG. 9, after only the first positioning plate 700a is fitted in the positioning groove 420 of the guide substrate 400, the first probe 500a is attached to the first positioning plate 700a, and then the first The second positioning plate 700b is brought into contact with the intermediate portion 520a of the first probe 500a to position the lower surface of the guide substrate 400, and in this state, the second probe 500b can be attached to the second positioning plate 700b. . Note that the third and fourth positioning plates 700c and 700d are brought into contact with the intermediate portions 520b and 520b of the second and third probes 500b and 500c in the same manner as the second positioning plate 700b. The third and fourth probes 500c and 500d may be attached after positioning on the lower surface. In this case, since only one positioning groove 420 needs to be provided in the guide substrate 400, the number of processing steps for the guide substrate 400 can be reduced. Also in this case, as described above, after the probe is attached to the positioning plate, it can be positioned on the lower surface of the guide substrate by abutting against the intermediate portion of the preceding probe.

  In the above embodiment, the first and second probes 500a and 500b are connected to the first and second through holes 120a and 120b of the main board 100. However, the present invention is not limited to this. Absent. For example, as shown in FIG. 10, the first and second through holes 430a, 430b, 430c, and 430d of the guide substrate 400 are plated through holes, and the first and second through holes 430a, 430b, 430c, and 430d are formed. The rear ends 530a and 530b of the first and second probes 500a, 500b, 500c, and 500d may be connected. In this case, since the guide substrate 400 also serves as the main substrate 100, the main substrate 100 can be omitted. The design change in this paragraph can also be applied to the example described in paragraph 0062.

  When the guide substrate also serves as the main substrate in this way, as shown in FIG. 11A, the first and second probes 500a ′ and 500′b are substantially L only at the tip portions 510a ′ and 510b ′. What was bent in the shape of a character can be used. In this case, an opening 720b ′ for allowing the first probe 500a ′ to pass therethrough is provided at the upper end of the second positioning plate 700b ′, and after the first and second probes 500a ′ and 500′b. The end portions 530a ′ and 530b ′ are connected to the first and second electrodes 460a ′ and 460b ′ of the guide substrate 400 ′. The design change in this paragraph can also be applied to the example described in paragraph 0062.

  In the above embodiment, the first and second probes 500a and 500b are arranged so that the tips thereof are arranged in a line. However, the tips of the first and second probes 500a and 500b are arranged in a row. It is also possible to arrange them side by side. In other words, the first and second probes 500a and 500b can be arranged so that their tips are arranged in two rows.

  Although the main substrate 100 is provided with the first and second through holes 120a and 120b, it is possible to provide an electrode pattern or the like printed on the surface of the main substrate 100 instead. .

The holding member 300 may be omitted when the above-described guide substrate 400 also serves as the main substrate 100. The reinforcing plate 200 can also be omitted when it is not necessary to reinforce the main board 100. Further, when the guide substrate 400 also serves as the main substrate 100, the reinforcing plate 200 can be attached to the guide substrate 400.
The design change in this paragraph can be applied to the probe card described in paragraph 0074.

  The design of the first and second positioning plates 700a and 700b can be arbitrarily changed as long as the recesses capable of holding at least the first and second probes are provided in a row. Therefore, the first and second positioning plates do not need to be plate-like bodies. Of course, it is possible to use a film other than the liquid crystal polymer film as the first and second positioning plates. In addition, the concave portions 710a and 710b are substantially U-shaped, but may be any shape that can hold the probe. For example, as shown in FIG. 12, it may be substantially V-shaped.

  In the above embodiment, the fixing resin 600 is the one in which the first and second fixing resins 601 and 602 are integrated. However, the present invention is not limited to this. After the first and second probes 500a and 500b are attached to the first and second positioning plates 700a and 700b, they may be fixed to the guide substrate 400 at once with the fixing resin 600. Of course, the first and second fixing resins 601 and 602 are not integrated, and the first probe 500a and the first positioning plate 700a are used for the second fixing with the first and second fixing resins 601. The second probe 500b and the second positioning plate 700b may be fixed to the guide substrate 400 with the resin 602.

  In the above embodiment, the resin 450 is filled in the hole 440 of the guide substrate 400 after the first and second probes 500a and 500b are fixed to the guide substrate 400 with the fixing resin 600. It is not limited to. For example, after the intermediate portion of the second probe is inserted into the second through hole of the guide substrate, the resin 450 is filled in the hole portion of the guide substrate to fix the first and second probes to the guide substrate. Alternatively, after inserting the intermediate portion of the first probe into the first through hole of the guide substrate, the resin 450 is filled into the hole portion of the guide substrate to fix the first probe to the guide substrate. After inserting the intermediate portion of the second probe into the second through hole of the guide substrate, the resin 450 may be filled into the hole of the guide substrate to fix the second probe to the guide substrate. . In the latter case, the guide substrate may be provided with two hole portions that communicate with the first and second through holes, respectively, and may be filled.

  For the fixing resin 600 and the resin 450, the first and second probes are fitted in the recesses of the first and second positioning plates, and the first and second positioning plates are the first of the guide substrate. If it is firmly attached to the guide substrate by fitting in the second positioning groove, it can be omitted.

  In the above embodiment, the materials, shapes, dimensions, etc. constituting each part of the probe card have been described as examples, and can be arbitrarily changed as long as the same function can be realized. .

100 main substrate 120a, 120b first and second through holes 400 guide substrate ( substrate in claims)
420a, 420b First and second positioning grooves 430a, 430b First and second through holes 440 Hole part 450 Resin 500a, 500b First and second probes 510a, 510b Tip part 520a, 520b Intermediate part 530a, 530b Rear end portion 600 Fixing resin 601 and 602 First and second fixing resins 700a and 700b First and second positioning plates 710a and 710b Recess

Claims (3)

A rear end portion extending linearly, an intermediate portion connected to the rear end portion and bent in a substantially L shape, and connected to the intermediate portion so that the front end faces the opposite side of the rear end portion. A plurality of first probes having tips that are bent in a substantially L-shape;
A rear end portion extending linearly, an intermediate portion connected to the rear end portion and bent in a substantially L shape, and connected to the intermediate portion so that the front end faces the opposite side of the rear end portion. A tip portion bent in a substantially L shape, and a length from the tip of the front tip portion to the bent portion is shorter than a length from the tip of the tip portion of the first probe to the bent portion. A second probe,
A plurality of first through-holes provided in a row and having a rear end portion of the first probe inserted therein, and provided substantially parallel to the arrangement of the first through-holes and the second A substrate having a plurality of second through holes into which the rear end portions of the probes are inserted,
A plurality of recesses fixed to the first surface of the substrate substantially in parallel with the first through-holes and holding the intermediate portion of the first probe substantially in parallel with the first through-holes. A first positioning member provided in a row;
And a second positioning member that is fixed between the first and second through holes of the first surface of the substrate and is taller than the first positioning member,
The end of the second positioning member is provided with a plurality of recesses substantially in parallel with the second through hole,
The concave portion of the second positioning member holds the intermediate portion of the second probe so that the tip of the second probe is substantially the same height as the tip of the first probe. Probe card. The probe card according to claim 1,
The substrate has the first surface to which the first and second positioning members are fixed,
A hole communicating with the first and second through holes;
And a probe card filled in the hole and having the first and second probes fixed to the substrate.   The probe card according to claim 1 or 2,
  A first positioning groove provided on the first surface substantially parallel to the first through hole and fitted with the first positioning member;
    And the 2nd positioning which the said 2nd positioning member fitted and the said 2nd positioning member fitted between the said 1st, 2nd through-hole of the said 1st surface between the said 1st, 2nd through-hole. Has a groove
  A probe card characterized by that.

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