JP5576193B2 - 表面実装エンドキャップを備え接続性を改善した超小型ヒューズ - Google Patents
表面実装エンドキャップを備え接続性を改善した超小型ヒューズ Download PDFInfo
- Publication number
- JP5576193B2 JP5576193B2 JP2010146484A JP2010146484A JP5576193B2 JP 5576193 B2 JP5576193 B2 JP 5576193B2 JP 2010146484 A JP2010146484 A JP 2010146484A JP 2010146484 A JP2010146484 A JP 2010146484A JP 5576193 B2 JP5576193 B2 JP 5576193B2
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- fuse element
- base
- end cap
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 claims description 38
- 230000014759 maintenance of location Effects 0.000 claims description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims description 5
- 230000000295 complement effect Effects 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims 1
- 238000007373 indentation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 13
- 238000005476 soldering Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000012811 non-conductive material Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 230000001755 vocal effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 201000001880 Sexual dysfunction Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/143—Electrical contacts; Fastening fusible members to such contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
- H01H85/175—Casings characterised by the casing shape or form
Landscapes
- Fuses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/492,621 | 2009-06-26 | ||
| US12/492,621 US8203420B2 (en) | 2009-06-26 | 2009-06-26 | Subminiature fuse with surface mount end caps and improved connectivity |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011009222A JP2011009222A (ja) | 2011-01-13 |
| JP2011009222A5 JP2011009222A5 (enExample) | 2013-07-18 |
| JP5576193B2 true JP5576193B2 (ja) | 2014-08-20 |
Family
ID=43380047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010146484A Expired - Fee Related JP5576193B2 (ja) | 2009-06-26 | 2010-06-28 | 表面実装エンドキャップを備え接続性を改善した超小型ヒューズ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8203420B2 (enExample) |
| JP (1) | JP5576193B2 (enExample) |
| KR (1) | KR20110000506A (enExample) |
| CN (1) | CN101937813B (enExample) |
| TW (1) | TWI475590B (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8629749B2 (en) * | 2010-11-30 | 2014-01-14 | Hung-Chih Chiu | Fuse assembly |
| US8941461B2 (en) | 2011-02-02 | 2015-01-27 | Tyco Electronics Corporation | Three-function reflowable circuit protection device |
| US9455106B2 (en) * | 2011-02-02 | 2016-09-27 | Littelfuse, Inc. | Three-function reflowable circuit protection device |
| JP5771057B2 (ja) * | 2011-04-22 | 2015-08-26 | 矢崎総業株式会社 | ヒューズ |
| US9196445B2 (en) * | 2011-07-05 | 2015-11-24 | Cooper Technologies Company | Electric fuse with torque restricting terminals |
| CN103972002B (zh) * | 2012-05-10 | 2016-02-10 | 苏州晶讯科技股份有限公司 | 防拉弧贴装型熔断器 |
| JP6437239B2 (ja) | 2013-08-28 | 2018-12-12 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子 |
| CN103839737B (zh) * | 2014-02-28 | 2016-03-30 | 南京萨特科技发展有限公司 | 表面贴装熔断器及其制造方法 |
| JP5878651B2 (ja) * | 2015-01-05 | 2016-03-08 | 釜屋電機株式会社 | チップヒューズとその製造方法 |
| DE202015101840U1 (de) * | 2015-04-15 | 2015-04-30 | Inter Control Hermann Köhler Elektrik GmbH & Co. KG | Schmelzsicherungsbauelement |
| TWI695402B (zh) * | 2015-05-19 | 2020-06-01 | 日商釜屋電機有限公司 | 片式熔斷器及其製造方法 |
| US10032583B2 (en) * | 2016-02-17 | 2018-07-24 | Dexerials Corporation | Protective circuit substrate |
| US10325744B2 (en) | 2016-06-01 | 2019-06-18 | Littelfuse, Inc. | Hollow fuse body with notched ends |
| US10276338B2 (en) * | 2016-06-01 | 2019-04-30 | Littelfuse, Inc. | Hollow fuse body with trench |
| JP6886810B2 (ja) * | 2016-12-12 | 2021-06-16 | デクセリアルズ株式会社 | 保護素子 |
| CN106848767A (zh) * | 2017-03-29 | 2017-06-13 | 上海航天科工电器研究院有限公司 | 一种双保险丝及led组件的保险盒 |
| US10283307B2 (en) * | 2017-04-05 | 2019-05-07 | Littelfuse, Inc. | Surface mount fuse |
| JP2020507884A (ja) * | 2017-11-27 | 2020-03-12 | 功得電子工業股▲分▼有限公司Conquer Electoronics Co.,Ltd. | ヒューズにおけるヒューズ線固定構造 |
| EP3803932B1 (en) * | 2018-06-06 | 2023-11-29 | Littelfuse, Inc. | Low profile integrated fuse module |
| US11101093B2 (en) | 2019-01-21 | 2021-08-24 | Littelfuse, Inc. | Fuses and methods of forming fuses |
| KR102066173B1 (ko) * | 2019-05-14 | 2020-01-14 | 한국단자공업 주식회사 | 링 이탈 방지 구조를 갖는 고전압 퓨즈 |
| JP7339071B2 (ja) * | 2019-08-29 | 2023-09-05 | デクセリアルズ株式会社 | 保護素子、バッテリパック |
| JP7390825B2 (ja) * | 2019-08-29 | 2023-12-04 | デクセリアルズ株式会社 | 保護素子、バッテリパック |
| US11869738B2 (en) * | 2019-09-13 | 2024-01-09 | Tridonic Gmbh & Co Kg | Conducting track fuse |
| CN111613494B (zh) * | 2020-07-09 | 2025-07-15 | 唐山航宇电力电子设备有限公司 | 一种用于小功率电源可调节的贴片式熔断器 |
| US12027337B2 (en) * | 2022-01-18 | 2024-07-02 | Littelfuse, Inc. | Fuse design |
| US11804353B1 (en) * | 2022-07-26 | 2023-10-31 | Littelfuse, Inc. | Fuse body with notched ends |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4158187A (en) * | 1977-08-05 | 1979-06-12 | Gould Inc. | Means for affixing ferrules to a fuse casing |
| US4208645A (en) * | 1977-12-09 | 1980-06-17 | General Electric Company | Fuse employing oriented plastic and a conductive layer |
| JPS5921500Y2 (ja) * | 1982-03-19 | 1984-06-25 | 三王株式会社 | リ−ド付き超小型ヒュ−ズ |
| US4608548A (en) * | 1985-01-04 | 1986-08-26 | Littelfuse, Inc. | Miniature fuse |
| US4612529A (en) * | 1985-03-25 | 1986-09-16 | Cooper Industries, Inc. | Subminiature fuse |
| NL8501004A (nl) * | 1985-04-04 | 1986-11-03 | Littelfuse Tracor | Smeltveiligheid. |
| JPS6456135U (enExample) * | 1987-10-01 | 1989-04-07 | ||
| US4972169A (en) * | 1988-06-09 | 1990-11-20 | Cooper Industries, Inc. | Spiral wound sand fuse |
| US4894633A (en) * | 1988-12-12 | 1990-01-16 | American Telephone And Telegraph Company | Fuse Apparatus |
| US4962363A (en) * | 1989-04-10 | 1990-10-09 | Littelfuse, Inc. | Surface mountable leadless fuse |
| US4988969A (en) * | 1990-04-23 | 1991-01-29 | Cooper Industries, Inc. | Higher current carrying capacity 250V subminiature fuse |
| JPH0629878Y2 (ja) * | 1990-10-11 | 1994-08-10 | エス・オー・シー株式会社 | 高遮断超小型ヒューズ |
| US5214406A (en) * | 1992-02-28 | 1993-05-25 | Littelfuse, Inc. | Surface mounted cartridge fuse |
| JPH06342623A (ja) * | 1993-06-01 | 1994-12-13 | S O C Kk | チップヒューズ |
| DE69426344T2 (de) * | 1993-09-14 | 2001-08-09 | Zierick Mfg. Corp., Mount Kisco | Oberflächenmontierter elektrischer Verbinder |
| US5739740A (en) * | 1994-06-29 | 1998-04-14 | Wickmann-Werke Gmbh | Surface mounted fuse with end caps |
| JP3618135B2 (ja) * | 1995-02-15 | 2005-02-09 | コーア株式会社 | ヒューズ |
| WO1997033294A1 (fr) * | 1996-03-05 | 1997-09-12 | Kabushiki Kaisha Sinzetto | Fusible |
| TW345672B (en) * | 1996-08-01 | 1998-11-21 | Bel Fuse Ine | Conductive epoxy fuse and method of making |
| US6147585A (en) * | 1997-01-30 | 2000-11-14 | Cooper Technologies Company | Subminiature fuse and method for making a subminiature fuse |
| US6002322A (en) * | 1998-05-05 | 1999-12-14 | Littelfuse, Inc. | Chip protector surface-mounted fuse device |
| JP3820143B2 (ja) * | 2001-02-16 | 2006-09-13 | エス・オー・シー株式会社 | 表面実装型小型ヒューズ |
| US7436284B2 (en) * | 2002-01-10 | 2008-10-14 | Cooper Technologies Company | Low resistance polymer matrix fuse apparatus and method |
| US7570148B2 (en) * | 2002-01-10 | 2009-08-04 | Cooper Technologies Company | Low resistance polymer matrix fuse apparatus and method |
| JP2004171923A (ja) * | 2002-11-20 | 2004-06-17 | Koa Corp | 電流ヒューズおよびその製造方法 |
| JP2005026188A (ja) | 2003-07-03 | 2005-01-27 | Koa Corp | 電流ヒューズ及び電流ヒューズの製造方法 |
| EP1513179B1 (en) * | 2003-09-03 | 2006-12-20 | Kyoshin Kogyo Co., Ltd | Fuse holder component |
| EP1797576A4 (en) * | 2004-09-15 | 2008-12-10 | Littelfuse Inc | HIGH VOLTAGE / HIGH CURRENT FUSE |
| US20060119465A1 (en) * | 2004-12-03 | 2006-06-08 | Dietsch G T | Fuse with expanding solder |
| KR100689021B1 (ko) * | 2004-12-17 | 2007-03-12 | 스마트전자 주식회사 | 표면실장형 소형 퓨즈 및 그 제조방법 |
| US7564337B2 (en) * | 2005-03-03 | 2009-07-21 | Littelfuse, Inc. | Thermally decoupling fuse holder and assembly |
| US7569907B2 (en) * | 2005-03-28 | 2009-08-04 | Cooper Technologies Company | Hybrid chip fuse assembly having wire leads and fabrication method therefor |
| US8937524B2 (en) * | 2009-03-25 | 2015-01-20 | Littelfuse, Inc. | Solderless surface mount fuse |
-
2009
- 2009-06-26 US US12/492,621 patent/US8203420B2/en active Active
-
2010
- 2010-06-15 TW TW099119565A patent/TWI475590B/zh not_active IP Right Cessation
- 2010-06-22 KR KR1020100059186A patent/KR20110000506A/ko not_active Withdrawn
- 2010-06-25 CN CN201010219828.8A patent/CN101937813B/zh not_active Expired - Fee Related
- 2010-06-28 JP JP2010146484A patent/JP5576193B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011009222A (ja) | 2011-01-13 |
| TW201112300A (en) | 2011-04-01 |
| TWI475590B (zh) | 2015-03-01 |
| US20100328020A1 (en) | 2010-12-30 |
| CN101937813B (zh) | 2015-04-22 |
| US8203420B2 (en) | 2012-06-19 |
| CN101937813A (zh) | 2011-01-05 |
| KR20110000506A (ko) | 2011-01-03 |
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