JP5548059B2 - Circuit element - Google Patents

Description

  The present invention relates to circuit elements used for RF-ID media and the like, and more particularly to the structure of external connection terminals.

  In recent years, with the progress of the information society, information is recorded on a card, and information management and settlement using the card are performed. Information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag. In information management using such a card, label, or tag, a contactless IC chip on which information can be written to or read from the card, label, or tag without contact is mounted. IC cards, non-contact type IC labels, or non-contact type IC tags are rapidly spreading due to their excellent convenience.

  RF-ID media such as a non-contact type IC card, a non-contact type IC label, or a non-contact type IC tag is formed such that a conductive antenna is formed on a base substrate and is connected to the antenna. An inlet on which an IC chip is mounted is sandwiched between a surface sheet and a card substrate.

  7A and 7B are diagrams showing an example of the configuration of an IC chip used for a general RF-ID medium. FIG. 7A is a diagram showing the structure of the back surface, and FIG. 7B is an AA shown in FIG. 'Cross section.

  As shown in FIG. 7, the IC chip in this example has a circuit portion 520 formed on the back surface of a plate-like resin base material 510 and two bumps 530 serving as external connection terminals connected to the circuit portion 520. The chip 501 is formed so as to protrude to one surface side, and the circuit portion 520 is covered with a protective film 550 made of a non-conductive material. The IC chip 501 configured in this manner is connected to a conductive antenna via bumps 530 so that information can be written to and read from the memory in the circuit unit 520 in a non-contact state. become.

  8A and 8B are diagrams showing a configuration example of an inlet in which the IC chip 501 shown in FIG. 7 is used, where FIG. 8A is a view seen from the surface, and FIG. 8B is an AA view shown in FIG. 'Cross section.

  In the inlet 502 in this example, as shown in FIG. 8, two antenna patterns 503a and 503b having an isosceles triangle shape are formed on one surface of a resin sheet 504 made of PET (polyethylene terephthalate) or the like. The antenna portion 503 is formed such that a straight line connecting vertices formed by equal sides is perpendicular to each of the bases of the isosceles triangle and the vertices are arranged with a gap. The IC chip 501 is mounted so as to be connected to the antenna unit 503. The IC chip 501 is adhered to the resin sheet 504 by a conductive adhesive 505 such as ACP (Anisotropic Conductive Paste) applied on the resin sheet 504 and provided on the back surface. The bumps 530 are electrically connected to the antenna portion 503 by contacting the apexes of the antenna patterns 503a and 503b.

  The inlet 502 configured as described above is sandwiched between a surface sheet and a card base and used as an RF-ID medium, and is brought close to an information writing / reading device (not shown) provided outside, The antenna unit 503 resonates with the radio wave from the information writing / reading device, and a current flows. This current is supplied to the IC chip 501, and thereby, from the information writing / reading device to the IC chip 501 in a non-contact state. Information is written or information written in the IC chip 501 is read out by the information writing / reading device via the antenna unit 503.

  As described above, in the IC chip 501 used for the RF-ID media, when the IC chip 501 is mounted on the resin sheet 504, the IC chip 501 protrudes to one surface side in order to be electrically connected to the antenna portion 503. Bumps 530 are used (see, for example, Patent Document 1).

JP 2005-242821 A

  In the IC chip 501 shown in FIGS. 7 and 8, as described above, the bump 530 is used to be electrically connected to the antenna portion 503 when mounted on the resin sheet 504 of the inlet 502. However, the bump 530 is generally formed by adhering a stud type metal to the back surface of the resin base material 510 or by metal plating. Alternatively, it is connected to the circuit portion 520 by wire bonding.

  However, as shown in FIG. 8, when the IC chip 501 is mounted on the resin sheet 504 of the inlet 502, the bumps 530 are in contact with the apexes of the antenna patterns 503a and 503b, and in this state, It is necessary to prevent this part from contacting the resin sheet 504 including the antenna patterns 503a and 503b, and the size and height of the bump 530 must satisfy the conditions. In particular, since the IC chip 501 used for the RF-ID media is about several millimeters in size, high accuracy is required to make the shape of the bump 530 satisfy the above conditions. Furthermore, there is a problem that a fine process for forming such a bump 530 on the resin base material 510 is required.

  The present invention has been made in view of the problems of the prior art as described above, and a circuit part is formed on the surface or inside of a plate-like substrate, and an external connection connected to the circuit part. An object of the present invention is to provide a circuit element that can simplify the process of forming an external connection terminal in a circuit element in which a terminal protrudes on one surface side of a plate-like substrate.

In order to achieve the above object, the present invention provides:
Together with a circuit portion is formed on the front surface of the plate-shaped substrates, a connection to an external connection terminal is protruded on the side of the circuit portion is formed of the plate-like substrate circuit element to the circuit section And
The plate-like substrate is made of a plastically deformable material,
The external connection terminal is plastically deformed so that a part of the area where the circuit part is not formed in the plate-like base material protrudes to the surface side where the circuit part is formed. It is formed by laminating a conductive material conducted to the part.

  In the present invention configured as described above, the plate-like base material is made of a plastically deformable material, and the external connection terminal connected to the circuit portion is a region where the circuit portion is not formed in the plate-like base material. Is formed by laminating a conductive material that is plastically deformed so as to protrude partly on one surface side and is conducted to the circuit portion in that region, so that the external connection terminal is one of the plate-like base materials. The structure protruding to the surface side is realized by plastic deformation of the plate-like base material, and thereby, when forming the external connection terminal, the area where the circuit portion of the plate-like base material is not formed It is only necessary to plastically deform a part of the laminated conductive material conducted to the circuit portion so as to protrude to one side, and to connect the external connection terminal having a predetermined size and height to the plate-like substrate. No need to form by bonding or plating , The step of forming the external connection terminal is simplified.

Further, if the conductive material is made of a material that can follow the plastic deformation of the plate-like substrate, the plate-like substrate is plastically deformed after the conductive material is laminated on the plate-like substrate. Even if it exists, the conductive material will not break.
The plate-like substrate is a shape having a longitudinal direction,
The circuit portion is formed at the center in the longitudinal direction of the surface of the plate-like base material,
The external connection terminals are provided on both sides of the circuit portion in the longitudinal direction .
The plate-like base material is coated with a protective film made of an insulating material in a region other than the external connection terminals on the surface on which the circuit portion is formed.

  As described above, in the present invention, the plate-like base material is made of a plastically deformable material, and the external connection terminal connected to the circuit portion is one of the regions of the plate-like base material where the circuit portion is not formed. When the external connection terminal is formed, the plate-like substrate is formed by forming a conductive material that is plastically deformed so that the portion protrudes on one surface side and is electrically connected to the circuit portion in that region. It is only necessary to plastically deform a portion of the region where the circuit portion of the material is not formed so that the conductive material conducted to the circuit portion is laminated so as to protrude to one surface side. It is not necessary to form the external connection terminal having a height on the plate-like substrate by adhesion, plating, or the like, and the process of forming the external connection terminal can be simplified.

  Further, in the case where the conductive material is made of a material that can follow the plastic deformation of the plate-shaped substrate, even if the plate-shaped substrate is plastically deformed after the conductive material is laminated on the plate-shaped substrate, The conductive material does not break.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows 1st Embodiment of the circuit element of this invention, (a) is a figure which shows the structure of a back surface, (b) is AA 'sectional drawing shown to (a), (c) is It is the A section enlarged view shown in (b). It is a figure for demonstrating the manufacturing method of IC chip shown in FIG. It is sectional drawing which shows the state of the IC chip single-piece | unit in each process shown in FIG. 2A and 2B are diagrams showing an example of the configuration of an inlet using the IC chip shown in FIG. 1, wherein FIG. 2A is a view seen from the surface, FIG. 2B is a cross-sectional view taken along line AA ′ shown in FIG. c) is an enlarged view of part A shown in FIG. It is a figure which shows 2nd Embodiment of the circuit element of this invention, (a) is a figure which shows the structure of a back surface, (b) is A-A 'sectional drawing shown to (a). FIGS. 6A and 6B are diagrams showing a configuration example of an inlet in which the IC chip shown in FIG. 5 is used, in which FIG. 5A is a view seen from the surface, FIG. 5B is a cross-sectional view taken along line AA ′ shown in FIG. c) is an enlarged view of part A shown in FIG. It is a figure which shows one structural example of the IC chip used for a general RF-ID medium, (a) is a figure which shows the structure of a back surface, (b) is AA 'sectional drawing shown to (a). is there. 8A and 8B are diagrams showing an example of the configuration of the inlet using the IC chip shown in FIG. 7, where FIG. 8A is a view seen from the surface, and FIG. 8B is a cross-sectional view taken along line AA ′ shown in FIG. .

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are diagrams showing a first embodiment of a circuit element of the present invention, in which FIG. 1A is a diagram showing a structure of a back surface, FIG. 1B is a cross-sectional view taken along line AA ′ shown in FIG. (C) is the A section enlarged view shown in (b).

  As shown in FIG. 1, the circuit element in this embodiment is formed so that a circuit part 20 is formed on a part of the back surface of the SUS plate 10 serving as a plate-like base material and is electrically connected to a part of the circuit part 20. Two external connection terminals 30 are formed by deforming so that the material 40 is laminated, the circuit portion 20 of the SUS board 10 is not formed, and the region where the conductive material 40 is laminated protrudes to the back surface side. Is formed. The SUS plate 10 is plastically deformable, and after an insulating layer (not shown) is formed on the front and back thereof, the circuit unit 20 is formed by printing or the like, and the conductive material 40 is laminated. In addition, the conductive material 40 is a material in which a conductive material is contained in a soft substance such as an elastomer, and thereby can follow the plastic deformation of the SUS plate 10. In addition, a protective film 50 made of an insulating material is applied to a region other than the two external connection terminals 30 on the surface on which the circuit unit 20 is formed, whereby one of the circuit unit 20 and the conductive material 40 is applied. The part is covered with the protective film 50. The protruding height of the external connection terminal 30 is 30 μm to 50 μm. The IC chip 1 configured as described above is connected to a conductive antenna via the external connection terminal 30 so that information can be written to and read from the memory in the circuit unit 20 in a non-contact state. Will be.

  Below, the manufacturing method of IC chip 1 comprised as mentioned above is explained.

  FIG. 2 is a view for explaining a method of manufacturing the IC chip 1 shown in FIG. 1, and FIG. 3 is a cross-sectional view showing a state of the IC chip 1 alone in each step shown in FIG.

  When the IC chip 1 shown in FIG. 1 is manufactured, first, the circuit unit 20 is arranged in a matrix on one surface of the base substrate 11 having a size that allows a plurality of the SUS boards 10 shown in FIG. Each IC chip 1 is formed (FIGS. 2A and 3A). The circuit unit 20 may be formed by printing, for example.

  Next, on the surface of the base substrate 11 on which the circuit unit 20 is formed, the conductive material 40 is applied to each of the IC chips 1 so as to be electrically connected to the input / output terminals of the IC chip 1 in the circuit unit 20. Thus, the layers are stacked (FIGS. 2B and 3B). Since the input / output terminals of the IC chip 1 are provided at both ends of the circuit unit 20, the conductive material 40 is applied and laminated on both sides of the circuit unit 20 on the surface of the base substrate 11 on which the circuit unit 20 is formed. Will be.

  Next, a protective film 50 made of an insulating material such as an acrylic resin or an epoxy resin is applied on the circuit portion 20 and a part of the conductive material 40 (FIGS. 2C and 3). (C)).

  Thereafter, the base substrate 11 is cut into the SUS plate 10 for each IC chip 1 by performing a press punching process on the base substrate 11, and the conductive material 40 is applied to each of the SUS plates 10. The formed region is plastically deformed so as to protrude toward the surface on which the conductive material 40 is applied. The plastically deformed region of the SUS plate 10 is the external connection terminal 30 for connecting the circuit unit 20 to the outside since the conductive material 40 conducted to the circuit unit 20 is laminated (FIG. 2D, FIG. 3 (d)). At this time, since the conductive material 40 is made of a material that can follow the plastic deformation of the SUS plate 10 as described above, even when the SUS plate 10 is plastically deformed, the conductive material 40 does not break. The external connection terminal 30 is connected to the circuit unit 20. Thus, in the process of cutting the base substrate 11 into each of the SUS plates 10 for each IC chip 1, the external connection terminals 30 are formed by plastic deformation of the SUS plate 10. Since the SUS plate 10 can be plastically deformed, the shape of the external connection terminal 30 is maintained thereafter.

  Hereinafter, the inlet using the IC chip 1 manufactured as described above will be described.

  4A and 4B are diagrams showing a configuration example of an inlet in which the IC chip 1 shown in FIG. 1 is used. FIG. 4A is a view seen from the surface, and FIG. 4B is an AA shown in FIG. 'Cross sectional view, (c) is an enlarged view of part A shown in (b).

  In the inlet 2 in this example, as shown in FIG. 4, two antenna patterns 3a and 3b having an isosceles triangle shape are formed on one surface of a resin sheet 4 made of PET or the like. The antenna portion 3 is formed so that the straight line connecting the vertices formed is perpendicular to each of the bases of the isosceles triangles and the vertices are arranged to have a gap. The IC chip 1 is mounted and configured so as to be connected to 3. The IC chip 1 is adhered to the resin sheet 4 with a conductive adhesive 5 such as ACP applied on the resin sheet 4, and the external connection terminals 30 formed on the back surface of the antenna patterns 3 a and 3 b are connected. By being in contact with each of the apexes, the antenna unit 3 is electrically connected. In the IC chip 1, the external connection terminal 30 protrudes to the back side of the SUS board 10, and the conductive material 40 connected to the circuit unit 20 is coated on the protruding surface. Therefore, only the external connection terminal 30 is an antenna pattern. The antenna unit 3 and the circuit unit 20 can be electrically connected through the external connection terminal 30. In addition, since the protective film 50 is applied to a region other than the two external connection terminals 30, the circuit part 20 is covered with the protective film 50, so that the circuit part 20 is connected to the antenna patterns 3a and 3b. In addition, it is possible to avoid conduction with other conductive patterns formed on the resin sheet 4.

  The inlet 2 configured as described above is sandwiched between a surface sheet and a card substrate and used as an RF-ID medium, and is brought close to an information writing / reading device (not shown) provided outside, The antenna unit 3 resonates with the radio wave from the information writing / reading device, and a current flows. This current is supplied to the IC chip 1, and thereby, the information writing / reading device transfers to the IC chip 1 in a non-contact state. Information is written or information written in the IC chip 1 is read out by the information writing / reading device via the antenna unit 3.

  As described above, in the present embodiment, the SUS plate 10 that can be plastically deformed is used as the base substrate of the IC chip 1, and a part of the SUS plate 10 is plastically deformed, so that the external portion protruding to the back side of the SUS plate 10. Since the connection terminal 30 is formed, it is not necessary to form an external connection terminal having a predetermined size or height on the plate-like base material by bonding or plating, and the process of forming the external connection terminal is simplified. Can do. Further, after forming the circuit portion 20 for each IC chip 1 on the base substrate 11 having a size such that a plurality of SUS plates 10 can be taken, the base substrate 11 is coated with the conductive material 40 and the protective film 50. In the step of cutting the SUS plate 10 for each IC chip 1, the external connection terminal 30 is formed by plastic deformation of the SUS plate 10, so that the step only for forming the external connection terminal 30 is not necessary.

(Second Embodiment)
5A and 5B are diagrams showing a second embodiment of the circuit element of the present invention, in which FIG. 5A is a diagram showing the structure of the back surface, and FIG. 5B is a cross-sectional view taken along line AA ′ shown in FIG. is there.

  In this embodiment, as shown in FIG. 5, the edge portion of the SUS plate 110 is swollen to the side opposite to the side from which the external connection terminal 30 protrudes, as compared with the one shown in the first embodiment. Only the points are different. The shape of the edge portion of the SUS plate 110 is simultaneously formed in a press punching process for cutting the base substrate 11 for each IC chip 1 as shown in FIG.

  6A and 6B are diagrams showing an example of the configuration of the inlet in which the IC chip 101 shown in FIG. 5 is used. FIG. 6A is a view seen from the surface, and FIG. 'Cross sectional view, (c) is an enlarged view of part A shown in (b).

  As shown in the first embodiment, the circuit portion 20 is formed for each IC chip 1 on the base substrate 11 having such a size that a plurality of SUS plates 10 can be taken, and the conductive material 40 and the protective film When the base substrate 11 is cut into the SUS plate 10 for each IC chip 1 after coating 50, an insulating layer is formed on the front and back of the base substrate 11, but the SUS plate is formed on the cut surface. Since 10 itself is exposed, if this cut surface contacts the antenna patterns 3a and 3b, the antenna patterns 3a and 3b may be short-circuited.

  Therefore, as shown in FIG. 5, the edge portion of the SUS board 110 has a shape that rises to the side opposite to the side from which the external connection terminal 30 protrudes, as shown in FIG. It can be avoided that the edge portion of the SUS plate 110 is separated from the antenna patterns 3a and 3b and the cut surface of the SUS plate 110 and the antenna patterns 3a and 3b come into contact with each other.

  Therefore, with such a configuration, even if the protruding height of the external connection terminal 30 is lower than that shown in the first embodiment, the cut surface of the SUS board 110 and the antenna patterns 3a and 3b Can be avoided. For example, in the case shown in the first embodiment, the protruding height of the external connection terminal 30 is 30 μm to 50 μm, but by using the SUS plate 110 having a shape as shown in FIG. The protruding height of the external connection terminal can be 20 μm or less. This has an effect that when the SUS plate 110 is plastically deformed, damage to the circuit unit 20 and the like during deformation can be suppressed.

  In the above-described two embodiments, the IC chips 1 and 101 used for the RF-ID media have been described as examples. However, the circuit element of the present invention has a circuit on the surface or inside of the plate-like substrate. As long as the portion is formed and the external connection terminal connected to the circuit portion protrudes to one surface side of the plate-like base material, it is not limited to such an IC chip.

  Further, the step of laminating the conductive material 40 on the SUS plates 10 and 110 is not limited to the coating as described above.

  In the two embodiments described above, the SUS plates 10 and 110 have been described as examples of the plastically deformable plate-like base material. However, the plate-like base material in the present invention can be plastically deformed. Any film may be used.

DESCRIPTION OF SYMBOLS 1,101 IC chip 2,102 Inlet 3 Antenna part 3a, 3b Antenna pattern 4 Resin sheet 5 Adhesive 10,110 SUS board 11 Base base material 20 Circuit part 30 External connection terminal 40 Conductive material 50 Protective film

Claims (3)

Together with a circuit portion is formed on the front surface of the plate-shaped substrates, a connection to an external connection terminal is protruded on the side of the circuit portion is formed of the plate-like substrate circuit element to the circuit section And
The plate-like substrate is made of a plastically deformable material,
The external connection terminal is plastically deformed so that a part of the area where the circuit part is not formed in the plate-like base material protrudes to the surface side where the circuit part is formed. A circuit element formed by laminating a conductive material conducted to a part. The circuit element according to claim 1,
The plate-like substrate is a shape having a longitudinal direction,
The circuit portion is formed at the center in the longitudinal direction of the surface of the plate-like base material,
The external connection terminal is a circuit element provided on both sides of the circuit portion in the longitudinal direction .   The circuit element according to claim 1 or 2,
  The plate-like substrate is a circuit element in which a protective film made of an insulating material is applied to a region other than the external connection terminals on the surface on which the circuit portion is formed.

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