JP2010267150A - Contactless information recording medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To avoid that information written in an IC chip is carelessly read without breaking part of an antenna and newly providing a switching function, in a contactless information recording medium formed with an electrically conductive antenna on a base substrate, and disposed with the IC chip allowing writing or reading of the information in a non-contact state by connection with the antenna. <P>SOLUTION: The contactless information recording medium is disposed with the IC chip 10 in a position wherein bumps 11 face the antenna patterns 20a, 20b, holds the IC chip 10 on the base substrate 30 such that the bumps 11 come into a non-contact state to the antenna patterns 20a, 20b, and has a covering film 50 capable of being deformable in a direction to which the bumps 11 contact with the antenna patterns 20a, 20b by external force, and restoring to an original shape when application of the external force is lost. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to a non-contact type information recording medium such as a non-contact type IC card and a non-contact type IC label capable of writing and reading information in a non-contact state.

In recent years, with the progress of the information society, information is recorded on a card, and information management and settlement using the card are performed. Information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag. In information management using such a card, label, or tag, a contactless IC chip on which information can be written to or read from the card, label, or tag without contact is mounted. Type I
C cards, non-contact type IC labels, or non-contact type IC tags are rapidly spreading due to their excellent convenience.

In such a non-contact type information recording medium such as a non-contact type IC card, a non-contact type IC label, or a non-contact type IC tag, a conductive antenna is formed on a base substrate and connected to the antenna. The IC chip is mounted on the non-contact type information recording medium, and the antenna is resonated with the radio wave when the device for writing and reading information is brought close to the non-contact information recording medium. In other words, information is written to or read from the IC chip.

However, since information is written to and read from the IC chip simply by bringing a device for writing and reading information to the non-contact type information recording medium close to the IC chip. Information may be read inadvertently, which is undesirable in terms of security.

Here, a non-contact type IC card is considered in which a conductive state can be switched by disconnecting a part of a coiled antenna and providing a switching function in the disconnected part (see, for example, Patent Document 1). ). Thus, by providing a configuration in which a part of the coiled antenna is disconnected and the conduction state is switched, it is possible to prevent the information written in the IC chip from being read inadvertently. .

JP 2001-67447 A

However, in the case where a part of the coiled antenna is disconnected as described above and the conduction state can be switched by providing a switching function in the disconnected part, it is necessary to disconnect a part of the antenna. The communication characteristics of the antenna may change. In addition, since such a switching function is newly provided, a new design part is generated in the non-contact type information recording medium, and it is necessary to take measures against defects in the part. There is.

The present invention has been made in view of the problems of the conventional techniques as described above,
In a non-contact type information recording medium in which a conductive antenna is formed on a base substrate and an IC chip capable of writing and reading information in a non-contact state by being connected to the antenna is disposed. To provide a non-contact type information recording medium that can avoid inadvertently reading out information written in an IC chip without disconnecting a part of the antenna and newly providing a switching function. With the goal.

In order to achieve the above object, the present invention provides:
Non-contact type information recording in which a conductive antenna is formed on a base substrate, and an IC chip capable of writing and / or reading information in a non-contact state by being connected to the antenna is arranged In the medium,
The IC chip is arranged at a position where a terminal connected to the antenna faces the antenna,
The IC chip is held on the base substrate so that the terminals of the IC chip are not in contact with the antenna, the terminal can be deformed in a direction in contact with the antenna by an external force, and an external force It has a holding member that restores to its original shape when no more is applied.

In the present invention configured as described above, when no external force is applied, I
Although the terminal of the C chip is arranged at a position facing the antenna, the IC chip is held by the holding member so that the terminal is not in contact with the antenna. The terminals of the IC chip are not in contact, and therefore the IC chip and the antenna are not conductive. In this state, even if a device for writing and reading information is brought close to the IC chip, information is not written to and read from the IC chip. When an external force is applied from above the holding member, the holding member is deformed in the direction in which the IC chip terminal is in contact with the antenna by the external force, and the IC chip terminal and the antenna are in contact with each other.
The IC chip and the antenna are electrically connected. In this state, when a device for writing and reading information is brought close to the IC chip, a current flows through the antenna, and this current is supplied to the IC chip, and information is written to and read from the IC chip. . After that, when the external force is no longer applied, the holding member is restored to its original shape, the IC chip terminal returns to the state where it is not in contact with the antenna, and a device for writing and reading information is brought close to the IC chip. However, no information is written to or read from the IC chip.

In addition, when the antenna is an antenna that resonates with radio waves, and the IC chip is one in which information is written and / or read when the antenna resonates with radio waves,
Even if the antenna is disconnected and the conduction state is switched, it is actually in a state where communication is possible, and when the device for writing and reading information is brought close to the IC chip, the IC chip There is a possibility that information is written or read. In the present invention, when no external force is applied, the IC chip and the antenna are not conductive. Therefore, even if an apparatus for writing and reading information is brought close to the IC chip, Information is not written or read.

A non-curing resin disposed on the antenna, an IC chip disposed on the non-curing resin, and a holding member disposed on the base substrate so as to cover the IC chip and the non-curing resin; It is conceivable to reduce the thickness.

Such a non-contact type information recording medium is
Forming the antenna on the base substrate;
Placing the non-curing resin on the antenna;
Disposing the IC chip on the non-curing resin so that the terminal faces the antenna;
Setting the distance between the terminal and the antenna to a predetermined distance by pressing the IC chip toward the base substrate;
Disposing the holding member on the base substrate so as to cover the IC chip and the non-curing resin by applying a curable resin to a region of the base substrate including the IC chip and the antenna. It can manufacture by the manufacturing method which has these.

As described above, in the present invention, the IC chip terminals are arranged in a position facing the antenna so that the IC chip is placed in a non-contact state with the antenna on the base substrate. And a holding member that can be deformed in a direction in which the terminal comes into contact with the antenna by an external force and that restores the original shape when the external force is no longer applied, and in the state where the external force is not applied, the IC chip and the antenna are When the external force is applied without conducting, the IC chip and the antenna are conducted. After that, when the external force is not applied, the IC chip and the antenna are not conducted. It is possible to avoid inadvertently reading out information written in the IC chip without providing a new one.

Further, in the case where the antenna is an antenna that resonates with radio waves and the IC chip performs writing and / or reading of information when the antenna resonates with radio waves, the above configuration allows the IC to Even when a device for writing and reading information is brought close to the chip, it is possible to reliably prevent writing and reading of information to and from the IC chip.

It is a figure which shows the structure of the inlet used for 1st Embodiment of the non-contact-type information recording medium of this invention, (a) is a surface figure, (b) is the AA 'cross section shown to (a). FIG. 4C is an enlarged view of a portion B shown in FIG. It is a figure for demonstrating the manufacturing method of the inlet shown in FIG. It is a figure for demonstrating the effect | action of the inlet shown in FIG. 1, (a) is a figure which shows the structure of the surface of the non-contact-type IC tag in which the inlet was incorporated, (b) is the non-shown in (a). The figure which shows the state of IC chip vicinity when the communication button of a contact type IC tag is not pressed down, (c) is the IC chip vicinity when the communication button of the non-contact type IC tag shown in (a) is pressed down It is a figure which shows the state of. It is a figure which shows 2nd Embodiment of the non-contact-type information recording medium of this invention, (a) is a surface figure, (b) is a figure which shows an internal structure, (c) is (a), (b). A-A ′ cross-sectional view shown in FIG. 4B is an enlarged view of a portion B shown in FIG. It is a figure for demonstrating the manufacturing method of the non-contact-type IC tag shown in FIG. FIG. 5 is a diagram for explaining the operation of the non-contact type IC tag shown in FIG. 4, and (a) is a diagram showing a state in the vicinity of the IC chip when the communication button of the non-contact type IC tag is not pressed; b) is a diagram showing a state in the vicinity of the IC chip when the communication button of the non-contact type IC tag is pressed.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a view showing the structure of an inlet used in the first embodiment of the non-contact type information recording medium of the present invention, where (a) is a surface view and (b) is A shown in (a). -A 'sectional view, (c)
FIG. 4 is an enlarged view of part B shown in FIG.

As shown in FIG. 1, the inlet in this embodiment is an abbreviation that constitutes an antenna made of a conductive material on a base substrate 30 made of a resin such as PET, PET-G, or PP, or a paper such as coated paper or high-quality paper. Two triangular antenna patterns 20a and 20b are formed, and the IC chip 10 is arranged in a region facing the two antenna patterns 20a and 20b. In the two antenna patterns 20a and 20b, one vertex of a substantially triangular shape is opposed to each other through a gap, and this vertex is a feeding point. The IC chip 10 has bumps 11 serving as terminals for connection to the antenna patterns 20a and 20b, and the bumps 11 are arranged so as to face the feeding points of the antenna patterns 20a and 20b. In the IC chip 10, when the antenna patterns 20a and 20b resonate with radio waves and a current flows through the antenna patterns 20a and 20b, information is written or read by supplying the current. . As the IC chip 10, any one of those that can only write information, those that can only read information, and those that can write and read information can be used in this embodiment. Further, on the base substrate 30, the non-curing resin 40 is disposed so as to straddle the feeding points of the antenna patterns 20a and 20b. The non-curing resin 40 is made of polyethylene glycol or the like, and its shape is deformable because it is not cured. Further, instead of the non-curing resin 40, it is also conceivable to use a viscous liquid made of glycerin, ethylene glycol, diethylene glycol, dodecanol, prorylene glycol or the like, or a gel made of gelatin or the like. The IC chip 10 is disposed on the non-cured resin 40. Therefore, the bumps 11 of the IC chip 10 are opposed to the feeding points of the antenna patterns 20a and 20b, but are opposed to the antenna patterns 20a and 20b because they are opposed via the non-curing resin 40. A coating film 50 serving as a holding member is disposed on the base substrate 30 so as to cover the IC chip 10 and the non-cured resin 40, and the IC chip 10 is also connected to the terminal by the coating film 50. 11 is held in a non-contact state with respect to the antenna patterns 20a and 20b. The coating film 50 is a coating film made of a curable resin such as a UV curable resin or a thermosetting resin,
In a state where the IC chip 10 is disposed on the non-curing resin 40, the region including the IC chip 10 and the non-curing resin 40 is applied by spray dispensing or coating,
It arrange | positions so that the IC chip 10 and the non-hardening resin 40 may be covered on the base base material 30, and it is in the state which the base part contact | abutted to the base base material 30. FIG. Although the coating film 50 is formed by curing a UV curable resin or a thermosetting resin, the coating film 50 is formed by being applied by spray dispensing or coating. It has a force, can be deformed by an external force, and restores its original shape when no external force is applied. IC
As the chip 10, for example, one having a side of 600 μm and the height of the bump 11 of about 20 μm is used. In this case, the distance between the bump 11 and the antenna patterns 20 a and 20 b is about 40.
The height of the lower surface of the IC chip 10 from the base substrate 30 can be about 60 μm.

  Below, the manufacturing method of the inlet 1 comprised as mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the inlet 1 shown in FIG.

First, two substantially triangular antenna patterns 20a and 20b are formed on the base substrate 30.
It is formed so that one apex of a substantially triangular shape is opposed to each other with a gap (FIG. 2A).
The antenna patterns 20a and 20b may be formed by screen printing using a conductive paste containing a conductive material such as silver, copper, or tin in a resin binder, etching, plating, or the like.

Next, the non-curing resin 40 made of the material as described above is dropped on the base substrate 30 so as to straddle the feeding points of the antenna patterns 20a and 20b, and the antenna patterns 20a and 20b are formed on the base substrate 30. The non-curing resin 40 is disposed so as to straddle the power feeding point (see FIG. 2
b)).

Next, the IC chip 10 is placed on the non-curing resin 40 placed on the base substrate 30 so that the bumps 11 of the IC chip 10 face the feeding points of the antenna patterns 20a and 20b (FIG. 2C). )). In this state, since the IC chip 10 is disposed on the non-curing resin 40, the bump 11 of the IC chip 10 faces the feeding points of the antenna patterns 20a and 20b, but the non-curing resin 40. Since they are opposed to each other, they are not in contact with the antenna patterns 20a and 20b. The non-curing resin 40 and the IC chip 10 are arranged by applying an adhesive on the base substrate 30 and placing the IC chip 10 thereon to bond the IC chip 10 onto the base substrate 30. It can be performed using an apparatus similar to the general process.

Next, by pressing the IC chip 10 disposed on the non-curing resin 40 toward the base substrate 30, the distance between the bump 11 of the IC chip 10 and the antenna patterns 20a and 20b becomes 16 μm as described above. (FIG. 2D).

Thereafter, in a state where the IC chip 10 is disposed on the non-curing resin 40, I of the base substrate 30
A coating film is formed on the base substrate 30 so as to cover the IC chip 10 and the non-curing resin 40 by applying a UV curable resin or a thermosetting resin to the region including the C chip 10 and the non-curing resin 40 and curing it. 50 is arranged (FIG. 2E). When UV curable resin is used, UV curing resin is applied and then cured by irradiating with ultraviolet rays. When a thermocoin resin is used, heat is applied after the thermosetting resin is applied. Harden.

  Below, the effect | action of the inlet 1 manufactured as mentioned above is demonstrated.

3 is a diagram for explaining the operation of the inlet 1 shown in FIG. 1. FIG. 3A is a diagram showing the structure of the surface of the non-contact IC tag in which the inlet 1 is built, and FIG. The figure which shows the state of IC chip 10 vicinity when the communication button 62 of the non-contact-type IC tag 2 shown to a) is not pressed down, (c) is communication of the non-contact-type IC tag 2 shown to (a) It is a figure which shows the state of IC chip 10 vicinity when the button 62 is pressed down.

The inlet 1 shown in FIG. 1 is used in a non-contact type IC tag 2 that is a non-contact type information recording medium as shown in FIG. Non-contact type IC tag 2 shown in FIG.
Is the antenna pattern 20a, 2 of the base substrate 30 in the inlet 1 shown in FIG.
The top sheet 60 is bonded to the surface on which the IC chip 10 is arranged while 0b is formed. The surface sheet 60 has information 61 displayed on the surface thereof, and a communication button 62 for operating the non-contact type IC tag 2 in a region facing the IC chip 10. The communication button 62 may be displayed by printing together with the information 61, or may be displayed by attaching a label or the like.

When the communication button 62 is not pressed with respect to the non-contact type IC tag 2 configured in this way, that is, when no external force is applied, as shown in FIG.
Is disposed on the non-curing resin 40, the bumps 11 of the IC chip 10 are opposed to the feeding points of the antenna patterns 20a and 20b, but are opposed to each other through the non-curing resin 40. The antenna patterns 20a and 20b are not in contact with each other. When no external force is applied, the IC chip 10 is held by the coating film 50 so as to be in a non-contact state with respect to the antenna patterns 20a and 20b. Therefore, in this state, even if a device for writing and reading information is brought close to the IC chip 10 and the antenna patterns 20a and 20b resonate with radio waves from the device and a current flows, the current flows to the IC chip. No information is written to or read from the IC chip 10 in this state.

When the communication button 62 is pressed with respect to the non-contact type IC tag 2, that is, the surface sheet 60.
When an external force is applied from the side, the coating film 50 disposed so as to cover the IC chip 10 and the non-curing resin 40 can be deformed by the external force, and as shown in FIG. However, the bumps 11 of the IC chip 10 are deformed in a direction in contact with the antenna patterns 20a and 20b, and the non-cured resin 40 interposed between the IC chip 10 and the antenna patterns 20a and 20b is also deformed. 10 bumps 11 and the antenna patterns 20a and 20b come into contact with each other. Thereby, the IC chip 10 and the antenna patterns 20a and 20b are electrically connected. In this state, when a device for writing and reading information is brought close to the IC chip 10, a current that flows through the antenna patterns 20 a and 20 b due to radio waves from the device is supplied to the IC chip 10, and the IC chip 10. Information is written to or read from.

After that, when the communication button 62 is not pressed against the non-contact type IC tag 2, that is, when no external force is applied, the coating film 50 is restored to its original shape when no external force is applied. As shown in FIG. 3B, the coating film 50 is restored to its original shape, and the bump 11 of the IC chip 10 and the antenna patterns 20a and 20b return to the state of being opposed to each other with the non-curing resin 40 interposed therebetween. The bumps 11 of the chip 10 are not in contact with the antenna patterns 20a and 20b.

As described above, when the external force is not applied by the coating film 50, the terminal 11 of the IC chip 10 and the antenna patterns 20a and 20b are brought into a non-contact state so as to be in a non-conductive state, and an external force is applied. A terminal 11 of the IC chip 10 and an antenna pattern 20a;
20b is brought into contact with each other so as to be in a conductive state, information written in the IC chip 10 may be read inadvertently without disconnecting a part of the antenna and newly providing a switching function. It can be avoided.

Further, as in this embodiment, the antenna for writing and reading information and the IC chip 10 are antennas in which an antenna composed of two antenna patterns 20a and 20b resonates with radio waves, and the IC chip 10 is the antenna. In the case where information is written or read by resonating with radio waves, communication is actually possible even if the antenna is disconnected and the conduction state is switched. When an apparatus for writing and reading information is brought close to the IC chip 10, there is a possibility that information is written to and read from the IC chip 10. In this embodiment, in the state where no external force is applied, the antenna pattern 20a constituting the antenna with the IC chip 10 is used.
, 20b are not connected to each other, so that information is not written to or read from the IC chip 10 even if a device for writing or reading information is brought close to the IC chip 10.

Further, as a holding member for holding the IC chip 10, a coating formed by applying a UV curable resin or a thermosetting resin to a region including the IC chip 10 and the non-curable resin 40 of the base substrate 30 and curing it. By using the film 50, it is possible to reduce the thickness in the region where the IC chip 10 is disposed.

(Second Embodiment)
4A and 4B are diagrams showing a second embodiment of the non-contact type information recording medium of the present invention. FIG. 4A is a front view, FIG. 4B is a diagram showing an internal structure, and FIG. 4C is a diagram (a). , (B) AA ′ cross-sectional view,
(D) is the B section enlarged view shown in (c).

In this embodiment, as shown in FIG. 4, on a base substrate 130 made of a resin such as PET, PET-G or PP, or a paper such as coated paper or high-quality paper, a substantially triangular shape made of a conductive material and constituting an antenna. The two antenna patterns 120a and 120b are formed, and the base substrate 130 is formed.
The surface sheet 16 serving as a holding member on the surface on which the antenna patterns 120a and 120b are formed
0 is adhered by an adhesive 140 such as hot melt. In the two antenna patterns 120a and 120b, one vertex of a substantially triangular shape is opposed to each other with a gap, and this vertex is a feeding point. When the antenna patterns 120a and 120b resonate with radio waves and a current flows through the antenna patterns 120a and 120b on one surface of the surface sheet 160, the current is supplied to read or write information. The IC chip 110 is mounted and bonded, and the IC chip 110 mounted and bonded is bonded to the base substrate 130 with the bonded surface as the bonding surface. In addition, information 161 is displayed on the surface of the surface sheet 160, that is, the surface opposite to the surface to which the IC chip 110 is bonded, and the non-contact type IC is formed in a region facing the IC chip 110. A communication button 162 for operating the tag 102 is displayed. This communication button 162 is information 161
In addition, it may be displayed by printing, or may be displayed by attaching a label or the like. On the base substrate 130, the adhesive 140 is not applied to the area facing the IC chip 110 and its peripheral part, and the IC chip 110 is fixed only to the top sheet 160. . This IC chip 110 has bumps 111 serving as terminals for connection to the antenna patterns 120a and 120b, and the surface sheet 16
The bump 111 is arranged and held by 0 so as to face the feeding points of the antenna patterns 120a and 120b in a non-contact state. As the IC chip 110, any of those that can only write information, those that can only read information, and those that can write and read information can be used in this embodiment. The surface sheet 160 may be made of paper or resin. However, when the surface sheet 160 has elasticity and no external force is applied, the IC chip 110 and the bump 111 are connected to the antenna patterns 120a, 1
The bump 11 of the IC chip 110 is held when it is held so as not to contact 20b and an external force is applied.
1 can be deformed in a direction in contact with the antenna patterns 120a and 120b, and is restored to its original shape when no external force is applied.

Hereinafter, a manufacturing method of the non-contact type IC tag 102 configured as described above will be described.

  FIG. 5 is a diagram for explaining a method of manufacturing the non-contact type IC tag 102 shown in FIG.

First, two substantially triangular antenna patterns 120 a and 120 are formed on the base substrate 130.
b is formed such that one apex of a substantially triangular shape is opposed to each other with a gap (FIG. 5 (a
)). The antenna patterns 120a and 120b may be formed by screen printing using a conductive paste containing a conductive material such as silver, copper, or tin in a resin binder, etching, plating, or the like.

Further, the IC chip 110 is bonded to one surface of the surface sheet 160 such that the surface opposite to the bump 111 of the IC chip 110 becomes an adhesive surface (FIG. 5B).

Next, on the surface of the base substrate 130 on which the antenna patterns 120a and 120b are formed,
Adhesive 1 except for the feeding points of antenna patterns 120a and 120b and the region between the feeding points
40 is applied (FIG. 5C). The application thickness of the adhesive 140 is set to be thicker than the combined height of the bumps 111 of the IC chip 110.

Thereafter, the surface sheet 160 to which the IC chip 110 is bonded and the base substrate 130 to which the adhesive 140 is applied are bonded to the surface of the surface sheet 160 to which the IC chip 110 is bonded and the adhesive 140 to the base substrate 130 is bonded. They are superposed so that the coated surfaces face each other, and these are adhered by the adhesive 140 (FIG. 5 (d)). At this time, since the adhesive 140 is not applied to the feeding points of the antenna patterns 120a and 120b and the region between the feeding points of the surface of the base substrate 130 facing the top sheet 160, the IC chip 110 is The state is fixed only to the top sheet 160. In addition, the application thickness of the adhesive 140 is set to be thicker than the combined height of the bumps 111 of the IC chip 110, so that the IC
The bumps 111 of the chip 110 are not in contact with the antenna patterns 120a and 120b.

The operation of the non-contact type IC tag 102 manufactured as described above will be described below.

FIG. 6 is a diagram for explaining the operation of the non-contact type IC tag 102 shown in FIG.
) Is the IC chip 1 when the communication button 162 of the non-contact type IC tag 102 is not pressed.
FIG. 10B is a diagram illustrating a state in the vicinity of the IC chip 110 when the communication button 162 of the non-contact type IC tag 102 is pressed.

When the communication button 162 is not pressed on the non-contact type IC tag 102 shown in FIG. 4, that is, when an external force is not applied, as shown in FIG.
However, since the bump 111 is held in a non-contact state with respect to the antenna patterns 120a and 120b by the surface sheet 160, the bump 111 of the IC chip 110 faces the feeding points of the antenna patterns 120a and 120b. Antenna pattern 120a,
It is not in contact with 120b. Therefore, in this state, even if a device for writing and reading information is brought close to the IC chip 110 and the antenna patterns 120a and 120b resonate with radio waves from the device and a current flows, the current flows to the IC chip. 110 is not supplied to the IC chip 110, and information is not written to or read from the IC chip 110 in this state.

When the communication button 162 is pressed on the non-contact type IC tag 102, that is, when an external force is applied from the surface sheet 160 side, the surface sheet 160 is deformed in a direction in which the bumps 111 of the IC chip 110 are in contact with the antenna patterns 120a and 120b. As shown in FIG. 6B, the pressure-sensitive adhesive 140 that bonds the top sheet 160 and the base substrate 130 is not applied to the periphery of the IC chip 110. IC of surface sheet 160
The region where the chip 110 is bonded is deformed in a direction in which the bumps 111 of the IC chip 110 are in contact with the antenna patterns 120a and 120b, and the bumps 111 of the IC chip 110 and the antenna patterns 120a and 120b are in contact. Thereby, the IC chip 110 and the antenna patterns 120a and 120b are electrically connected. In this state, when a device for writing and reading information is brought close to the IC chip 110, the current that flows through the antenna patterns 120a and 120b by radio waves from the device is supplied to the IC chip 110, and the IC chip 110 Information is written to or read from.

Thereafter, when the communication button 162 is not pressed on the non-contact type IC tag 102, that is, when the external force is not applied, the top sheet 160 is restored to the original shape when the external force is not applied. As shown in (a), the surface sheet 160 is restored to its original shape, and the bumps 111 of the IC chip 110 and the antenna patterns 120a and 120b return to the non-contact state.

Thus, in the state where no external force is applied by the surface sheet 160, the IC
The terminal 111 of the chip 110 and the antenna patterns 120a and 120b are brought into a non-contact state to make them non-conductive, and when an external force is applied, the terminal 111 of the IC chip 110 and the antenna patterns 120a and 120b are brought into contact with each other to conduct. Therefore, the information written in the IC chip 110 can be prevented from being read inadvertently without disconnecting a part of the antenna and newly providing a switching function.

In the two embodiments described above, two antenna patterns 20a and 20b are used.
, 120a, and 120b have been described as an example, but a monopole antenna having a single antenna pattern may be used.

In the two embodiments described above, the antenna patterns 20a, 20b, 12 are used.
The antenna patterns 20a, 20b, 120a, 120b are generated by resonance of 0a, 120b with radio waves.
Is supplied to the IC chips 10 and 110 when the current flows through
Although description has been given by taking as an example the case where information is written to and read from the C chips 10 and 110, a coiled antenna is formed on the base materials 30 and 130, and this antenna is subjected to electromagnetic induction. Information may be written to or read from the IC chips 10 and 110 by supplying a current and supplying the current to the IC chips 10 and 110.

DESCRIPTION OF SYMBOLS 1 Inlet 2,102 Non-contact type IC tag 10,110 IC chip 11,111 Bump 20a, 20b, 120a, 120b Antenna pattern 30,130 Base base material 40 Non-hardening resin 50 Coating film 60,160 Surface sheet 61,161 Information 62,162 Communication button 140 Adhesive

Claims (2)

Non-contact type information recording in which a conductive antenna is formed on a base substrate, and an IC chip capable of writing and / or reading information in a non-contact state by being connected to the antenna is arranged In the medium,
The IC chip is arranged at a position where a terminal connected to the antenna faces the antenna,
The IC chip is held on the base substrate so that the terminals of the IC chip are not in contact with the antenna, the terminal can be deformed in a direction in contact with the antenna by an external force, and an external force A non-contact information recording medium having a holding member that is restored to its original shape when no more is applied. The non-contact type information recording medium according to claim 1,
The antenna is an antenna that resonates with radio waves,
In the IC chip, the antenna resonates with radio waves, thereby writing information and / or
Alternatively, a non-contact type information recording medium from which reading is performed.

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